KR102602489B1 - 반도체 장치의 제조 방법 및 접착 필름 - Google Patents

반도체 장치의 제조 방법 및 접착 필름 Download PDF

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Publication number
KR102602489B1
KR102602489B1 KR1020207021839A KR20207021839A KR102602489B1 KR 102602489 B1 KR102602489 B1 KR 102602489B1 KR 1020207021839 A KR1020207021839 A KR 1020207021839A KR 20207021839 A KR20207021839 A KR 20207021839A KR 102602489 B1 KR102602489 B1 KR 102602489B1
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KR
South Korea
Prior art keywords
film
adhesive film
semiconductor
semiconductor chip
adhesive
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KR1020207021839A
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English (en)
Korean (ko)
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KR20200111703A (ko
Inventor
유이 구니토
가즈히로 야마모토
고우헤이 다니구치
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가부시끼가이샤 레조낙
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
KR1020207021839A 2018-01-30 2019-01-29 반도체 장치의 제조 방법 및 접착 필름 KR102602489B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-013752 2018-01-30
JP2018013752A JP6977588B2 (ja) 2018-01-30 2018-01-30 半導体装置の製造方法及び接着フィルム
PCT/JP2019/003010 WO2019151260A1 (ja) 2018-01-30 2019-01-29 半導体装置の製造方法及び接着フィルム

Publications (2)

Publication Number Publication Date
KR20200111703A KR20200111703A (ko) 2020-09-29
KR102602489B1 true KR102602489B1 (ko) 2023-11-16

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KR1020207021839A KR102602489B1 (ko) 2018-01-30 2019-01-29 반도체 장치의 제조 방법 및 접착 필름

Country Status (6)

Country Link
JP (1) JP6977588B2 (zh)
KR (1) KR102602489B1 (zh)
CN (1) CN111656500B (zh)
SG (1) SG11202007053XA (zh)
TW (1) TWI791751B (zh)
WO (1) WO2019151260A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7298404B2 (ja) * 2019-09-06 2023-06-27 株式会社レゾナック 半導体装置の製造方法
JP7427480B2 (ja) 2020-03-09 2024-02-05 キオクシア株式会社 半導体装置
JP2022036756A (ja) 2020-08-24 2022-03-08 キオクシア株式会社 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008274259A (ja) 2007-04-02 2008-11-13 Hitachi Chem Co Ltd 接着シート
JP2010254763A (ja) 2009-04-22 2010-11-11 Hitachi Chem Co Ltd 接着剤組成物、その製造方法、これを用いた接着シート、一体型シート、その製造方法、半導体装置及びその製造方法
JP2013256574A (ja) 2012-06-12 2013-12-26 Hitachi Chemical Co Ltd フィルム状接着剤、接着シート、及び半導体装置の製造方法

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CN1209948C (zh) * 2002-07-17 2005-07-06 威盛电子股份有限公司 嵌埋有ic芯片与无源元件的整合式模块板及其制作方法
JP2004217757A (ja) * 2003-01-14 2004-08-05 Hitachi Chem Co Ltd 緩衝性カバーフィルムを備えた接着シートならびに半導体装置およびその製造方法
US7375370B2 (en) 2004-08-05 2008-05-20 The Trustees Of Princeton University Stacked organic photosensitive devices
JP5003090B2 (ja) * 2006-10-06 2012-08-15 住友ベークライト株式会社 接着フィルムおよびこれを用いた半導体装置
US20100112272A1 (en) * 2006-10-06 2010-05-06 Sumitomo Bakelite Co., Ltd. Film for use in manufacturing semiconductor devices, method for producing the film and semiconductor device
CN101647096B (zh) * 2007-04-05 2012-01-04 日立化成工业株式会社 半导体芯片的制造方法和半导体用粘接膜及其复合片
KR20120002556A (ko) * 2007-10-09 2012-01-05 히다치 가세고교 가부시끼가이샤 접착 필름이 부착된 반도체칩의 제조 방법 및 이 제조 방법에 사용되는 반도체용 접착 필름, 및 반도체 장치의 제조 방법
JP4994429B2 (ja) * 2008-08-04 2012-08-08 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2012089630A (ja) * 2010-10-18 2012-05-10 Sumitomo Bakelite Co Ltd 半導体用フィルムおよび半導体装置
JP5736899B2 (ja) * 2011-03-28 2015-06-17 日立化成株式会社 フィルム状接着剤、接着シート及び半導体装置
JP5834662B2 (ja) * 2011-09-13 2015-12-24 日立化成株式会社 フィルム状接着剤、接着シート、半導体装置及びその製造方法
KR20160139043A (ko) * 2012-03-08 2016-12-06 히타치가세이가부시끼가이샤 접착시트 및 반도체 장치의 제조 방법
JP6322026B2 (ja) * 2014-03-31 2018-05-09 日東電工株式会社 ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
JP6670177B2 (ja) * 2016-05-30 2020-03-18 日東電工株式会社 ダイボンドフィルム、ダイシングダイボンドフィルム、及び、半導体装置の製造方法
JP6222395B1 (ja) * 2017-08-07 2017-11-01 日立化成株式会社 フィルム状接着剤及びダイシングダイボンディング一体型接着シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008274259A (ja) 2007-04-02 2008-11-13 Hitachi Chem Co Ltd 接着シート
JP2010254763A (ja) 2009-04-22 2010-11-11 Hitachi Chem Co Ltd 接着剤組成物、その製造方法、これを用いた接着シート、一体型シート、その製造方法、半導体装置及びその製造方法
JP2013256574A (ja) 2012-06-12 2013-12-26 Hitachi Chemical Co Ltd フィルム状接着剤、接着シート、及び半導体装置の製造方法

Also Published As

Publication number Publication date
JP6977588B2 (ja) 2021-12-08
TWI791751B (zh) 2023-02-11
CN111656500B (zh) 2023-08-15
SG11202007053XA (en) 2020-08-28
WO2019151260A1 (ja) 2019-08-08
TW201941314A (zh) 2019-10-16
KR20200111703A (ko) 2020-09-29
JP2019134020A (ja) 2019-08-08
CN111656500A (zh) 2020-09-11

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