JP2006169533A5 - - Google Patents
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- Publication number
- JP2006169533A5 JP2006169533A5 JP2005362032A JP2005362032A JP2006169533A5 JP 2006169533 A5 JP2006169533 A5 JP 2006169533A5 JP 2005362032 A JP2005362032 A JP 2005362032A JP 2005362032 A JP2005362032 A JP 2005362032A JP 2006169533 A5 JP2006169533 A5 JP 2006169533A5
- Authority
- JP
- Japan
- Prior art keywords
- film composite
- component
- bis
- composite material
- diamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000002131 composite material Substances 0.000 claims description 33
- 150000004985 diamines Chemical class 0.000 claims description 24
- -1 aliphatic diamines Chemical class 0.000 claims description 18
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 6
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims description 4
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 4
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims description 4
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 4
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 2
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 2
- BZXJAHGHOJFYRT-UHFFFAOYSA-N 3-[2-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C(=CC=CC=2)OC=2C=C(N)C=CC=2)=C1 BZXJAHGHOJFYRT-UHFFFAOYSA-N 0.000 claims description 2
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims description 2
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 claims description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 2
- RYYUUQPLFHRZOY-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1OC1=CC=C(N)C=C1 RYYUUQPLFHRZOY-UHFFFAOYSA-N 0.000 claims description 2
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical group C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 claims description 2
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 claims description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 claims description 2
- 235000019739 Dicalciumphosphate Nutrition 0.000 claims description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 150000004984 aromatic diamines Chemical class 0.000 claims description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 2
- 229910002113 barium titanate Inorganic materials 0.000 claims description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 2
- 239000001506 calcium phosphate Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- NEFBYIFKOOEVPA-UHFFFAOYSA-K dicalcium phosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])([O-])=O NEFBYIFKOOEVPA-UHFFFAOYSA-K 0.000 claims description 2
- 229940038472 dicalcium phosphate Drugs 0.000 claims description 2
- 229910000390 dicalcium phosphate Inorganic materials 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 claims description 2
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 2
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/012,475 US20060124693A1 (en) | 2004-12-15 | 2004-12-15 | Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006169533A JP2006169533A (ja) | 2006-06-29 |
| JP2006169533A5 true JP2006169533A5 (enExample) | 2009-01-29 |
Family
ID=35585001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005362032A Withdrawn JP2006169533A (ja) | 2004-12-15 | 2005-12-15 | 電子デバイスの熱伝導部分として有用な、大きな機械的伸びを有する熱伝導性ポリイミドフィルム複合材料 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060124693A1 (enExample) |
| EP (1) | EP1672008A1 (enExample) |
| JP (1) | JP2006169533A (enExample) |
| KR (1) | KR20060067878A (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI417418B (zh) * | 2005-04-28 | 2013-12-01 | Kaneka Corp | 鍍敷用材料及其利用 |
| US20070232734A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto |
| US20070231588A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Capacitive polyimide laminate |
| TW200909201A (en) * | 2007-08-31 | 2009-03-01 | Mortech Corp | Metal clad laminate and the manufacturing method thereof |
| KR101292993B1 (ko) * | 2007-11-20 | 2013-08-02 | 코오롱인더스트리 주식회사 | 폴리이미드 수지와 이를 이용한 액정 배향막 및 필름 |
| TWI454375B (zh) * | 2008-03-06 | 2014-10-01 | Nippon Steel & Sumikin Chem Co | Laminates for flexible substrates and thermally conductive polyimide films |
| EP2325000B1 (en) * | 2008-09-08 | 2013-05-29 | Nippon Steel & Sumikin Chemical Co., Ltd. | Highly heat conductive polyimide film, highly heat conductive metal-clad laminate and method for producing same |
| JP5344880B2 (ja) * | 2008-10-01 | 2013-11-20 | 三井化学株式会社 | 接着樹脂組成物、およびそれを含む積層体 |
| US20100143706A1 (en) * | 2008-12-09 | 2010-06-10 | Mortech Corporation | Polyimide laminate and a method of fabricating the same |
| KR101064816B1 (ko) * | 2009-04-03 | 2011-09-14 | 주식회사 두산 | 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판 |
| JP5740834B2 (ja) | 2009-05-11 | 2015-07-01 | 三菱化学株式会社 | 液晶性ポリイミド、及びこれを含有する液晶性樹脂組成物、並びに半導体素子用樹脂膜 |
| JP5562334B2 (ja) * | 2009-07-03 | 2014-07-30 | 三井化学株式会社 | 樹脂組成物、それを含む積層体、半導体装置およびフィルム |
| CN102152539B (zh) * | 2010-11-11 | 2013-08-14 | 广东生益科技股份有限公司 | 铝基覆铜板的连续化生产方法及其连续化生产线 |
| CN102673047A (zh) * | 2012-05-28 | 2012-09-19 | 珠海亚泰电子科技有限公司 | 导热无卤无胶覆铜箔的制作方法 |
| CN102806722A (zh) * | 2012-08-06 | 2012-12-05 | 广东生益科技股份有限公司 | 二层法单面挠性覆铜板 |
| CN102774077B (zh) * | 2012-08-06 | 2016-02-17 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板及其制作方法 |
| TWI490274B (zh) * | 2014-10-29 | 2015-07-01 | Mortech Corp | 聚醯亞胺基聚合物、應用聚醯亞胺基聚合物之聚醯亞胺膜與應用聚醯亞胺基聚合物之聚醯亞胺積層板 |
| US11046051B2 (en) * | 2015-12-01 | 2021-06-29 | Materion Corporation | Metal-on-ceramic substrates |
| TWI618980B (zh) * | 2017-06-30 | 2018-03-21 | 律勝科技股份有限公司 | 導熱型感光性樹脂 |
| TWI618979B (zh) * | 2017-06-30 | 2018-03-21 | 律勝科技股份有限公司 | 導熱型聚醯亞胺基板 |
| DE102018202058A1 (de) * | 2018-02-09 | 2019-08-14 | Siemens Aktiengesellschaft | Formulierung zur Herstellung eines Isolationssystems, elektrische Maschine und Verfahren zur Herstellung eines Isolationssystems |
| CN110452418B (zh) * | 2019-09-25 | 2021-03-02 | 桂林电子科技大学 | 一种核壳结构导热填料制备的高导热聚酰亚胺薄膜及其制备方法 |
| CN113264770B (zh) * | 2021-05-27 | 2022-11-11 | 沈阳化工大学 | 一种抗弯折MXene/碳复合材料散热膜制备方法 |
| CN113621155B (zh) * | 2021-09-02 | 2023-04-18 | 大同共聚(西安)科技有限公司 | 一种纳米-微米氮化硼/聚酰亚胺复合材料的制备方法 |
| CN114381040A (zh) * | 2022-01-26 | 2022-04-22 | 四川轻化工大学 | 一种高介电常数聚酰亚胺复合薄膜及其制备方法 |
| CN116423598B (zh) * | 2023-05-31 | 2024-06-11 | 东北林业大学 | 一种木芯聚酰亚胺壳层复合材料的制备方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3496139A (en) * | 1966-12-20 | 1970-02-17 | Gen Electric | Epoxy resins with reaction product of a polysiloxane and an amine |
| US3803085A (en) * | 1972-12-29 | 1974-04-09 | Gen Electric | Method for making polyetherimides |
| US4040874A (en) * | 1975-08-04 | 1977-08-09 | General Electric Company | Semiconductor element having a polymeric protective coating and glass coating overlay |
| US4447670A (en) * | 1982-04-09 | 1984-05-08 | Westinghouse Electric Corp. | High-current cryogenic leads |
| US4574879A (en) * | 1984-02-29 | 1986-03-11 | The Bergquist Company | Mounting pad for solid-state devices |
| US4810563A (en) * | 1986-03-14 | 1989-03-07 | The Bergquist Company | Thermally conductive, electrically insulative laminate |
| US4808686A (en) * | 1987-06-18 | 1989-02-28 | General Electric Company | Silicone-polyimides, and method for making |
| US5208031A (en) * | 1989-06-06 | 1993-05-04 | Kelly Patrick D | Sexual lubricants containing zinc as an anti-viral agent |
| JPH0832591B2 (ja) * | 1989-10-11 | 1996-03-29 | 日本ピラー工業株式会社 | 複合材 |
| US5260413A (en) * | 1990-02-05 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Coated, heat-sealable aromatic polyimide film having superior compressive strength |
| EP0474054B1 (en) * | 1990-08-27 | 1995-12-06 | E.I. Du Pont De Nemours And Company | Flexible multi-layer polyimide film laminates and preparation thereof |
| US5331040A (en) * | 1992-10-26 | 1994-07-19 | E. I. Du Pont De Nemours And Company | Adhesive composition with functional filler |
| US5302652A (en) * | 1992-12-15 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Process for preparing a pigmented polyimide shaped article |
| WO1997001437A1 (en) * | 1995-06-28 | 1997-01-16 | Fraivillig Materials Company | Circuit board laminates and method of making |
| US5893498A (en) * | 1997-12-17 | 1999-04-13 | Aronson; Gina E. | Socket retaining utility belt |
| KR100256957B1 (ko) * | 1997-12-26 | 2000-05-15 | 윤종용 | 코드분할 다중접속 시스템에서 동일셀내 주파수간 하드핸드오프 방법 |
| US6207364B1 (en) * | 1998-04-21 | 2001-03-27 | Konica Corporation | Thermally developable material |
| US20020092163A1 (en) * | 1999-01-05 | 2002-07-18 | James Fraivillig | Mounting a flexible printed circuit to a heat sink |
| US6710456B1 (en) * | 2000-08-31 | 2004-03-23 | Micron Technology, Inc. | Composite interposer for BGA packages |
| JP3895125B2 (ja) * | 2001-04-12 | 2007-03-22 | 日東電工株式会社 | 補強板付フレキシブルプリント回路板 |
| US6410971B1 (en) * | 2001-07-12 | 2002-06-25 | Ferrotec (Usa) Corporation | Thermoelectric module with thin film substrates |
-
2004
- 2004-12-15 US US11/012,475 patent/US20060124693A1/en not_active Abandoned
-
2005
- 2005-10-31 EP EP05023744A patent/EP1672008A1/en not_active Withdrawn
- 2005-12-14 KR KR1020050123050A patent/KR20060067878A/ko not_active Withdrawn
- 2005-12-15 JP JP2005362032A patent/JP2006169533A/ja not_active Withdrawn
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