KR20010039511A - 접착 조인트 - Google Patents

접착 조인트 Download PDF

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KR20010039511A
KR20010039511A KR1019997010554A KR19997010554A KR20010039511A KR 20010039511 A KR20010039511 A KR 20010039511A KR 1019997010554 A KR1019997010554 A KR 1019997010554A KR 19997010554 A KR19997010554 A KR 19997010554A KR 20010039511 A KR20010039511 A KR 20010039511A
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에릭 하인만
랄프 헨
프랑크 퓌쉬너
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칼 하인쯔 호르닝어
지멘스 악티엔게젤샤프트
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G06K19/041Constructional details
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07722Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/101Glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00Adhesive articles, e.g. adhesive tapes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00Cards, e.g. identity cards, credit cards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Credit Cards Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Materials For Medical Uses (AREA)
  • Laminated Bodies (AREA)
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Abstract

본 발명은 접착층(V)에 의해 제 1 금속 보디(1)를 플라스틱 보디(5)에 접속하는 접착 조인트에 관한 것으로 접착층(V)은 아크릴로 이루어진 가요성 코어층(4) 및 각각 제 1 보디(1)와 플라스틱 보디(5)에 인접한 용해된 접착제로 이루어진 외부층(2)을 포함하며 전이층(3)은 각각 외부층 사이에 배치되는 다중층 구조에 관한 것이다.

Description

접착 조인트{BONDED JOINT}
칩 카드식 부재에 접속된 반도체 모듈에 의한 접착 조인트가 DE 44 41 931에 개시되어 있다. 반도체 모듈은 반도체 칩이 부착되며 소위 리드 프레임(lead frame)이라 불리는 지지 부재를 포함한다. 반도체 칩상의 접촉은 접착 방법에 의해 리드 프레임으로 부착된다. 리드 프레임은 접착 조인트에 의해 카드식 부재로 접속된다. 접착 조인트는 두개의 접착 부재로 접착된 가요성 중간 층을 가진 다중층 접착제를 포함하며, 외부층을 통하여, 한편으로는 리드 프레임, 다른 한편으로는 카드식 부재를 포함한다. 이 외부층은 용해된 접착제를 포함한다. 이 구조의 불리한 점은 접착 조인트가 예를 들면, 칩 카드식 구조에서 밴딩 압력을 수용하는 가요성 구조이지만, 적절한 내구성을 가지지는 못한다.
본 발명은 접착층에 의해 제 1 금속 보디를 플라스틱 보디에 접속하는 접착 조인트에 관한 것으로 접착층은 아크릴로 이루어진 가요성 코어층 및 각각 제 1 보디와 플라스틱 보디에 인접한 용해된 접착제로 이루어진 외부층을 포함하며 전이층은 각각 외부층 사이에 배치되는 다중층 구조에 관한 것으로, 특히 이 접착 조인트를 사용한 카드식 구조에 관한 것이다.
도 1은 본 발명에 따른 접착 조인트의 기본 구조를 도시한다.
도 2는 리드 프레임 모듈을 가진 카드식 배치를 도시한다.
본 발명의 목적은 내구성을 향상시키기 위해 접착 조인트에 서로 결합되는 카드식 부재 및 반도체 모듈을 제공하는 것이다.
이 목적은 본 발명에 따라 아크릴 코어층 및 접착 부재에 인접한 외부층 사이에서 전이층을 가진 접착층에 의해 달성된다. 이 방법에 의해, 용해된 접착제 및 중간층 사이의 내구적이면서 긴밀한 접착은 보호될 수 있다.
본 발명은 도면을 참조로 하여 이하에서 상세히 설명된다.
도 1에 확대된 원 A안에서 접착 조인트의 구조가 자세히 도시되어 있다. 코어층(4)은 아크릴을 포함한다. 이 코어층(4)은 양쪽면에서 전이층(3)이 제공되며, PET(폴리에틸렌 테레프탈레이트) 필름 및 폴리카보네이트 플름은 모두 전이층에 사용될 수 있다. 이 전이층(3)은 외부층(2)에 접합되고 용해된 접착제를 포함한다. 외부층(2)은 서로 접속된 접착 부재에 대하여 직접 접촉층을 형성한다. 도 1의 확대되지 않은 부분에서, 한 접착 부재는 플라스틱을 포함하는 카드식 부재에 의해 형성되며 다른 접착 부재는 반도체 칩(6)을 지지하는 지지 부재(1)에 의해 형성된다. 이 지지 부재는 대체로 금속 리드 프레임이거나 에폭시 수지 유리 섬유 보강 조직 또는 세라믹으로 이루어진 모듈 이동체(carrier)일 수 있다.
도 2는 플라스틱으로 이루어진 카드식 부재(5)를 포함하는 카드식 구조 및 금속 전도성 리드 프레임으로 이루어진 지지 부재(1')를 포함하는 모듈을 나타낸다. 도 2에 도시된 바와 같이, 본드(8)는 반도체 칩(6) 및 리드 프레임(1') 사이에서 제공된다. 반도체 칩(6) 및 본드(8)는 커버링(7)에 의해 전체가 커버된다. 리드 프레임(1')은 접착 조인트(V)에 의해 카드식 부재(5)로 접속되고, 접착 조인트(V)는 도 1의 확대된 부분과 동일한 구조를 갖는다.

Claims (7)

  1. 아크릴로 이루어진 가요성 코어층(4) 및 각각 제 1 보디(1)와 플라스틱 보디(5)에 인접한 용해된 접착제로 이루어진 외부층(2)을 가진 다중층 구조를 포함하는 접착층(V)에 의해 제 1 재료의 보디(1)를 플라스틱 보디(5)에 접속하는 접착 조인트에 있어서, 전이층(3)은 각각 상기 외부층(2) 사이에 배치되는 것을 특징으로 하는 접착 조인트.
  2. 제 1 항에 있어서, 상기 전이층(3)은 PET 필름을 포함하는 것을 특징으로 하는 접착 조인트.
  3. 제 1 항에 있어서, 상기 전이층(3)은 폴리카보네이트 필름을 포함하는 것을 특징으로 하는 접착 조인트.
  4. 반도체 칩(6)을 지지하는 상기 지지 부재(1,1') 및 플라스틱으로 이루어진 상기 카드식 부재(5)를 가지며, 상기 지지 부재(1,1')는 제 1 항 내지 3 항중 어느 한 항의 접착 조인트에 의해 상기 카드식 부재(5)로 접속되는 것을 특징으로 하는 칩 카드식 구조물.
  5. 제 4 항에 있어서, 상기 지지 부재(1,1')는 전기적으로 도전성인 것을 특징으로 하는 카드식 구조.
  6. 제 4 항에 있어서, 상기 지지 부재(1)는 에폭시-수지 유리-섬유-보강 조직을 포함하는 것을 특징으로 하는 카드식 구조.
  7. 제 4 항에 있어서, 상기 지지 부재(1)는 세라믹 물질을 포함하는 것을 특징으로 하는 카드식 구조.
KR10-1999-7010554A 1997-05-15 1998-04-28 접착 조인트 KR100526595B1 (ko)

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DE29708687U DE29708687U1 (de) 1997-05-15 1997-05-15 Klebeverbindung
DE29708687.1 1997-05-15
PCT/DE1998/001176 WO1998051488A1 (de) 1997-05-15 1998-04-28 Klebeverbindung

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US (1) US6469902B1 (ko)
EP (1) EP0981435B1 (ko)
JP (1) JP3502396B2 (ko)
KR (1) KR100526595B1 (ko)
CN (1) CN1134339C (ko)
AT (1) ATE204809T1 (ko)
BR (1) BR9809618A (ko)
DE (2) DE29708687U1 (ko)
ES (1) ES2163871T3 (ko)
RU (1) RU2180138C2 (ko)
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JP3404446B2 (ja) * 1996-04-24 2003-05-06 シャープ株式会社 テープキャリアパッケージ及びそのテープキャリアパッケージを備えた液晶表示装置
JP3676074B2 (ja) * 1997-03-14 2005-07-27 Tdk株式会社 ホットメルト材およびラミネート体とその製造方法

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RU2180138C2 (ru) 2002-02-27
EP0981435A1 (de) 2000-03-01
UA51788C2 (uk) 2002-12-16
US6469902B1 (en) 2002-10-22
EP0981435B1 (de) 2001-08-29
ATE204809T1 (de) 2001-09-15
KR100526595B1 (ko) 2005-11-08
CN1255890A (zh) 2000-06-07
CN1134339C (zh) 2004-01-14
ES2163871T3 (es) 2002-02-01
BR9809618A (pt) 2000-07-04
JP3502396B2 (ja) 2004-03-02
JP2000512418A (ja) 2000-09-19
DE29708687U1 (de) 1997-07-24
DE59801324D1 (de) 2001-10-04
WO1998051488A1 (de) 1998-11-19

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