KR19980032057A - 프로브 카드 및 그것을 이용한 시험장치 - Google Patents
프로브 카드 및 그것을 이용한 시험장치 Download PDFInfo
- Publication number
- KR19980032057A KR19980032057A KR1019970009246A KR19970009246A KR19980032057A KR 19980032057 A KR19980032057 A KR 19980032057A KR 1019970009246 A KR1019970009246 A KR 1019970009246A KR 19970009246 A KR19970009246 A KR 19970009246A KR 19980032057 A KR19980032057 A KR 19980032057A
- Authority
- KR
- South Korea
- Prior art keywords
- probe card
- chip
- bonding pad
- glass substrate
- quartz glass
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 30
- 238000012360 testing method Methods 0.000 title abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims description 20
- 238000003825 pressing Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 8
- 239000004593 Epoxy Substances 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 25
- 238000002788 crimping Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/048—Making electrodes
- H01L21/049—Conductor-insulator-semiconductor electrodes, e.g. MIS contacts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP96-263970 | 1996-10-04 | ||
| JP8263970A JPH10111315A (ja) | 1996-10-04 | 1996-10-04 | プローブカードおよびこれを用いた試験装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19980032057A true KR19980032057A (ko) | 1998-07-25 |
Family
ID=17396757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970009246A KR19980032057A (ko) | 1996-10-04 | 1997-03-19 | 프로브 카드 및 그것을 이용한 시험장치 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH10111315A (zh) |
| KR (1) | KR19980032057A (zh) |
| CN (1) | CN1153269C (zh) |
| DE (1) | DE19717369A1 (zh) |
| TW (1) | TW313688B (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100689180B1 (ko) * | 2006-02-07 | 2007-03-02 | 주식회사 코셈 | 반도체 웨이퍼 검사용 프로브 카드 |
| KR101471778B1 (ko) * | 2013-07-23 | 2014-12-10 | 세메스 주식회사 | 프로브 카드의 탐침과 웨이퍼 사이의 실제 접촉 위치를 검출하기 위한 지그 및 이를 이용하는 실제 접촉 위치 검출 방법 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3326095B2 (ja) | 1996-12-27 | 2002-09-17 | 日本発条株式会社 | 導電性接触子 |
| WO1999004274A1 (en) * | 1997-07-14 | 1999-01-28 | Nhk Spring Co., Ltd. | Conductive contact |
| JP2001033487A (ja) | 1999-07-22 | 2001-02-09 | Mitsubishi Electric Corp | 半導体集積回路テスト用のプローブカードおよびこのプローブカードの製造方法 |
| KR20020054914A (ko) * | 2000-12-28 | 2002-07-08 | 주식회사 현대 디스플레이 테크놀로지 | 티에프티 엘씨디 패널 테스트 유닛 |
| DE10308916A1 (de) * | 2003-02-28 | 2004-09-16 | Infineon Technologies Ag | Anordnung zum elektrischen Kontaktieren eines Substrats |
| JP3757971B2 (ja) * | 2003-10-15 | 2006-03-22 | カシオ計算機株式会社 | 半導体装置の製造方法 |
| WO2005103734A1 (ja) * | 2004-04-27 | 2005-11-03 | Jsr Corporation | シート状プローブおよびその製造方法並びにその応用 |
| DE102004035343A1 (de) * | 2004-07-21 | 2005-09-29 | Infineon Technologies Ag | Kontaktierungskarte, Kontaktierungsvorrichtung und Verfahren zum Kontaktieren von einer auf einer Substratscheibe angeorndeten integrierten Schaltung zum Testen |
| CN1326225C (zh) * | 2004-11-05 | 2007-07-11 | 中国科学院上海微系统与信息技术研究所 | 微机械芯片测试探卡及制造方法 |
| US20060109014A1 (en) * | 2004-11-23 | 2006-05-25 | Te-Tsung Chao | Test pad and probe card for wafer acceptance testing and other applications |
| JP2006292727A (ja) * | 2005-03-18 | 2006-10-26 | Alps Electric Co Ltd | 半導体搬送トレイ、これを用いたバーンインボード、バーンイン試験用の検査装置及びバーンイン試験方法並びに半導体の製造方法 |
| CN1321320C (zh) * | 2005-03-23 | 2007-06-13 | 北京青鸟元芯微系统科技有限责任公司 | 热扩散压阻式mems压力传感器芯片级老化方法 |
| DE102006054734A1 (de) * | 2005-12-05 | 2007-06-06 | Feinmetall Gmbh | Elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings sowie entsprechendes Verfahren |
| JP5221118B2 (ja) * | 2007-12-14 | 2013-06-26 | 東京エレクトロン株式会社 | 検査装置 |
| JP2011095028A (ja) * | 2009-10-28 | 2011-05-12 | Optnics Precision Co Ltd | プローブシート |
| TW201216391A (en) * | 2010-10-11 | 2012-04-16 | Ind Tech Res Inst | Detection method and detection device for LED chips on wafer and transparent probe card thereof |
| JP6218718B2 (ja) * | 2014-10-22 | 2017-10-25 | 三菱電機株式会社 | 半導体評価装置及びその評価方法 |
| CN105044402A (zh) * | 2015-08-25 | 2015-11-11 | 贵州航天计量测试技术研究所 | 一种封装微波压控振荡器测试装置 |
| CN112213612A (zh) * | 2019-07-09 | 2021-01-12 | 刘小伟 | 一种汽车电工电子实训基础电路测试装置 |
| CN111090033A (zh) * | 2019-12-24 | 2020-05-01 | 淮安芯测半导体有限公司 | 一种半导体装置及其探针测试方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05340964A (ja) * | 1992-06-05 | 1993-12-24 | Mitsubishi Electric Corp | ウエハ及びチップの試験装置 |
-
1996
- 1996-10-04 JP JP8263970A patent/JPH10111315A/ja active Pending
-
1997
- 1997-01-31 TW TW086101087A patent/TW313688B/zh active
- 1997-03-19 KR KR1019970009246A patent/KR19980032057A/ko not_active Application Discontinuation
- 1997-04-24 DE DE19717369A patent/DE19717369A1/de not_active Ceased
- 1997-05-23 CN CNB971113009A patent/CN1153269C/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100689180B1 (ko) * | 2006-02-07 | 2007-03-02 | 주식회사 코셈 | 반도체 웨이퍼 검사용 프로브 카드 |
| KR101471778B1 (ko) * | 2013-07-23 | 2014-12-10 | 세메스 주식회사 | 프로브 카드의 탐침과 웨이퍼 사이의 실제 접촉 위치를 검출하기 위한 지그 및 이를 이용하는 실제 접촉 위치 검출 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW313688B (en) | 1997-08-21 |
| CN1153269C (zh) | 2004-06-09 |
| JPH10111315A (ja) | 1998-04-28 |
| DE19717369A1 (de) | 1998-04-09 |
| CN1179006A (zh) | 1998-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| J201 | Request for trial against refusal decision | ||
| AMND | Amendment | ||
| E902 | Notification of reason for refusal | ||
| B601 | Maintenance of original decision after re-examination before a trial | ||
| J301 | Trial decision |
Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 19991229 Effective date: 20010629 |