KR20010015363A - 적층 세라믹 콘덴서 - Google Patents
적층 세라믹 콘덴서 Download PDFInfo
- Publication number
- KR20010015363A KR20010015363A KR1020000041291A KR20000041291A KR20010015363A KR 20010015363 A KR20010015363 A KR 20010015363A KR 1020000041291 A KR1020000041291 A KR 1020000041291A KR 20000041291 A KR20000041291 A KR 20000041291A KR 20010015363 A KR20010015363 A KR 20010015363A
- Authority
- KR
- South Korea
- Prior art keywords
- internal electrodes
- ceramic
- laminate
- electrodes
- internal
- Prior art date
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 39
- 239000000919 ceramic Substances 0.000 claims abstract description 73
- 239000002245 particle Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 abstract description 19
- 239000011800 void material Substances 0.000 abstract description 5
- 230000008602 contraction Effects 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 23
- 238000010304 firing Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 229920000178 Acrylic resin Polymers 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 4
- 229910002113 barium titanate Inorganic materials 0.000 description 4
- 229920001249 ethyl cellulose Polymers 0.000 description 4
- 235000019325 ethyl cellulose Nutrition 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 230000008707 rearrangement Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims (3)
- 세라믹층(7)과 내부 전극(5, 6)이 교대로 적층된 적층체(3)와, 이 적층체(3)의 단부에 마련된 외부 전극(2)을 포함하고, 상기 내부 전극(5, 6)은 세라믹층(7)의 서로 대향하는 적어도 한 쌍의 가장자리의 어느 한 쪽으로 각각 연장됨으로써 적층체(3)의 대향하는 단면에서 각각 도출되고, 적층체(3)의 단면에 도출된 상기 내부 전극(5, 6)이 상기 외부 전극(2)과 각각 접속되어 있는 적층 세라믹 콘덴서에 있어서,적층체(3)의 내부에서 대향하는 내부 전극(5, 6)에, 부분적으로 도체 입자(8)도 세라믹 입자(10)도 존재하지 않는 공극부(9)를 마련한 것을 특징으로 하는 적층 세라믹 콘덴서.
- 제 1 항에 있어서,내부 전극(5, 6)내에 존재하는 공극부(9)는 내부 전극(5, 6)의 면적의 25% 내지 75%를 점유하는 것을 특징으로 하는 적층 세라믹 콘덴서.
- 제 1 항 내지 제 2 항 중 어느 한 항에 있어서,상기 내부 전극(5, 6)의 막 두께가 3 ㎛ 이하인 것을 특징으로 하는 적층 세라믹 콘덴서.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1999-205588 | 1999-07-21 | ||
JP11205588A JP2001035747A (ja) | 1999-07-21 | 1999-07-21 | 積層セラミックコンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010015363A true KR20010015363A (ko) | 2001-02-26 |
KR100676035B1 KR100676035B1 (ko) | 2007-01-29 |
Family
ID=16509377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000041291A KR100676035B1 (ko) | 1999-07-21 | 2000-07-19 | 적층 세라믹 콘덴서 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2001035747A (ko) |
KR (1) | KR100676035B1 (ko) |
CN (1) | CN100466120C (ko) |
HK (1) | HK1032664A1 (ko) |
TW (1) | TW452807B (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4560765B2 (ja) * | 2003-12-05 | 2010-10-13 | 株式会社村田製作所 | 積層型電子部品の製造方法 |
WO2006068245A1 (ja) * | 2004-12-24 | 2006-06-29 | Murata Manufacturing Co., Ltd | 積層型圧電セラミック部品、及び積層型圧電セラミック部品の製造方法 |
JP4896642B2 (ja) * | 2006-09-12 | 2012-03-14 | Tdk株式会社 | 積層コンデンサ及び電子機器 |
JP4809173B2 (ja) * | 2006-09-27 | 2011-11-09 | 京セラ株式会社 | 積層セラミックコンデンサ |
JP5158061B2 (ja) * | 2009-11-30 | 2013-03-06 | Tdk株式会社 | 薄膜コンデンサ |
KR101508503B1 (ko) * | 2010-08-18 | 2015-04-07 | 다이요 유덴 가부시키가이샤 | 적층형 세라믹 전자 부품 |
CN105530965B (zh) | 2014-01-22 | 2018-07-24 | 翰昂系统株式会社 | 光触媒装置和具有该光触媒装置的车用空调 |
CN105354136B (zh) | 2015-09-25 | 2018-06-15 | 华为技术有限公司 | 一种调试方法、多核处理器和调试设备 |
DE202016102203U1 (de) * | 2016-04-26 | 2016-06-29 | Epcos Ag | Vielschichtbauelement |
JP7040206B2 (ja) * | 2018-03-27 | 2022-03-23 | Tdk株式会社 | 積層セラミック電子部品 |
JP7416021B2 (ja) * | 2021-06-16 | 2024-01-17 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP7548181B2 (ja) | 2021-09-30 | 2024-09-10 | 株式会社村田製作所 | 積層セラミックコンデンサ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0423309A (ja) * | 1990-05-14 | 1992-01-27 | Hitachi Aic Inc | 積層セラミックコンデンサ |
JPH06349674A (ja) * | 1993-06-14 | 1994-12-22 | Murata Mfg Co Ltd | 金属膜支持体及びセラミックグリーンシート供給体並びに電子部品用セラミック積層体 |
JPH07326537A (ja) * | 1994-05-30 | 1995-12-12 | Murata Mfg Co Ltd | セラミック積層電子部品の製造方法 |
JPH0855753A (ja) * | 1994-08-10 | 1996-02-27 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ及びその製造方法 |
JPH11340074A (ja) * | 1998-05-28 | 1999-12-10 | Matsushita Electric Ind Co Ltd | 粒界絶縁型積層半導体コンデンサの製造方法 |
JP4023309B2 (ja) * | 2002-12-19 | 2007-12-19 | 株式会社大真空 | 圧電振動子の製造装置及びその製造方法 |
-
1999
- 1999-07-21 JP JP11205588A patent/JP2001035747A/ja active Pending
-
2000
- 2000-06-28 TW TW089112762A patent/TW452807B/zh not_active IP Right Cessation
- 2000-07-10 CN CNB001203320A patent/CN100466120C/zh not_active Expired - Lifetime
- 2000-07-19 KR KR1020000041291A patent/KR100676035B1/ko active IP Right Grant
-
2001
- 2001-05-08 HK HK01103230.3A patent/HK1032664A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1032664A1 (en) | 2001-07-27 |
TW452807B (en) | 2001-09-01 |
CN1282085A (zh) | 2001-01-31 |
JP2001035747A (ja) | 2001-02-09 |
CN100466120C (zh) | 2009-03-04 |
KR100676035B1 (ko) | 2007-01-29 |
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