KR19980086512A - 캡슐화 물질을 가지는 전자부품 조립체 및 그의 형성 방법 - Google Patents

캡슐화 물질을 가지는 전자부품 조립체 및 그의 형성 방법 Download PDF

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Publication number
KR19980086512A
KR19980086512A KR1019980005893A KR19980005893A KR19980086512A KR 19980086512 A KR19980086512 A KR 19980086512A KR 1019980005893 A KR1019980005893 A KR 1019980005893A KR 19980005893 A KR19980005893 A KR 19980005893A KR 19980086512 A KR19980086512 A KR 19980086512A
Authority
KR
South Korea
Prior art keywords
electronic component
trench
edge
masking layer
encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019980005893A
Other languages
English (en)
Korean (ko)
Inventor
씨.셀라야 필립
알.케르 존
Original Assignee
빈센트 비. 인그라시아
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빈센트 비. 인그라시아, 모토로라 인코포레이티드 filed Critical 빈센트 비. 인그라시아
Publication of KR19980086512A publication Critical patent/KR19980086512A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1019980005893A 1997-05-30 1998-02-25 캡슐화 물질을 가지는 전자부품 조립체 및 그의 형성 방법 Ceased KR19980086512A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8/865,652 1997-05-30
US08/865,652 US5808873A (en) 1997-05-30 1997-05-30 Electronic component assembly having an encapsulation material and method of forming the same

Publications (1)

Publication Number Publication Date
KR19980086512A true KR19980086512A (ko) 1998-12-05

Family

ID=25345964

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980005893A Ceased KR19980086512A (ko) 1997-05-30 1998-02-25 캡슐화 물질을 가지는 전자부품 조립체 및 그의 형성 방법

Country Status (5)

Country Link
US (1) US5808873A (https=)
JP (1) JPH10335542A (https=)
KR (1) KR19980086512A (https=)
CN (1) CN1126168C (https=)
MY (1) MY117410A (https=)

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US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
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US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US6018448A (en) 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
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US6127728A (en) * 1999-06-24 2000-10-03 Lsi Logic Corporation Single reference plane plastic ball grid array package
KR20010009350A (ko) * 1999-07-09 2001-02-05 윤종용 기판이 없는 칩 스케일 패키지 및 그 제조방법
US6277672B1 (en) * 1999-09-03 2001-08-21 Thin Film Module, Inc. BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technology
US6483101B1 (en) 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
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US6611055B1 (en) 2000-11-15 2003-08-26 Skyworks Solutions, Inc. Leadless flip chip carrier design and structure
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US6867493B2 (en) * 2000-11-15 2005-03-15 Skyworks Solutions, Inc. Structure and method for fabrication of a leadless multi-die carrier
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CN101370361B (zh) * 2001-06-13 2010-09-08 株式会社电装 埋有电子器件的印刷线路板的制造方法
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Also Published As

Publication number Publication date
JPH10335542A (ja) 1998-12-18
CN1126168C (zh) 2003-10-29
CN1201255A (zh) 1998-12-09
US5808873A (en) 1998-09-15
MY117410A (en) 2004-06-30

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J2X1 Appeal (before the patent court)

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Free format text: TRIAL NUMBER: 2006201009067; APPEAL AGAINST DECISION TO DECLINE REFUSAL

PJ2001 Appeal

St.27 status event code: A-3-3-V10-V12-crt-PJ2001

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000