JPWO2021230344A1 - - Google Patents
Info
- Publication number
- JPWO2021230344A1 JPWO2021230344A1 JP2022522213A JP2022522213A JPWO2021230344A1 JP WO2021230344 A1 JPWO2021230344 A1 JP WO2021230344A1 JP 2022522213 A JP2022522213 A JP 2022522213A JP 2022522213 A JP2022522213 A JP 2022522213A JP WO2021230344 A1 JPWO2021230344 A1 JP WO2021230344A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2240/00—Type of materials or objects being cleaned
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020086242 | 2020-05-15 | ||
| JP2020086242 | 2020-05-15 | ||
| PCT/JP2021/018359 WO2021230344A1 (ja) | 2020-05-15 | 2021-05-14 | 洗浄装置および洗浄方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021230344A1 true JPWO2021230344A1 (https=) | 2021-11-18 |
| JP7470785B2 JP7470785B2 (ja) | 2024-04-18 |
Family
ID=78524509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022522213A Active JP7470785B2 (ja) | 2020-05-15 | 2021-05-14 | 洗浄装置および洗浄方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12343770B2 (https=) |
| JP (1) | JP7470785B2 (https=) |
| KR (1) | KR102928049B1 (https=) |
| CN (1) | CN115605981A (https=) |
| TW (1) | TWI888557B (https=) |
| WO (1) | WO2021230344A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7739157B2 (ja) * | 2021-11-30 | 2025-09-16 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP2023167740A (ja) | 2022-05-13 | 2023-11-24 | 株式会社荏原製作所 | 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001319909A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | 液処理装置及び液処理方法 |
| JP2003109936A (ja) * | 2001-09-28 | 2003-04-11 | Dainippon Screen Mfg Co Ltd | 基板周縁処理装置および基板周縁処理方法 |
| JP2014199917A (ja) * | 2013-03-15 | 2014-10-23 | 東京エレクトロン株式会社 | 基板液処理方法、基板液処理装置および記憶媒体 |
| JP2015201627A (ja) * | 2014-04-01 | 2015-11-12 | 株式会社荏原製作所 | 洗浄装置及び洗浄方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6827814B2 (en) | 2000-05-08 | 2004-12-07 | Tokyo Electron Limited | Processing apparatus, processing system and processing method |
| US7476290B2 (en) * | 2003-10-30 | 2009-01-13 | Ebara Corporation | Substrate processing apparatus and substrate processing method |
| JP4734063B2 (ja) * | 2005-08-30 | 2011-07-27 | 東京エレクトロン株式会社 | 基板洗浄装置及び基板洗浄方法。 |
| CN104971916B (zh) * | 2014-04-01 | 2020-07-07 | 株式会社荏原制作所 | 清洗装置及清洗方法 |
| JP6389089B2 (ja) * | 2014-09-18 | 2018-09-12 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6314779B2 (ja) * | 2014-10-01 | 2018-04-25 | 東京エレクトロン株式会社 | 液処理方法、記憶媒体及び液処理装置 |
| JP6797526B2 (ja) * | 2014-11-11 | 2020-12-09 | 株式会社荏原製作所 | 基板洗浄装置 |
| JP7364322B2 (ja) * | 2018-02-23 | 2023-10-18 | 株式会社荏原製作所 | 基板洗浄装置および基板洗浄方法 |
| CN114361059A (zh) * | 2020-10-13 | 2022-04-15 | 长鑫存储技术有限公司 | 晶圆清洗设备和清洗方法 |
| KR102583342B1 (ko) * | 2020-10-22 | 2023-09-26 | 세메스 주식회사 | 기판 처리 장치 |
| JP7781577B2 (ja) * | 2021-09-22 | 2025-12-08 | キオクシア株式会社 | 基板処理装置及び基板処理方法 |
-
2021
- 2021-05-14 JP JP2022522213A patent/JP7470785B2/ja active Active
- 2021-05-14 CN CN202180035345.9A patent/CN115605981A/zh active Pending
- 2021-05-14 KR KR1020227043529A patent/KR102928049B1/ko active Active
- 2021-05-14 US US17/924,939 patent/US12343770B2/en active Active
- 2021-05-14 WO PCT/JP2021/018359 patent/WO2021230344A1/ja not_active Ceased
- 2021-05-14 TW TW110117519A patent/TWI888557B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001319909A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | 液処理装置及び液処理方法 |
| JP2003109936A (ja) * | 2001-09-28 | 2003-04-11 | Dainippon Screen Mfg Co Ltd | 基板周縁処理装置および基板周縁処理方法 |
| JP2014199917A (ja) * | 2013-03-15 | 2014-10-23 | 東京エレクトロン株式会社 | 基板液処理方法、基板液処理装置および記憶媒体 |
| JP2015201627A (ja) * | 2014-04-01 | 2015-11-12 | 株式会社荏原製作所 | 洗浄装置及び洗浄方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115605981A (zh) | 2023-01-13 |
| KR20230010693A (ko) | 2023-01-19 |
| JP7470785B2 (ja) | 2024-04-18 |
| WO2021230344A1 (ja) | 2021-11-18 |
| US20230191460A1 (en) | 2023-06-22 |
| TWI888557B (zh) | 2025-07-01 |
| KR102928049B1 (ko) | 2026-02-20 |
| US12343770B2 (en) | 2025-07-01 |
| TW202201517A (zh) | 2022-01-01 |
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