KR102578976B1 - 밀봉용 조성물 - Google Patents

밀봉용 조성물 Download PDF

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Publication number
KR102578976B1
KR102578976B1 KR1020197031922A KR20197031922A KR102578976B1 KR 102578976 B1 KR102578976 B1 KR 102578976B1 KR 1020197031922 A KR1020197031922 A KR 1020197031922A KR 20197031922 A KR20197031922 A KR 20197031922A KR 102578976 B1 KR102578976 B1 KR 102578976B1
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KR
South Korea
Prior art keywords
ethylenically unsaturated
composition
mass
acrylate
manufactured
Prior art date
Application number
KR1020197031922A
Other languages
English (en)
Korean (ko)
Other versions
KR20190130012A (ko
Inventor
사토루 오하시
유키 야마모토
유키 쿠보
나오키 나토리
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20190130012A publication Critical patent/KR20190130012A/ko
Application granted granted Critical
Publication of KR102578976B1 publication Critical patent/KR102578976B1/ko

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020197031922A 2017-03-31 2018-03-29 밀봉용 조성물 KR102578976B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-071985 2017-03-31
JP2017071985 2017-03-31
PCT/JP2018/013117 WO2018181664A1 (fr) 2017-03-31 2018-03-29 Composition d'étanchéité

Publications (2)

Publication Number Publication Date
KR20190130012A KR20190130012A (ko) 2019-11-20
KR102578976B1 true KR102578976B1 (ko) 2023-09-18

Family

ID=63676031

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197031922A KR102578976B1 (ko) 2017-03-31 2018-03-29 밀봉용 조성물

Country Status (5)

Country Link
JP (1) JP7024785B2 (fr)
KR (1) KR102578976B1 (fr)
CN (1) CN110382561B (fr)
TW (1) TWI771397B (fr)
WO (1) WO2018181664A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7276312B2 (ja) * 2018-02-27 2023-05-18 味の素株式会社 封止用樹脂組成物
KR20210094013A (ko) * 2018-11-22 2021-07-28 아지노모토 가부시키가이샤 접착제 조성물
JPWO2021002375A1 (fr) * 2019-07-04 2021-01-07

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016025965A1 (fr) * 2014-08-11 2016-02-18 Henkel IP & Holding GmbH Adhésifs thermofusibles optiquement transparents et utilisations de ceux-ci
WO2016158770A1 (fr) * 2015-03-27 2016-10-06 味の素株式会社 Composition de résine pour l'étanchéité

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY110671A (en) * 1992-09-17 1999-01-30 Ciba Specialty Chemicals Holding Inc Process for the preparation of olefin polymers
JP3306222B2 (ja) * 1994-04-22 2002-07-24 東亞合成株式会社 樹脂組成物
JP4017091B2 (ja) * 1998-08-19 2007-12-05 昭和電工株式会社 重合性化合物、それを用いた高分子固体電解質及びその用途
JP2004091647A (ja) * 2002-08-30 2004-03-25 Kyowa Chem Ind Co Ltd 塗料用フクレ防止剤及び塗膜のフクレ防止方法
JP2006282958A (ja) * 2005-04-05 2006-10-19 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機el素子
JP5070972B2 (ja) * 2007-07-26 2012-11-14 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP5236587B2 (ja) * 2009-07-15 2013-07-17 太陽ホールディングス株式会社 光硬化性樹脂組成物
EP2537893B1 (fr) * 2010-02-18 2016-07-13 Bridgestone Corporation Film de scellement pour modules photovoltaïques, et modules photovoltaïques l'utilisant
JP5540165B1 (ja) * 2013-06-28 2014-07-02 太陽インキ製造株式会社 光硬化性樹脂組成物、その硬化物およびプリント配線板
JP6609439B2 (ja) 2014-08-29 2019-11-20 積水化学工業株式会社 硬化性組成物及び有機エレクトロルミネッセンス表示素子用封止剤
JP6821985B2 (ja) * 2015-07-21 2021-01-27 味の素株式会社 封止用樹脂組成物
JP6683204B2 (ja) * 2015-09-30 2020-04-15 味の素株式会社 封止用樹脂組成物
TWI749075B (zh) * 2016-10-04 2021-12-11 日商味之素股份有限公司 密封用樹脂組成物及密封用薄片

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016025965A1 (fr) * 2014-08-11 2016-02-18 Henkel IP & Holding GmbH Adhésifs thermofusibles optiquement transparents et utilisations de ceux-ci
WO2016158770A1 (fr) * 2015-03-27 2016-10-06 味の素株式会社 Composition de résine pour l'étanchéité

Also Published As

Publication number Publication date
JPWO2018181664A1 (ja) 2020-02-13
KR20190130012A (ko) 2019-11-20
WO2018181664A1 (fr) 2018-10-04
JP7024785B2 (ja) 2022-02-24
CN110382561B (zh) 2023-01-31
TWI771397B (zh) 2022-07-21
CN110382561A (zh) 2019-10-25
TW201900834A (zh) 2019-01-01

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