JP7470785B2 - 洗浄装置および洗浄方法 - Google Patents

洗浄装置および洗浄方法 Download PDF

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Publication number
JP7470785B2
JP7470785B2 JP2022522213A JP2022522213A JP7470785B2 JP 7470785 B2 JP7470785 B2 JP 7470785B2 JP 2022522213 A JP2022522213 A JP 2022522213A JP 2022522213 A JP2022522213 A JP 2022522213A JP 7470785 B2 JP7470785 B2 JP 7470785B2
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Japan
Prior art keywords
substrate
cleaning liquid
tube nozzle
cleaning
liquid
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JP2022522213A
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English (en)
Japanese (ja)
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JPWO2021230344A1 (https=
Inventor
佑季 田中
健 飯泉
敬之 梶川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
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Publication of JPWO2021230344A1 publication Critical patent/JPWO2021230344A1/ja
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Publication of JP7470785B2 publication Critical patent/JP7470785B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2240/00—Type of materials or objects being cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof

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  • Cleaning Or Drying Semiconductors (AREA)
JP2022522213A 2020-05-15 2021-05-14 洗浄装置および洗浄方法 Active JP7470785B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020086242 2020-05-15
JP2020086242 2020-05-15
PCT/JP2021/018359 WO2021230344A1 (ja) 2020-05-15 2021-05-14 洗浄装置および洗浄方法

Publications (2)

Publication Number Publication Date
JPWO2021230344A1 JPWO2021230344A1 (https=) 2021-11-18
JP7470785B2 true JP7470785B2 (ja) 2024-04-18

Family

ID=78524509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022522213A Active JP7470785B2 (ja) 2020-05-15 2021-05-14 洗浄装置および洗浄方法

Country Status (6)

Country Link
US (1) US12343770B2 (https=)
JP (1) JP7470785B2 (https=)
KR (1) KR102928049B1 (https=)
CN (1) CN115605981A (https=)
TW (1) TWI888557B (https=)
WO (1) WO2021230344A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7739157B2 (ja) * 2021-11-30 2025-09-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2023167740A (ja) 2022-05-13 2023-11-24 株式会社荏原製作所 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319909A (ja) 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2003109936A (ja) 2001-09-28 2003-04-11 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法
JP2014199917A (ja) 2013-03-15 2014-10-23 東京エレクトロン株式会社 基板液処理方法、基板液処理装置および記憶媒体
JP2015201627A (ja) 2014-04-01 2015-11-12 株式会社荏原製作所 洗浄装置及び洗浄方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6827814B2 (en) 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
US7476290B2 (en) * 2003-10-30 2009-01-13 Ebara Corporation Substrate processing apparatus and substrate processing method
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
CN104971916B (zh) * 2014-04-01 2020-07-07 株式会社荏原制作所 清洗装置及清洗方法
JP6389089B2 (ja) * 2014-09-18 2018-09-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6314779B2 (ja) * 2014-10-01 2018-04-25 東京エレクトロン株式会社 液処理方法、記憶媒体及び液処理装置
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
JP7364322B2 (ja) * 2018-02-23 2023-10-18 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN114361059A (zh) * 2020-10-13 2022-04-15 长鑫存储技术有限公司 晶圆清洗设备和清洗方法
KR102583342B1 (ko) * 2020-10-22 2023-09-26 세메스 주식회사 기판 처리 장치
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319909A (ja) 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2003109936A (ja) 2001-09-28 2003-04-11 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法
JP2014199917A (ja) 2013-03-15 2014-10-23 東京エレクトロン株式会社 基板液処理方法、基板液処理装置および記憶媒体
JP2015201627A (ja) 2014-04-01 2015-11-12 株式会社荏原製作所 洗浄装置及び洗浄方法

Also Published As

Publication number Publication date
CN115605981A (zh) 2023-01-13
JPWO2021230344A1 (https=) 2021-11-18
KR20230010693A (ko) 2023-01-19
WO2021230344A1 (ja) 2021-11-18
US20230191460A1 (en) 2023-06-22
TWI888557B (zh) 2025-07-01
KR102928049B1 (ko) 2026-02-20
US12343770B2 (en) 2025-07-01
TW202201517A (zh) 2022-01-01

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