KR102604150B1 - 슬릿 노즐, 슬릿 노즐의 조정 방법 및 기판 처리 장치 - Google Patents

슬릿 노즐, 슬릿 노즐의 조정 방법 및 기판 처리 장치 Download PDF

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Publication number
KR102604150B1
KR102604150B1 KR1020220072673A KR20220072673A KR102604150B1 KR 102604150 B1 KR102604150 B1 KR 102604150B1 KR 1020220072673 A KR1020220072673 A KR 1020220072673A KR 20220072673 A KR20220072673 A KR 20220072673A KR 102604150 B1 KR102604150 B1 KR 102604150B1
Authority
KR
South Korea
Prior art keywords
main body
body portion
adjustment
discharge port
gap
Prior art date
Application number
KR1020220072673A
Other languages
English (en)
Korean (ko)
Other versions
KR20230000430A (ko
Inventor
유지 아베
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20230000430A publication Critical patent/KR20230000430A/ko
Application granted granted Critical
Publication of KR102604150B1 publication Critical patent/KR102604150B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B05C5/0262—Coating heads with slot-shaped outlet adjustable in width, i.e. having lips movable relative to each other in order to modify the slot width, e.g. to close it
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B05C5/0258—Coating heads with slot-shaped outlet flow controlled, e.g. by a valve
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
KR1020220072673A 2021-06-24 2022-06-15 슬릿 노즐, 슬릿 노즐의 조정 방법 및 기판 처리 장치 KR102604150B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-104551 2021-06-24
JP2021104551A JP7330233B2 (ja) 2021-06-24 2021-06-24 スリットノズル、スリットノズルの調整方法および基板処理装置

Publications (2)

Publication Number Publication Date
KR20230000430A KR20230000430A (ko) 2023-01-02
KR102604150B1 true KR102604150B1 (ko) 2023-11-20

Family

ID=84695710

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220072673A KR102604150B1 (ko) 2021-06-24 2022-06-15 슬릿 노즐, 슬릿 노즐의 조정 방법 및 기판 처리 장치

Country Status (3)

Country Link
JP (1) JP7330233B2 (ja)
KR (1) KR102604150B1 (ja)
CN (1) CN115518828A (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003024855A (ja) 2001-07-13 2003-01-28 Sumitomo Heavy Ind Ltd ダイコータ装置
JP2012030164A (ja) 2010-07-29 2012-02-16 Fujifilm Corp 塗布装置、及び光学フィルムの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1015461A (ja) * 1996-07-02 1998-01-20 Sony Corp 塗布装置
JPH11188301A (ja) * 1997-12-26 1999-07-13 Hirata Corp 流体塗布装置
EP1600218B1 (en) * 2003-03-03 2009-09-23 Toray Industries, Inc. Slit die, and method and device for producing base material with coating film
KR100739477B1 (ko) * 2005-06-21 2007-07-13 세메스 주식회사 평판 디스플레이 제조에 사용되는 슬릿 노즐
KR100756563B1 (ko) * 2006-08-09 2007-09-07 주식회사 디엠에스 슬릿형 코팅장치
KR100987184B1 (ko) * 2008-08-22 2010-10-11 주식회사 디엠에스 슬릿 노즐
KR101252957B1 (ko) 2010-12-13 2013-04-15 삼성에스디아이 주식회사 코팅장치 및 이를 이용한 코팅 방법
JP2014008465A (ja) 2012-06-29 2014-01-20 Dainippon Printing Co Ltd ダイヘッド、丁合装置およびダイヘッドのスリットの隙間の大きさの調整方法
CN103736631B (zh) * 2013-12-10 2016-08-24 京东方科技集团股份有限公司 一种狭缝式涂布机
KR101583747B1 (ko) * 2014-01-29 2016-01-08 세메스 주식회사 액 공급 유닛
TWI828873B (zh) 2019-03-28 2024-01-11 日商尼康股份有限公司 塗布裝置、以及噴頭單元

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003024855A (ja) 2001-07-13 2003-01-28 Sumitomo Heavy Ind Ltd ダイコータ装置
JP2012030164A (ja) 2010-07-29 2012-02-16 Fujifilm Corp 塗布装置、及び光学フィルムの製造方法

Also Published As

Publication number Publication date
TW202301534A (zh) 2023-01-01
JP2023003459A (ja) 2023-01-17
JP7330233B2 (ja) 2023-08-21
KR20230000430A (ko) 2023-01-02
CN115518828A (zh) 2022-12-27

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