ES2163871T3 - Union por encolado. - Google Patents
Union por encolado.Info
- Publication number
- ES2163871T3 ES2163871T3 ES98932020T ES98932020T ES2163871T3 ES 2163871 T3 ES2163871 T3 ES 2163871T3 ES 98932020 T ES98932020 T ES 98932020T ES 98932020 T ES98932020 T ES 98932020T ES 2163871 T3 ES2163871 T3 ES 2163871T3
- Authority
- ES
- Spain
- Prior art keywords
- encolado
- union
- adhesive
- outer layers
- core layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
- G06K19/041—Constructional details
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Credit Cards Or The Like (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Materials For Medical Uses (AREA)
- Orthopedics, Nursing, And Contraception (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Unión por encolado, que une por medio de una capa de pegamento (V) un cuerpo (1) de un primer material con un cuerpo de material plástico (5), teniendo la capa de pegamento (V) una configuración compuesta de varias capas, que consta de una capa central flexible (4) y capas de borde (2), que limitan respectivamente cada una de ellas con el primer cuerpo (1) o con el cuerpo de plástico (5) y que constan de un material termoadhesivo, caracterizada porque entre la capa central y cada una de las capas de borde (2) está situada respectivamente una capa de transición (3) y porque la capa central consta de acrilato.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29708687U DE29708687U1 (de) | 1997-05-15 | 1997-05-15 | Klebeverbindung |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2163871T3 true ES2163871T3 (es) | 2002-02-01 |
Family
ID=8040414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES98932020T Expired - Lifetime ES2163871T3 (es) | 1997-05-15 | 1998-04-28 | Union por encolado. |
Country Status (12)
Country | Link |
---|---|
US (1) | US6469902B1 (es) |
EP (1) | EP0981435B1 (es) |
JP (1) | JP3502396B2 (es) |
KR (1) | KR100526595B1 (es) |
CN (1) | CN1134339C (es) |
AT (1) | ATE204809T1 (es) |
BR (1) | BR9809618A (es) |
DE (2) | DE29708687U1 (es) |
ES (1) | ES2163871T3 (es) |
RU (1) | RU2180138C2 (es) |
UA (1) | UA51788C2 (es) |
WO (1) | WO1998051488A1 (es) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7030316B2 (en) * | 2004-01-30 | 2006-04-18 | Piranha Plastics | Insert molding electronic devices |
US7193161B1 (en) * | 2006-02-15 | 2007-03-20 | Sandisk Corporation | SiP module with a single sided lid |
US7440285B2 (en) | 2006-12-29 | 2008-10-21 | Piranha Plastics, Llc | Electronic device housing |
DE102011006622A1 (de) * | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | Elektronikmodul sowie Verfahren zu dessen Herstellung |
DE102011006632A1 (de) * | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | Elektronikmodul |
LT6416B (lt) | 2016-02-15 | 2017-07-10 | Alvydas MARKAUSKAS | Buitinė biohumuso kompostinė |
DE102016011750A1 (de) * | 2016-09-29 | 2018-03-29 | Ceramtec-Etec Gmbh | Datenträger aus Keramik |
CN106535520B (zh) * | 2016-10-12 | 2022-05-03 | 歌尔光学科技有限公司 | 功能陶瓷背板制备方法 |
DE102017004499A1 (de) | 2017-05-10 | 2018-11-15 | Giesecke+Devrient Mobile Security Gmbh | Elastischer Trägerfilm |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3629223A1 (de) * | 1986-08-28 | 1988-03-10 | Fraunhofer Ges Forschung | Bauplatte im schichtenaufbau und verfahren zu ihrer herstellung |
DE9110057U1 (es) * | 1991-08-14 | 1992-02-20 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
US5917705A (en) * | 1994-04-27 | 1999-06-29 | Siemens Aktiengesellschaft | Chip card |
DE4441931C1 (de) * | 1994-04-27 | 1995-07-27 | Siemens Ag | Chipkarte |
JP3270807B2 (ja) * | 1995-06-29 | 2002-04-02 | シャープ株式会社 | テープキャリアパッケージ |
US6010768A (en) * | 1995-11-10 | 2000-01-04 | Ibiden Co., Ltd. | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler |
DE19543427C2 (de) * | 1995-11-21 | 2003-01-30 | Infineon Technologies Ag | Chipmodul, insbesondere zum Einbau in eine Chipkarte |
JP3404446B2 (ja) * | 1996-04-24 | 2003-05-06 | シャープ株式会社 | テープキャリアパッケージ及びそのテープキャリアパッケージを備えた液晶表示装置 |
JP3676074B2 (ja) * | 1997-03-14 | 2005-07-27 | Tdk株式会社 | ホットメルト材およびラミネート体とその製造方法 |
-
1997
- 1997-05-15 DE DE29708687U patent/DE29708687U1/de not_active Expired - Lifetime
-
1998
- 1998-04-28 CN CNB988051087A patent/CN1134339C/zh not_active Expired - Fee Related
- 1998-04-28 ES ES98932020T patent/ES2163871T3/es not_active Expired - Lifetime
- 1998-04-28 BR BR9809618-4A patent/BR9809618A/pt not_active IP Right Cessation
- 1998-04-28 WO PCT/DE1998/001176 patent/WO1998051488A1/de active IP Right Grant
- 1998-04-28 UA UA99116186A patent/UA51788C2/uk unknown
- 1998-04-28 RU RU99127355/09A patent/RU2180138C2/ru not_active IP Right Cessation
- 1998-04-28 DE DE59801324T patent/DE59801324D1/de not_active Expired - Lifetime
- 1998-04-28 JP JP54867498A patent/JP3502396B2/ja not_active Expired - Fee Related
- 1998-04-28 EP EP98932020A patent/EP0981435B1/de not_active Expired - Lifetime
- 1998-04-28 KR KR10-1999-7010554A patent/KR100526595B1/ko not_active IP Right Cessation
- 1998-04-28 AT AT98932020T patent/ATE204809T1/de active
-
1999
- 1999-11-15 US US09/440,409 patent/US6469902B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6469902B1 (en) | 2002-10-22 |
RU2180138C2 (ru) | 2002-02-27 |
DE59801324D1 (de) | 2001-10-04 |
WO1998051488A1 (de) | 1998-11-19 |
JP3502396B2 (ja) | 2004-03-02 |
BR9809618A (pt) | 2000-07-04 |
UA51788C2 (uk) | 2002-12-16 |
EP0981435A1 (de) | 2000-03-01 |
KR20010039511A (ko) | 2001-05-15 |
KR100526595B1 (ko) | 2005-11-08 |
DE29708687U1 (de) | 1997-07-24 |
EP0981435B1 (de) | 2001-08-29 |
CN1255890A (zh) | 2000-06-07 |
CN1134339C (zh) | 2004-01-14 |
ATE204809T1 (de) | 2001-09-15 |
JP2000512418A (ja) | 2000-09-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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