KR102606268B1 - 기판 구조화 방법 - Google Patents
기판 구조화 방법 Download PDFInfo
- Publication number
- KR102606268B1 KR102606268B1 KR1020217029058A KR20217029058A KR102606268B1 KR 102606268 B1 KR102606268 B1 KR 102606268B1 KR 1020217029058 A KR1020217029058 A KR 1020217029058A KR 20217029058 A KR20217029058 A KR 20217029058A KR 102606268 B1 KR102606268 B1 KR 102606268B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- structuring
- seed layer
- titanium
- etching
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 60
- 239000000758 substrate Substances 0.000 title claims abstract description 52
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000010936 titanium Substances 0.000 claims abstract description 50
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 50
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 38
- 238000005530 etching Methods 0.000 claims abstract description 32
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 25
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 239000007800 oxidant agent Substances 0.000 claims description 15
- 238000007654 immersion Methods 0.000 claims description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 8
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 239000007858 starting material Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 2
- 238000009210 therapy by ultrasound Methods 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims 1
- 239000000243 solution Substances 0.000 description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 150000003609 titanium compounds Chemical class 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010494 dissociation reaction Methods 0.000 description 2
- 230000005593 dissociations Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003631 wet chemical etching Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012822 chemical development Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
- H01L21/76865—Selective removal of parts of the layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
- H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019112030.6 | 2019-05-08 | ||
| DE102019112030.6A DE102019112030B4 (de) | 2019-05-08 | 2019-05-08 | Verfahren zum Strukturieren eines Substrats |
| PCT/EP2020/062843 WO2020225414A1 (de) | 2019-05-08 | 2020-05-08 | Verfahren zum strukturieren eines substrats |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20220006499A KR20220006499A (ko) | 2022-01-17 |
| KR102606268B1 true KR102606268B1 (ko) | 2023-11-24 |
Family
ID=70738488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217029058A KR102606268B1 (ko) | 2019-05-08 | 2020-05-08 | 기판 구조화 방법 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US11854829B2 (pt) |
| EP (1) | EP3853883B1 (pt) |
| JP (1) | JP2022532288A (pt) |
| KR (1) | KR102606268B1 (pt) |
| CN (1) | CN113508458B (pt) |
| DE (1) | DE102019112030B4 (pt) |
| ES (1) | ES2914075T3 (pt) |
| PT (1) | PT3853883T (pt) |
| TW (1) | TWI764147B (pt) |
| WO (1) | WO2020225414A1 (pt) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015063080A1 (de) | 2013-10-31 | 2015-05-07 | Schmid, Holger Manfred | Vorrichtung und verfahren zur bearbeitung von metallischen oberflächen mit einer ätzflüssigkeit |
| WO2018135325A1 (ja) | 2017-01-19 | 2018-07-26 | 富士通株式会社 | 電子部品、電子部品の製造方法及び電子装置 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1410780A (en) * | 1972-09-29 | 1975-10-22 | Exacta Circuits Ltd | Through-hole plated printed circuits |
| US5120572A (en) * | 1990-10-30 | 1992-06-09 | Microelectronics And Computer Technology Corporation | Method of fabricating electrical components in high density substrates |
| US6376374B1 (en) * | 1998-05-12 | 2002-04-23 | Semitool, Inc. | Process and manufacturing tool architecture for use in the manufacturing of one or more protected metallization structures on a workpiece |
| KR20040043383A (ko) * | 2002-11-18 | 2004-05-24 | 주식회사 하이닉스반도체 | 반도체 소자의 구리 배선 형성방법 |
| JP4510369B2 (ja) * | 2002-11-28 | 2010-07-21 | 日本リーロナール有限会社 | 電解銅めっき方法 |
| JP3778508B2 (ja) * | 2002-12-10 | 2006-05-24 | 聯華電子股▲ふん▼有限公司 | 集積回路の製造方法 |
| JP2004311537A (ja) * | 2003-04-03 | 2004-11-04 | Renesas Technology Corp | 半導体装置 |
| US8698697B2 (en) * | 2007-06-12 | 2014-04-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2010135461A (ja) * | 2008-12-03 | 2010-06-17 | Seiko Epson Corp | 電子部品実装用フィルムキャリアテープの製造方法 |
| US7901981B2 (en) * | 2009-02-20 | 2011-03-08 | National Semiconductor Corporation | Integrated circuit micro-module |
| KR101121151B1 (ko) | 2010-03-19 | 2012-03-20 | 주식회사 대원이노스트 | Ｌｅｄ 모듈 및 그 제조 방법 |
| US8389397B2 (en) * | 2010-09-14 | 2013-03-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for reducing UBM undercut in metal bump structures |
| KR20120044630A (ko) * | 2010-10-28 | 2012-05-08 | 주식회사 동진쎄미켐 | 구리 함유 금속막 식각액 조성물 및 이를 이용한 식각 방법 |
| JP2012119664A (ja) * | 2010-11-12 | 2012-06-21 | Kobe Steel Ltd | 配線構造 |
| WO2012097092A2 (en) * | 2011-01-13 | 2012-07-19 | Tamarack Scientific Co. Inc. | Laser removal of conductive seed layers |
| KR102080646B1 (ko) * | 2013-04-12 | 2020-02-24 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 구리 및 티탄을 포함하는 다층막의 에칭에 사용되는 액체조성물, 및 이 조성물을 이용한 에칭방법, 다층막 배선의 제조방법, 기판 |
| US9159683B2 (en) * | 2014-02-10 | 2015-10-13 | GlobalFoundries, Inc. | Methods for etching copper during the fabrication of integrated circuits |
| US9275896B2 (en) * | 2014-07-28 | 2016-03-01 | GlobalFoundries, Inc. | Methods for fabricating integrated circuits using directed self-assembly |
| KR102667884B1 (ko) * | 2016-07-27 | 2024-05-23 | 삼성전자주식회사 | 반도체 소자의 제조 방법 |
| KR102421116B1 (ko) * | 2017-06-22 | 2022-07-15 | 삼성디스플레이 주식회사 | 식각액 조성물 및 식각액 조성물을 이용한 배선 형성 방법 |
| DE102018117822A1 (de) * | 2017-11-17 | 2019-05-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Drei-schritte-ätzen zum bilden einer rdl |
-
2019
- 2019-05-08 DE DE102019112030.6A patent/DE102019112030B4/de not_active Expired - Fee Related
-
2020
- 2020-05-07 TW TW109115253A patent/TWI764147B/zh active
- 2020-05-08 JP JP2021554409A patent/JP2022532288A/ja active Pending
- 2020-05-08 KR KR1020217029058A patent/KR102606268B1/ko active IP Right Grant
- 2020-05-08 US US17/423,369 patent/US11854829B2/en active Active
- 2020-05-08 WO PCT/EP2020/062843 patent/WO2020225414A1/de unknown
- 2020-05-08 EP EP20726012.6A patent/EP3853883B1/de active Active
- 2020-05-08 CN CN202080016906.6A patent/CN113508458B/zh active Active
- 2020-05-08 PT PT207260126T patent/PT3853883T/pt unknown
- 2020-05-08 ES ES20726012T patent/ES2914075T3/es active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015063080A1 (de) | 2013-10-31 | 2015-05-07 | Schmid, Holger Manfred | Vorrichtung und verfahren zur bearbeitung von metallischen oberflächen mit einer ätzflüssigkeit |
| WO2018135325A1 (ja) | 2017-01-19 | 2018-07-26 | 富士通株式会社 | 電子部品、電子部品の製造方法及び電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113508458B (zh) | 2024-05-31 |
| US11854829B2 (en) | 2023-12-26 |
| EP3853883A1 (de) | 2021-07-28 |
| DE102019112030A1 (de) | 2020-11-12 |
| ES2914075T3 (es) | 2022-06-07 |
| WO2020225414A1 (de) | 2020-11-12 |
| KR20220006499A (ko) | 2022-01-17 |
| EP3853883B1 (de) | 2022-04-27 |
| US20220130680A1 (en) | 2022-04-28 |
| CN113508458A (zh) | 2021-10-15 |
| DE102019112030B4 (de) | 2023-11-02 |
| TW202111815A (zh) | 2021-03-16 |
| JP2022532288A (ja) | 2022-07-14 |
| PT3853883T (pt) | 2022-05-13 |
| TWI764147B (zh) | 2022-05-11 |
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