KR100756563B1 - 슬릿형 코팅장치 - Google Patents
슬릿형 코팅장치 Download PDFInfo
- Publication number
- KR100756563B1 KR100756563B1 KR1020060075121A KR20060075121A KR100756563B1 KR 100756563 B1 KR100756563 B1 KR 100756563B1 KR 1020060075121 A KR1020060075121 A KR 1020060075121A KR 20060075121 A KR20060075121 A KR 20060075121A KR 100756563 B1 KR100756563 B1 KR 100756563B1
- Authority
- KR
- South Korea
- Prior art keywords
- slit
- guide groove
- gap
- nozzle body
- pressure block
- Prior art date
Links
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
- B05B1/3033—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (5)
- 기판에 감광액을 도포하기 위한 작업이 진행되는 작업면을 제공하는 작업대;상기 작업면 일측에 고정되며 슬릿형의 토출구가 구비된 노즐 본체;상기 노즐 본체에서 상기 토출구 간극을 사이에 두고 어느 한쪽 편에 형성된 가이드홈 내측에 끼워지는 가압블럭;상기 가압블럭 일측면에 형성되어 상기 가이드홈 내부면 일측과 경사지게 면 접촉된 상태로 이동되면서 상기 가이드홈을 사이에 두고 위아래 방향으로 접촉 압력을 발생하기 위한 면접촉부;상기 가압블럭이 상기 면접촉부의 경사진 방향을 따라 전진 또는 후진이 가능하도록 나사 결합되며 상기 면접촉부에서 발생된 압력에 의해 상기 토출구 간극을 사이에 두고 어느 한편을 휨 변형시키면서 다른 한편을 향하여 근접하거나 그 반대로 이동되도록 조절하기 위한 조절구;를 포함하는 슬릿형 코팅장치.
- 청구항 1에 있어서,상기 면접촉부는 상기 가압블럭의 윗면 또는 저면 중에서 어느 한면 또는 양측면에 경사지게 형성되는 슬릿형 코팅장치.
- 청구항 1에 있어서,상기 가압블럭은 상기 토출구의 절개 방향을 따라 적어도 1개 이상이 복수개의 지점에 이격 설치되는 슬릿형 코팅장치.
- 청구항 1에 있어서,상기 슬릿형 코팅장치는 조절구용 브라켓트를 더 포함하고,이 브라켓트는 상기 가압블럭이 전진 또는 후진될 때 상기 조절구가 상기 노즐 본체에서 어느 한 방향으로 걸림 상태가 유지되도록 고정하는 것을 특징으로 하는 슬릿형 코팅장치.
- 청구항 1에 있어서,상기 가이드홈은 상기 토출구의 절개 방향을 따라 1군데 이상의 지점에 형성되는 슬릿형 코팅장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060075121A KR100756563B1 (ko) | 2006-08-09 | 2006-08-09 | 슬릿형 코팅장치 |
CN2007100976038A CN101122747B (zh) | 2006-08-09 | 2007-04-20 | 狭缝式涂敷装置 |
TW096114381A TWI322715B (en) | 2006-08-09 | 2007-04-24 | Slit coater |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060075121A KR100756563B1 (ko) | 2006-08-09 | 2006-08-09 | 슬릿형 코팅장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100756563B1 true KR100756563B1 (ko) | 2007-09-07 |
Family
ID=38736904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060075121A KR100756563B1 (ko) | 2006-08-09 | 2006-08-09 | 슬릿형 코팅장치 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100756563B1 (ko) |
CN (1) | CN101122747B (ko) |
TW (1) | TWI322715B (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100969358B1 (ko) * | 2008-06-30 | 2010-07-09 | 주식회사 디엠에스 | 슬릿 노즐 |
KR100987184B1 (ko) | 2008-08-22 | 2010-10-11 | 주식회사 디엠에스 | 슬릿 노즐 |
JP2020168758A (ja) * | 2019-04-01 | 2020-10-15 | パナソニックIpマネジメント株式会社 | インクジェットヘッド |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7330233B2 (ja) * | 2021-06-24 | 2023-08-21 | 株式会社Screenホールディングス | スリットノズル、スリットノズルの調整方法および基板処理装置 |
DE102022205815A1 (de) * | 2022-06-08 | 2023-12-14 | Carl Zeiss Smt Gmbh | Komponente für eine Projektionsbelichtungsanlage für die Halbleiterlithografie und Projektionsbelichtungsanlage |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050115360A (ko) * | 2004-06-03 | 2005-12-07 | 동부아남반도체 주식회사 | 레지스트 코팅장치 |
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2006
- 2006-08-09 KR KR1020060075121A patent/KR100756563B1/ko active IP Right Grant
-
2007
- 2007-04-20 CN CN2007100976038A patent/CN101122747B/zh active Active
- 2007-04-24 TW TW096114381A patent/TWI322715B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050115360A (ko) * | 2004-06-03 | 2005-12-07 | 동부아남반도체 주식회사 | 레지스트 코팅장치 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100969358B1 (ko) * | 2008-06-30 | 2010-07-09 | 주식회사 디엠에스 | 슬릿 노즐 |
KR100987184B1 (ko) | 2008-08-22 | 2010-10-11 | 주식회사 디엠에스 | 슬릿 노즐 |
JP2020168758A (ja) * | 2019-04-01 | 2020-10-15 | パナソニックIpマネジメント株式会社 | インクジェットヘッド |
JP7054810B2 (ja) | 2019-04-01 | 2022-04-15 | パナソニックIpマネジメント株式会社 | インクジェットヘッド |
Also Published As
Publication number | Publication date |
---|---|
CN101122747B (zh) | 2010-08-11 |
TWI322715B (en) | 2010-04-01 |
CN101122747A (zh) | 2008-02-13 |
TW200808461A (en) | 2008-02-16 |
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