CN115605981A - 清洗装置及清洗方法 - Google Patents

清洗装置及清洗方法 Download PDF

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Publication number
CN115605981A
CN115605981A CN202180035345.9A CN202180035345A CN115605981A CN 115605981 A CN115605981 A CN 115605981A CN 202180035345 A CN202180035345 A CN 202180035345A CN 115605981 A CN115605981 A CN 115605981A
Authority
CN
China
Prior art keywords
substrate
cleaning
tube nozzle
cleaning liquid
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180035345.9A
Other languages
English (en)
Chinese (zh)
Inventor
田中佑季
饭泉健
梶川敬之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN115605981A publication Critical patent/CN115605981A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2240/00—Type of materials or objects being cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
CN202180035345.9A 2020-05-15 2021-05-14 清洗装置及清洗方法 Pending CN115605981A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020086242 2020-05-15
JP2020-086242 2020-05-15
PCT/JP2021/018359 WO2021230344A1 (ja) 2020-05-15 2021-05-14 洗浄装置および洗浄方法

Publications (1)

Publication Number Publication Date
CN115605981A true CN115605981A (zh) 2023-01-13

Family

ID=78524509

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180035345.9A Pending CN115605981A (zh) 2020-05-15 2021-05-14 清洗装置及清洗方法

Country Status (6)

Country Link
US (1) US12343770B2 (https=)
JP (1) JP7470785B2 (https=)
KR (1) KR102928049B1 (https=)
CN (1) CN115605981A (https=)
TW (1) TWI888557B (https=)
WO (1) WO2021230344A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7739157B2 (ja) * 2021-11-30 2025-09-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2023167740A (ja) 2022-05-13 2023-11-24 株式会社荏原製作所 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319909A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2003109936A (ja) * 2001-09-28 2003-04-11 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法
US20140261570A1 (en) * 2013-03-15 2014-09-18 Tokyo Electron Limited Substrate liquid processing method, substrate liquid processing apparatus, and storage medium
CN104971916A (zh) * 2014-04-01 2015-10-14 株式会社荏原制作所 清洗装置及清洗方法
US20150348806A1 (en) * 2014-04-01 2015-12-03 Ebara Corporation Cleaning apparatus and cleaning method
CN107004593A (zh) * 2014-11-11 2017-08-01 株式会社荏原制作所 基板清洗装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6827814B2 (en) 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
US7476290B2 (en) * 2003-10-30 2009-01-13 Ebara Corporation Substrate processing apparatus and substrate processing method
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
JP6389089B2 (ja) * 2014-09-18 2018-09-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6314779B2 (ja) * 2014-10-01 2018-04-25 東京エレクトロン株式会社 液処理方法、記憶媒体及び液処理装置
JP7364322B2 (ja) * 2018-02-23 2023-10-18 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN114361059A (zh) * 2020-10-13 2022-04-15 长鑫存储技术有限公司 晶圆清洗设备和清洗方法
KR102583342B1 (ko) * 2020-10-22 2023-09-26 세메스 주식회사 기판 처리 장치
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319909A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
JP2003109936A (ja) * 2001-09-28 2003-04-11 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法
US20140261570A1 (en) * 2013-03-15 2014-09-18 Tokyo Electron Limited Substrate liquid processing method, substrate liquid processing apparatus, and storage medium
CN104971916A (zh) * 2014-04-01 2015-10-14 株式会社荏原制作所 清洗装置及清洗方法
US20150348806A1 (en) * 2014-04-01 2015-12-03 Ebara Corporation Cleaning apparatus and cleaning method
CN107004593A (zh) * 2014-11-11 2017-08-01 株式会社荏原制作所 基板清洗装置

Also Published As

Publication number Publication date
JPWO2021230344A1 (https=) 2021-11-18
KR20230010693A (ko) 2023-01-19
JP7470785B2 (ja) 2024-04-18
WO2021230344A1 (ja) 2021-11-18
US20230191460A1 (en) 2023-06-22
TWI888557B (zh) 2025-07-01
KR102928049B1 (ko) 2026-02-20
US12343770B2 (en) 2025-07-01
TW202201517A (zh) 2022-01-01

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