KR20030009070A - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR20030009070A KR20030009070A KR1020020010415A KR20020010415A KR20030009070A KR 20030009070 A KR20030009070 A KR 20030009070A KR 1020020010415 A KR1020020010415 A KR 1020020010415A KR 20020010415 A KR20020010415 A KR 20020010415A KR 20030009070 A KR20030009070 A KR 20030009070A
- Authority
- KR
- South Korea
- Prior art keywords
- memory cell
- bipolar transistor
- memory
- mtj element
- data line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 230000005415 magnetization Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 6
- 239000003302 ferromagnetic material Substances 0.000 claims description 5
- 230000008859 change Effects 0.000 abstract description 15
- 230000005291 magnetic effect Effects 0.000 abstract description 10
- 230000010354 integration Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 16
- 238000009792 diffusion process Methods 0.000 description 11
- 230000005294 ferromagnetic effect Effects 0.000 description 11
- 238000005468 ion implantation Methods 0.000 description 9
- 238000002955 isolation Methods 0.000 description 8
- 230000001360 synchronised effect Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000003321 amplification Effects 0.000 description 5
- 238000003199 nucleic acid amplification method Methods 0.000 description 5
- 101150009920 MCA2 gene Proteins 0.000 description 4
- 101100229953 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) SCT1 gene Proteins 0.000 description 4
- 101100194362 Schizosaccharomyces pombe (strain 972 / ATCC 24843) res1 gene Proteins 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1659—Cell access
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2001-00176465 | 2001-06-12 | ||
| JP2001176465A JP3869682B2 (ja) | 2001-06-12 | 2001-06-12 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20030009070A true KR20030009070A (ko) | 2003-01-29 |
Family
ID=19017444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020010415A Ceased KR20030009070A (ko) | 2001-06-12 | 2002-02-27 | 반도체 장치 |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US6573586B2 (enExample) |
| JP (1) | JP3869682B2 (enExample) |
| KR (1) | KR20030009070A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100451660B1 (ko) * | 2001-12-05 | 2004-10-08 | 대한민국(서울대학교 총장) | 전압을 이용한 강자성박막의 자화용이축 제어방법 및 이를이용한 비휘발성, 초고집적, 초절전형 자기메모리와정보기록방법 |
| KR100493161B1 (ko) * | 2002-11-07 | 2005-06-02 | 삼성전자주식회사 | Mram과 그 제조 및 구동방법 |
| KR100669363B1 (ko) * | 2004-10-26 | 2007-01-16 | 삼성전자주식회사 | 메모리 장치의 읽기 방법 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4539007B2 (ja) * | 2002-05-09 | 2010-09-08 | 日本電気株式会社 | 半導体記憶装置 |
| EP1408550B1 (en) * | 2002-10-08 | 2006-12-27 | STMicroelectronics S.r.l. | Array of cells including a selection bipolar transistor and fabrication method thereof |
| EP1408549B1 (en) * | 2002-10-08 | 2007-03-07 | STMicroelectronics S.r.l. | Process for manufacturing an array of cells including selection bipolar junction transistors and associated array of cells |
| JP3866649B2 (ja) * | 2002-11-28 | 2007-01-10 | 株式会社東芝 | 磁気ランダムアクセスメモリ |
| JP4664573B2 (ja) * | 2002-11-28 | 2011-04-06 | ルネサスエレクトロニクス株式会社 | 磁気半導体記憶装置 |
| US6711053B1 (en) * | 2003-01-29 | 2004-03-23 | Taiwan Semiconductor Manufacturing Company | Scaleable high performance magnetic random access memory cell and array |
| TW589753B (en) * | 2003-06-03 | 2004-06-01 | Winbond Electronics Corp | Resistance random access memory and method for fabricating the same |
| JP4142993B2 (ja) * | 2003-07-23 | 2008-09-03 | 株式会社東芝 | 磁気メモリ装置の製造方法 |
| JP2005116658A (ja) | 2003-10-06 | 2005-04-28 | Fujitsu Ltd | 磁気抵抗メモリ装置 |
| US6933204B2 (en) * | 2003-10-13 | 2005-08-23 | International Business Machines Corporation | Method for improved alignment of magnetic tunnel junction elements |
| KR100782944B1 (ko) | 2003-12-30 | 2007-12-07 | 심정칠 | 저전력용 자기 메모리소자 |
| US7009903B2 (en) * | 2004-05-27 | 2006-03-07 | Hewlett-Packard Development Company, L.P. | Sense amplifying magnetic tunnel device |
| JP2006156608A (ja) | 2004-11-29 | 2006-06-15 | Hitachi Ltd | 磁気メモリおよびその製造方法 |
| US7486550B2 (en) * | 2006-06-06 | 2009-02-03 | Micron Technology, Inc. | Semiconductor magnetic memory integrating a magnetic tunneling junction above a floating-gate memory cell |
| JP5119436B2 (ja) * | 2006-12-28 | 2013-01-16 | 国立大学法人大阪大学 | 不揮発性メモリセルおよびその製造方法、抵抗可変型不揮発性メモリ装置、並びに不揮発性メモリセルの設計方法 |
| US20090121259A1 (en) * | 2007-11-13 | 2009-05-14 | Iben Icko E T | Paired magnetic tunnel junction to a semiconductor field-effect transistor |
| JP2009135291A (ja) | 2007-11-30 | 2009-06-18 | Sanyo Electric Co Ltd | 半導体メモリ装置 |
| JP2009135290A (ja) * | 2007-11-30 | 2009-06-18 | Sanyo Electric Co Ltd | 半導体メモリ装置 |
| KR100961723B1 (ko) * | 2008-02-18 | 2010-06-10 | 이화여자대학교 산학협력단 | 스핀 토크 변환을 이용한 자기터널접합 소자를 사용한xor 논리 연산장치 |
| US8208290B2 (en) * | 2009-08-26 | 2012-06-26 | Qualcomm Incorporated | System and method to manufacture magnetic random access memory |
| JP2012069671A (ja) * | 2010-09-22 | 2012-04-05 | Toshiba Corp | 半導体記憶装置およびその製造方法 |
| US9246100B2 (en) | 2013-07-24 | 2016-01-26 | Micron Technology, Inc. | Memory cell array structures and methods of forming the same |
| US9813049B2 (en) | 2015-08-12 | 2017-11-07 | Qualcomm Incorporated | Comparator including a magnetic tunnel junction (MTJ) device and a transistor |
| KR102406722B1 (ko) * | 2015-09-25 | 2022-06-09 | 삼성전자주식회사 | 자기 메모리 장치 및 그 제조 방법 |
| US11411049B2 (en) * | 2020-12-21 | 2022-08-09 | International Business Machines Corporation | Symmetric read operation resistive random-access memory cell with bipolar junction selector |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6055178A (en) * | 1998-12-18 | 2000-04-25 | Motorola, Inc. | Magnetic random access memory with a reference memory array |
| DE10020128A1 (de) * | 2000-04-14 | 2001-10-18 | Infineon Technologies Ag | MRAM-Speicher |
| JP2002170377A (ja) * | 2000-09-22 | 2002-06-14 | Mitsubishi Electric Corp | 薄膜磁性体記憶装置 |
| US6418046B1 (en) * | 2001-01-30 | 2002-07-09 | Motorola, Inc. | MRAM architecture and system |
| JP4637388B2 (ja) * | 2001-03-23 | 2011-02-23 | ルネサスエレクトロニクス株式会社 | 薄膜磁性体記憶装置 |
| JP2002298572A (ja) * | 2001-03-28 | 2002-10-11 | Toshiba Corp | 半導体記憶装置 |
| US6490217B1 (en) * | 2001-05-23 | 2002-12-03 | International Business Machines Corporation | Select line architecture for magnetic random access memories |
-
2001
- 2001-06-12 JP JP2001176465A patent/JP3869682B2/ja not_active Expired - Fee Related
-
2002
- 2002-02-25 US US10/081,537 patent/US6573586B2/en not_active Expired - Lifetime
- 2002-02-27 KR KR1020020010415A patent/KR20030009070A/ko not_active Ceased
-
2003
- 2003-04-14 US US10/412,423 patent/US6771535B2/en not_active Expired - Fee Related
-
2004
- 2004-06-09 US US10/863,748 patent/US6903966B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100451660B1 (ko) * | 2001-12-05 | 2004-10-08 | 대한민국(서울대학교 총장) | 전압을 이용한 강자성박막의 자화용이축 제어방법 및 이를이용한 비휘발성, 초고집적, 초절전형 자기메모리와정보기록방법 |
| KR100493161B1 (ko) * | 2002-11-07 | 2005-06-02 | 삼성전자주식회사 | Mram과 그 제조 및 구동방법 |
| KR100669363B1 (ko) * | 2004-10-26 | 2007-01-16 | 삼성전자주식회사 | 메모리 장치의 읽기 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20020195630A1 (en) | 2002-12-26 |
| US6903966B2 (en) | 2005-06-07 |
| US6771535B2 (en) | 2004-08-03 |
| JP3869682B2 (ja) | 2007-01-17 |
| JP2002367365A (ja) | 2002-12-20 |
| US6573586B2 (en) | 2003-06-03 |
| US20040223368A1 (en) | 2004-11-11 |
| US20030173628A1 (en) | 2003-09-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20020227 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20070227 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20020227 Comment text: Patent Application |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
Patent event date: 20071001 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20080225 Patent event code: PE09021S01D |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20080811 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20090202 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20080811 Comment text: Notification of reason for refusal Patent event code: PE06011S01I Patent event date: 20080225 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |