KR102857258B1 - 경질 강자성 바이어스층을 갖는 자기 코어 및 이를 포함하는 구조 - Google Patents

경질 강자성 바이어스층을 갖는 자기 코어 및 이를 포함하는 구조

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Publication number
KR102857258B1
KR102857258B1 KR1020237019208A KR20237019208A KR102857258B1 KR 102857258 B1 KR102857258 B1 KR 102857258B1 KR 1020237019208 A KR1020237019208 A KR 1020237019208A KR 20237019208 A KR20237019208 A KR 20237019208A KR 102857258 B1 KR102857258 B1 KR 102857258B1
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KR
South Korea
Prior art keywords
ferromagnetic layer
soft
ferromagnetic
layer
hard
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Application number
KR1020237019208A
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English (en)
Korean (ko)
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KR20230116816A (ko
Inventor
마이클 레카스
라이언 데이비스
노아 스터켄
데니스 시쉬코브
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페릭 잉크.
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Publication of KR20230116816A publication Critical patent/KR20230116816A/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/10—Composite arrangements of magnetic circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/0302—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity characterised by unspecified or heterogeneous hardness or specially adapted for magnetic hardness transitions
    • H01F1/0306—Metals or alloys, e.g. LAVES phase alloys of the MgCu2-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01L23/5227—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00—Cores, Yokes, or armatures
    • H01F3/10—Composite arrangements of magnetic circuits
    • H01F2003/103—Magnetic circuits with permanent magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Thin Magnetic Films (AREA)
  • Soft Magnetic Materials (AREA)
  • Hard Magnetic Materials (AREA)
  • Magnetic Heads (AREA)
KR1020237019208A 2020-12-01 2021-11-15 경질 강자성 바이어스층을 갖는 자기 코어 및 이를 포함하는 구조 Active KR102857258B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/108,096 2020-12-01
US17/108,096 US12322695B2 (en) 2020-12-01 2020-12-01 Magnetic core with hard ferromagnetic biasing layers and structures containing same
PCT/US2021/072400 WO2022120319A2 (en) 2020-12-01 2021-11-15 Magnetic core with hard ferromagnetic biasing layers and structures containing same

Publications (2)

Publication Number Publication Date
KR20230116816A KR20230116816A (ko) 2023-08-04
KR102857258B1 true KR102857258B1 (ko) 2025-09-10

Family

ID=78844874

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237019208A Active KR102857258B1 (ko) 2020-12-01 2021-11-15 경질 강자성 바이어스층을 갖는 자기 코어 및 이를 포함하는 구조

Country Status (6)

Country Link
US (2) US12322695B2 (https=)
JP (1) JP7792188B2 (https=)
KR (1) KR102857258B1 (https=)
DE (1) DE112021005049T5 (https=)
TW (1) TWI817268B (https=)
WO (1) WO2022120319A2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10720487B2 (en) * 2018-06-28 2020-07-21 Taiwan Semiconductor Manufacturing Co., Ltd. Structure and formation method of semiconductor device with magnetic element
US12125713B2 (en) 2022-03-22 2024-10-22 Ferric Inc. Method for manufacturing ferromagnetic-dielectric composite material
US20230411442A1 (en) * 2022-06-20 2023-12-21 Taiwan Semiconductor Manufacturing Co., Ltd. Package with permalloy core inductor and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070218273A1 (en) 2006-03-15 2007-09-20 Kenji Ikeda High-frequency magnetic thin film and high-frequency electronic device

Family Cites Families (131)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1553983A (en) 1919-12-26 1925-09-15 Western Electric Co Electrical coil
US2931966A (en) 1955-01-14 1960-04-05 Charles F Rockey Alternating current rectifier
US3110613A (en) 1960-09-19 1963-11-12 Charles P Bean Magnetic material
US3543249A (en) 1967-12-19 1970-11-24 Bell Telephone Labor Inc High permeability magnetic film structure
US3614554A (en) 1968-10-24 1971-10-19 Texas Instruments Inc Miniaturized thin film inductors for use in integrated circuits
US3573760A (en) 1968-12-16 1971-04-06 Ibm High density thin film memory and method of operation
US4025379A (en) 1973-05-03 1977-05-24 Whetstone Clayton N Method of making laminated magnetic material
US4103315A (en) 1977-06-24 1978-07-25 International Business Machines Corporation Antiferromagnetic-ferromagnetic exchange bias films
US4236946A (en) 1978-03-13 1980-12-02 International Business Machines Corporation Amorphous magnetic thin films with highly stable easy axis
JPS5821810A (ja) 1981-07-31 1983-02-08 Matsushita Electric Works Ltd 安定器の鉄芯打抜き方法
JPS60124859A (ja) 1983-12-09 1985-07-03 Nec Corp 多層配線構造
JPS6428957A (en) 1987-07-24 1989-01-31 Hitachi Ltd Magnetic semiconductor material
US5070317A (en) 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
DE3931628C2 (de) 1989-09-22 1994-01-20 Steingroever Magnet Physik Elektromagnet mit einstellbarem Luftspalt
DE4117878C2 (de) 1990-05-31 1996-09-26 Toshiba Kawasaki Kk Planares magnetisches Element
US5319343A (en) 1990-08-21 1994-06-07 Powercube Corporation Integrated magnetic inductor having series and common mode windings
JPH0582736A (ja) 1991-07-15 1993-04-02 Matsushita Electric Ind Co Ltd インダクタ
US5225971A (en) 1992-01-08 1993-07-06 International Business Machines Corporation Three coil bridge transformer
JPH05291063A (ja) 1992-04-09 1993-11-05 Fuji Electric Co Ltd 磁気誘導素子
US5399372A (en) 1993-11-08 1995-03-21 Southwall Technologies, Inc. Method of patterning magnetic members
EP0742906B1 (de) 1994-01-31 1998-09-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verwendung einer miniaturisierten spulenanordnung hergestellt in planartechnologie zur detektion von ferromagnetischen stoffen
US5635892A (en) 1994-12-06 1997-06-03 Lucent Technologies Inc. High Q integrated inductor
JPH09162354A (ja) 1995-07-07 1997-06-20 Northern Telecom Ltd 集積インダクタ構造およびその製造方法
US5912553A (en) 1997-01-17 1999-06-15 Schott Corporation Alternating current ferroresonant transformer with low harmonic distortion
JPH10284314A (ja) 1997-04-10 1998-10-23 Masato Sagawa 磁心材料
US6118351A (en) 1997-06-10 2000-09-12 Lucent Technologies Inc. Micromagnetic device for power processing applications and method of manufacture therefor
US7107666B2 (en) 1998-07-23 2006-09-19 Bh Electronics Method of manufacturing an ultra-miniature magnetic device
KR20000014333A (ko) 1998-08-20 2000-03-06 윤종용 전자렌지의 노이즈방지기능을 갖는 고압트랜스
US6542379B1 (en) 1999-07-15 2003-04-01 International Business Machines Corporation Circuitry with integrated passive components and method for producing
US6870456B2 (en) 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US20030070282A1 (en) 2000-04-27 2003-04-17 Bh Electronics, Inc. Ultra-miniature magnetic device
US20040009614A1 (en) 2000-05-12 2004-01-15 Ahn Chong H Magnetic bead-based arrays
US7026905B2 (en) 2000-05-24 2006-04-11 Magtech As Magnetically controlled inductive device
FR2813987B1 (fr) 2000-09-12 2003-01-10 Memscap Microcomposant du type micro-inductance ou micro-transformateur
TW535175B (en) 2000-10-16 2003-06-01 Primarion Inc System and method for orthogonal inductance variation
JP2002208127A (ja) 2000-11-09 2002-07-26 Fuji Electric Co Ltd 磁気記録媒体およびその製造方法
FR2817622B1 (fr) 2000-12-01 2003-01-10 Memscap Micromagnetometre a porte de flux
JP2002190411A (ja) 2000-12-21 2002-07-05 Mitsui High Tec Inc チップインダクタ
US6362986B1 (en) 2001-03-22 2002-03-26 Volterra, Inc. Voltage converter with coupled inductive windings, and associated methods
US20030090244A1 (en) 2001-11-05 2003-05-15 Krishna Shenai Multislice DC-DC converter
US6646532B2 (en) 2002-02-26 2003-11-11 Nec Tokin Corporation Powder core and reactor using the same
US6940384B2 (en) 2002-03-11 2005-09-06 Netpower Technologies, Inc. Packaging techniques for a high-density power converter
JP2004146543A (ja) * 2002-10-23 2004-05-20 Asahi Kasei Chemicals Corp 磁石用固形材料およびその製造方法
US7169472B2 (en) 2003-02-13 2007-01-30 Jds Uniphase Corporation Robust multilayer magnetic pigments and foils
US7109689B2 (en) 2003-04-04 2006-09-19 Intersil Americas Inc. Transient-phase PWM power supply and method
JP4059498B2 (ja) 2003-10-24 2008-03-12 ローム株式会社 半導体装置
US7098766B2 (en) 2004-01-21 2006-08-29 Intel Corporation Magnetic material for transformers and/or inductors
US7279391B2 (en) 2004-04-26 2007-10-09 Intel Corporation Integrated inductors and compliant interconnects for semiconductor packaging
US7294525B2 (en) 2005-05-25 2007-11-13 Intel Corporation High performance integrated inductor
JP2006228824A (ja) 2005-02-15 2006-08-31 Tokyo Coil Engineering Kk インダクタ及びその製造方法
US7176662B2 (en) 2005-02-23 2007-02-13 Coldwatt, Inc. Power converter employing a tapped inductor and integrated magnetics and method of operating the same
TWI330863B (en) 2005-05-18 2010-09-21 Megica Corp Semiconductor chip with coil element over passivation layer
US7262069B2 (en) 2005-06-07 2007-08-28 Freescale Semiconductor, Inc. 3-D inductor and transformer devices in MRAM embedded integrated circuits
JP2007049084A (ja) 2005-08-12 2007-02-22 Toshiba Corp スイッチ素子、メモリ素子および磁気抵抗効果素子
FR2894679B1 (fr) 2005-12-14 2008-03-21 Commissariat Energie Atomique Noyau magnetique miniature, capteur le comportant et procede pour le fabriquer
US7230408B1 (en) 2005-12-21 2007-06-12 Micrel, Incorporated Pulse frequency modulated voltage regulator with linear regulator control
US7875955B1 (en) 2006-03-09 2011-01-25 National Semiconductor Corporation On-chip power inductor
US7791837B2 (en) 2006-03-31 2010-09-07 Tdk Corporation Thin film device having thin film coil wound on magnetic film
US7636242B2 (en) 2006-06-29 2009-12-22 Intel Corporation Integrated inductor
US7719084B2 (en) 2006-06-30 2010-05-18 Intel Corporation Laminated magnetic material for inductors in integrated circuits
US7518481B2 (en) 2006-06-30 2009-04-14 Intel Corporation Slotted magnetic material for integrated circuit inductors
US9048022B2 (en) 2006-08-28 2015-06-02 Youngtack Shim Electromagnetically-countered transformer systems and methods
FR2905792A1 (fr) 2006-09-11 2008-03-14 Commissariat Energie Atomique Circuit magnetique ferme pour applications dynamiques a haute frequence et procede de realisation d'un tel circuit magnetique.
MY149292A (en) 2007-01-17 2013-08-30 Univ Illinois Optical systems fabricated by printing-based assembly
US20080172861A1 (en) 2007-01-23 2008-07-24 Holmes Alan G Methods for manufacturing motor core parts with magnetic orientation
JP4872833B2 (ja) 2007-07-03 2012-02-08 富士電機株式会社 圧粉磁心およびその製造方法
US7943510B2 (en) 2007-09-10 2011-05-17 Enpirion, Inc. Methods of processing a substrate and forming a micromagnetic device
JP4854690B2 (ja) 2007-09-21 2012-01-18 ソニーケミカル＆インフォメーションデバイス株式会社 磁性シート及びその製造方法
US7554399B1 (en) 2007-09-27 2009-06-30 Cirrus Logic, Inc. Protection circuit and method for protecting switching power amplifier circuits during reset
US8270137B2 (en) 2007-10-15 2012-09-18 International Rectifier Corporation Interposer for an integrated DC-DC converter
US7986209B2 (en) 2007-11-20 2011-07-26 Intel Corporation Inductor using bulk metallic glass material
US7868431B2 (en) 2007-11-23 2011-01-11 Alpha And Omega Semiconductor Incorporated Compact power semiconductor package and method with stacked inductor and integrated circuit die
US7867787B2 (en) 2007-12-31 2011-01-11 Intel Corporation Forming inductor and transformer structures with magnetic materials using damascene processing for integrated circuits
TWI384739B (zh) 2008-01-03 2013-02-01 台達電子工業股份有限公司 組合式電路及電子元件
US7666688B2 (en) 2008-01-25 2010-02-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a coil inductor
JP2010110432A (ja) 2008-11-05 2010-05-20 Olympus Corp 無線型被検体内情報取得装置
US20120154966A1 (en) 2009-08-31 2012-06-21 Ricor Cryogenic & Vacuum Systems Limited Partnership Fault current limiters (fcl) with the cores saturated by non-superconducting coils
US20110151588A1 (en) 2009-12-17 2011-06-23 Cooledge Lighting, Inc. Method and magnetic transfer stamp for transferring semiconductor dice using magnetic transfer printing techniques
SG175482A1 (en) * 2010-05-04 2011-11-28 Agency Science Tech & Res Multi-bit cell magnetic memory with perpendicular magnetization and spin torque switching
CN101840993B (zh) 2010-05-05 2012-02-15 北京科技大学 一种具有交换偏置效应的多层膜结构及其制作方法
US8130067B2 (en) 2010-05-11 2012-03-06 Texas Instruments Incorporated High frequency semiconductor transformer
JP5649857B2 (ja) 2010-06-21 2015-01-07 ルネサスエレクトロニクス株式会社 レギュレータ回路
JP5403279B2 (ja) 2010-08-04 2014-01-29 戸田工業株式会社 Ｒｆタグの製造方法、磁性体アンテナの製造方法及び当該ｒｆタグを実装した基板、通信システム
JP5690545B2 (ja) 2010-10-06 2015-03-25 ルネサスエレクトロニクス株式会社 電源装置
WO2012166877A1 (en) 2011-05-31 2012-12-06 The Trustees Of Columbia University In The City Of New York Systems and methods for coupled power inductors
WO2013003788A1 (en) 2011-06-30 2013-01-03 Analog Devices, Inc. Isolated power converter with magnetics on chip
US9251458B2 (en) 2011-09-11 2016-02-02 Féinics Amatech Teoranta Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles
US8840800B2 (en) 2011-08-31 2014-09-23 Kabushiki Kaisha Toshiba Magnetic material, method for producing magnetic material, and inductor element
US8558344B2 (en) 2011-09-06 2013-10-15 Analog Devices, Inc. Small size and fully integrated power converter with magnetics on chip
US9659706B2 (en) 2011-09-22 2017-05-23 The Trustees Of Dartmouth College Methods for making radially anisotropic thin-film magnetic torroidal cores
US8525281B2 (en) 2011-10-19 2013-09-03 Texas Instruments Incorporated Z-axis semiconductor fluxgate magnetometer
US20130099762A1 (en) 2011-10-20 2013-04-25 Qualcomm Atheros, Inc. Systems and methods for counteracting overvoltage events
US20140026654A1 (en) 2012-07-25 2014-01-30 Micro-G Lacoste, Inc. Interferometric Differential Gradiometer Apparatus and Method
US8742539B2 (en) 2012-07-27 2014-06-03 Infineon Technologies Austria Ag Semiconductor component and method for producing a semiconductor component
US9484136B2 (en) 2012-09-04 2016-11-01 Analog Devices Global Magnetic core for use in an integrated circuit, an integrated circuit including such a magnetic core, a transformer and an inductor fabricated as part of an integrated circuit
US11064610B2 (en) 2012-09-11 2021-07-13 Ferric Inc. Laminated magnetic core inductor with insulating and interface layers
US9844141B2 (en) 2012-09-11 2017-12-12 Ferric, Inc. Magnetic core inductor integrated with multilevel wiring network
KR101476044B1 (ko) 2012-12-06 2014-12-23 쓰리엠 이노베이티브 프로퍼티즈 캄파니 페라이트 그린 시트, 소결 페라이트 시트, 이를 포함하는 페라이트 복합시트 및 도전 루프 안테나 모듈
US9337251B2 (en) 2013-01-22 2016-05-10 Ferric, Inc. Integrated magnetic core inductors with interleaved windings
US9449945B2 (en) 2013-03-08 2016-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Filter and capacitor using redistribution layer and micro bump layer
US9576721B2 (en) 2013-03-14 2017-02-21 Sumida Corporation Electronic component and method for manufacturing electronic component
WO2014181154A1 (en) 2013-05-09 2014-11-13 Nokia Siemens Networks Oy Measurements in a wireless system
JP2015061000A (ja) 2013-09-20 2015-03-30 株式会社東芝 電波吸収体
WO2015057209A1 (en) 2013-10-15 2015-04-23 Intel Corporation Magnetic shielded integrated circuit package
US9276477B2 (en) 2013-11-21 2016-03-01 Stmicroelectronics International N.V. DC-DC converter with enhanced automatic switching between CCM and DCM operating modes
US9647053B2 (en) 2013-12-16 2017-05-09 Ferric Inc. Systems and methods for integrated multi-layer magnetic films
US9047890B1 (en) 2013-12-30 2015-06-02 International Business Machines Corporation Inductor with non-uniform lamination thicknesses
US10251280B2 (en) 2013-12-31 2019-04-02 Texas Instruments Incorporated Integrated circuit with micro inductor and micro transformer with magnetic core
US9693461B2 (en) 2014-04-16 2017-06-27 Avago Technologies General Ip (Singapore) Pte. Ltd. Magnetic-core three-dimensional (3D) inductors and packaging integration
KR101662207B1 (ko) 2014-09-11 2016-10-06 주식회사 모다이노칩 파워 인덕터
JP2016063170A (ja) 2014-09-22 2016-04-25 株式会社東芝 磁性部材、磁性部材の製造方法およびインダクタ素子
KR101642610B1 (ko) 2014-12-30 2016-07-25 삼성전기주식회사 코일 부품 및 그 제조 방법
US11264156B2 (en) 2015-01-07 2022-03-01 Metglas, Inc. Magnetic core based on a nanocrystalline magnetic alloy
US9496213B2 (en) 2015-02-05 2016-11-15 Qualcomm Incorporated Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate
JP6803523B2 (ja) 2015-03-31 2020-12-23 パナソニックＩｐマネジメント株式会社 薄膜磁石および薄膜磁石の製造方法
US10784045B2 (en) 2015-09-15 2020-09-22 International Business Machines Corporation Laminated magnetic materials for on-chip magnetic inductors/transformers
KR101900879B1 (ko) 2015-10-16 2018-09-21 주식회사 모다이노칩 파워 인덕터
KR101773093B1 (ko) 2015-11-27 2017-08-30 엘지이노텍 주식회사 무선 전력 충전기를 위한 자성 차폐 블록 제조 방법
US9728596B1 (en) 2016-02-05 2017-08-08 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and integrated inductor
US10354950B2 (en) 2016-02-25 2019-07-16 Ferric Inc. Systems and methods for microelectronics fabrication and packaging using a magnetic polymer
US10283249B2 (en) 2016-09-30 2019-05-07 International Business Machines Corporation Method for fabricating a magnetic material stack
CN106910602B (zh) 2017-01-24 2019-05-10 华为机器有限公司 一种薄膜电感和电源转换电路
DE102017101966A1 (de) 2017-02-01 2018-08-02 Osram Opto Semiconductors Gmbh Verfahren zum Transfer zumindest eines Halbleiterchips auf einen Zielträger
US10593449B2 (en) 2017-03-30 2020-03-17 International Business Machines Corporation Magnetic inductor with multiple magnetic layer thicknesses
US10867740B2 (en) 2017-11-30 2020-12-15 Qualcomm Incorporated Inductor apparatus and method of fabricating
JP7143159B2 (ja) 2018-09-12 2022-09-28 株式会社東芝 複合磁性材料及び回転電機
US11264158B2 (en) 2018-11-08 2022-03-01 Ferric Inc. Electromagnetically-driven ferromagnetic actuator device
WO2021049995A1 (en) 2019-09-10 2021-03-18 Ribet Frederico Method and arrangement for assembly of microchips into a separate substrate
EP4087694A1 (en) 2020-01-10 2022-11-16 Basf Se Soft-magnetic powder comprising coated particles
JP7309675B2 (ja) 2020-09-17 2023-07-18 株式会社東芝 回転電機
JP2024124859A (ja) 2023-03-03 2024-09-13 武州工業株式会社 揚げカス処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070218273A1 (en) 2006-03-15 2007-09-20 Kenji Ikeda High-frequency magnetic thin film and high-frequency electronic device

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