KR20010078053A - 접착제 조성물 - Google Patents
접착제 조성물 Download PDFInfo
- Publication number
- KR20010078053A KR20010078053A KR1020010003611A KR20010003611A KR20010078053A KR 20010078053 A KR20010078053 A KR 20010078053A KR 1020010003611 A KR1020010003611 A KR 1020010003611A KR 20010003611 A KR20010003611 A KR 20010003611A KR 20010078053 A KR20010078053 A KR 20010078053A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive composition
- connection
- conductive adhesive
- anisotropic conductive
- oxetane compound
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/02—Condensation polymers of aldehydes or ketones only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
실시예 | 비교예 | |||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | |||
성분 | 절연성수지 | |||||||||||
페녹시수지(유니온카바이트사제,PKHH) | 40 | 40 | ||||||||||
고리식지방족에폭시수지(유니온카비아드제조, ERL4221) | 30 | 20 | ← | ← | ← | ← | ← | ← | ← | ← | 30 | |
고리식지방족에폭시수지(유니온카비아드제조, ERL4299) | 20 | |||||||||||
비스페놀A형에폭시수지(유화쉘에폭시사제조, EP828) | 10 | 10 | ||||||||||
비스페놀A형에폭시수지(유화쉘에폭시사제조, EP1001) | 10 | ← | ← | ← | ← | ← | ← | ← | ← | |||
나프탈렌골격에폭시수지(다이닛뽕잉크카가꾸고교사 제조, HP4032D) | 40 | ← | ← | ← | 20 | 50 | 65 | 10 | 67 | |||
옥세탄화합물 | ||||||||||||
XDO(도아고세이사 제조) | 20 | 20 | 20 | 20 | 20 | 30 | 10 | 5 | 30 | 3 | ||
EOXA(도아고세이사 제조) | 10 | |||||||||||
HOX(도아고세이사 제조) | 10 | |||||||||||
PHO(도아고세이사 제조) | 10 | 20 | 10 | 30 | ||||||||
DOX(도아고세이사 제조) | 10 | |||||||||||
실란커플링제(니혼유니카사 제조, A-187) | 1 | 1 | ← | ← | ← | ← | ← | ← | ← | ← | ← | |
카티온계광중합개시제 (아사히덴카사 제조, SP-150) | 3 | |||||||||||
카티온계광중합개시제 (아사히덴카사 제조, SP-170) | 3 | ← | ← | ← | ← | ← | ← | ← | ← | ← | ||
도전성입자Ni-Au도금수지입자(¢5㎛)(니혼카가꾸고교사 제조) | 5 | 10 | ← | ← | ← | ← | ← | ← | ← | ← | ← | |
평가 | 저항상승 | O | O | O | O | O | O | O | O | △ | △ | X(*1) |
접착강도(에이징전)(mM/㎝)(에지징후)(mM/㎝) | 53904120 | 47004020 | 44104120 | 53904700 | 55904410 | 44104210 | 58805000 | 55904510 | 46103330 | 39202940 | 55903920 | |
반응율(%) | 82 | 85 | 82 | 80 | 84 | 87 | 75 | 67 | 88 | 62 | 60 | |
외관 | O | O | O | O | O | O | O | O | △ | △ | X | |
(*1)비교예의 에이징후의 에이징전에 대한 저항상승은 3배 |
Claims (4)
- 절연성수지, 광중합개시제 및 옥세탄화합물을 함유하는 것을 특징으로 하는 접착제조성물.
- 제 1 항에 있어서, 옥세탄화합물이 접착제조성물 100 중량% 중에 5 ∼ 50 중량% 함유되어 있는 접착제조성물.
- 추가로 도전성입자가 함유되어 있는 제 1 항 또는 제 2 항의 기재의 이방도전성 접착제 조성물.
- 플라스틱기판과 회로기판의 대치하는 전극간을 제 1 항 내지 제 3 항의 어느 한 항에 기재의 접착제조성물로 접속한 접속구조체.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-21870 | 2000-01-26 | ||
JP2000021870A JP2001207150A (ja) | 2000-01-26 | 2000-01-26 | 接着剤組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010078053A true KR20010078053A (ko) | 2001-08-20 |
KR100773277B1 KR100773277B1 (ko) | 2007-11-05 |
Family
ID=18548227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010003611A KR100773277B1 (ko) | 2000-01-26 | 2001-01-22 | 접착제 조성물 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6780898B2 (ko) |
JP (1) | JP2001207150A (ko) |
KR (1) | KR100773277B1 (ko) |
TW (1) | TWI238181B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107011813A (zh) * | 2015-12-07 | 2017-08-04 | 三星Sdi株式会社 | 各向异性导电膜的组成物、各向异性导电膜以及使用所述各向异性导电膜的连接结构 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20010080093A (ko) * | 1999-08-12 | 2001-08-22 | 사토 아키오 | 실링제용광경화형수지조성물 및 실링방법. |
JP2001303015A (ja) * | 2000-04-25 | 2001-10-31 | Hitachi Chem Co Ltd | 接着フィルム、その製造方法及び接着方法 |
JP4660880B2 (ja) * | 2000-04-25 | 2011-03-30 | 日立化成工業株式会社 | 接着剤組成物及びそれを用いた接着フィルム、接着方法 |
JP2004510785A (ja) * | 2000-10-04 | 2004-04-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 重合性液晶ジオキセタン、並びにその製造方法及び使用 |
JP4667588B2 (ja) * | 2000-12-06 | 2011-04-13 | 富士通株式会社 | 接着・封止用樹脂組成物 |
KR101121671B1 (ko) * | 2003-08-12 | 2012-03-14 | 미쓰이 가가쿠 가부시키가이샤 | 광경화형 수지 조성물 및 그것을 이용한 플랫 패널디스플레이용 실링제 |
JP4282417B2 (ja) * | 2003-09-12 | 2009-06-24 | ソニーケミカル&インフォメーションデバイス株式会社 | 接続構造体 |
JP2005320491A (ja) * | 2004-05-11 | 2005-11-17 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法 |
US20060110600A1 (en) * | 2004-11-19 | 2006-05-25 | 3M Innovative Properties Company | Anisotropic conductive adhesive composition |
US20060223978A1 (en) * | 2005-04-04 | 2006-10-05 | Shengqian Kong | Radiation- or thermally-curable oxetane barrier sealants |
JP2007091959A (ja) * | 2005-09-30 | 2007-04-12 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
US20070116961A1 (en) * | 2005-11-23 | 2007-05-24 | 3M Innovative Properties Company | Anisotropic conductive adhesive compositions |
US20090311502A1 (en) * | 2006-07-24 | 2009-12-17 | Mccutcheon Jeffrey W | Electrically conductive pressure sensitive adhesives |
US7554793B2 (en) * | 2006-11-16 | 2009-06-30 | Kemet Electronics Corporation | Low temperature curable conductive adhesive and capacitors formed thereby |
EP2139629B1 (en) * | 2007-03-26 | 2018-09-05 | LORD Corporation | Method for producing heterogeneous composites |
TWI428389B (zh) * | 2007-10-31 | 2014-03-01 | Dainippon Ink & Chemicals | 活性能量線硬化性組成物及其製造方法 |
WO2010144762A1 (en) * | 2009-06-12 | 2010-12-16 | Lord Corporation | Method for protecting a substrate from lightning strikes |
KR101650693B1 (ko) | 2010-03-09 | 2016-08-25 | 헨켈 아이피 앤드 홀딩 게엠베하 | 압력 감응성 접착제를 위한 양이온성 uv가교성 아크릴 중합체 |
JP5561199B2 (ja) * | 2011-02-17 | 2014-07-30 | 日立化成株式会社 | 接着剤組成物、回路接続材料、接続体及びその製造方法、並びに半導体装置 |
TWI519560B (zh) | 2014-11-24 | 2016-02-01 | 財團法人工業技術研究院 | 含氧雜環丁烷基與環氧基之樹脂與樹脂組成物 |
CN111849394B (zh) * | 2019-04-29 | 2021-12-28 | 常州强力电子新材料股份有限公司 | 光固化粘接剂组合物、光固化粘接剂、偏光板及光学设备 |
JPWO2022075370A1 (ko) * | 2020-10-07 | 2022-04-14 |
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JPH08231938A (ja) * | 1995-02-24 | 1996-09-10 | Toagosei Co Ltd | ラミネート用活性エネルギー線硬化型接着剤組成物 |
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KR100629923B1 (ko) * | 1998-09-30 | 2006-09-29 | 돗빤호무즈가부시기가이샤 | 도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체 |
JP2001072957A (ja) | 1999-03-26 | 2001-03-21 | Hitachi Chem Co Ltd | 回路用接続部材 |
JP4642174B2 (ja) | 1999-11-10 | 2011-03-02 | 協立化学産業株式会社 | 難接着性材料に対して高接着性を呈するカチオン硬化型接着剤組成物 |
-
2000
- 2000-01-26 JP JP2000021870A patent/JP2001207150A/ja not_active Withdrawn
-
2001
- 2001-01-16 TW TW090100937A patent/TWI238181B/zh not_active IP Right Cessation
- 2001-01-18 US US09/761,191 patent/US6780898B2/en not_active Expired - Lifetime
- 2001-01-22 KR KR1020010003611A patent/KR100773277B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107011813A (zh) * | 2015-12-07 | 2017-08-04 | 三星Sdi株式会社 | 各向异性导电膜的组成物、各向异性导电膜以及使用所述各向异性导电膜的连接结构 |
Also Published As
Publication number | Publication date |
---|---|
US20010018477A1 (en) | 2001-08-30 |
JP2001207150A (ja) | 2001-07-31 |
US6780898B2 (en) | 2004-08-24 |
KR100773277B1 (ko) | 2007-11-05 |
TWI238181B (en) | 2005-08-21 |
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