KR102928049B1 - 세정 장치 및 세정 방법 - Google Patents

세정 장치 및 세정 방법

Info

Publication number
KR102928049B1
KR102928049B1 KR1020227043529A KR20227043529A KR102928049B1 KR 102928049 B1 KR102928049 B1 KR 102928049B1 KR 1020227043529 A KR1020227043529 A KR 1020227043529A KR 20227043529 A KR20227043529 A KR 20227043529A KR 102928049 B1 KR102928049 B1 KR 102928049B1
Authority
KR
South Korea
Prior art keywords
substrate
cleaning
cleaning liquid
tube nozzle
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227043529A
Other languages
English (en)
Korean (ko)
Other versions
KR20230010693A (ko
Inventor
유키 다나카
다케시 이이즈미
다카유키 가지카와
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20230010693A publication Critical patent/KR20230010693A/ko
Application granted granted Critical
Publication of KR102928049B1 publication Critical patent/KR102928049B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2240/00—Type of materials or objects being cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
KR1020227043529A 2020-05-15 2021-05-14 세정 장치 및 세정 방법 Active KR102928049B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020086242 2020-05-15
JPJP-P-2020-086242 2020-05-15
PCT/JP2021/018359 WO2021230344A1 (ja) 2020-05-15 2021-05-14 洗浄装置および洗浄方法

Publications (2)

Publication Number Publication Date
KR20230010693A KR20230010693A (ko) 2023-01-19
KR102928049B1 true KR102928049B1 (ko) 2026-02-20

Family

ID=78524509

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227043529A Active KR102928049B1 (ko) 2020-05-15 2021-05-14 세정 장치 및 세정 방법

Country Status (6)

Country Link
US (1) US12343770B2 (https=)
JP (1) JP7470785B2 (https=)
KR (1) KR102928049B1 (https=)
CN (1) CN115605981A (https=)
TW (1) TWI888557B (https=)
WO (1) WO2021230344A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7739157B2 (ja) * 2021-11-30 2025-09-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2023167740A (ja) 2022-05-13 2023-11-24 株式会社荏原製作所 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319909A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2014199917A (ja) * 2013-03-15 2014-10-23 東京エレクトロン株式会社 基板液処理方法、基板液処理装置および記憶媒体
JP2015201627A (ja) * 2014-04-01 2015-11-12 株式会社荏原製作所 洗浄装置及び洗浄方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6827814B2 (en) 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
JP3779582B2 (ja) 2001-09-28 2006-05-31 大日本スクリーン製造株式会社 基板周縁処理装置および基板周縁処理方法
US7476290B2 (en) * 2003-10-30 2009-01-13 Ebara Corporation Substrate processing apparatus and substrate processing method
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
CN104971916B (zh) * 2014-04-01 2020-07-07 株式会社荏原制作所 清洗装置及清洗方法
JP6389089B2 (ja) * 2014-09-18 2018-09-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6314779B2 (ja) * 2014-10-01 2018-04-25 東京エレクトロン株式会社 液処理方法、記憶媒体及び液処理装置
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
JP7364322B2 (ja) * 2018-02-23 2023-10-18 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN114361059A (zh) * 2020-10-13 2022-04-15 长鑫存储技术有限公司 晶圆清洗设备和清洗方法
KR102583342B1 (ko) * 2020-10-22 2023-09-26 세메스 주식회사 기판 처리 장치
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319909A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2014199917A (ja) * 2013-03-15 2014-10-23 東京エレクトロン株式会社 基板液処理方法、基板液処理装置および記憶媒体
JP2015201627A (ja) * 2014-04-01 2015-11-12 株式会社荏原製作所 洗浄装置及び洗浄方法

Also Published As

Publication number Publication date
CN115605981A (zh) 2023-01-13
JPWO2021230344A1 (https=) 2021-11-18
KR20230010693A (ko) 2023-01-19
JP7470785B2 (ja) 2024-04-18
WO2021230344A1 (ja) 2021-11-18
US20230191460A1 (en) 2023-06-22
TWI888557B (zh) 2025-07-01
US12343770B2 (en) 2025-07-01
TW202201517A (zh) 2022-01-01

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