TWI888557B - 清洗裝置及清洗方法 - Google Patents

清洗裝置及清洗方法 Download PDF

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Publication number
TWI888557B
TWI888557B TW110117519A TW110117519A TWI888557B TW I888557 B TWI888557 B TW I888557B TW 110117519 A TW110117519 A TW 110117519A TW 110117519 A TW110117519 A TW 110117519A TW I888557 B TWI888557 B TW I888557B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning liquid
tube nozzle
cleaning
liquid
Prior art date
Application number
TW110117519A
Other languages
English (en)
Chinese (zh)
Other versions
TW202201517A (zh
Inventor
田中佑季
飯泉健
梶川敬之
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202201517A publication Critical patent/TW202201517A/zh
Application granted granted Critical
Publication of TWI888557B publication Critical patent/TWI888557B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2240/00—Type of materials or objects being cleaned
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW110117519A 2020-05-15 2021-05-14 清洗裝置及清洗方法 TWI888557B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020086242 2020-05-15
JP2020-086242 2020-05-15

Publications (2)

Publication Number Publication Date
TW202201517A TW202201517A (zh) 2022-01-01
TWI888557B true TWI888557B (zh) 2025-07-01

Family

ID=78524509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110117519A TWI888557B (zh) 2020-05-15 2021-05-14 清洗裝置及清洗方法

Country Status (6)

Country Link
US (1) US12343770B2 (https=)
JP (1) JP7470785B2 (https=)
KR (1) KR102928049B1 (https=)
CN (1) CN115605981A (https=)
TW (1) TWI888557B (https=)
WO (1) WO2021230344A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7739157B2 (ja) * 2021-11-30 2025-09-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2023167740A (ja) 2022-05-13 2023-11-24 株式会社荏原製作所 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109936A (ja) * 2001-09-28 2003-04-11 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法
US20140261570A1 (en) * 2013-03-15 2014-09-18 Tokyo Electron Limited Substrate liquid processing method, substrate liquid processing apparatus, and storage medium

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6827814B2 (en) 2000-05-08 2004-12-07 Tokyo Electron Limited Processing apparatus, processing system and processing method
JP2001319909A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
US7476290B2 (en) * 2003-10-30 2009-01-13 Ebara Corporation Substrate processing apparatus and substrate processing method
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
CN104971916B (zh) * 2014-04-01 2020-07-07 株式会社荏原制作所 清洗装置及清洗方法
JP6600470B2 (ja) * 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
JP6389089B2 (ja) * 2014-09-18 2018-09-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6314779B2 (ja) * 2014-10-01 2018-04-25 東京エレクトロン株式会社 液処理方法、記憶媒体及び液処理装置
JP6797526B2 (ja) * 2014-11-11 2020-12-09 株式会社荏原製作所 基板洗浄装置
JP7364322B2 (ja) * 2018-02-23 2023-10-18 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN114361059A (zh) * 2020-10-13 2022-04-15 长鑫存储技术有限公司 晶圆清洗设备和清洗方法
KR102583342B1 (ko) * 2020-10-22 2023-09-26 세메스 주식회사 기판 처리 장치
JP7781577B2 (ja) * 2021-09-22 2025-12-08 キオクシア株式会社 基板処理装置及び基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109936A (ja) * 2001-09-28 2003-04-11 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法
US20140261570A1 (en) * 2013-03-15 2014-09-18 Tokyo Electron Limited Substrate liquid processing method, substrate liquid processing apparatus, and storage medium

Also Published As

Publication number Publication date
CN115605981A (zh) 2023-01-13
JPWO2021230344A1 (https=) 2021-11-18
KR20230010693A (ko) 2023-01-19
JP7470785B2 (ja) 2024-04-18
WO2021230344A1 (ja) 2021-11-18
US20230191460A1 (en) 2023-06-22
KR102928049B1 (ko) 2026-02-20
US12343770B2 (en) 2025-07-01
TW202201517A (zh) 2022-01-01

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