CN1134339C - 粘接连接和在采用这样粘接连接的条件下的卡装置 - Google Patents

粘接连接和在采用这样粘接连接的条件下的卡装置 Download PDF

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CN1134339C
CN1134339C CNB988051087A CN98805108A CN1134339C CN 1134339 C CN1134339 C CN 1134339C CN B988051087 A CNB988051087 A CN B988051087A CN 98805108 A CN98805108 A CN 98805108A CN 1134339 C CN1134339 C CN 1134339C
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CN1255890A (zh
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E·海尼曼
R·赫恩
F·皮施纳
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Infineon Technologies AG
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/4809—Loop shape
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

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  • Credit Cards Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Materials For Medical Uses (AREA)
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Abstract

在此涉及用粘接层(V)将一种第一材料的物体(1)与塑料物体(5)连接的一种粘接连接，在此粘接层(V)具有由丙烯酸酯的柔性核心层(4)和热粘接剂的边缘层(2)组合而成的一种多层构造，这些边缘层各自界靠到第一物体(1)上，或塑料物体(5)上，并且在此粘接连接上在边缘层(2)之间各自布置了一个过渡层(3)。

Description

粘接连接和在采用这样粘接连接的条件下的卡装置
技术领域
本发明涉及用一个粘接层将一个金属引线架、环氧树脂玻璃纤维加强的织物或陶瓷材料制成的模块载体与一个塑料物体连接的粘接连接，其中粘接层具有由丙烯酸酯构成的一个柔性核心层和热粘接剂制的边缘层组合而成的一种多层构造，这些边缘层各自附靠到所述模块载体或塑料物体上；本发明还涉及在采用这样粘接连接的条件下的一种卡装置。
背景技术
从DE 44 41 931 C1中公开了在其上半导体模块与芯片卡元件连接的一种粘接连接。半导体模块由一个承载元件，在其上固定了半导体芯片的一个所谓的引线架组成。半导体芯片上的接点是用压焊连接固定在引线架上的，引线架是用一种粘接连接与卡元件连接的。粘接连接由具有一个柔性中间层的多层粘接剂制成，此中间层是经一个边缘层与一方面由引线架和另一方面由卡元件组成的两个粘接搭配连接的。这些边缘层又以有利的方式由一种热粘接剂制成。这个装置的缺点在于，粘接连接虽然是柔性的，以便在芯片卡装置中例如适应弯曲负荷，可是不具有足够的耐久性。
发明内容
因此基于本发明的任务在于，使得一种粘接连接或由用一种粘接连接拼合的一个半导体模块和一个卡元件制成的芯片卡装置配备有改善的耐久性。
按本发明由此来解决此任务，即在丙烯酸酯制的核心层和附靠到这些粘接搭配上的边缘层之间的粘接层具有一个由PET薄膜或聚碳酸酯薄膜制成的过渡层。以此方式保证了在熔化粘接剂和中间层之间的耐久和内在的连接。
附图说明
以下用实施例根据图详述本发明。
图1示出按本发明粘接连接的基本构造，和
图2示出具有引线架模块的一种卡装置。
具体实施方式
图1中表示了一个装置，在此装置上在放大圆A中表示了粘接连接的细节。在此安排了由丙烯酸酯制的一个核心层4。此核心层4在两侧配备了过渡层3，在此对于此过渡层是既可采用PET(聚乙烯对酞酸酯)薄膜，也可采用聚碳酸酯薄膜的。又是由一种熔化粘接剂制的边缘层2是堆敷在这些过渡层3上的。这些边缘层2又形成对互相连接的粘接搭配的直接接触层。在图1的未放大的图示中由塑料的卡元件形成其中的一个粘接搭配。另外的粘接搭配是承载一个半导体芯片6的承载元件1。此承载元件基本上可以是一个金属的引线架，或者也可以是由环氧树脂玻璃纤维加强的织物，或甚至由陶瓷制成的一个模块载体。
图2中表示了一个装置，在此装置上卡装置又由塑料的一个卡元件5组成，在此模块由金属导电的引线架构造的一个承载元件1’组成。如图2中所示，在半导体芯片6和引线架1’之间安排了压焊连接8。半导体芯片6和压焊连接8是总的由一个护板7覆盖的。引线架1’又用一种粘接连接V与卡元件5连接的，在此此粘接连接V具有如在图1的放大A中所示的一种构造。

Claims (3)

1.用一个粘接层(V)将一个金属引线架、环氧树脂玻璃纤维加强的织物或陶瓷材料制成的模块载体(1)与一个塑料物体(5)连接的粘接连接，其中粘接层(V)具有由丙烯酸酯构成的一个柔性核心层(4)和热粘接剂制的边缘层(2)组合而成的一种多层构造，这些边缘层各自附靠到所述模块载体(1)上，或塑料物体(5)上，其特征在于，在所述边缘层(2)之间各自布置了一个由PET薄膜或聚碳酸酯薄膜制成的过渡层(3)。
2.具有承载一个半导体芯片(6)的一个金属引线架、环氧树脂玻璃纤维加强的织物或陶瓷材料制成的模块载体(1；1’)和由塑料制成的一个卡元件(5)的芯片卡装置，其中所述模块载体(1；1’)是用按权利要求1所述的一种粘接连接与卡元件(5)连接的。
3.按权利要求2所述的卡装置，其特征在于，所述模块载体(1；1’)是导电的。
CNB988051087A 1997-05-15 1998-04-28 粘接连接和在采用这样粘接连接的条件下的卡装置 Expired - Fee Related CN1134339C (zh)

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DE (2) DE29708687U1 (zh)
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US7440285B2 (en) 2006-12-29 2008-10-21 Piranha Plastics, Llc Electronic device housing
DE102011006622A1 (de) * 2011-04-01 2012-10-04 Robert Bosch Gmbh Elektronikmodul sowie Verfahren zu dessen Herstellung
DE102011006632A1 (de) * 2011-04-01 2012-10-04 Robert Bosch Gmbh Elektronikmodul
LT6416B (lt) 2016-02-15 2017-07-10 Alvydas MARKAUSKAS Buitinė biohumuso kompostinė
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DE102017004499A1 (de) 2017-05-10 2018-11-15 Giesecke+Devrient Mobile Security Gmbh Elastischer Trägerfilm

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JP3676074B2 (ja) * 1997-03-14 2005-07-27 Ｔｄｋ株式会社 ホットメルト材およびラミネート体とその製造方法

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US6469902B1 (en) 2002-10-22
RU2180138C2 (ru) 2002-02-27
DE59801324D1 (de) 2001-10-04
WO1998051488A1 (de) 1998-11-19
JP3502396B2 (ja) 2004-03-02
BR9809618A (pt) 2000-07-04
UA51788C2 (uk) 2002-12-16
ES2163871T3 (es) 2002-02-01
EP0981435A1 (de) 2000-03-01
KR20010039511A (ko) 2001-05-15
KR100526595B1 (ko) 2005-11-08
DE29708687U1 (de) 1997-07-24
EP0981435B1 (de) 2001-08-29
CN1255890A (zh) 2000-06-07
ATE204809T1 (de) 2001-09-15
JP2000512418A (ja) 2000-09-19

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