KR20060052010A - 결함 검사 방법 - Google Patents

결함 검사 방법 Download PDF

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Publication number
KR20060052010A
KR20060052010A KR1020050093138A KR20050093138A KR20060052010A KR 20060052010 A KR20060052010 A KR 20060052010A KR 1020050093138 A KR1020050093138 A KR 1020050093138A KR 20050093138 A KR20050093138 A KR 20050093138A KR 20060052010 A KR20060052010 A KR 20060052010A
Authority
KR
South Korea
Prior art keywords
substrate
light
defect
pattern
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020050093138A
Other languages
English (en)
Korean (ko)
Inventor
다케오 오오모리
가즈히코 후카자와
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20060052010A publication Critical patent/KR20060052010A/ko
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/314—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry with comparison of measurements at specific and non-specific wavelengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020050093138A 2004-10-06 2005-10-04 결함 검사 방법 Ceased KR20060052010A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004322905A JP4901090B2 (ja) 2004-10-06 2004-10-06 欠陥検査方法及び欠陥検出装置
JPJP-P-2004-00322905 2004-10-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020120021482A Division KR101275343B1 (ko) 2004-10-06 2012-02-29 결함 검사 방법

Publications (1)

Publication Number Publication Date
KR20060052010A true KR20060052010A (ko) 2006-05-19

Family

ID=36375851

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020050093138A Ceased KR20060052010A (ko) 2004-10-06 2005-10-04 결함 검사 방법
KR1020120021482A Expired - Lifetime KR101275343B1 (ko) 2004-10-06 2012-02-29 결함 검사 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020120021482A Expired - Lifetime KR101275343B1 (ko) 2004-10-06 2012-02-29 결함 검사 방법

Country Status (4)

Country Link
JP (1) JP4901090B2 (enExample)
KR (2) KR20060052010A (enExample)
CN (1) CN1758022A (enExample)
TW (1) TW200626888A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101237583B1 (ko) * 2007-10-23 2013-02-26 시바우라 메카트로닉스 가부시키가이샤 촬영 화상에 기초한 검사 방법 및 검사 장치

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060099344A1 (en) 2004-11-09 2006-05-11 Eastman Kodak Company Controlling the vaporization of organic material
JP4548385B2 (ja) * 2006-05-10 2010-09-22 株式会社ニコン 表面検査装置
JP4692892B2 (ja) * 2006-06-01 2011-06-01 株式会社ニコン 表面検査装置
JP5201350B2 (ja) 2006-07-14 2013-06-05 株式会社ニコン 表面検査装置
WO2008033779A2 (en) * 2006-09-12 2008-03-20 Rudolph Technologies, Inc. Polarization imaging
KR101467010B1 (ko) * 2007-06-13 2014-12-01 가부시키가이샤 니콘 검사 장치, 검사 방법 및 프로그램
WO2009125805A1 (ja) * 2008-04-09 2009-10-15 株式会社ニコン 表面検査方法および表面検査装置
JP2009300216A (ja) * 2008-06-12 2009-12-24 Nikon Corp 観察装置
JP5252286B2 (ja) * 2008-11-14 2013-07-31 株式会社ニコン 表面検査方法、表面検査装置および検査方法
TW201100787A (en) 2009-02-18 2011-01-01 Nikon Corp Surface examining device and surface examining method
WO2012081587A1 (ja) * 2010-12-14 2012-06-21 株式会社ニコン 検査方法、検査装置、露光管理方法、露光システムおよび半導体デバイス
JP6406492B2 (ja) * 2014-01-27 2018-10-17 株式会社ニコン 評価方法、評価装置、及び露光システム
US9599573B2 (en) * 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection
CN108180826B (zh) * 2017-12-20 2023-12-22 深圳湾新科技有限公司 一种锂电池卷绕层边界的检测设备及检测方法
CN110132996A (zh) * 2019-06-06 2019-08-16 德淮半导体有限公司 缺陷检测装置及其检测方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS643545A (en) * 1987-06-26 1989-01-09 Hitachi Ltd Method and apparatus for inspection
JPS649306A (en) * 1987-07-01 1989-01-12 Fujitsu Ltd Detector for light transmitting fine pattern
JP3692685B2 (ja) * 1997-02-19 2005-09-07 株式会社ニコン 欠陥検査装置
JPH10325805A (ja) * 1997-05-23 1998-12-08 Nikon Corp 半導体ウエハの自動検査装置
JP3982017B2 (ja) * 1997-08-05 2007-09-26 株式会社ニコン 欠陥検査装置
JPH1164234A (ja) * 1997-08-20 1999-03-05 Advantest Corp 異物検出方法、および異物検出装置
KR100374762B1 (ko) * 1998-07-28 2003-03-04 히다치 덴시 엔지니어링 가부시키 가이샤 결함 검사 장치 및 그 방법
JP4184543B2 (ja) * 1999-06-10 2008-11-19 株式会社日立製作所 光学像検出方法および外観検査装置
JP3769996B2 (ja) * 1999-09-20 2006-04-26 三菱電機株式会社 欠陥検査用半導体基板、半導体基板の検査方法および半導体基板検査用モニター装置
JP2001165632A (ja) * 1999-12-03 2001-06-22 Sony Corp 検査装置及び検査方法
JP4153652B2 (ja) * 2000-10-05 2008-09-24 株式会社東芝 パターン評価装置及びパターン評価方法
JP2002257747A (ja) * 2001-02-27 2002-09-11 Matsushita Electric Ind Co Ltd 欠陥検査装置
KR100492159B1 (ko) * 2002-10-30 2005-06-02 삼성전자주식회사 기판 검사 장치
JP4183492B2 (ja) * 2002-11-27 2008-11-19 株式会社日立製作所 欠陥検査装置および欠陥検査方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101237583B1 (ko) * 2007-10-23 2013-02-26 시바우라 메카트로닉스 가부시키가이샤 촬영 화상에 기초한 검사 방법 및 검사 장치

Also Published As

Publication number Publication date
JP2006105951A (ja) 2006-04-20
KR20120036923A (ko) 2012-04-18
TW200626888A (en) 2006-08-01
CN1758022A (zh) 2006-04-12
KR101275343B1 (ko) 2013-06-17
JP4901090B2 (ja) 2012-03-21

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