KR19990077827A - 전자부품용 콘택터 및 그 제조방법 및 콘택터 제조장치 - Google Patents
전자부품용 콘택터 및 그 제조방법 및 콘택터 제조장치 Download PDFInfo
- Publication number
- KR19990077827A KR19990077827A KR1019990008305A KR19990008305A KR19990077827A KR 19990077827 A KR19990077827 A KR 19990077827A KR 1019990008305 A KR1019990008305 A KR 1019990008305A KR 19990008305 A KR19990008305 A KR 19990008305A KR 19990077827 A KR19990077827 A KR 19990077827A
- Authority
- KR
- South Korea
- Prior art keywords
- contactor
- conductive member
- forming
- contact electrode
- bump
- Prior art date
Links
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Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- G—PHYSICS
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- G01R1/067—Measuring probes
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- G01R1/06744—Microprobes, i.e. having dimensions as IC details
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- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
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- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
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- H01L2224/11—Manufacturing methods
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
Claims (56)
- 전자부품에 형성되어 있는 단자가 압접됨으로써 전기적으로 접속되는 전자부품용 콘택터에 있어서,전기적 절연재료로 되고, 탄성변형 가능한 구성으로 된 절연기판과,상기 절연기판 위의 상기 단자와 대응한 위치에 형성된 전극패드와,상기 전극패드 위에 도전성을 갖는 와이어상 부재를 접합함으로써 형성된 콘택트 전극을 구비한 것을 특징으로 하는 전자부품용 콘택터.
- 제1항에 있어서,상기 와이어상 부재로서 상기 전자부품에 형성되어 있는 단자보다도 경도가 높은 재료를 사용한 것을 특징으로 하는 전자부품용 콘택터.
- 제1항에 있어서,상기 와이어상 부재의 재료로서, VllI족 금속원소에 포함되는 어느 한 금속을 사용한 것을 특징으로 하는 전자부품용 콘택터.
- 제1항에 있어서,상기 와이어상 부재의 재료로서 VllI족 금속원소에 포함되는 어느 한 금속을 주성분으로서 함유하는 Vlll족 금속계 합금을 사용한 것을 특징으로 하는 전자부품용 콘택터.
- 제1항에 있어서,상기 와이어상 부재의 재료로서 금(Au)을 주성분으로서 포함하는 합금을 사용한 것을 특징으로 하는 전자부품용 콘택터.
- 제5항에 있어서,상기 와이어상 부재의 재료로서 금(Au)과 은(Ag)의 합금을 사용한 것을 특징으로 하는 전자부품용 콘택터.
- 제1항 내지 제6항중 어느 한항에 있어서,상기 절연기판을 폴리이미드 수지로 된 박막으로 형성하는 동시에, 상기 전극패드를 동막으로 형성한 것을 특징으로 하는 전자부품용 콘택트.
- 전자부품에 형성되어 있는 단자가 압접됨으로써 전기적으로 접속되는 콘택트 전극을 절연기판에 형성된 전극패드 위에 형성하여 전자부품용 콘택터를 제조하는 전자부품용 콘택터의 제조방법에 있어서,우선 상기 전극패드의 상부에 도전성을 갖는 와이어상 부재를 접합하여 제l 범프를 형성하는 제1 범프 형성공정과,상기 제1 범프 형성공정 종료후, 상기 제1 범프의 상부에 상기 제1 범프 형성공정에서 사용한 것과 같은 재료의 와이어상 부재를 접합하여 상기 제1 범프와 거의 동일 형상의 단수 또는 복수의 제2 범프를 상기 제1 범프 위에 형성하는 제2 범프 형성공정을 갖는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 전자부품에 형성되어 있는 단자가 압접됨으로써 전기적으로 접속되는 콘택트 전극을 절연기판에 형성된 전극패드 위에 형성하여 전자부품용 콘택터를 제조하는 전자부품용 콘택터의 제조방법에 있어서,우선 상기 전극패드 상부에 도전성을 갖는 와이어상 부재를 접합하여 제1 범프를 형성하는 제1 범프 형성공정과,상기 제1 범프 형성공정 종료후, 상기 제 l 범프 상부에 상기 제1 범프 형성공정에서 사용한 것과 다른 재료의 와이어상 부재를 접합함으로써, 상기 제1 범프와 다른 형상의 제2 범프를 상기 제1 범프 위에 형성하는 제2 범프 형성공정을 갖는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 전자부품에 형성되어 있는 단자가 압접됨으로써 전기적으로 접속되는 콘택트 전극을 절연기판에 형성된 전극패드 위에 형성하여 전자부품용 콘택터를 제조하는 전자부품용 콘택터의 제조방법에 있어서,우선 상기 전극패드의 상부에 도전성을 갖는 와이어상 부재를 접합하여 범프를 형성하는 범프 형성공정과,상기 범프 형성공정 종료후, 성형툴을 사용하여 상기 범프에 성형처리를 하여 소정 형상의 상기 콘택트 전극을 형성하는 성형공정을 갖는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제10항에 있어서,상기 성형공정을 실시할 때 상기 성형툴에 가압력뿐만 아니라, 동시에 상기 범프를 연화시키는 에너지를 인가하고 성형처리를 행하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 전자부품에 형성되어 있는 단자가 압접됨으로써 전기적으로 접속되는 콘택트 전극을 절연기판에 형성된 전극패드 위에 형성하여 전자부품용 콘택터를 제조하는 전자부품용 콘택터의 제조방법에 있어서,우선 상기 전극패드의 상부에 도전성을 갖는 와이어상 부재를 접합하여 제1 범프를 형성하는 제1 범프 형성공정과,상기 제1 범프 형성공정의 종료후, 성형툴을 사용하여 상기 제1 범프를 소정 형상으로 성형처리하는 성형공정과,상기 성형공정의 종료후, 상기 제1 범프의 상부에 와이어상 부재를 접합함으로써, 제2 범프를 상기 제1 범프 위에 형성하는 제2 범프 형성공정을 갖는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제10항 내지 제12항 중 어느 한항에 있어서,상기 성형공정에서 상기 성형툴로서 인접하는 상기 범프에 접촉되지 않도록 끝이 가는 형상으로 된 것을 사용하고,또한, 상기 성형처리를 복수 형성된 각 범프에 대하여 하나씩 성형처리하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제10항 내지 제12항 중 어느 한항에 있어서,상기 성형공정에서 상기 성형툴로서 복수의 상기 범프에 일괄적으로 접촉하는 평면도가 높은 성형면을 갖는 것을 사용하고,상기 성형처리를 복수 형성된 각 범프에 대하여 일괄적으로 성형처리 하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제10항 내지 제13항 중 어느 한항에 있어서,상기 성형공정에서 상기 성형툴로서 상기 범프의 중앙 위치에 대향하는 위치에 오목한 캐비티부가 형성되는 동시에 상기 범프의 외주부를 압압하는 압압부가 형성된 것을 사용하고,또한 상기 성형툴에 가압력뿐만 아니라 동시에 상기 범프를 연화시키는 에너지를 인가하여 성형처리를 행하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제10항 내지 제13항 중 어느 한항에 있어서,상기 성형공정에서 상기 성형툴로서 상기 범프의 중앙 위치에 대향하는 위치에 돌출한 볼록부가 형성된 것을 사용하고,또한 상기 성형툴에 가압력뿐만 아니라 동시에 상기 범프를 연화시키는 에너지를 인가하여 성형처리를 행하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제10항 내지 제16항 중 어느 한항에 있어서,상기 성형공정에서 상기 성형툴로서 범프와 대향하는 위치에 복수의 요철을 갖는 요철 형성부가 형성된 것을 사용하고,상기 성형처리를 실시함으로써 상기 요철 형성부가 상기 범프를 가압하고, 상기 콘택트 전극의 표면에 요철을 형성한 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 절연기판에 형성된 전극패드 위에 전자부품에 형성된 단자가 접속되는 콘택트 전극을 형성하여 전자부품용 콘택터를 제조하는 콘택터 제조장치에 있어서,상기 전극패드에 상기 범프를 형성하는 압착헤드와,상기 전극패드에 형성된 범프를 소정 형상으로 성형하여 콘택트 전극을 형성하는 성형툴을 구비하고,상기 압착헤드와 상기 성형툴을 상대적으로 변위불능한 상태로 고정하고, 상기 압착헤드와 상기 성형툴이 연동하여 이동하도록 구성한 것을 특징으로 하는 콘택터 제조장치.
- 전자부품에 형성되어 있는 단자가 압접됨으로써 전기적으로 접속되는 전자부품용 콘택터에 있어서,전기적 절연재료로 되고 탄성변형 가능한 구성으로 된 절연기판과,상기 절연기판 위의 상기 단자와 대응한 위치에 형성된 전극패드와,개편화 된 도전부재로 형성되어 있고, 상기 전극패드 위에 돌출 설치된 콘택트 전극을 구비하는 것을 특징으로 하는 전자부품용 콘택터.
- 제19항에 있어서,상기 도전부재가 상기 전자부품의 단자보다도 경도가 높은 재료로 된 것을 특징으로 하는 전자부품용 콘택터.
- 제19항 또는 제20항에 있어서,상기 절연기판이 탄성변형 가능한 플렉시블기판으로 된 것을 특징으로 하는 전자부품용 콘택터.
- 제19항 내지 제21항 중 어느 한항에 있어서,상기 콘택트 전극을 복수개 적층한 구성으로 한 것을 특징으로 하는 전자부품용 콘택터.
- 제22항에 있어서,이질의 상기 콘택트 전극을 복수개 적층한 것을 특징으로 하는 전자부품용 콘택터.
- 제19항 내지 제23항 중 어느 한항에 있어서,상기 콘택트 전극의 상기 단자가 압접되는 부위에 오목부 및/ 또는 볼록부를 형성한 것을 특징으로 하는 전자부품용 콘택터.
- 제19항 내지 제24항 중 어느 한항에 있어서,상기 콘택트 전극의 표면에 경화층을 형성하여 된 것을 특징으로 하는 전자부품용 콘택터.
- 제25항에 있어서,상기 경화층은 도전성 금속으로 된 도금막인 것을 특징으로 하는 전자부품용 콘택터.
- 전자부품에 형성되어 있는 단자가 압접됨으로써 전기적으로 접속되는 콘택트 전극을 절연기판에 형성된 전극패드 위에 형성하여 전자부품용 콘택터를 제조하는 전자부품용 콘택터의 제조방법에 있어서,적어도 상기 콘택트 전극이 되는 도전부재를 지지하는 지지기구와, 상기 도전부재를 상기 전극패드에 접합하는 접합기능을 갖는 헤드를 사용하고, 상기 도전부재를 상기 지지기구에 의해 지지하면서 상기 헤드를 이동시킴으로써 상기 도전부재를 상기 전극패드 위로 반송하는 반송공정과,상기 헤드에 의해 상기 도전부재를 상기 전극패드 위에 접합하는 접합 공정과,상기 전극패드 위에 접합된 상기 도전부재에 대하여 성형처리를 함으로써 소정 형상의 상기 콘택트 전극을 형성하는 성형공정을 갖는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제27항에 있어서,상기 반송공정, 상기 접합공정 및 상기 성형공정을 복수회 반복하여 실시하여,적층구조의 콘택트 전극을 형성하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 전자부품에 형성되어 있는 단자가 압접됨으로써 전기적으로 접속되는 콘택트 전극을 절연기판에 형성된 전극패드 위에 형성하여 전자부품용 콘택터를 제조하는 전자부품용 콘택터의 제조방법에 있어서,적어도 상기 콘택트 전극이 되는 도전부재를 지지하는 지지기구와 상기 도전부재를 상기 전극패드에 접합하는 접합기능을 갖는 헤드를 사용하고, 상기 도전부재를 상기 지지기구에 의해 지지하면서 상기 헤드를 이동시킴으로써 제1 도전부재를 상기 전극패드 위에 반송하는 제1 반송공정과,상기 헤드에 의해 상기 제1 도전부재를 상기 전극패드 위에 접합하는 제1 접합 공정을 복수회 반복하여 실시하고,그 후 레벨링툴을 사용하여 상기 제1 도전부재의 높이를 균일화시키는 레벨링 처리를 행하는 레벨링 공정을 실시하고,그 후 상기 헤드를 사용하여 상기 레벨링 된 상기 제1 도전부재상에 제2 도전부재를 반송하는 제2 반송공정과,상기 헤드를 사용하여 상기 제1 도전부재상에 제2 도전부재를 접합하는 제2 접합 공정을 복수회 반복하여 실시하고,그 후 적층된 복수의 도전부재 중 최상부에 위치하는 도전부재에 대하여 성형처리를 함으로써, 소정 형상의 상기 콘택트 전극을 형성하는 성형공정을 실시하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제28항 또는 제29항에 있어서,적층되는 복수의 상기 도전부재가 다른 재질을 포함하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제27항 내지 제30항 중 어느 한항에 있어서,상기 도전부재는 상기 반송공정에서 상기 전극패드 위로 반송되기 전에, 미리 상기 단자에 대응한 크기로 가공되어 있는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제31항에 있어서,상기 도전부재는 구형상을 갖는 구형상 도전부재인 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제27항 내지 제32항 중 어느 한항에 있어서,상기 헤드에 상기 도전부재를 성형하는 기능을 더 갖게 하고, 상기 성형공정에서는 상기 헤드를 사용하여 상기 콘택트 전극을 형성하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제33항에 있어서,상기 헤드로서 인접하는 상기 도전부재에 접촉하지 않도록 끝이 가는 형상으로 된 것을 사용하는 동시에, 상기 도전부재의 개개에 대하여 하나씩 성형처리하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제33항에 있어서,상기 성형공정에서, 상기 헤드로서 복수의 상기 도전부재에 대응한 복수의 상기 캐비티부를 갖는 것을 사용하고, 복수의 상기 도전부재에 대해서 일괄적으로 성형처리하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제33 내지 제35항 중 어느 한항에 있어서,상기 성형공정에서, 상기 헤드로서 상기 도전부재의 중앙 위치에 대향하는 위치에 오목한 캐비티부가 형성되는 동시에 상기 도전부재의 외주부를 압압하는 압압부가 형성된 것을 사용하고,또한 상기 헤드에 가압력뿐만 아니라, 동시에 상기 도전부재를 연화시키는 에너지를 인가하여 성형처리를 하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제33항 내지 제35항중 어느 한항에 있어서,상기 성형공정에서 상기 헤드로서 상기 도전부재의 중앙위치에 대향하는 위치에 돌출한 볼록부가 형성된 것을 사용하고,또한 상기 헤드에 가압력뿐만 아니라 동시에 상기 도전부재를 연화시키는 에너지를 인가하여 성형처리를 하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제33항 내지 제35항중 어느 한항에 있어서,상기 성형공정에서, 상기 헤드로서 상기 도전부재와 대향하는 위치에 복수의 요철을 갖는 요철 형성부가 형성된 것을 사용하고,상기 성형처리를 실시함으로써 상기 요철 형성부가 상기 도전부재를 가압하여, 상기 도전부재의 표면에 요철을 형성하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제27항 내지 제38항중 어느 한항에 있어서,상기 성형처리의 종료후 또는 상기 성형처리와 동시에 실시되고, 형성된 상기 콘택트 전극의 표면을 경화시키는 표면경화처리를 실시하는 표면경화 공정을 갖는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제39항에 있어서,상기 표면경화처리는 상기 헤드에 전압을 인가하여 상기 헤드와 상기 콘택트 전극 사이에 방전을 발생시킴으로써 표면경화시키는 처리인 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제39항에 있어서,상기 표면경화처리는 상기 헤드에 진동을 부여하고, 상기 진동에 의해서 상기 헤드가 상기 콘택트 전극을 두들김으로써 표면경화시키는 처리인 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제39항에 있어서,상기 표면경화처리는 상기 콘택트 전극 표면에 상기 도전부재 보다도 고경도의 금속막을 형성하는 금속도금 처리인 것을 특징으로 하는 전자부품용 콘택트의 제조방법.
- 전자부품에 형성되어 있는 단자가 압접됨으로써 전기적으로 접속되는 콘택트 전극을 절연기판에 형성된 전극패드 위에 형성하여 전자부품용 콘택터를 제조하는 전자부품용 콘택터의 제조방법에 있어서,연화한 상태의 상기 도전부재를 상기 단자에 접속되는 데 적합한 양만 적하함으로써 상기 도전부재를 상기 전극패드 위에 배설하는 배설공정과,상기 전극패드 위에 배설된 상기 도전부재에 대하여 성형처리를 행함으로써 소정 형상의 상기 콘택트 전극을 형성하는 성형공정을 갖는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제43항에 있어서,상기 배설 공정에서는 봉 형상 또는 와이어상의 도전부재에 대하여 상기 도전부재가 용융하는 온도이상으로 가열된 용단헤드로 도전성 재료를 용단하고, 상기 용단헤드에 의해 가열됨으로써 연화한 상기 도전부재를 상기 전극패드 위에 적하하여 배설하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제27항 내지 제32항 또는 제43항 또는 제44항중 어느 한항에 있어서,상기 성형공정에서는 상기 도전부재를 성형하기 위한 캐비티부를 갖는 성형툴을 사용하여 상기 콘택트 전극을 형성하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제45항에 있어서,상기 성형툴로서 인접하는 상기 도전부재에 접촉하지 않도록 끝이 가는 형상으로 된 것을 사용하는 동시에, 상기 도전부재의 개개에 대하여 하나씩 성형처리를 하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제45항에 있어서,상기 성형공정에서 상기 성형툴로서 복수의 상기 도전부재에 대응한 복수의 상기 캐비티부를 가진 것을 사용하여, 복수의 상기 도전부재에 대하여 일괄적으로 성형처리를 하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제45항 내지 제47항 중 어느 한항에 있어서,상기 성형공정에서 상기 성형툴로서 상기 도전부재의 중앙위치에 대향하는 위치에 오목한 캐비티부가 형성되는 동시에 상기 도전부재의 외주부를 압압하는 압압부가 형성된 것을 사용하고,또한 상기 성형툴에 가압력뿐만 아니라 동시에 상기 도전부재를 연화시키는 에너지를 인가하여 성형처리하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제45항 내지 제47항중 어느 한항에 있어서,상기 성형공정에서 상기 성형툴로서 상기 도전부재의 중앙 위치에 대향하는 위치에 돌출한 볼록부가 형성된 것을 사용하고,또한 상기 성형툴에 가압력뿐만 아니라 동시에 상기 도전부재를 연화시키는 에너지를 인가하여 성형처리를 하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제45항 내지 제47항중 어느 한항에 있어서,상기 성형공정에서 상기 성형툴로서 상기 도전부재와 대향하는 위치에 복수의 요철을 갖는 요철 형성부가 형성된 것을 사용하고,상기 성형처리를 실시함으로써 상기 요철 형성부가 상기 도전부재를 가압하여, 상기 도전부재의 표면에 요철을 형성하는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제43항 내지 제50항중 어느 한항에 있어서,상기 성형처리의 종료후 또는 상기 성형처리와 동시에 실시되고, 형성된 상기 콘택트 전극의 표면을 경화시키는 표면경화처리를 실시하는 표면경화 공정을 갖는 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제51항에 있어서,상기 표면경화처리는 상기 성형툴에 전압을 인가하여 상기 성형툴과 상기 콘택트 전극 사이에 방전을 발생시킴으로써 표면경화시키는 처리인 것을 특징으로 하는 전자부품용 콘택터의 제조 방법.
- 제51항에 있어서,상기 표면경화처리는 상기 성형툴에 진동을 가하고, 상기 진동에 의해 상기 성형툴이 상기 콘택트 전극을 두둘김으로써 표면경화시키는 처리인 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 제51항에 있어서,상기 표면경화처리는 상기 콘택트 전극의 표면에 상기 도전부재 보다도 고경도의 금속막을 형성하는 금속 도금 처리인 것을 특징으로 하는 전자부품용 콘택터의 제조방법.
- 절연기판에 형성된 전극패드 위에, 전자부품에 형성된 단자가 접속되는 콘택트 전극을 형성하여 전자부품용 콘택터를 제조하는 콘택터 제조장치 있어서,연화한 상태의 상기 도전부재를 상기 단자에 접속되는데 적합한 양만 상기 전극패드 위에 적하하는 디스펜스 기구와,상기 전극패드에 배설된 상기 도전부재를 소정 형상으로 성형하여 콘택트 전극을 형성하는 성형툴을 구비하는 것을 특징으로 하는 콘택터 제조장치.
- 제55항에 있어서,상기 디스펜스 기구는 봉형상 또는 와이어상의 상기 도전부재와,상기 도전부재를 용단시키기 위한 가열 가능한 용단헤드에 의해 구성되는 것을 특징으로 하는 콘택터 제조장치.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP98-061594 | 1998-03-12 | ||
JP6159498 | 1998-03-12 | ||
JP10139040A JPH11326379A (ja) | 1998-03-12 | 1998-05-20 | 電子部品用コンタクタ及びその製造方法及びコンタクタ製造装置 |
JP98-139040 | 1998-05-20 |
Publications (2)
Publication Number | Publication Date |
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KR19990077827A true KR19990077827A (ko) | 1999-10-25 |
KR100317982B1 KR100317982B1 (ko) | 2001-12-22 |
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KR1019990008305A KR100317982B1 (ko) | 1998-03-12 | 1999-03-12 | 전자부품용 콘택터 및 그 제조방법 및 콘택터 제조장치 |
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US (2) | US6555764B1 (ko) |
JP (1) | JPH11326379A (ko) |
KR (1) | KR100317982B1 (ko) |
TW (1) | TW480690B (ko) |
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EP1557908B1 (en) | 2004-01-05 | 2007-08-15 | Sumitomo Wiring Systems, Ltd. | A connector |
US7118389B2 (en) * | 2004-06-18 | 2006-10-10 | Palo Alto Research Center Incorporated | Stud bump socket |
CN101002311A (zh) * | 2004-07-28 | 2007-07-18 | Sv探针私人有限公司 | 用于在基板上形成共面焊盘的方法和装置 |
US7279917B2 (en) * | 2004-08-26 | 2007-10-09 | Sv Probe Pte Ltd. | Stacked tip cantilever electrical connector |
JP4068610B2 (ja) | 2004-10-01 | 2008-03-26 | 山一電機株式会社 | 半導体装置用キャリアユニットおよびそれを備える半導体装置用ソケット |
JP4709535B2 (ja) * | 2004-11-19 | 2011-06-22 | 株式会社東芝 | 半導体装置の製造装置 |
EP1896377A1 (en) * | 2005-06-17 | 2008-03-12 | Shell Internationale Research Maatschappij B.V. | Modified sulphur and product comprising modified sulphur as binder |
US7326591B2 (en) | 2005-08-31 | 2008-02-05 | Micron Technology, Inc. | Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices |
JP2007142271A (ja) * | 2005-11-21 | 2007-06-07 | Tanaka Electronics Ind Co Ltd | バンプ材料および接合構造 |
JP4848752B2 (ja) * | 2005-12-09 | 2011-12-28 | イビデン株式会社 | 部品実装用ピンを有するプリント配線板及びこれを使用した電子機器 |
JP2007165383A (ja) | 2005-12-09 | 2007-06-28 | Ibiden Co Ltd | 部品実装用ピンを形成したプリント基板 |
JP4654897B2 (ja) | 2005-12-09 | 2011-03-23 | イビデン株式会社 | 部品実装用ピンを有するプリント配線板の製造方法 |
JP2007172697A (ja) * | 2005-12-20 | 2007-07-05 | Fujitsu Ltd | フライングリードの接合方法 |
US7486525B2 (en) * | 2006-08-04 | 2009-02-03 | International Business Machines Corporation | Temporary chip attach carrier |
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DE102011113430A1 (de) * | 2011-09-14 | 2013-03-14 | Osram Opto Semiconductors Gmbh | Verfahren zur temporären elektrischen Kontaktierung einer Bauelementanordnung und Vorrichtung hierfür |
JP5920454B2 (ja) * | 2012-03-15 | 2016-05-18 | 富士電機株式会社 | 半導体装置およびその製造方法 |
TWI395313B (zh) * | 2012-11-07 | 2013-05-01 | Wire technology co ltd | 銲球凸塊結構及其形成方法 |
KR101977270B1 (ko) * | 2016-02-24 | 2019-05-10 | 주식회사 아모텍 | 가이드 결합형 컨택터 및 이를 구비한 휴대용 전자장치 |
CN108701943B (zh) | 2016-02-26 | 2020-02-07 | 阿莫泰克有限公司 | 功能性接触器及包括其的便携式电子装置 |
TWI604487B (zh) * | 2016-08-25 | 2017-11-01 | 緯創資通股份有限公司 | 電子裝置及其壓力感應件 |
TWI613780B (zh) * | 2017-01-25 | 2018-02-01 | 華邦電子股份有限公司 | 半導體結構及其製作方法 |
CN108346640B (zh) | 2017-01-25 | 2020-02-07 | 华邦电子股份有限公司 | 半导体结构及其制作方法 |
DE112018007032T5 (de) * | 2018-02-07 | 2020-10-29 | Mitsubishi Electric Corporation | Keilwerkzeug, Bondvorrichtung und Bondprüfverfahren |
US20230110307A1 (en) * | 2021-10-08 | 2023-04-13 | Watlow Electric Manufacturing Company | Shaped electrical interconnections for multi-layer heater constructions |
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US5765744A (en) | 1995-07-11 | 1998-06-16 | Nippon Steel Corporation | Production of small metal bumps |
KR100186752B1 (ko) * | 1995-09-04 | 1999-04-15 | 황인길 | 반도체 칩 본딩방법 |
US5629837A (en) * | 1995-09-20 | 1997-05-13 | Oz Technologies, Inc. | Button contact for surface mounting an IC device to a circuit board |
JP3138626B2 (ja) | 1995-12-21 | 2001-02-26 | 株式会社双晶テック | プローブユニット |
JPH09274066A (ja) | 1996-02-07 | 1997-10-21 | Fujitsu Ltd | 半導体試験装置及びこれを利用した試験方法及び半導体装置 |
JPH09260417A (ja) | 1996-03-19 | 1997-10-03 | Matsushita Electric Ind Co Ltd | 導電性ボールの接合方法及び導電性ボールの接合装置 |
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1998
- 1998-05-20 JP JP10139040A patent/JPH11326379A/ja active Pending
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1999
- 1999-02-25 TW TW088102865A patent/TW480690B/zh not_active IP Right Cessation
- 1999-03-10 US US09/267,928 patent/US6555764B1/en not_active Expired - Lifetime
- 1999-03-12 KR KR1019990008305A patent/KR100317982B1/ko not_active IP Right Cessation
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2003
- 2003-02-21 US US10/369,711 patent/US7174629B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6555764B1 (en) | 2003-04-29 |
KR100317982B1 (ko) | 2001-12-22 |
JPH11326379A (ja) | 1999-11-26 |
US20030132027A1 (en) | 2003-07-17 |
TW480690B (en) | 2002-03-21 |
US7174629B2 (en) | 2007-02-13 |
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