KR102578976B1 - Sealing composition - Google Patents
Sealing composition Download PDFInfo
- Publication number
- KR102578976B1 KR102578976B1 KR1020197031922A KR20197031922A KR102578976B1 KR 102578976 B1 KR102578976 B1 KR 102578976B1 KR 1020197031922 A KR1020197031922 A KR 1020197031922A KR 20197031922 A KR20197031922 A KR 20197031922A KR 102578976 B1 KR102578976 B1 KR 102578976B1
- Authority
- KR
- South Korea
- Prior art keywords
- ethylenically unsaturated
- composition
- mass
- acrylate
- manufactured
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 145
- 238000007789 sealing Methods 0.000 title claims abstract description 45
- 150000001875 compounds Chemical class 0.000 claims abstract description 91
- 229960001545 hydrotalcite Drugs 0.000 claims abstract description 84
- 229910001701 hydrotalcite Inorganic materials 0.000 claims abstract description 84
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 35
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims abstract 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 32
- 125000002723 alicyclic group Chemical group 0.000 claims description 22
- 239000003085 diluting agent Substances 0.000 claims description 22
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 20
- 238000002834 transmittance Methods 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- PWZFXELTLAQOKC-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide;tetrahydrate Chemical compound O.O.O.O.[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O PWZFXELTLAQOKC-UHFFFAOYSA-A 0.000 description 82
- -1 isobornane ring Chemical group 0.000 description 75
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 66
- 239000003822 epoxy resin Substances 0.000 description 50
- 229920000647 polyepoxide Polymers 0.000 description 50
- 239000010410 layer Substances 0.000 description 37
- 150000002148 esters Chemical class 0.000 description 32
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 22
- 125000003700 epoxy group Chemical group 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 238000010521 absorption reaction Methods 0.000 description 15
- 230000004888 barrier function Effects 0.000 description 13
- 230000001588 bifunctional effect Effects 0.000 description 13
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 13
- 239000007788 liquid Substances 0.000 description 13
- 239000002245 particle Substances 0.000 description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 11
- 239000004844 aliphatic epoxy resin Substances 0.000 description 10
- 125000004386 diacrylate group Chemical group 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 9
- 229940105570 ornex Drugs 0.000 description 9
- 229920006395 saturated elastomer Polymers 0.000 description 9
- 239000013585 weight reducing agent Substances 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 125000004122 cyclic group Chemical group 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000003505 polymerization initiator Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 7
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 239000011777 magnesium Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 239000012756 surface treatment agent Substances 0.000 description 6
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 5
- IAXXETNIOYFMLW-GYSYKLTISA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C(=C)C)C[C@@H]1C2(C)C IAXXETNIOYFMLW-GYSYKLTISA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 150000004665 fatty acids Chemical class 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000000634 powder X-ray diffraction Methods 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 4
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 4
- PSGCQDPCAWOCSH-BREBYQMCSA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] prop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C=C)C[C@@H]1C2(C)C PSGCQDPCAWOCSH-BREBYQMCSA-N 0.000 description 4
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 150000001343 alkyl silanes Chemical class 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- SFLRURCEBYIKSS-UHFFFAOYSA-N n-butyl-2-[[1-(butylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound CCCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCCC SFLRURCEBYIKSS-UHFFFAOYSA-N 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 3
- 239000007877 V-601 Substances 0.000 description 3
- VCFFZAQQHCLMNH-UHFFFAOYSA-N [3-(6-prop-2-enoyloxyhexanoyloxy)-2-[[3-(6-prop-2-enoyloxyhexanoyloxy)-2,2-bis(6-prop-2-enoyloxyhexanoyloxymethyl)propoxy]methyl]-2-(6-prop-2-enoyloxyhexanoyloxymethyl)propyl] 6-prop-2-enoyloxyhexanoate Chemical compound C=CC(=O)OCCCCCC(=O)OCC(COC(=O)CCCCCOC(=O)C=C)(COC(=O)CCCCCOC(=O)C=C)COCC(COC(=O)CCCCCOC(=O)C=C)(COC(=O)CCCCCOC(=O)C=C)COC(=O)CCCCCOC(=O)C=C VCFFZAQQHCLMNH-UHFFFAOYSA-N 0.000 description 3
- PFHLXMMCWCWAMA-UHFFFAOYSA-N [4-(4-diphenylsulfoniophenyl)sulfanylphenyl]-diphenylsulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC(C=C1)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 PFHLXMMCWCWAMA-UHFFFAOYSA-N 0.000 description 3
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical class OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 229940119545 isobornyl methacrylate Drugs 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- MXFQRSUWYYSPOC-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate Chemical class C=CC(=O)OCC(C)(C)COC(=O)C=C MXFQRSUWYYSPOC-UHFFFAOYSA-N 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 2
- ZMTBGVBNTHTBEC-UHFFFAOYSA-N (3,3,5-trimethylcyclohexyl) prop-2-enoate Chemical compound CC1CC(OC(=O)C=C)CC(C)(C)C1 ZMTBGVBNTHTBEC-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 2
- LAIJAUHBAWLPCO-UHFFFAOYSA-N (4-tert-butylcyclohexyl) prop-2-enoate Chemical compound CC(C)(C)C1CCC(OC(=O)C=C)CC1 LAIJAUHBAWLPCO-UHFFFAOYSA-N 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 2
- VHJRQDUWYYJDBE-UHFFFAOYSA-N 11-trimethoxysilylundecane-1-thiol Chemical compound CO[Si](OC)(OC)CCCCCCCCCCCS VHJRQDUWYYJDBE-UHFFFAOYSA-N 0.000 description 2
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 2
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical class C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 2
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 2
- URQQDYIVGXOEDA-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethyl prop-2-enoate Chemical compound C=COCCOCCOC(=O)C=C URQQDYIVGXOEDA-UHFFFAOYSA-N 0.000 description 2
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- DABQKEQFLJIRHU-UHFFFAOYSA-N 2-Propenoic acid, 2-methyl-, 3,3,5-trimethylcyclohexyl ester Chemical compound CC1CC(OC(=O)C(C)=C)CC(C)(C)C1 DABQKEQFLJIRHU-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 2
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 2
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 2
- COCLLEMEIJQBAG-UHFFFAOYSA-N 8-methylnonyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C(C)=C COCLLEMEIJQBAG-UHFFFAOYSA-N 0.000 description 2
- YJVIKVWFGPLAFS-UHFFFAOYSA-N 9-(2-methylprop-2-enoyloxy)nonyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCOC(=O)C(C)=C YJVIKVWFGPLAFS-UHFFFAOYSA-N 0.000 description 2
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- ALBJGICXDBJZGK-UHFFFAOYSA-N [1-[(1-acetyloxy-1-phenylethyl)diazenyl]-1-phenylethyl] acetate Chemical compound C=1C=CC=CC=1C(C)(OC(=O)C)N=NC(C)(OC(C)=O)C1=CC=CC=C1 ALBJGICXDBJZGK-UHFFFAOYSA-N 0.000 description 2
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 2
- OQHMGFSAURFQAF-UHFFFAOYSA-N [2-hydroxy-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)COC(=O)C(C)=C OQHMGFSAURFQAF-UHFFFAOYSA-N 0.000 description 2
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- DUYKOAQJUCADEC-UHFFFAOYSA-N [SiH4].N1=NN=CC=C1 Chemical compound [SiH4].N1=NN=CC=C1 DUYKOAQJUCADEC-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- BEWYHVAWEKZDPP-UHFFFAOYSA-N bornane group Chemical group C12(CCC(CC1)C2(C)C)C BEWYHVAWEKZDPP-UHFFFAOYSA-N 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical group CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 230000004069 differentiation Effects 0.000 description 2
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 2
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- XFFPIAQRIDTSIZ-UHFFFAOYSA-N n'-[3-(dimethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound COC(OC)[SiH2]CCCNCCN XFFPIAQRIDTSIZ-UHFFFAOYSA-N 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- DVYVMJLSUSGYMH-UHFFFAOYSA-N n-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CNCCC[Si](OC)(OC)OC DVYVMJLSUSGYMH-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000005504 styryl group Chemical group 0.000 description 2
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 2
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 2
- 238000002411 thermogravimetry Methods 0.000 description 2
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 2
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 2
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 2
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- JXCAHDJDIAQCJO-UHFFFAOYSA-N (1-tert-butylperoxy-2-ethylhexyl) hydrogen carbonate Chemical compound CCCCC(CC)C(OC(O)=O)OOC(C)(C)C JXCAHDJDIAQCJO-UHFFFAOYSA-N 0.000 description 1
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- VWDXBRMLFUFNSX-UHFFFAOYSA-N (2-hydroxy-5-methyl-4-oxohex-5-enyl) prop-2-enoate Chemical compound CC(=C)C(=O)CC(O)COC(=O)C=C VWDXBRMLFUFNSX-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- HCXVPNKIBYLBIT-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOOC(C)(C)C HCXVPNKIBYLBIT-UHFFFAOYSA-N 0.000 description 1
- SZBCSBLGVPJBEM-UHFFFAOYSA-N (2-phenoxy-3-phenylpropyl) 2-methylprop-2-enoate Chemical compound C(C(=C)C)(=O)OCC(OC1=CC=CC=C1)CC1=CC=CC=C1 SZBCSBLGVPJBEM-UHFFFAOYSA-N 0.000 description 1
- ZMZHRHTZJDBLEX-UHFFFAOYSA-N (2-phenylphenyl) prop-2-enoate Chemical class C=CC(=O)OC1=CC=CC=C1C1=CC=CC=C1 ZMZHRHTZJDBLEX-UHFFFAOYSA-N 0.000 description 1
- PYEYLPDXIYOCJK-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methyl prop-2-enoate Chemical compound C=CC(=O)OCC1(CC)COC1 PYEYLPDXIYOCJK-UHFFFAOYSA-N 0.000 description 1
- NLBJAOHLJABDAU-UHFFFAOYSA-N (3-methylbenzoyl) 3-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC(C(=O)OOC(=O)C=2C=C(C)C=CC=2)=C1 NLBJAOHLJABDAU-UHFFFAOYSA-N 0.000 description 1
- BXSPZNVFEYWSLZ-UHFFFAOYSA-N (3-phenoxyphenyl)methyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC(OC=2C=CC=CC=2)=C1 BXSPZNVFEYWSLZ-UHFFFAOYSA-N 0.000 description 1
- YGGARCQQBAOLGB-UHFFFAOYSA-N (3-prop-2-enoyloxy-1-adamantyl) prop-2-enoate Chemical compound C1C(C2)CC3CC1(OC(=O)C=C)CC2(OC(=O)C=C)C3 YGGARCQQBAOLGB-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) 2-methylprop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C(=C)C)CC1C2(C)C IAXXETNIOYFMLW-UHFFFAOYSA-N 0.000 description 1
- QKAIFCSOWIMRJG-UHFFFAOYSA-N (4-methylphenyl)-(4-propan-2-ylphenyl)iodanium Chemical compound C1=CC(C(C)C)=CC=C1[I+]C1=CC=C(C)C=C1 QKAIFCSOWIMRJG-UHFFFAOYSA-N 0.000 description 1
- XQWPAXMLSPUNPV-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OOC(=O)OC1CCC(C(C)(C)C)CC1 XQWPAXMLSPUNPV-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- PCLLJCFJFOBGDE-UHFFFAOYSA-N (5-bromo-2-chlorophenyl)methanamine Chemical compound NCC1=CC(Br)=CC=C1Cl PCLLJCFJFOBGDE-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- PTPLXVHPKMTVIW-FPLPWBNLSA-N (Z)-hydroxyimino-oxido-phenylazanium Chemical compound O\N=[N+](/[O-])c1ccccc1 PTPLXVHPKMTVIW-FPLPWBNLSA-N 0.000 description 1
- CTPYJEXTTINDEM-UHFFFAOYSA-N 1,2-bis(1-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOCC(C)C1=CC=CC=C1C(C)COOC(C)(C)C CTPYJEXTTINDEM-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- KATAXDCYPGGJNJ-UHFFFAOYSA-N 1,3-bis(oxiran-2-ylmethoxy)propan-2-ol Chemical compound C1OC1COCC(O)COCC1CO1 KATAXDCYPGGJNJ-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical group C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- UHLWGJNVYHBNBV-UHFFFAOYSA-N 1-(1-hydroxypropan-2-yloxy)-3-methoxypropan-2-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.COCC(O)COC(C)CO UHLWGJNVYHBNBV-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- VEQCTDMBEVLHOF-UHFFFAOYSA-N 1-(2-benzoylphenyl)prop-2-en-1-one Chemical compound C=CC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 VEQCTDMBEVLHOF-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- RJDAWNNBHDXTNY-UHFFFAOYSA-N 1-(4-bromo-2,5-dihydroxyphenyl)-7-hydroxy-3,7-dimethyloct-2-en-1-one Chemical compound CC(O)(C)CCCC(C)=CC(=O)C1=CC(O)=C(Br)C=C1O RJDAWNNBHDXTNY-UHFFFAOYSA-N 0.000 description 1
- MLKIVXXYTZKNMI-UHFFFAOYSA-N 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one Chemical compound CCCCCCCCCCCCC1=CC=C(C(=O)C(C)(C)O)C=C1 MLKIVXXYTZKNMI-UHFFFAOYSA-N 0.000 description 1
- OBSKXJSZGYXFFB-UHFFFAOYSA-N 1-benzylpyridin-1-ium-2-carbonitrile Chemical compound N#CC1=CC=CC=[N+]1CC1=CC=CC=C1 OBSKXJSZGYXFFB-UHFFFAOYSA-N 0.000 description 1
- CDDDRVNOHLVEED-UHFFFAOYSA-N 1-cyclohexyl-3-[1-[[1-(cyclohexylcarbamoylamino)cyclohexyl]diazenyl]cyclohexyl]urea Chemical compound C1CCCCC1(N=NC1(CCCCC1)NC(=O)NC1CCCCC1)NC(=O)NC1CCCCC1 CDDDRVNOHLVEED-UHFFFAOYSA-N 0.000 description 1
- OBNIRVVPHSLTEP-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(O)COCCO OBNIRVVPHSLTEP-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- URSAGXOMYPJSFX-UHFFFAOYSA-N 10-[8-(9h-acridin-10-yl)octyl]-9h-acridine Chemical compound C12=CC=CC=C2CC2=CC=CC=C2N1CCCCCCCCN1C2=CC=CC=C2CC2=CC=CC=C21 URSAGXOMYPJSFX-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CRJIYMRJTJWVLU-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl 3-(5,5-dimethylhexyl)dioxirane-3-carboxylate Chemical compound CC(C)(C)CCCCC1(C(=O)OC(C)(C)CC(C)(C)C)OO1 CRJIYMRJTJWVLU-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- MGMSZKIPUNOMCS-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC=C MGMSZKIPUNOMCS-UHFFFAOYSA-N 0.000 description 1
- IAMASUILMZETHW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCC(O)OC1=CC=CC=C1 IAMASUILMZETHW-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- IEQWWMKDFZUMMU-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethyl)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)CCOC(=O)C=C IEQWWMKDFZUMMU-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- OADIZUFHUPTFAG-UHFFFAOYSA-N 2-[2-(2-ethylhexoxy)ethoxy]ethanol Chemical compound CCCCC(CC)COCCOCCO OADIZUFHUPTFAG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- OWDBMKZHFCSOOL-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)propoxy]propoxy]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)COC(C)COC(C)COC(=O)C(C)=C OWDBMKZHFCSOOL-UHFFFAOYSA-N 0.000 description 1
- SEFYJVFBMNOLBK-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCC1CO1 SEFYJVFBMNOLBK-UHFFFAOYSA-N 0.000 description 1
- VSRMIIBCXRHPCC-UHFFFAOYSA-N 2-[2-[2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxy]ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCCOCCOCC1CO1 VSRMIIBCXRHPCC-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- XKBHBVFIWWDGQX-UHFFFAOYSA-N 2-bromo-3,3,4,4,5,5,5-heptafluoropent-1-ene Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(Br)=C XKBHBVFIWWDGQX-UHFFFAOYSA-N 0.000 description 1
- CKSAKVMRQYOFBC-UHFFFAOYSA-N 2-cyanopropan-2-yliminourea Chemical compound N#CC(C)(C)N=NC(N)=O CKSAKVMRQYOFBC-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- AJKLVSRUKOZBMY-UHFFFAOYSA-N 2-ethylhexoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COOC(=O)OCC(CC)CCCC AJKLVSRUKOZBMY-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- YAQDPWONDFRAHF-UHFFFAOYSA-N 2-methyl-2-(2-methylpentan-2-ylperoxy)pentane Chemical compound CCCC(C)(C)OOC(C)(C)CCC YAQDPWONDFRAHF-UHFFFAOYSA-N 0.000 description 1
- OVEUFHOBGCSKSH-UHFFFAOYSA-N 2-methyl-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound CC1=CC=CC=C1N(CC1OC1)CC1OC1 OVEUFHOBGCSKSH-UHFFFAOYSA-N 0.000 description 1
- RTEZVHMDMFEURJ-UHFFFAOYSA-N 2-methylpentan-2-yl 2,2-dimethylpropaneperoxoate Chemical compound CCCC(C)(C)OOC(=O)C(C)(C)C RTEZVHMDMFEURJ-UHFFFAOYSA-N 0.000 description 1
- YMMLZUQDXYPNOG-UHFFFAOYSA-N 2-methylpentan-2-yl 7,7-dimethyloctaneperoxoate Chemical compound CCCC(C)(C)OOC(=O)CCCCCC(C)(C)C YMMLZUQDXYPNOG-UHFFFAOYSA-N 0.000 description 1
- WXDJDZIIPSOZAH-UHFFFAOYSA-N 2-methylpentan-2-yl benzenecarboperoxoate Chemical compound CCCC(C)(C)OOC(=O)C1=CC=CC=C1 WXDJDZIIPSOZAH-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- UPTHZKIDNHJFKQ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(O)CO UPTHZKIDNHJFKQ-UHFFFAOYSA-N 0.000 description 1
- RPBWMJBZQXCSFW-UHFFFAOYSA-N 2-methylpropanoyl 2-methylpropaneperoxoate Chemical compound CC(C)C(=O)OOC(=O)C(C)C RPBWMJBZQXCSFW-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 1
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical compound CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VXVUDUCBEZFQGY-UHFFFAOYSA-N 4,4-dimethylpentanenitrile Chemical compound CC(C)(C)CCC#N VXVUDUCBEZFQGY-UHFFFAOYSA-N 0.000 description 1
- MKTOIPPVFPJEQO-UHFFFAOYSA-N 4-(3-carboxypropanoylperoxy)-4-oxobutanoic acid Chemical compound OC(=O)CCC(=O)OOC(=O)CCC(O)=O MKTOIPPVFPJEQO-UHFFFAOYSA-N 0.000 description 1
- USWANRSZMQLWTG-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)butyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOCC1CO1 USWANRSZMQLWTG-UHFFFAOYSA-N 0.000 description 1
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 description 1
- NCAVPEPBIJTYSO-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate;2-(oxiran-2-ylmethoxymethyl)oxirane Chemical compound C1OC1COCC1CO1.OCCCCOC(=O)C=C NCAVPEPBIJTYSO-UHFFFAOYSA-N 0.000 description 1
- OPPHXULEHGYZRW-UHFFFAOYSA-N 4-methoxy-2,4-dimethyl-2-phenyldiazenylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC1=CC=CC=C1 OPPHXULEHGYZRW-UHFFFAOYSA-N 0.000 description 1
- NFWPZNNZUCPLAX-UHFFFAOYSA-N 4-methoxy-3-methylaniline Chemical compound COC1=CC=C(N)C=C1C NFWPZNNZUCPLAX-UHFFFAOYSA-N 0.000 description 1
- 125000004864 4-thiomethylphenyl group Chemical group 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- JNMQSQSQBYTXSV-UHFFFAOYSA-N C(CCCCCCCCCCC)C1=C(C=CC=C1)IC1=C(C=CC=C1)CCCCCCCCCCCC Chemical compound C(CCCCCCCCCCC)C1=C(C=CC=C1)IC1=C(C=CC=C1)CCCCCCCCCCCC JNMQSQSQBYTXSV-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920001174 Diethylhydroxylamine Polymers 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920002582 Polyethylene Glycol 600 Polymers 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 241000750631 Takifugu chinensis Species 0.000 description 1
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007875 V-40 Substances 0.000 description 1
- 239000007878 VAm-110 Substances 0.000 description 1
- SEEVRZDUPHZSOX-WPWMEQJKSA-N [(e)-1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(\C)=N\OC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-WPWMEQJKSA-N 0.000 description 1
- LOCXTTRLSIDGPS-FVDSYPCUSA-N [(z)-[1-oxo-1-(4-phenylsulfanylphenyl)octan-2-ylidene]amino] benzoate Chemical compound C=1C=C(SC=2C=CC=CC=2)C=CC=1C(=O)C(/CCCCCC)=N\OC(=O)C1=CC=CC=C1 LOCXTTRLSIDGPS-FVDSYPCUSA-N 0.000 description 1
- SEEVRZDUPHZSOX-UHFFFAOYSA-N [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(C)=NOC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-UHFFFAOYSA-N 0.000 description 1
- HTMMMSIQFWMMIJ-UHFFFAOYSA-N [3-[2,2-dimethyl-3-(6-prop-2-enoyloxyhexanoyloxy)propanoyl]oxy-2,2-dimethylpropyl] 6-prop-2-enoyloxyhexanoate Chemical compound C=CC(=O)OCCCCCC(=O)OCC(C)(C)COC(=O)C(C)(C)COC(=O)CCCCCOC(=O)C=C HTMMMSIQFWMMIJ-UHFFFAOYSA-N 0.000 description 1
- YNTQTLGBCMXNFX-UHFFFAOYSA-N [5-ethyl-2-(2-methyl-1-prop-2-enoyloxypropan-2-yl)-1,3-dioxan-5-yl]methyl prop-2-enoate Chemical compound C=CC(=O)OCC1(CC)COC(C(C)(C)COC(=O)C=C)OC1 YNTQTLGBCMXNFX-UHFFFAOYSA-N 0.000 description 1
- LOCXTTRLSIDGPS-UHFFFAOYSA-N [[1-oxo-1-(4-phenylsulfanylphenyl)octan-2-ylidene]amino] benzoate Chemical compound C=1C=C(SC=2C=CC=CC=2)C=CC=1C(=O)C(CCCCCC)=NOC(=O)C1=CC=CC=C1 LOCXTTRLSIDGPS-UHFFFAOYSA-N 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- IKBVWGOHCLVYTA-UHFFFAOYSA-N butan-2-yl butan-2-yloxy carbonate Chemical compound CCC(C)OOC(=O)OC(C)CC IKBVWGOHCLVYTA-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001924 cycloalkanes Chemical group 0.000 description 1
- LMGZGXSXHCMSAA-UHFFFAOYSA-N cyclodecane Chemical group C1CCCCCCCCC1 LMGZGXSXHCMSAA-UHFFFAOYSA-N 0.000 description 1
- VBWIZSYFQSOUFQ-UHFFFAOYSA-N cyclohexanecarbonitrile Chemical compound N#CC1CCCCC1 VBWIZSYFQSOUFQ-UHFFFAOYSA-N 0.000 description 1
- NLUNLVTVUDIHFE-UHFFFAOYSA-N cyclooctylcyclooctane Chemical group C1CCCCCCC1C1CCCCCCC1 NLUNLVTVUDIHFE-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000000412 dendrimer Substances 0.000 description 1
- 229920000736 dendritic polymer Polymers 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- WSFMFXQNYPNYGG-UHFFFAOYSA-M dimethyl-octadecyl-(3-trimethoxysilylpropyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCC[Si](OC)(OC)OC WSFMFXQNYPNYGG-UHFFFAOYSA-M 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- GZAROOOHRGKEPC-UHFFFAOYSA-N n-butyl-2-methylpropanamide Chemical compound CCCCNC(=O)C(C)C GZAROOOHRGKEPC-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical group C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical class C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 description 1
- UFUASNAHBMBJIX-UHFFFAOYSA-N propan-1-one Chemical compound CC[C]=O UFUASNAHBMBJIX-UHFFFAOYSA-N 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- YXTWPSHEGIZWEU-UHFFFAOYSA-N propoxy propyl carbonate Chemical compound CCCOOC(=O)OCCC YXTWPSHEGIZWEU-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 235000019281 tert-butylhydroquinone Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Polymerisation Methods In General (AREA)
- Electroluminescent Light Sources (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
Abstract
본 발명은, 1분자 중에 2개 이상의 에틸렌성 불포화기를 갖는 화합물, 반소성 하이드로탈사이트, 및 라디칼 중합 개시제를 포함하는 밀봉용 조성물을 제공한다.The present invention provides a sealing composition containing a compound having two or more ethylenically unsaturated groups in one molecule, semi-baked hydrotalcite, and a radical polymerization initiator.
Description
본 발명은 밀봉용 조성물에 관한 것으로, 특히 유기 EL(Electroluminescence) 소자 등의 발광 소자나 태양 전지 등의 수광 소자 등의 밀봉에 적합한 밀봉용 조성물에 관한 것이다.The present invention relates to a sealing composition, and particularly to a sealing composition suitable for sealing light-emitting devices such as organic EL (Electroluminescence) devices and light-receiving devices such as solar cells.
유기 EL 소자는 발광 재료에 유기 물질을 사용한 발광 소자이며, 저전압으로 고휘도의 발광을 얻을 수 있기 때문에 최근 각광을 받고 있다. 그러나, 유기 EL 소자는 수분에 극히 약하고, 발광 재료(발광층)가 수분에 의해 변질되어, 휘도가 저하되거나, 발광하지 않게 되거나, 전극과 발광층과의 계면이 수분의 영향으로 박리되거나, 금속이 산화되어 고저항화되어 버리거나 하는 문제가 있다. 이 때문에, 소자 내부를 외기 중의 수분으로부터 차단하기 위해, 예를 들어, 기판 위에 형성된 발광층의 전면을 덮도록 조성물에 의해 밀봉층을 형성하여 유기 EL 소자를 밀봉하는 것이 행해진다. 이러한 유기 EL 소자의 밀봉층에는 높은 수분 차단성이 요구된다. 또한, 디스플레이나 터치 패널, 조명 등의 용도에서, 밀봉면으로부터 광을 추출하는 구조나 투과형의 구조인 경우, 밀봉층에도 높은 투명성도 요구된다. 이와 같이, 높은 수분 차단성과 투명성을 양립하는 밀봉층을 형성할 수 있는 조성물이 요구되고 있다.Organic EL devices are light-emitting devices that use organic materials as light-emitting materials, and have recently been in the spotlight because they can produce high-brightness light emission at low voltage. However, organic EL elements are extremely vulnerable to moisture, and the light-emitting material (light-emitting layer) may deteriorate due to moisture, resulting in lowered luminance or no longer emitting light, or the interface between the electrode and the light-emitting layer may peel off under the influence of moisture, or the metal may oxidize. There is a problem that the resistance becomes high. For this reason, in order to block the inside of the device from moisture in the outside air, for example, the organic EL device is sealed by forming a sealing layer with a composition to cover the entire surface of the light emitting layer formed on the substrate. The sealing layer of such an organic EL device is required to have high moisture barrier properties. Additionally, in applications such as displays, touch panels, and lighting, in the case of a structure that extracts light from the sealing surface or a transmissive structure, high transparency is also required in the sealing layer. In this way, there is a demand for a composition that can form a sealing layer that has both high moisture barrier properties and transparency.
특허문헌 1에는, 수소 첨가 환상 올레핀계 폴리머 및 폴리이소부틸렌 수지를 포함하는 접착성 봉입용 조성물이 기재되어 있다. 특허문헌 1에는, 상기 조성물에, 추가로 광경화형 수지 및 광중합 개시제를 배합시키는 것이 기재되어 있다. 또한, 특허문헌 2에는, 경화성 화합물과, 중합 개시제와, 흡수율이 30중량% 이상인 제1 흡습제와, 흡수율이 5중량% 이상 30중량% 미만인 제2 흡습제를 함유하는 경화성 조성물이 기재되어 있다. 그러나, 특허문헌 1 및 2의 어느 것에도, 높은 수분 차단성과 투명성을 양립하는 밀봉층에 대해서는 기재되어 있지 않다.Patent Document 1 describes a composition for adhesive encapsulation containing a hydrogenated cyclic olefin polymer and a polyisobutylene resin. Patent Document 1 describes further blending a photocurable resin and a photopolymerization initiator into the composition. Additionally, Patent Document 2 describes a curable composition containing a curable compound, a polymerization initiator, a first moisture absorbent with a water absorption of 30% by weight or more, and a second moisture absorbent with a water absorption of 5% by weight or more and less than 30% by weight. However, neither Patent Documents 1 nor 2 describe a sealing layer that achieves both high moisture barrier properties and transparency.
본 발명은, 수분 차단성 및 투명성의 양쪽이 뛰어난 밀봉층(경화물층)을 형성할 수 있는 밀봉용 조성물을 제공하는 것을 목적으로 한다. The purpose of the present invention is to provide a sealing composition capable of forming a sealing layer (cured layer) that is excellent in both moisture barrier properties and transparency.
본 발명자들은, 상기 목적을 달성하기 위해 예의 연구를 한 결과, 1분자 중에 2개 이상의 에틸렌성 불포화기를 갖는 화합물, 반소성 하이드로탈사이트 및 라디칼 중합 개시제를 포함하는 조성물이, 수분 차단성 및 투명성의 양쪽이 뛰어난 밀봉층(경화물층)을 형성할 수 있음을 발견하였다. 이와 같은 지견에 기초하는 본 발명은, 이하와 같다. The present inventors have conducted extensive research to achieve the above object, and as a result, a composition containing a compound having two or more ethylenically unsaturated groups in one molecule, semi-calcined hydrotalcite, and a radical polymerization initiator has moisture barrier properties and transparency. It was discovered that both sides can form an excellent sealing layer (cured material layer). The present invention based on such knowledge is as follows.
[1] 1분자 중에 2개 이상의 에틸렌성 불포화기를 갖는 화합물, 반소성 하이드로탈사이트 및 라디칼 중합 개시제를 포함하는 밀봉용 조성물. [1] A sealing composition containing a compound having two or more ethylenically unsaturated groups in one molecule, semi-baked hydrotalcite, and a radical polymerization initiator.
[2] 1분자 중에 2개 이상의 에틸렌성 불포화기를 갖는 화합물이, 1분자 중에 3개 이상의 에틸렌성 불포화기를 갖는 화합물을 포함하는 상기 [1]에 기재된 조성물. [2] The composition according to [1] above, wherein the compound having two or more ethylenically unsaturated groups in one molecule includes a compound having three or more ethylenically unsaturated groups in one molecule.
[3] 1분자 중에 2개 이상의 에틸렌성 불포화기를 갖는 화합물이, 1분자 중에 2개 이상의 에틸렌성 불포화기 및 지환식 구조를 갖는 화합물을 포함하는 상기 [1] 또는 [2]에 기재된 조성물.[3] The composition according to [1] or [2] above, wherein the compound having two or more ethylenically unsaturated groups in one molecule includes a compound having two or more ethylenically unsaturated groups and an alicyclic structure in one molecule.
[4] 추가로 희석제를 포함하는 상기 [1] 내지 [3] 중 어느 하나에 기재된 조성물.[4] The composition according to any one of [1] to [3] above, further comprising a diluent.
[5] 희석제가, 1분자 중에 1개의 에틸렌성 불포화기를 갖는 화합물인 상기 [4]에 기재된 조성물.[5] The composition according to [4] above, wherein the diluent is a compound having one ethylenically unsaturated group per molecule.
[6] 에틸렌성 불포화기가 (메타)아크릴로일기인 상기 [1] 내지 [5] 중 어느 하나에 기재된 조성물.[6] The composition according to any one of [1] to [5] above, wherein the ethylenically unsaturated group is a (meth)acryloyl group.
[7] 1분자 중에 2개 이상의 에틸렌성 불포화기를 갖는 화합물의 양이, 조성물 전체당 20 내지 78질량%인 상기 [1] 내지 [6] 중 어느 하나에 기재된 조성물.[7] The composition according to any one of [1] to [6] above, wherein the amount of the compound having two or more ethylenically unsaturated groups per molecule is 20 to 78% by mass per entire composition.
[8] 반소성 하이드로탈사이트의 양이, 조성물 전체당, 10 내지 70질량%인 상기 [1] 내지 [7] 중 어느 하나에 기재된 조성물.[8] The composition according to any one of [1] to [7] above, wherein the amount of semi-calcined hydrotalcite is 10 to 70% by mass per total composition.
[9] 라디칼 중합 개시제가, 광 라디칼 중합 개시제 및/또는 열 라디칼 중합 개시제인 상기 [1] 내지 [8] 중 어느 하나에 기재된 조성물.[9] The composition according to any one of [1] to [8] above, wherein the radical polymerization initiator is a photo-radical polymerization initiator and/or a thermal radical polymerization initiator.
[10] 라디칼 중합 개시제의 양이, 에틸렌성 불포화기를 갖는 화합물 100질량부에 대하여, 0.5 내지 10질량부인 상기 [1] 내지 [9] 중 어느 하나에 기재된 조성물.[10] The composition according to any one of [1] to [9] above, wherein the amount of the radical polymerization initiator is 0.5 to 10 parts by mass based on 100 parts by mass of the compound having an ethylenically unsaturated group.
[11] 추가로 실란 커플링제를 포함하는 상기 [1] 내지 [10] 중 어느 하나에 기재된 조성물.[11] The composition according to any one of [1] to [10] above, further comprising a silane coupling agent.
[12] 두께가 20μm인 조성물의 경화물층의 D65광으로의 전광선 투과율이 85% 이상인 상기 [1] 내지 [11] 중 어느 하나에 기재된 조성물. [12] The composition according to any one of [1] to [11] above, wherein the total light transmittance of the cured layer of the composition having a thickness of 20 μm to D65 light is 85% or more.
[13] 두께가 20μm인 조성물의 경화물층의 헤이즈가 3.0% 미만인 상기 [1] 내지 [12] 중 어느 하나에 기재된 조성물.[13] The composition according to any one of [1] to [12] above, wherein the haze of the cured layer of the composition having a thickness of 20 μm is less than 3.0%.
[14] 액상인 상기 [1] 내지 [13] 중 어느 하나에 기재된 조성물.[14] The composition according to any one of [1] to [13] above, which is in a liquid form.
[15] 유기 EL 소자의 밀봉용인 상기 [1] 내지 [14] 중 어느 하나에 기재된 조성물.[15] The composition according to any one of [1] to [14] above, which is for sealing an organic EL device.
[16] 상기 [1] 내지 [15] 중 어느 하나에 기재된 조성물의 경화물로 유기 EL 소자가 밀봉된 유기 EL 디바이스. [16] An organic EL device in which an organic EL element is sealed with a cured product of the composition according to any one of [1] to [15] above.
본 발명의 조성물로부터, 수분 차단성 및 투명성의 양쪽이 뛰어난 밀봉층을 형성할 수 있다. From the composition of the present invention, a sealing layer excellent in both moisture barrier properties and transparency can be formed.
<조성물><Composition>
본 발명의 조성물은, 1분자 중에 2개 이상의 에틸렌성 불포화기를 갖는 화합물, 반소성 하이드로탈사이트, 및 라디칼 중합 개시제를 포함한다. 여기에서 「에틸렌성 불포화기」란, 에틸렌성 이중 결합을 갖는 관능기를 의미한다. 본 발명의 조성물은, 상기 성분, 및 필요에 따라 다른 성분을 혼련 롤러나 회전 믹서 등을 사용하여 혼합함으로써 제조할 수 있다.The composition of the present invention contains a compound having two or more ethylenically unsaturated groups in one molecule, semi-calcined hydrotalcite, and a radical polymerization initiator. Here, “ethylenically unsaturated group” means a functional group having an ethylenic double bond. The composition of the present invention can be produced by mixing the above components and, if necessary, other components using a kneading roller, rotary mixer, or the like.
본 발명의 조성물은, 예를 들어, 반도체, 태양 전지, 고휘도 LED, LCD, EL 소자 등의 전자 부품, 바람직하게는 유기 EL 소자, 태양 전지 등의 광학 반도체의 밀봉에 사용된다. 본 발명의 조성물은, 특히 유기 EL 소자의 밀봉에 적합하게 사용된다. 구체적으로는, 유기 EL 소자의 발광부의 상부 및/또는 주위(측부)에 적용하여 유기 EL 소자의 발광부를 외부로부터 보호하기 위해, 본 발명의 조성물을 사용할 수 있다.The composition of the present invention is used, for example, for sealing electronic components such as semiconductors, solar cells, high-brightness LEDs, LCDs, and EL devices, and preferably optical semiconductors such as organic EL devices and solar cells. The composition of the present invention is particularly suitably used for sealing organic EL devices. Specifically, the composition of the present invention can be used to protect the light-emitting part of an organic EL element from the outside by applying it to the top and/or surroundings (sides) of the light-emitting part of the organic EL element.
본 발명의 조성물은, 바람직하게는 액상의 밀봉용 조성물이다. 여기에서 「액상의 밀봉용 조성물」이란, 상온(25℃) 및 상압(1기압)에서 유동성을 갖는 밀봉용 조성물을 의미한다. 예를 들어, 무기 충전제를 포함하는 밀봉용 조성물도, 상온 및 상압에서 유동성을 가지면, 본 발명에서의 액상의 밀봉용 조성물에 해당한다. 액상의 밀봉재(밀봉용 조성물)는 필름상의 밀봉재와 비교하여, 일반적으로, 회로를 갖는 발광 소자면의 매립성, 밀봉면이 대면적인 경우의 보이드의 억제, 밀봉층의 막두께 조정의 용이성, 밀봉 전에 댐을 형성하고, 위치를 맞춤으로써 달성되는 높은 얼라이먼트 정밀도 등의 점에서 유리해지는 경우가 많다.The composition of the present invention is preferably a liquid sealing composition. Here, “liquid sealing composition” means a sealing composition that has fluidity at room temperature (25°C) and normal pressure (1 atm). For example, a sealing composition containing an inorganic filler also corresponds to a liquid sealing composition in the present invention if it has fluidity at room temperature and pressure. Compared to film-shaped sealing materials, liquid sealing materials (sealing compositions) generally have the following advantages: embedding ability in the surface of a light emitting element having a circuit, suppression of voids when the sealing surface is large, ease of adjustment of the film thickness of the sealing layer, and sealing. It is often advantageous in terms of high alignment precision achieved by forming the dam before and adjusting its position.
본 발명의 조성물은, 용제 등의 휘발분을 포함하지 않는 것이 바람직하다. 또한, 본 발명의 조성물이 용제 등의 휘발분을 포함하는 경우, 각 성분의 양의 기준에는, 용제 등의 휘발분은 포함되지 않는다. 즉, 본 발명의 조성물이 휘발분을 포함하는 경우, 각 성분의 양의 기준인 「조성물 전체당」이란, 「조성물의 불휘발분 전체당」을 의미한다.It is preferable that the composition of the present invention does not contain volatile components such as solvents. In addition, when the composition of the present invention contains volatile components such as solvents, volatile components such as solvents are not included in the standard for the amount of each component. That is, when the composition of the present invention contains volatile matter, “the total sugar of the composition”, which is the standard for the amount of each component, means “the total sugar of the non-volatile matter of the composition.”
<1분자 중에 2개 이상의 에틸렌성 불포화기를 갖는 화합물><Compounds having two or more ethylenically unsaturated groups in one molecule>
본 발명의 조성물은, 1분자 중에 2개 이상의 에틸렌성 불포화기를 갖는 화합물(이하 「다관능 에틸렌성 불포화 화합물」이라고 약칭하는 경우가 있음)을 포함한다. 다관능 에틸렌성 불포화 화합물은, 1종만을 단독으로 사용해도되고, 2종 이상을 병용해도 좋다. 다관능 에틸렌성 불포화 화합물은 본 발명의 효과가 발휘되는 범위에서, 에폭시기 등의 다른 관능기를 포함하고 있어도 좋다. 또한, 에폭시기를 포함하는 다관능 에틸렌성 불포화 화합물은, 본 발명에서는, 에폭시 수지가 아니라, 다관능 에틸렌성 불포화 화합물로 분류된다.The composition of the present invention contains a compound having two or more ethylenically unsaturated groups in one molecule (hereinafter sometimes abbreviated as “polyfunctional ethylenically unsaturated compound”). The polyfunctional ethylenically unsaturated compound may be used individually or in combination of two or more types. The polyfunctional ethylenically unsaturated compound may contain other functional groups such as an epoxy group, as long as the effect of the present invention is exhibited. In addition, in the present invention, polyfunctional ethylenically unsaturated compounds containing an epoxy group are classified as polyfunctional ethylenically unsaturated compounds, not epoxy resins.
다관능 에틸렌성 불포화 화합물은, 본 발명의 밀봉용 조성물을 액상으로 하기 위해, 액상인 것이 바람직하다. 여기에서 「액상」이란, 상온(25℃) 및 상압(1 기압)에서의 다관능 에틸렌성 불포화 화합물의 상태이다. 다관능 에틸렌성 불포화 화합물이 2종 이상의 화합물의 혼합물인 경우, 이것들의 혼합물이 액상인 것이 바람직하다. 예를 들어, 고형의 다관능 에틸렌성 불포화 화합물과 액상의 다관능 에틸렌성 화합물을 사용하는 경우, 이들 화합물의 혼합물이 액상인 것이 바람직하다.The polyfunctional ethylenically unsaturated compound is preferably in a liquid form in order to make the sealing composition of the present invention in a liquid form. Here, “liquid phase” refers to the state of a polyfunctional ethylenically unsaturated compound at room temperature (25°C) and normal pressure (1 atm). When the polyfunctional ethylenically unsaturated compound is a mixture of two or more types of compounds, it is preferable that these mixtures are in a liquid state. For example, when using a solid polyfunctional ethylenically unsaturated compound and a liquid polyfunctional ethylenically compound, it is preferable that the mixture of these compounds is liquid.
다관능 에틸렌성 불포화 화합물은, 고밀도의 가교 구조를 형성하고, 높은 수분 차단성을 발휘하는 관점에서, 바람직하게는 1분자 중에 3개 이상의 에틸렌성 불포화기를 갖는 화합물, 보다 바람직하게는 1분자 중에 4개 이상의 에틸렌성 불포화기, 더욱 바람직하게는 1분자 중에 5개 이상의 에틸렌성 불포화기를 갖는 화합물, 특히 바람직하게는 1분자 중에 6개 이상의 에틸렌성 불포화기를 갖는 화합물을 포함한다. 다관능 에틸렌성 불포화 화합물에 있어서, 1분자 중에 포함되는 에틸렌성 불포화기의 수의 상한은 특별히 한정되지 않지만, 그 수는, 바람직하게는 15 이하,보다 바람직하게는 12 이하, 더욱 바람직하게는 10 이하이다.From the viewpoint of forming a high-density crosslinked structure and exhibiting high moisture barrier properties, the polyfunctional ethylenically unsaturated compound is preferably a compound having 3 or more ethylenically unsaturated groups per molecule, and more preferably 4 per molecule. It includes compounds having at least 5 ethylenically unsaturated groups, more preferably at least 5 ethylenically unsaturated groups in one molecule, and particularly preferably at least 6 ethylenically unsaturated groups in one molecule. In the polyfunctional ethylenically unsaturated compound, the upper limit of the number of ethylenically unsaturated groups contained in one molecule is not particularly limited, but the number is preferably 15 or less, more preferably 12 or less, and still more preferably 10. It is as follows.
1분자 중에 3개 이상의 에틸렌성 불포화기를 갖는 화합물을 사용하는 경우, 그 양은, 높은 수분 차단성을 발휘하는 관점에서, 조성물 전체당, 바람직하게는 2질량% 이상, 보다 바람직하게는 3질량% 이상, 더욱 바람직하게는 4질량% 이상이며, 바람직하게는 70질량% 이하, 보다 바람직하게는 65질량% 이하, 더욱 바람직하게는 60질량% 이하이다.When using a compound having 3 or more ethylenically unsaturated groups in one molecule, the amount is preferably 2% by mass or more, more preferably 3% by mass or more, per entire composition, from the viewpoint of demonstrating high moisture barrier properties. , more preferably 4% by mass or more, preferably 70% by mass or less, more preferably 65% by mass or less, and even more preferably 60% by mass or less.
다관능 에틸렌성 불포화 화합물은, 수분 차단성을 높이는 관점에서, 바람직하게는 1분자 중에 2개 이상의 에틸렌성 불포화기 및 지환식 구조를 갖는 화합물,보다 바람직하게는 1분자 중에 2개의 에틸렌성 불포화기 및 지환식 구조를 갖는 화합물을 포함한다. 지환식 구조로서는, 예를 들어, 탄소 원자수 5 내지 12의 지환 식 탄화수소환을 갖는 구조를 들 수 있다. 지환식 탄화수소환으로서는, 예를 들어 트리사이클로[5.2.1.02,6]데칸환, 보르난환, 이소보르난환, 사이클로헥산환, 비사이클로옥탄환, 노르보르난환, 사이클로데칸환, 아다만탄환, 사이클로펜탄환 등을 들 수 있다. 지환식 구조 중에 헤테로 원자를 갖고 있어도 좋다. 또한 지환식 구조는, 알킬기, 알콕시기, 알킬렌기 등의 치환기가 결합되어 있어도 좋다.From the viewpoint of improving moisture barrier properties, the polyfunctional ethylenically unsaturated compound is preferably a compound having two or more ethylenically unsaturated groups and an alicyclic structure in one molecule, and more preferably two ethylenically unsaturated groups in one molecule. and compounds having an alicyclic structure. Examples of the alicyclic structure include structures having an alicyclic hydrocarbon ring having 5 to 12 carbon atoms. Examples of alicyclic hydrocarbon rings include tricyclo[5.2.1.0 2,6 ] decane ring, bornane ring, isobornane ring, cyclohexane ring, bicyclooctane ring, norbornene ring, cyclodecane ring, adamantane ring, Cyclopentane, etc. can be mentioned. The alicyclic structure may have a hetero atom. Additionally, the alicyclic structure may have a substituent such as an alkyl group, an alkoxy group, or an alkylene group bonded thereto.
1분자 중에 2개 이상의 에틸렌성 불포화기 및 지환식 구조를 갖는 화합물(특히, 1분자 중에 2개의 에틸렌성 불포화기 및 지환식 구조를 갖는 화합물)을 사용하는 경우, 그 양은, 조성물 전체당, 바람직하게는 5질량% 이상, 보다 바람직하게는 10질량% 이상, 더욱 바람직하게는 15질량% 이상이고, 바람직하게는 75질량% 이하, 보다 바람직하게는 70질량% 이하, 더욱 바람직하게는 65질량% 이하이다.When using a compound having two or more ethylenically unsaturated groups and an alicyclic structure in one molecule (particularly, a compound having two ethylenically unsaturated groups and an alicyclic structure in one molecule), the amount is preferably per composition. Preferably it is 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, preferably 75% by mass or less, more preferably 70% by mass or less, and even more preferably 65% by mass. It is as follows.
에틸렌성 불포화기로서는, (메타)아크릴로일기가 바람직하다. 즉, 에틸렌성 불포화기를 갖는 화합물로서는, (메타)아크릴로일기를 갖는 (메타)아크릴레이트가 바람직하다. 본 명세서 중, 「(메타)아크릴로일기」란, 「아크릴로일기 및/또는 메타크릴로일기」를 의미하고, 「(메타)아크릴레이트」란, 「아크릴레이트 및/또는 메타크릴레이트」를 의미한다. 또한, 1분자 중에 2개 이상의 (메타)아크릴로일기를 갖는 (메타)아크릴레이트를, 이하 「다관능 (메타)아크릴레이트」라고 약칭하는 경우가 있다. 또한 1분자 중에 2개의 (메타)아크릴로일기를 갖는 (메타)아크릴레이트를 「2관능 (메타)아크릴레이트」라고 약칭하는 경우가 있다.As the ethylenically unsaturated group, a (meth)acryloyl group is preferable. That is, as the compound having an ethylenically unsaturated group, (meth)acrylate having a (meth)acryloyl group is preferable. In this specification, “(meth)acryloyl group” means “acryloyl group and/or methacryloyl group”, and “(meth)acrylate” means “acrylate and/or methacrylate”. it means. In addition, (meth)acrylate having two or more (meth)acryloyl groups in one molecule may hereinafter be abbreviated as “polyfunctional (meth)acrylate”. Additionally, (meth)acrylate having two (meth)acryloyl groups in one molecule is sometimes abbreviated as “bifunctional (meth)acrylate”.
다관능 (메타)아크릴레이트로서는, 올리고머를 사용해도 좋다. 올리고머로서는, 예를 들어, 폴리에스테르폴리올과 아크릴산과의 반응으로 합성되는 폴리에스테르 올리고머, 우레탄 결합을 갖는 우레탄 올리고머, 글리시딜에테르와 아크릴산 또는 카르복시기를 갖는 아크릴레이트와의 반응으로 합성되는 에폭시 올리고머 등을 들 수 있다.As the multifunctional (meth)acrylate, an oligomer may be used. Examples of oligomers include polyester oligomers synthesized by the reaction of polyester polyol and acrylic acid, urethane oligomers with urethane bonds, epoxy oligomers synthesized by the reaction of glycidyl ether with acrylic acid or acrylate with a carboxyl group, etc. can be mentioned.
2관능 (메타)아크릴레이트로서는, 예를 들어, 다이셀 오르넥스사 제조 「DPGDA」(디프로필렌글리콜 디아크릴레이트), 「HDDA」(1,6-헥산디올 디아크릴레이트) 「TPGDA」(트리프로필렌글리콜 디아크릴레이트), 「EBECRYL145」(PO 변성 네오펜틸글리콜 디아크릴레이트), 「EBECRYL150」(변성 비스페놀A 디아크릴레이트), 「IRR214-K」(트리사이클로데칸디메탄올 디아크릴레이트), 「EBECRYL11」(PEG600 디아크릴레이트), 「HPNDA」(네오펜틸글리콜 하이드록시피발산에스테르 디아크릴레이트), 쿄에이샤 카가쿠사 제조 「라이트 에스테르 EG」(에틸렌글리콜 디메타크릴레이트), 「라이트 에스테르 NP-A」(네오펜틸글루콜 디메타크릴레이트), 「라이트 에스테르 2EG」(디에틸렌글리콜 디메타크릴레이트), 「라이트 에스테르 1.6HX」(1,6-헥산디올 디메타크릴레이트), 「라이트 에스테르 1.9ND」(1,9-노난디올 디메타크릴레이트), 「라이트 에스테르 G-101P」(글리세린 디메타크릴레이트), 「라이트 에스테르 BP-2EMK」(비스페놀A의 EO 부가물 디메타크릴레이트), 「라이트 아크릴레이트 NP-A」(네오펜틸글리콜 디아크릴레이트), 「라이트 아크릴레이트 1.9ND-A」(1,9-노난디올 디아크릴레이트), 「라이트 아크릴레이트 BP-4EAL」(비스페놀A의 EO 부가물 디아크릴레이트)」, 「라이트 아크릴레이트 BP-4PA」(비스페놀A의 PO 부가물 디아크릴레이트), 신나카무라 카가쿠코교사 제조 「NK 에스테르 701A」(2-하이드록시-3-메타크릴프로필아크릴레이트), 「NK 에스테르 A-200」(폴리에틸렌글리콜#200 디아크릴레이트), 「NK 에스테르 APG-400」(폴리프로필렌글리콜#400 디아크릴레이트),「NK 에스테르 A-PTMG-65」(폴리테트라메틸렌글리콜#650 디아크릴레이트), 「NK 에스테르 A-1206PE」(폴리에틸렌폴리프로필렌글리콜 디아크릴레이트), 「NK 에스테르에스테르 A-BPEF」(9,9-비스[4-(2-하이드록시에톡시)페닐]플루오렌 디아크릴레이트), 「NK 에스테르에스테르 A-BPE 30」(에톡시화 비스페놀A 디아크릴레이트), 「NK 에스테르 A-BPP-3」(프로폭시화 비스페놀A 디아크릴레이트), 「NK 에스테르 BG」(1,3-부탄디올 디메타크릴레이트), 「NK 에스테르 701」(2-하이드록시-1,3-디메타크릴록시프로판), 「NK 에스테르 3PG」(트리프로필렌글리콜 디메타크릴레이트), 「NK 에스테르에스테르에스테르 1206PE」(폴리에틸렌폴리프로필렌글리콜 디메타크릴레이트), 「NK 에스테르 DCP」(트리사이클로데칸디메탄올 디메타크릴레이트), 닛폰 카야쿠사 제조 「KAYARAD FM-400」, 「KAYARAD HX-220」, 「KAYARAD HX-620」(네오펜틸 변성 디아크릴레이트), 「KAYARAD R-604」(디옥산글리콜 디아크릴레이트), 「KAYARAD UX-3204」(1분자 중에 2개의 아크릴기를 갖는 올리고머), 오사카 유키 카가쿠코교사 제조 「비스코토#195」(1,4-부탄디올 디아크릴레이트), 「비스코토#540」(비스페놀A디글리시딜에테르 아크릴산 부가물), 아르케마사 제조 「CD406」(사이클로헥산디메탄올 디아크릴레이트), 「SR562」(알콕시화 헥산디올 디아크릴레이트), 다이셀 오르넥스사 제조 「EBECRYL600」(1분자 중에 2개의 아크릴로일기를 갖는 비스페놀A형 에폭시아크릴레이트), 「EBECRYL210」(1분자 중에 2개의 아크릴로일기를 갖는 방향족 우레탄 올리머), 「EBECRYL230」(1분자 중에 2개의 아크릴기를 갖는 지방족 우레탄 올리고머), 「EBECRYL436」(1분자 중에 2개의 아크릴기를 갖는 에스테르 올리고머), 아르케마사 제조 「CN959」(1분자 중에 2개의 아크릴기를 갖는 우레탄 올리고머), 네카미 코교사 제조 「아트레진 UN-9000PEP」(1분자 중에 2개의 아크릴로일기를 갖는 우레탄 올리고머) 「아트레진 UN-333」(1분자 중에 2개의 아크릴기를 갖는 올리고머) 등을 들 수 있다. As bifunctional (meth)acrylates, for example, “DPGDA” (dipropylene glycol diacrylate), “HDDA” (1,6-hexanediol diacrylate), and “TPGDA” (trimethylcellulose) manufactured by Daicel Ornex. propylene glycol diacrylate), “EBECRYL145” (PO modified neopentyl glycol diacrylate), “EBECRYL150” (modified bisphenol A diacrylate), “IRR214-K” (tricyclodecane dimethanol diacrylate), “ “EBECRYL11” (PEG600 diacrylate), “HPNDA” (neopentyl glycol hydroxypivalic acid ester diacrylate), “Light Ester EG” (ethylene glycol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., “Light Ester NP” -A” (neopentylglucol dimethacrylate), “Light Ester 2EG” (Diethylene glycol dimethacrylate), “Light Ester 1.6HX” (1,6-hexanediol dimethacrylate), “Light Ester 2EG” (Diethylene glycol dimethacrylate), “Light Ester 1.6HX” (1,6-hexanediol dimethacrylate) “Ester 1.9ND” (1,9-nonanediol dimethacrylate), “Light ester G-101P” (glycerin dimethacrylate), “Light ester BP-2EMK” (EO adduct dimethacrylate of bisphenol A) ), “Light Acrylate NP-A” (neopentyl glycol diacrylate), “Light Acrylate 1.9ND-A” (1,9-nonanediol diacrylate), “Light Acrylate BP-4EAL” (bisphenol EO adduct diacrylate of A)”, “Light acrylate BP-4PA” (PO adduct diacrylate of bisphenol A), “NK Ester 701A” (2-hydroxy-3) manufactured by Shinnakamura Kagakukogyo Co., Ltd. -Methacrylpropyl acrylate), “NK Ester A-200” (polyethylene glycol #200 diacrylate), “NK Ester APG-400” (polypropylene glycol #400 diacrylate), “NK Ester A-PTMG- 65” (polytetramethylene glycol #650 diacrylate), “NK ester A-1206PE” (polyethylene polypropylene glycol diacrylate), “NK ester ester A-BPEF” (9,9-bis[4-(2) -Hydroxyethoxy)phenyl]fluorene diacrylate), “NK ester ester A-BPE 30” (ethoxylated bisphenol A diacrylate), “NK ester A-BPP-3” (propoxylated bisphenol A diacrylate) acrylate), “NK ester BG” (1,3-butanediol dimethacrylate), “NK ester 701” (2-hydroxy-1,3-dimethacryloxypropane), “NK ester 3PG” (trimethacrylate) Propylene glycol dimethacrylate), “NK ester ester ester 1206PE” (polyethylene polypropylene glycol dimethacrylate), “NK ester DCP” (tricyclodecane dimethanol dimethacrylate), “KAYARAD FM manufactured by Nippon Kayaku Co., Ltd. -400”, “KAYARAD HX-220”, “KAYARAD HX-620” (neopentyl modified diacrylate), “KAYARAD R-604” (dioxane glycol diacrylate), “KAYARAD UX-3204” (1 molecule oligomer having two acrylic groups in the middle), Osaka Yuki Kagakukogyo Co., Ltd. “Viscoto #195” (1,4-butanediol diacrylate), “Viscoto #540” (bisphenol A diglycidyl ether acrylic acid adduct) ), “CD406” (cyclohexanedimethanol diacrylate) manufactured by Arkema, “SR562” (alkoxylated hexanediol diacrylate), “EBECRYL600” manufactured by Daicel Ornex (two acryloyl groups per molecule) bisphenol A type epoxy acrylate), “EBECRYL210” (aromatic urethane oligomer with two acryloyl groups in one molecule), “EBECRYL230” (aliphatic urethane oligomer with two acrylic groups in one molecule), “EBECRYL436” ( ester oligomer having two acrylic groups in one molecule), “CN959” manufactured by Arkema (urethane oligomer having two acrylic groups in one molecule), “Artresine UN-9000PEP” manufactured by Nekami Kogyo Co., Ltd. (two acrylic groups in one molecule) and “Artrezine UN-333” (urethane oligomer having a loyl group) (oligomer having two acrylic groups in one molecule).
1분자 중에 3개 이상의 (메타)아크릴로일기를 갖는 (메타)아크릴레이트로서는, 예를 들어 코에샤 카가쿠사 제조 「라이트 에스테르 TMP」(트리메틸올프로판 트리메타크릴레이트), 「라이트 아크릴레이트 PE-3A」(펜타에리스리톨 트리아크릴레이트), 「라이트 아크릴레이트 PE-4A」(펜타에리스리톨 테트라아크릴레이트), 「라이트 아크릴레이트 DGE-4A」(EO 부가물 변성 디글리세린 테트라아크릴레이트), 다이셀 오르넥스사 제조 「PETIA」(펜타에리스리톨 (트리/테트라)아크릴레이트), TMPTA(트리메틸올프로판 트리아크릴레이트), TMPEOTA(트리메틸올프로판에톡시 트리아크릴레이트), 「EBECRYL135」(트리메틸올프로판프로폭시 트리아크릴레이트) 「PETA」(펜타에리스리톨 (트리/테트라)아크릴레이트), 「DPHA」(디펜타에리스리톨 헥사아크릴레이트), 신나카무라 카가쿠코교사 제조 「NK 에스테르 A-TMPT」(트리메틸올프로판 트리아크릴레이트), 「NK 에스테르 A-TMPT-3PO」(프로폭시화 트리메틸올프로판 트리아크릴레이트), 「NK 에스테르 A-GLY-6E」(에톡시화 글리세린 트리아크릴레이트), 「NK 에스테르 A-GLY-6P」(프로폭시화 글리세린 트리아크릴레이트), 「NK 에스테르 A-9300」(트리스-(2-아크릴록시에틸)이소시아누레이트), 「NK 에스테르 A-9200」(비스/트리스-(2-아크릴록시에틸)이소시아누레이트), 「NK 에스테르 A-9300-1CL」(카프로락톤 변성 트리스-(2-아크릴록시에틸)이소시아누레이트), 「NK 에스테르 ATM-4EL」(에톡시화 펜타에리스리톨 (트리/테트라)아크릴레이트), 닛폰 카야쿠사 제조 「KAYARAD DPCA-20」(6관능 아크릴레이트), 「KAYARAD DPCA-60」(6관능 아크릴레이트), 「T-1420(T)」(4관능 아크릴레이트), 「DPEA-12」(6관능 아크릴레이트), 「KAYARAD DPHA-40H」(1분자 중에 10개의 아크릴로일기를 갖는 올리고머), 오사카 유키 카가쿠코교사 제조 「비스코토#802」(펜타에리스리톨아크릴레이트), 「비스코토#1000」(덴드리머아크릴레이트), 아르케마사 제조 「CN989NS」(1분자 중에 3개의 아크릴로일기를 갖는 지방족 우레탄 올리고머), 「CN9039」(1분자 중에 6개의 아크릴로일기를 갖는 지방족 우레탄 올리고머), 네카미 코교사 제조 「UN-3320HA」 「UN-3320HC」, 「UN-906S」(1분자 중에 6개의 아크릴로일기를 갖는 지방족 우레탄 올리고머), DIC사 제조 「DICLITE UE-8740」(1분자 중에 3개의 아크릴로일기를 갖는 페놀노볼락형 에폭시아크릴레이트) 등을 들 수 있다. 또한 「펜타에리스리톨 (트리/테트라)아크릴레이트」란, 펜타에리스리톨 트리아크릴레이트 및 펜타에리스리톨 테트라아크릴레이트의 혼합물을 의미한다. 다른 「(트리/테트라)」 등도 같은 의미이다. Examples of (meth)acrylates having three or more (meth)acryloyl groups in one molecule include “Light Ester TMP” (trimethylolpropane trimethacrylate) manufactured by Koesha Chemical Co., Ltd. and “Light Acrylate PE”. -3A” (pentaerythritol triacrylate), “light acrylate PE-4A” (pentaerythritol tetraacrylate), “light acrylate DGE-4A” (EO adduct-modified diglycerol tetraacrylate), Daicel Orr "PETIA" (pentaerythritol (tri/tetra)acrylate), TMPTA (trimethylolpropane triacrylate), TMPEOTA (trimethylolpropane ethoxy triacrylate), "EBECRYL135" (trimethylolpropane propoxy triacrylate) manufactured by Nex Corporation Acrylate) “PETA” (pentaerythritol (tri/tetra)acrylate), “DPHA” (dipentaerythritol hexaacrylate), “NK Ester A-TMPT” (trimethylolpropane triacrylate) manufactured by Shinnakamura Kagakukogyo Co., Ltd. rate), “NK ester A-TMPT-3PO” (propoxylated trimethylolpropane triacrylate), “NK ester A-GLY-6E” (ethoxylated glycerin triacrylate), “NK ester A-GLY-6P "(Propoxylated glycerin triacrylate), "NK Ester A-9300" (Tris-(2-acryloxyethyl)isocyanurate), "NK Ester A-9200" (Bis/Tris-(2-acrylate) oxyethyl)isocyanurate), “NK ester A-9300-1CL” (caprolactone modified tris-(2-acryloxyethyl)isocyanurate), “NK ester ATM-4EL” (ethoxylated pentaerythritol ( tri/tetra)acrylate), “KAYARAD DPCA-20” (hexa-functional acrylate) manufactured by Nippon Kayaku Co., Ltd., “KAYARAD DPCA-60” (hexa-functional acrylate), “T-1420(T)” (tetra-functional acrylate) rate), “DPEA-12” (hexa-functional acrylate), “KAYARAD DPHA-40H” (oligomer having 10 acryloyl groups in one molecule), “Viscoto #802” (Penta) manufactured by Osaka Yuki Kagakukogyo Co., Ltd. Erythritol acrylate), “Viscot #1000” (dendrimer acrylate), “CN989NS” manufactured by Arkema (aliphatic urethane oligomer with 3 acryloyl groups per molecule), “CN9039” (6 acryloyl groups per molecule) aliphatic urethane oligomer having a single group), “UN-3320HA”, “UN-3320HC”, and “UN-906S” (aliphatic urethane oligomer having 6 acryloyl groups in one molecule) manufactured by Nekami Kogyo Co., Ltd., “DICLITE” manufactured by DIC Corporation UE-8740” (phenol novolak-type epoxy acrylate having three acryloyl groups in one molecule), etc. Additionally, “pentaerythritol (tri/tetra)acrylate” means a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate. Other words such as “(tree/tetra)” also have the same meaning.
지환식 구조를 갖는 다관능 (메타)아크릴레이트로서는, 예를 들어 트리사이클로[5.2.1.02,6]데칸환 구조를 갖는, 다이셀 오르넥스사 제조 「IRR214-K」(트리사이클로데칸디메탄올 디아크릴레이트), 미츠비시 가스 카가쿠사 제조 1,3-아다만탄디올 디아크릴레이트 등을 들 수 있다. As a polyfunctional (meth)acrylate having an alicyclic structure, for example, "IRR214-K" (tricyclodecane dimethanol) manufactured by Daicel Ornex, which has a tricyclo[5.2.1.0 2,6 ] decane ring structure diacrylate), 1,3-adamantanediol diacrylate manufactured by Mitsubishi Gas Chemical Co., Ltd., etc.
다관능 에틸렌성 불포화 화합물의 양은, 조성물 전체당, 바람직하게는 20 내지 78질량%, 보다 바람직하게는 25 내지 75질량%, 더욱 바람직하게는 30 내지 70질량%이다.The amount of the polyfunctional ethylenically unsaturated compound is preferably 20 to 78% by mass, more preferably 25 to 75% by mass, and even more preferably 30 to 70% by mass, per the entire composition.
<1분자 중에 1개의 에틸렌성 불포화기를 갖는 화합물> <Compound having one ethylenically unsaturated group in one molecule>
본 발명의 밀봉용 조성물은, 1분자 중에 1개의 에틸렌성 불포화기를 갖는 화합물(이하 「단관능 에틸렌성 불포화 화합물」이라고 약칭하는 경우가 있음)을 함유하고 있다. 「단관능 에틸렌성 불포화 화합물」은, 후술하는 바와 같이, 희석제로서 본 발명의 밀봉용 조성물에 포함되는 경우가 있다. 단관능 에틸렌성 불포화 화합물은, 본 발명의 효과가 발휘되는 범위에서, 에폭시기 등의 다른 작용기를 포함하고 있어도 좋다. 이러한 화합물로서는, 예를 들어, 1분자 중에 1개 이상의 에폭시기 및 1개의 에틸렌성 불포화기를 갖는 화합물을 들 수 있다. 또한, 에폭시기를 포함하는 단관능 에틸렌성 불포화 화합물은, 본 발명에서는, 에폭시 수지가 아니라, 단관능 에틸렌성 불포화 화합물로 분류된다.The sealing composition of the present invention contains a compound having one ethylenically unsaturated group per molecule (hereinafter sometimes abbreviated as “monofunctional ethylenically unsaturated compound”). As will be described later, the “monofunctional ethylenically unsaturated compound” may be included in the sealing composition of the present invention as a diluent. The monofunctional ethylenically unsaturated compound may contain other functional groups such as an epoxy group, as long as the effect of the present invention is exhibited. Examples of such compounds include compounds having one or more epoxy groups and one ethylenically unsaturated group in one molecule. In addition, in the present invention, monofunctional ethylenically unsaturated compounds containing an epoxy group are classified as monofunctional ethylenically unsaturated compounds, not epoxy resins.
에폭시기 및 1분자 중에 1개의 에틸렌성 불포화기를 갖는 화합물의 시판품으로서는, 예를 들면 다이셀 오르넥스사 제조 「사이클로마 M100」(3,4-에폭시사이클로헥실메틸메타크릴레이트), 「UVACURE1561」(에폭시기 및 1분자 중에 1개의 아크릴로일기를 갖는 화합물(함유량: 78 내지 82질량%)과 비스페놀A형 에폭시 수지(함유량: 18 내지 22질량%)와의 혼합물), 닛폰 카세이사 제조 「4HBAGE」(4-하이드록시부틸아크릴레이트글리시딜에테르) 등을 들 수 있다. Commercially available compounds having an epoxy group and one ethylenically unsaturated group per molecule include, for example, “Cycloma M100” (3,4-epoxycyclohexylmethyl methacrylate) and “UVACURE1561” (epoxy group) manufactured by Daicel Ornex. and a mixture of a compound having one acryloyl group in one molecule (content: 78 to 82% by mass) and a bisphenol A type epoxy resin (content: 18 to 22% by mass), “4HBAGE” (4- Hydroxybutylacrylate glycidyl ether) etc. can be mentioned.
본 발명의 밀봉용 조성물이 단관능 에틸렌성 불포화 화합물을 포함하는 경우, 그 양은, 조성물 전체당, 바람직하게는 0.5질량% 이상, 보다 바람직하게는 1질량% 이상, 더욱 바람직하게는 1.5질량% 이상이며, 바람직하게는 55질량% 이하, 보다 바람직하게는 50질량% 이하, 더욱 바람직하게는 40질량% 이하이다.When the sealing composition of the present invention contains a monofunctional ethylenically unsaturated compound, the amount is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 1.5% by mass or more, per the total composition. , and is preferably 55 mass% or less, more preferably 50 mass% or less, and even more preferably 40 mass% or less.
<에틸렌성 불포화기를 갖는 화합물><Compounds having an ethylenically unsaturated group>
상술한 「다관능 에틸렌성 불포화 화합물」 및 「단관능 에틸렌성 불포화 화합물」을 합쳐서 「에틸렌성 불포화기를 갖는 화합물」이라고 기재한다. 이 에틸렌성 불포화기를 갖는 화합물의 양은, 조성물 전체당, 바람직하게는 30 내지 80질량%, 보다 바람직하게는 35 내지 80질량%, 더욱 바람직하게는 40 내지 80질량%이다. The above-mentioned “polyfunctional ethylenically unsaturated compound” and “monofunctional ethylenically unsaturated compound” are collectively described as “compound having an ethylenically unsaturated group.” The amount of the compound having an ethylenically unsaturated group is preferably 30 to 80% by mass, more preferably 35 to 80% by mass, and still more preferably 40 to 80% by mass, per the entire composition.
<희석제><Diluent>
본 발명의 밀봉용 조성물은 액상 밀봉용 조성물로서 적당한 점도를 달성하는데 희석제를 함유하고 있어도 좋다. B형 점도계로 25℃의 온도 조건에서 측정한 희석제의 점도는, 바람직하게는 0.1 내지 5000mPa·s, 보다 바람직하게는 0.1 내지 2500mPa·s, 더욱 바람직하게는 0.1 내지 1000mPa·s이다. The sealing composition of the present invention is a liquid sealing composition and may contain a diluent to achieve an appropriate viscosity. The viscosity of the diluent measured at a temperature of 25°C with a type B viscometer is preferably 0.1 to 5000 mPa·s, more preferably 0.1 to 2500 mPa·s, and still more preferably 0.1 to 1000 mPa·s.
희석제로서는, 반응성 희석제가 바람직하다. 반응성 희석제로서는, 1분자 중에 1개의 에틸렌성 불포화기를 갖는 화합물(이하 「단관능 에틸렌성 불포화 화합물」이라고 약칭하는 경우가 있음)이 바람직하다.As a diluent, a reactive diluent is preferred. As a reactive diluent, a compound having one ethylenically unsaturated group per molecule (hereinafter sometimes abbreviated as “monofunctional ethylenically unsaturated compound”) is preferable.
또한, 본 발명에서 「다관능 에틸렌성 불포화 화합물」로 분류되는 1분자 중에 2개의 에틸렌성 불포화기를 갖는 화합물(이하 「2관능 에틸렌성 불포화 화합물」이라고 약칭하는 경우가 있음)은, 상기 점도 범위의 것이라면 반응성 희석제로서도 기능하는 경우가 있다. 반응성 희석제로서도 기능하는 2관능 에틸렌성 불포화 화합물을 배합하는 경우, 희석제를 배합하지 않거나, 또는 배합하는 경우에도 배합량을 그만큼 줄일 수 있다. 희석제로서도 기능하는 2관능 에틸렌성 불포화 화합물로서는, 예를 들어, 「DPGDA」(디프로필렌글리콜 디아크릴레이트), 「HDDA」(1,6-헥산디올 디아크릴레이트), 「TPGDA」(트리프로필렌글리콜 디아크릴레이트), 「EBECRYL145」(PO 변성 네오펜틸글리콜 디아크릴레이트), 「HPNDA」(네오펜틸글리콜 하이드록시피발산에스테르 디아크릴레이트), 쿄에이샤 카가쿠사 제조 「라이트 에스테르 NP」(네오펜틸글루콜 디메타크릴레이트), 「라이트 에스테르 EG」(에틸렌글리콜 디메타크릴레이트), 「라이트 에스테르 2EG」(디에틸렌글리콜 디메타크릴레이트), 「라이트 에스테르 1.6HX」(1,6-헥산디올 디메타크릴레이트), 「라이트 에스테르 1.9ND」(1,9-노난디올 디메타크릴레이트), 「라이트 아크릴레이트 NP-A」(네오펜틸글리콜 디아크릴레이트), 「라이트 아크릴레이트 1.9ND-A」(1,9-노난디올 디아크릴레이트), 신나카무라 카가쿠코교사 제조 「NK 에스테르 701A」(2-하이드록시-3-메타크릴프로필아크릴레이트), 「NK 에스테르 A-200」(폴리에틸렌글리콜#200 디아크릴레이트), 「NK 에스테르 APG-400」(폴리프로필렌글리콜#400 디아크릴레이트), 「NK 에스테르 BG」(1,3-부탄디올 디메타크릴레이트), 「NK 에스테르 701」(2-하이드록시-1,3-디메타크릴록시프로판), 「NK 에스테르 3PG」(트리프로필렌글리콜 디메타크릴레이트), 오사카 유키 카가쿠코교사 제조 「비스코토#195」(1,4-부탄디올 디아크릴레이트), 아르케마사 제조 「SR562」(알콕시화 헥산디올 디아크릴레이트) 등을 들 수 있다. 에틸렌성 불포화기로서는 (메타)아크릴로일기가 바람직하고, 반응성 희석제는 특히 1분자 중에 1개의 (메타)아크릴로일기를 갖는 (메타)아크릴레이트가 보다 바람직하다(이하 「단관능 (메타)아크릴레이트」라고 약칭하는 경우가 있음). In addition, compounds having two ethylenically unsaturated groups in one molecule (hereinafter sometimes abbreviated as "bifunctional ethylenically unsaturated compounds") classified as "polyfunctional ethylenically unsaturated compounds" in the present invention have a viscosity range of the above. In some cases, it also functions as a reactive diluent. When blending a bifunctional ethylenically unsaturated compound that also functions as a reactive diluent, the blending amount can be reduced accordingly by not blending the diluent or even when blending it. Examples of bifunctional ethylenically unsaturated compounds that also function as diluents include “DPGDA” (dipropylene glycol diacrylate), “HDDA” (1,6-hexanediol diacrylate), and “TPGDA” (tripropylene glycol). diacrylate), “EBECRYL145” (PO modified neopentyl glycol diacrylate), “HPNDA” (neopentyl glycol hydroxypivalic acid ester diacrylate), “Light Ester NP” (neopentyl) manufactured by Kyoeisha Chemical Co., Ltd. Glucol Dimethacrylate), “Light Ester EG” (Ethylene Glycol Dimethacrylate), “Light Ester 2EG” (Diethylene Glycol Dimethacrylate), “Light Ester 1.6HX” (1,6-hexanediol dimethacrylate), “light ester 1.9ND” (1,9-nonanediol dimethacrylate), “light acrylate NP-A” (neopentyl glycol diacrylate), “light acrylate 1.9ND-A” "(1,9-nonanediol diacrylate), "NK Ester 701A" (2-hydroxy-3-methacrylpropyl acrylate) manufactured by Shinnakamura Chemical Co., Ltd., "NK Ester A-200" (polyethylene glycol) #200 diacrylate), “NK ester APG-400” (polypropylene glycol #400 diacrylate), “NK ester BG” (1,3-butanediol dimethacrylate), “NK ester 701” (2- Hydroxy-1,3-dimethacryloxypropane), “NK Ester 3PG” (tripropylene glycol dimethacrylate), “Viscoto #195” (1,4-butanediol diacrylate) manufactured by Osaka Yuki Kagaku Kogyo Co., Ltd. rate), “SR562” (alkoxylated hexanediol diacrylate) manufactured by Arkema, etc. The ethylenically unsaturated group is preferably a (meth)acryloyl group, and the reactive diluent is particularly preferably a (meth)acrylate having one (meth)acryloyl group per molecule (hereinafter referred to as “monofunctional (meth)acrylic”). (sometimes abbreviated as “rate”).
희석제로서 사용하는 단관능 (메타)아크릴레이트로서는, 예를 들어, 다이셀 오르넥스사 제조 「ODA-N」(옥틸/데실아크릴레이트, 즉 장쇄 알킬기를 갖는 단관능 아크릴레이트), 「EBECRYL 110」, 「EBECRYL1114」(에톡시화 페닐아크릴레이트), 쿄에이샤 카가쿠사 제조 「라이트 에스테르 E」(에틸메타크릴레이트), 「라이트 에스테르 NB」(n-부틸메타크릴레이트), 「라이트 에스테르 IB」(이소부틸메타크릴레이트), 「라이트 에스테르 TB」(t-부틸메타크릴레이트), 「라이트 에스테르 EH」(2-에틸헥실메타크릴레이트), 「라이트 에스테르 ID」(이소데실메타크릴레이트), 「라이트 에스테르 L」(n-라우릴메타크릴레이트), 「라이트 에스테르 S」(n-스테아릴메타크릴레이트), 「라이트 에스테르 CH」(사이클로헥실메타크릴레이트), 「라이트 에스테르 THF(1000)」(테트라하이드로푸르푸릴메타크릴레이트), 「라이트 에스테르 BZ」(벤질메타크릴레이트), 「라이트 에스테르 PO」(벤질페녹시에틸메타크릴레이트), 「라이트 에스테르 IB-X」(이소보르닐메타크릴레이트), 「라이트 에스테르 HO-250」(2-하이드록시에틸메타크릴레이트), 「라이트 에스테르 HOA」(하이드록시에틸아크릴레이트), 「라이트 에스테르 G」(글리시딜메타크릴레이트), 「라이트 아크릴레이트 IAA」(이소아밀아크릴레이트, 즉 분기 알킬기를 갖는 단관능 아크릴레이트), 「라이트 아크릴레이트 S-A」(스테아릴아크릴레이트), 「라이트 아크릴레이트 EC-A」(에톡시-디에틸렌글리콜아크릴레이트), 「라이트 아크릴레이트 EHDG-AT」(2-에틸헥실-디글리콜아크릴레이트), 「라이트 아크릴레이트 DPM-A」(메톡시디프로필렌글리콜아크릴레이트), 「라이트 아크릴레이트 IB-XA」(이소보르닐메타크릴레이트, 즉, 지환식기를 갖는 단관능 메타크릴레이트), 「라이트 아크릴레이트 PO-A」(페녹시에틸아크릴레이트, 즉 방향족환을 갖는 단관능 아크릴레이트), 「라이트 아크릴레이트 P2H-A」(페녹시디에틸렌글리콜아크릴레이트), 「라이트 아크릴레이트 P-200A」(페녹시-폴리에틸렌글리콜아크릴레이트), 「라이트 아크릴레이트 POB-A」(m-페녹시벤질아크릴레이트), 「라이트 아크릴레이트 TFH-A」(테트라하이드로푸르푸릴아크릴레이트), 「라이트 에스테르 HOP-A (N)」(2-하이드록시프로필아크릴레이트), 「HOA-MS(N)」(2-아크릴로일옥시에틸-숙신산), 「에폭시 에스테르 M-600A」(2-하이드록시-3-페녹시프로필아크릴레이트), 오사카 유키 카카구코교사 제조 「IDAA」(이소데실아크릴레이트), 「비스코토#155」(사이클로헥실아크릴레이트), 「비스코토#160」(벤질아크릴레이트), 「비스코토#150」(테트라하이드로푸르푸릴아크릴레이트), 「비스코토#190」(에틸카르비톨아크릴레이트), 「OXE-10」(3-에틸-3-옥세타닐메틸아크릴레이트, 즉, 옥세탄환을 갖는 아크릴레이트), 「MEDOL-10」(2-메틸-2-에틸-1,3-디옥솔란-4-일)메틸아크릴레이트, 즉, 디옥솔란환을 갖는 아크릴레이트), 토아 코세사 제조 「아로닉스 M-101A」(페놀 EO 변성 아크릴레이트), 신나카무라 카가쿠 코교사 제조 NK 에스테르 A-LEN-10」(에톡시화 o-페닐페놀아크릴레이트), 「NK 에스테르 EH-4E」(에톡시화 헥실폴리에틸렌글리콜메타크릴레이트), 히타치 카세이사 제조 「FA-511AS」(디사이클로펜테닐아크릴레이트), 「FA-512AS」(디사이클로펜테닐옥시에틸아크릴레이트), 「FA-513AS」(디사이클로펜타닐아크릴레이트), 아르케마사 제조 「SR217NS」(4-tert-부틸사이클로헥산올아크릴레이트), 「SR420NS」(3,3,5-트리메틸사이클로헥산올아크릴레이트), 「SR531」(환상 트리메틸올프로판포르말아크릴레이트), 「CD421」(3,3,5-트리메틸사이클로헥산올메타크릴레이트), 「CD535」(디사이클로펜타디에닐메타크릴레이트), 닛폰 쇼쿠바이사 제조 「VEEA」(아크릴산2-(2-비닐옥시에톡시)에틸), 「VEEM」(메타크릴산2-(2-비닐옥시에톡시)에틸) 등을 들 수 있다. 또한 「옥틸/데실아크릴레이트」란, 옥틸아크릴레이트 및 데실아크릴레이트의 혼합물을 의미한다. Examples of monofunctional (meth)acrylates used as diluents include “ODA-N” (octyl/decyl acrylate, i.e., monofunctional acrylate with a long-chain alkyl group) manufactured by Daicel Ornex, and “EBECRYL 110.” , “EBECRYL1114” (ethoxylated phenylacrylate), “Light Ester E” (ethyl methacrylate) manufactured by Kyoeisha Chemical Co., Ltd., “Light Ester NB” (n-butyl methacrylate), “Light Ester IB” ( Isobutyl methacrylate), “Light ester TB” (t-butyl methacrylate), “Light ester EH” (2-ethylhexyl methacrylate), “Light ester ID” (isodecyl methacrylate), “ “Light ester L” (n-lauryl methacrylate), “Light ester S” (n-stearyl methacrylate), “Light ester CH” (cyclohexyl methacrylate), “Light ester THF (1000)” (tetrahydrofurfuryl methacrylate), “light ester BZ” (benzyl methacrylate), “light ester PO” (benzylphenoxyethyl methacrylate), “light ester IB-X” (isobornyl methacrylate) rate), “light ester HO-250” (2-hydroxyethyl methacrylate), “light ester HOA” (hydroxyethyl acrylate), “light ester G” (glycidyl methacrylate), “light Acrylate IAA" (isoamyl acrylate, that is, monofunctional acrylate with a branched alkyl group), "light acrylate S-A" (stearyl acrylate), "light acrylate EC-A" (ethoxy-diethylene glycol acrylate) rate), “light acrylate EHDG-AT” (2-ethylhexyl-diglycol acrylate), “light acrylate DPM-A” (methoxydipropylene glycol acrylate), “light acrylate IB-XA” (isopropylene glycol acrylate) Bornyl methacrylate, i.e., monofunctional methacrylate having an alicyclic group), “light acrylate PO-A” (phenoxyethyl acrylate, i.e., monofunctional acrylate having an aromatic ring), “light acrylate P2H” -A” (phenoxydiethylene glycol acrylate), “light acrylate P-200A” (phenoxy-polyethylene glycol acrylate), “light acrylate POB-A” (m-phenoxybenzyl acrylate), “light Acrylate TFH-A” (tetrahydrofurfuryl acrylate), “Light ester HOP-A (N)” (2-hydroxypropyl acrylate), “HOA-MS(N)” (2-acryloyloxy Ethyl-succinic acid), “Epoxy ester M-600A” (2-hydroxy-3-phenoxypropylacrylate), “IDAA” (isodecyl acrylate) manufactured by Osaka Yuki Kakagukogyo Co., Ltd., “Viscoto #155” ( Cyclohexyl acrylate), “Viscot #160” (benzyl acrylate), “Viscot #150” (tetrahydrofurfuryl acrylate), “Viscot #190” (ethylcarbitol acrylate), “OXE- 10” (3-ethyl-3-oxetanylmethyl acrylate, that is, acrylate having an oxetane ring), “MEDOL-10” (2-methyl-2-ethyl-1,3-dioxolan-4-yl ) Methyl acrylate, i.e., acrylate having a dioxolane ring), “Aronix M-101A” (phenol EO modified acrylate) manufactured by Toa Kosei Co., Ltd., NK Ester A-LEN-10” manufactured by Shinnakamura Kagaku Kogyo Co., Ltd. (ethoxylated o-phenylphenol acrylate), “NK Ester EH-4E” (ethoxylated hexylpolyethylene glycol methacrylate), “FA-511AS” (dicyclopentenyl acrylate) manufactured by Hitachi Kasei Corporation, “FA- 512AS" (dicyclopentenyloxyethyl acrylate), "FA-513AS" (dicyclopentanyl acrylate), "SR217NS" (4-tert-butylcyclohexanol acrylate) manufactured by Arkema, "SR420NS" (3 , 3,5-trimethylcyclohexanol acrylate), “SR531” (cyclic trimethylolpropane formal acrylate), “CD421” (3,3,5-trimethylcyclohexanol methacrylate), “CD535” ( Dicyclopentadienyl methacrylate), “VEEA” (2-(2-vinyloxyethoxy)ethyl acrylate) manufactured by Nippon Shokubai Co., Ltd., “VEEM” (2-(2-vinyloxyethoxy) methacrylate) ethyl) and the like. Additionally, “octyl/decyl acrylate” means a mixture of octyl acrylate and decyl acrylate.
희석제로서 사용하는 단관능 (메타)아크릴레이트로서는, 특히 지환식 구조를 갖는 단관능 메타크릴레이트가 바람직하다. 지환식 구조는 전술한 것과 동의(同義)이다. 시판의 지환식 구조를 갖는 단관능 (메타)아크릴레이트로서는, 예를 들어, 보르난환 구조를 갖는 쿄에이샤 카가쿠사 제조 「라이트 에스테르 IB-X」(이소보르닐메타크릴레이트), 「라이트 아크릴레이트 IB-XA」(이소보르닐메타크릴레이트), 사이클로헥실 구조를 갖는 쿄에이샤 카가쿠사 제조 「라이트 에스테르 CH」(사이클로헥실메타크릴레이트), 오사카 유키 카카구코교사 제조 「비스코토#155」(사이클로헥실아크릴레이트), 아르케마사 제조 「SR217NS」(4-tert-부틸사이클로헥산올아크릴레이트), 「SR420NS」(3,3,5-트리메틸사이클로헥산올아크릴레이트), 「CD421」(3,3,5-트리메틸사이클로헥산올메타크릴레이트), 「CD535」(디사이클로펜타디에닐메타크릴레이트), 디사이클로환 구조를 갖는 히타치 카세이사 제조 「FA-511AS」(디사이클로펜테닐아크릴레이트), 「FA-512AS」(디사이클로펜테닐옥시에틸아크릴레이트), 「FA-513AS」(디사이클로펜타닐아크릴레이트), 아르케마사 제조 「CD535」(디사이클로펜타디에닐메타크릴레이트), 닛폰 쇼쿠바이사 제조 「VEEA」(아크릴산2-(2-비닐옥시에톡시)에틸), 「VEEM」(메타크릴산2-(2-비닐옥시에톡시)에틸) 등을 들 수 있다. As the monofunctional (meth)acrylate used as a diluent, monofunctional methacrylate having an alicyclic structure is particularly preferable. The alicyclic structure is identical to the one described above. Commercially available monofunctional (meth)acrylates having an alicyclic structure include, for example, “Light Ester IB-X” (isobornyl methacrylate), manufactured by Kyoeisha Chemical Co., Ltd. and “Light Acrylic,” which have a bornane ring structure. “Rate IB-XA” (isobornyl methacrylate), “Light Ester CH” (cyclohexyl methacrylate) manufactured by Kyoeisha Chemical Co., Ltd., which has a cyclohexyl structure, and “Viscoto #155” manufactured by Osaka Yuki Kakagukogyo Co., Ltd. (cyclohexyl acrylate), “SR217NS” (4-tert-butylcyclohexanol acrylate) manufactured by Arkema, “SR420NS” (3,3,5-trimethylcyclohexanol acrylate), “CD421” (3, 3,5-trimethylcyclohexanol methacrylate), “CD535” (dicyclopentadienyl methacrylate), “FA-511AS” (dicyclopentenyl acrylate) manufactured by Hitachi Kasei, which has a dicyclo ring structure. , “FA-512AS” (dicyclopentenyloxyethyl acrylate), “FA-513AS” (dicyclopentanyl acrylate), “CD535” (dicyclopentadienyl methacrylate) manufactured by Arkema Corporation, Nippon Shokuba Co., Ltd. “VEEA” (2-(2-vinyloxyethoxy)ethyl acrylate) and “VEEM” (2-(2-vinyloxyethoxy)ethyl methacrylate) manufactured by Isa Corporation.
희석제를 사용하는 경우, 그 양(희석제로서 기능하는 「2관능 에틸렌성 불포화 화합물」을 포함한 경우에는, 그 양도 포함함)은, 조성물 전체당, 바람직하게는 2질량% 이상, 보다 바람직 5질량% 이상, 더욱 바람직하게는 10질량% 이상, 바람직하게는 60질량% 이하, 보다 바람직하게는 55질량% 이하, 더욱 바람직하게는 50질량% 이하이다.When a diluent is used, the amount (including the amount when a "bifunctional ethylenically unsaturated compound" functioning as a diluent is included) is preferably 2% by mass or more, more preferably 5% by mass, per total composition. or more, more preferably 10 mass% or more, preferably 60 mass% or less, more preferably 55 mass% or less, even more preferably 50 mass% or less.
<반소성 하이드로탈사이트><Semi-fired hydrotalcite>
본 발명의 조성물은, 반소성 하이드로탈사이트를 포함한다. 반소성 하이드로탈사이트는, 1종만이라도 좋고, 2종 이상이라도 좋다.The composition of the present invention includes semi-baked hydrotalcite. There may be only one type of semi-fired hydrotalcite, or two or more types may be used.
하이드로탈사이트는, 미소성 하이드로탈사이트, 반소성 하이드로탈사이트, 및 소성 하이드로탈사이트로 분류할 수 있다.Hydrotalcite can be classified into uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite.
미소성 하이드로탈사이트는, 예를 들어, 천연 하이드로탈사이트(Mg6Al2(OH)16CO3·4H2O)로 대표되는 바와 같은 층상의 결정 구조를 갖는 금속 수산화물이며, 예를 들어, 기본 골격이 되는 층 [Mg1-XAlX(OH)2]X+와 중간층 [(CO3)X/2·mH2O]X-로 이루어진다. 본 발명에서의 미소성 하이드로탈사이트는, 합성 하이드로탈사이트 등의 하이드로탈사이트양(樣) 화합물을 포함하는 개념이다. 하이드로탈사이트양 화합물로서는, 예를 들어, 하기 식 (I) 및 하기 화학식 (II)로 표시되는 것을 들 수 있다.Uncalcined hydrotalcite is a metal hydroxide with a layered crystal structure, as represented by natural hydrotalcite (Mg 6 Al 2 (OH) 16 CO 3 ·4H 2 O), for example, It consists of the basic skeleton layer [ Mg 1 - X Al The concept of uncalcined hydrotalcite in the present invention includes hydrotalcite-like compounds such as synthetic hydrotalcite. Examples of hydrotalcite-like compounds include those represented by the following formula (I) and the following formula (II).
[M2+ 1-xM3+x(OH)2]x+·[(An-)x/n·mH2O]x- (I)[M 2+ 1-x M 3+ x(OH) 2 ] x+ ·[(A n- ) x/n ·mH 2 O] x- (I)
(식 중, M2+는 Mg2+, Zn2+ 등의 2가의 금속 이온을 나타내고, M3+는 Al3+, Fe3+ 등의 3가의 금속 이온을 나타내고, An-은 CO3 2-, Cl-, NO3 - 등의 n가의 음이온을 나타내고, 0<x<1이며, 0≤m<1이고, n은 양의 수이다.)(In the formula, M 2+ represents a divalent metal ion such as Mg 2+ and Zn 2+ , M 3+ represents a trivalent metal ion such as Al 3+ and Fe 3+ , and A n- represents CO 3 Represents n-valent anions such as 2- , Cl- , NO 3- , etc., 0<x<1, 0≤m<1, and n is a positive number.)
식 (I) 중, M2+는, 바람직하게는 Mg2+이며, M3+는 바람직하게는 Al3+이고, An-은, 바람직하게는 CO3 2-이다.In formula (I), M 2+ is preferably Mg 2+ , M 3+ is preferably Al 3+ , and A n- is preferably CO 3 2- .
M2+ xAl2(OH)2x+6-nz(An-)z·mH2O (II)M 2+ x Al 2 (OH) 2x+6-nz (A n- ) z ·mH 2 O (II)
(식 중, M2+는 Mg2+, Zn2+ 등의 2가의 금속 이온을 나타내고, An-은 CO3 2-, Cl-, NO3- 등의 n가의 음이온을 나타내고, x는 2 이상의 양의 수이고, z는 2 이하의 양의 수이고, m은 양의 수이며, n은 양의 수이다.)(In the formula, M 2+ represents a divalent metal ion such as Mg 2+ or Zn 2+ , A n- represents an n-valent anion such as CO 3 2- , Cl - , NO 3- , and x is 2 is a positive number greater than or equal to 2, z is a positive number less than or equal to 2, m is a positive number, and n is a positive number.)
식 (II) 중, M2+는 바람직하게는 Mg2+이며, An-은 바람직하게는 CO3 2-이다. In formula (II), M 2+ is preferably Mg 2+ and A n- is preferably CO 3 2- .
반소성 하이드로탈사이트는, 미소성 하이드로탈사이트를 소성하여 얻어지는, 층간수의 양이 감소 또는 소실된 층상의 결정 구조를 갖는 금속 수산화물을 말한다. 「층간수」란, 조성식을 사용하여 설명하면, 상술한 미소성의 천연 하이드로탈사이트 및 하이드로탈사이트양 화합물의 조성식에 기재된 「H2O」를 가리킨다. 본 발명은, 이 반소성 하이드로탈사이트를 사용하는 것을 특징의 하나로 한다.Semi-calcined hydrotalcite refers to a metal hydroxide obtained by calcining uncalcined hydrotalcite and having a layered crystal structure in which the amount of interlayer water is reduced or lost. When explained using the composition formula, “interlayer water” refers to “H 2 O” described in the composition formula of the above-mentioned uncooked natural hydrotalcite and hydrotalcite-like compound. One of the features of the present invention is that this semi-calcined hydrotalcite is used.
한편, 소성 하이드로탈사이트는, 미소성 하이드로탈사이트 또는 반소성 하이드로탈사이트를 소성하여 얻어지고, 층간수뿐만 아니라, 수산기도 축합 탈수에 의해 소실된, 비정질 구조를 갖는 금속 산화물을 말한다.On the other hand, calcined hydrotalcite refers to a metal oxide obtained by calcining uncalcined or semi-calcined hydrotalcite and having an amorphous structure in which not only interlayer water but also hydroxyl groups are lost by condensation dehydration.
미소성 하이드로탈사이트, 반소성 하이드로탈사이트 및 소성 하이드로탈사이트는, 포화 흡수율에 따라 구별할 수 있다. 반소성 하이드로탈사이트의 포화 흡수율은, 1질량% 이상 20질량% 미만이다. 한편, 미소성 하이드로탈사이트의 포화 흡수율은, 1질량% 미만이며, 소성 하이드로탈사이트의 포화 흡수율은, 20질량% 이상이다.Uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished according to their saturation water absorption. The saturated water absorption of semi-baked hydrotalcite is 1 mass% or more and less than 20 mass%. On the other hand, the saturated water absorption of uncalcined hydrotalcite is less than 1 mass%, and the saturated water absorption of calcined hydrotalcite is 20 mass% or more.
본 발명에서의 「포화 흡수율」이란, 미소성 하이드로탈사이트, 반소성 하이드로탈사이트 또는 소성 하이드로탈사이트를 천칭으로 1.5g 달아, 초기 질량을 측정한 후, 대기압, 60℃, 90%RH(상대 습도)로 설정한 소형 환경 시험기(에스펙사 제조 SH-222)에 200시간 정치한 경우의, 초기 질량에 대한 질량 증가율을 말하고, 하기 식 (i):In the present invention, “saturated water absorption rate” means weighing 1.5 g of uncalcined hydrotalcite, semi-calcined hydrotalcite, or calcined hydrotalcite on a balance, measuring the initial mass, and then measuring the initial mass at atmospheric pressure, 60°C, 90%RH (relative This refers to the mass increase rate relative to the initial mass when left in a small environmental tester (SH-222 manufactured by Espec) set to humidity for 200 hours, and is expressed in the following equation (i):
포화 흡수율(질량%)Saturated absorption rate (mass%)
=100×(흡수 후의 질량-초기 질량)/초기 질량 (i)=100×(mass after absorption-initial mass)/initial mass (i)
으로 구할 수 있다.It can be obtained with
반소성 하이드로탈사이트의 포화 흡수율은, 바람직하게는 3질량% 이상 20질량% 미만, 보다 바람직하게는 5질량% 이상 20질량% 미만이다.The saturated water absorption of the semi-calcined hydrotalcite is preferably 3% by mass or more and less than 20% by mass, more preferably 5% by mass or more and less than 20% by mass.
또한, 미소성 하이드로탈사이트, 반소성 하이드로탈사이트 및 소성 하이드로탈사이트는, 열 중량 분석으로 측정되는 열 중량 감소율에 의해 구별할 수 있다. 반소성 하이드로탈사이트의 280℃에서의 열 중량 감소율은 15질량% 미만이고, 또한 그 380℃에서의 열 중량 감소율은 12질량% 이상이다. 한편, 미소성 하이드로탈사이트의 280℃에서의 열 중량 감소율은, 15질량% 이상이며, 소성 하이드로탈사이트의 380℃에서의 열 중량 감소율은, 12질량% 미만이다. Additionally, uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished by the thermogravimetric reduction rate measured by thermogravimetric analysis. The thermal weight reduction rate of semi-baked hydrotalcite at 280°C is less than 15% by mass, and the thermal weight reduction rate at 380°C is 12% by mass or more. On the other hand, the thermal weight reduction rate of uncalcined hydrotalcite at 280°C is 15% by mass or more, and the thermal weight reduction rate of calcined hydrotalcite at 380°C is less than 12% by mass.
열 질량 분석은, 히타치 하이테크 사이언스사 제조 TG/DTA EXSTAR6300을 사용하여, 알루미늄제의 샘플 팬에 하이드로탈사이트를 5mg 칭량하고, 뚜껑을 덮지 않고 오픈 상태에서, 질소 유량 200mL/분의 분위기 하, 30℃에서 550℃까지 승온 속도 10℃/min의 조건으로 행할 수 있다. 열 중량 감소율은, 하기 식 (ii):For thermal mass spectrometry, 5 mg of hydrotalcite was weighed into an aluminum sample pan using TG/DTA EXSTAR6300 manufactured by Hitachi High-Tech Science, Inc., and the lid was left open in an atmosphere with a nitrogen flow rate of 200 mL/min for 30 mL/min. It can be carried out from ℃ to 550℃ under the condition of a temperature increase rate of 10℃/min. The thermal weight loss rate is expressed by the following formula (ii):
열 중량 감소율(질량%)Thermal weight reduction rate (mass%)
=100×(가열 전의 질량-소정 온도에 도달했을 때의 질량)/가열 전의 질량 (ii)=100×(mass before heating-mass when reaching predetermined temperature)/mass before heating (ii)
으로 구할 수 있다.It can be obtained with
또한, 미소성 하이드로탈사이트, 반소성 하이드로탈사이트 및 소성 하이드로탈사이트는, 분말 X선 회절로 측정된 피크 및 상대 강도비에 의해 구별할 수 있다. 반소성 하이드로탈사이트는, 분말 X선 회절에 의해 2θ가 8 내지 18°부근에 두개로 분할(split)한 피크, 또는 두개의 피크의 합성에 의해 숄더를 갖는 피크를 나타내고, 저각측에 나타나는 피크 또는 숄더의 회절 강도(=저각측 회절 강도)와, 고각측에 나타나는 피크 또는 숄더의 회절 강도(=고각측 회절 강도)의 상대 강도비(저각측 회절 강도/고각측 회절 강도)는, 0.001 내지 1,000이다. 한편, 미소성 하이드로탈사이트는 8 내지 18°부근에서 하나의 피크밖에 갖지 않거나, 또는 저각측에 나타나는 피크 또는 숄더와 고각측에 나타나는 피크 또는 숄더의 회절 강도의 상대 강도비가 전술한 범위 밖이 된다. 소성 하이드로탈사이트는 8°내지 18°의 영역에 특징적인 피크를 갖지 않고, 43°에 특징적인 피크를 갖는다. 분말 X선 회절 측정은, 분말 X선 회절 장치(PANalytical사 제조, Empyrean)에 의해, 카운터 음극 CuKα(1.5405A), 전압: 45V, 전류: 40mA, 샘플링 폭: 0.0260°, 주사 속도: 0.0657°/s, 측정 회절각 범위(2θ): 5.0131 내지 79.9711°의 조건에서 행하였다. 피크 서치는, 회절 장치 부속의 소프트웨어의 피크 서치 기능을 이용하여, 「최소 유의도: 0.50, 최소 피크 칩: 0.01°, 최대 피크 칩: 1.00°, 피크 베이스 폭: 2.00°, 방법: 2차 미분의 최소값」의 조건으로 행할 수 있다.Additionally, uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished by peaks and relative intensity ratios measured by powder X-ray diffraction. Semi-calcined hydrotalcite shows a peak split into two at 2θ around 8 to 18° by powder Or, the relative intensity ratio (low-angle side diffraction intensity/high-angle side diffraction intensity) of the diffraction intensity of the shoulder (=low-angle side diffraction intensity) and the diffraction intensity of the peak or shoulder appearing on the high-angle side (=high-angle side diffraction intensity) is 0.001 to 0.001. It's 1,000. On the other hand, uncalcined hydrotalcite has only one peak around 8 to 18°, or the relative intensity ratio of the diffraction intensity of the peak or shoulder appearing on the low angle side and the peak or shoulder appearing on the high angle side is outside the above-mentioned range. . Calcined hydrotalcite does not have a characteristic peak in the region of 8° to 18°, but has a characteristic peak at 43°. Powder X-ray diffraction measurement was performed using a powder s, the measurement was carried out under the conditions of a diffraction angle range (2θ): 5.0131 to 79.9711°. Peak search is performed using the peak search function of the software attached to the diffraction device, “minimum significance: 0.50, minimum peak chip: 0.01°, maximum peak chip: 1.00°, peak base width: 2.00°, method: second order differentiation. It can be done under the condition of “minimum value of.”
반소성 하이드로탈사이트의 BET 비표면적은, 1 내지 250㎡/g가 바람직하고, 5 내지 200㎡/g가 보다 바람직하다. 반소성 하이드로탈사이트의 BET 비표면적은, BET법에 따라, 비표면적 측정 장치(Macsorb HM Model 1210 마운텍사 제조)를 이용하여 시료 표면에 질소 가스를 흡착시키고, BET 다점법을 이용하여 산출할 수 있다.The BET specific surface area of the semi-calcined hydrotalcite is preferably 1 to 250 m2/g, and more preferably 5 to 200 m2/g. The BET specific surface area of semi-calcined hydrotalcite can be calculated by adsorbing nitrogen gas on the surface of the sample using a specific surface area measuring device (Macsorb HM Model 1210 manufactured by Mountex) according to the BET method and using the BET multi-point method. there is.
반소성 하이드로탈사이트의 평균 입자직경은, 1 내지 1,000nm가 바람직하고, 10 내지 800nm가 보다 바람직하다. 반소성 하이드로탈사이트의 평균 입자직경은, 레이저 회절 산란식 입도 분포 측정(JIS Z 8825)에 의해 입도 분포를 체적 기준으로 작성했을 때의 당해 입도 분포의 중앙(median) 직경이다.The average particle diameter of semi-calcined hydrotalcite is preferably 1 to 1,000 nm, and more preferably 10 to 800 nm. The average particle diameter of semi-calcined hydrotalcite is the median diameter of the particle size distribution when the particle size distribution is created on a volume basis by laser diffraction scattering particle size distribution measurement (JIS Z 8825).
반소성 하이드로탈사이트는, 표면 처리제로 표면 처리한 것을 사용할 수 있다. 표면 처리에 사용하는 표면 처리제로서는, 예를 들어, 고급 지방산, 알킬실란류, 실란 커플링제 등을 사용할 수 있고, 그 중에서도, 고급 지방산, 알킬 실란류가 바람직하다. 표면 처리제는, 1종 또는 2종 이상을 사용할 수 있다.Semi-baked hydrotalcite can be used after surface treatment with a surface treatment agent. As surface treatment agents used for surface treatment, for example, higher fatty acids, alkyl silanes, silane coupling agents, etc. can be used, and among them, higher fatty acids and alkyl silanes are preferable. One type or two or more types of surface treatment agents can be used.
고급 지방산으로서는, 예를 들어, 스테아르산, 몬탄산, 미리스트산, 팔미트산 등의 탄소수 18 이상의 고급 지방산을 들 수 있고, 그 중에서도, 스테아르산이 바람직하다. 이것들은, 1종 또는 2종 이상을 사용할 수 있다.Examples of higher fatty acids include higher fatty acids having 18 carbon atoms or more, such as stearic acid, montanic acid, myristic acid, and palmitic acid, and among these, stearic acid is preferable. These can be used one type or two or more types.
알킬 실란류로서는, 예를 들어, 메틸트리메톡시실란, 에틸트리메톡시실란, 헥실트리메톡시실란, 옥틸트리메톡시실란, 데실트리메톡시실란, 옥타데실트리메톡시실란, 디메틸디메톡시실란, 옥틸트리에톡시실란, n-옥타데실디메틸(3-(트리메톡시실릴)프로필)암모늄클로라이드 등을 들 수 있다. 이것들은 1종 또는 2종 이상을 사용할 수 있다.Examples of alkyl silanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, octadecyltrimethoxysilane, and dimethyldimethoxysilane. , octyltriethoxysilane, n-octadecyldimethyl(3-(trimethoxysilyl)propyl)ammonium chloride, etc. These can be used one or two or more types.
실란 커플링제로서는, 예를 들어, 3-글리시딜옥시프로필트리메톡시실란, 3-글리시딜옥시프로필트리에톡시실란, 3-글리시딜옥시프로필(디메톡시)메틸실란 및 2-(3,4-에폭시사이클로헥실)에틸트리메톡시실란 등의 에폭시계 실란 커플링제; 3-머캅토프로필트리메톡시실란, 3- 머캅토프로필트리에톡시실란, 3-머캅토프로필메틸디메톡시실란 및 11-머캅토운데실트리메톡시실란 등의 머캅토계 실란 커플링제; 3-아미노프로필트리메톡시실란, 3-아미노프로필트리에톡시실란, 3-아미노프로필디메톡시메틸실란, N-페닐-3-아미노프로필트리메톡시실란, N-메틸아미노프로필트리메톡시실란, N-(2-아미노에틸)-3-아미노프로필트리메톡시실란 및 N-(2-아미노에틸)-3-아미노프로필디메톡시메틸실란 등의 아미노계 실란 커플링제; 3-우레이드프로필트리에톡시실란 등의 우레이드계 실란 커플링제, 비닐트리메톡시실란, 비닐트리에 톡시실란 및 비닐메틸디에톡시실란 등의 비닐계 실란 커플링제; p-스티릴트리메톡시실란 등의 스티릴계 실란 커플링제; 3-아크릴옥시프로필트리메톡시실란 및 3-메타크릴옥시프로필트리메톡시실란 등의 아크릴레이트계 실란 커플링제; 3-이소시아네이트프로필트리메톡시실란 등의 이소시아네이트계 실란 커플링제, 비스(트리에 톡시실릴프로필)디설파이드, 비스(트리에톡시실릴프로필)테트라설파이드 등의 설파이드계 실란 커플링제; 페닐트리메톡시실란, 메타크릴록시프로필트리메톡시실란, 이미다졸실란, 트리아진실란 등을 들 수 있다. 이것들은 1종 또는 2종 이상을 사용할 수 있다.Silane coupling agents include, for example, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropyl(dimethoxy)methylsilane, and 2-( Epoxy-based silane coupling agents such as 3,4-epoxycyclohexyl)ethyltrimethoxysilane; Mercapto-based silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 11-mercaptoundecyltrimethoxysilane; 3-Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane, Amino silane coupling agents such as N-(2-aminoethyl)-3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropyldimethoxymethylsilane; Uride-based silane coupling agents such as 3-ureide propyltriethoxysilane, vinyl-based silane coupling agents such as vinyltrimethoxysilane, vinyltriethoxysilane, and vinylmethyldiethoxysilane; Styryl-based silane coupling agents such as p-styryltrimethoxysilane; Acrylate-based silane coupling agents such as 3-acryloxypropyltrimethoxysilane and 3-methacryloxypropyltrimethoxysilane; Isocyanate-based silane coupling agents such as 3-isocyanate propyltrimethoxysilane, sulfide-based silane coupling agents such as bis(triethoxysilylpropyl)disulfide and bis(triethoxysilylpropyl)tetrasulfide; Phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, imidazole silane, triazine silane, etc. are mentioned. These can be used one or two or more types.
반소성 하이드로탈사이트의 표면 처리는, 예를 들어, 미처리의 반소성 하이드로탈사이트를 혼합기로 상온에서 교반 분산시키면서, 표면 처리제를 첨가 분무하여 5 내지 60분간 교반함으로써 행할 수 있다. 혼합기로서는, 공지의 혼합기를 사용할 수 있고, 예를 들어, V 블렌더, 리본 블렌더, 버블콘 블렌더 등의 블렌더, 볼밀, 헨쉘 믹서 및 콘크리트 믹서 등의 믹서, 볼 밀, 커터 밀 등을 들 수 있다. 또, 볼밀 등으로 반소성 하이드로탈사이트를 분쇄할 때에, 상기의 고급 지방산, 알킬 실란류 또는 실란 커플링제를 첨가하여, 표면 처리를 행할 수도 있다. 표면 처리제의 사용량은, 반소성 하이드로탈사이트의 종류 또는 표면 처리제의 종류 등에 따라서도 다르지만, 표면 처리되어 있지 않은 반소성 하이드로탈사이트 100질량부에 대하여 1 내지 10질량부가 바람직하다. 본 발명에서는, 표면 처리된 반소성 하이드로탈사이트도, 본 발명에서의 「반소성 하이드로탈사이트」에 포함된다.Surface treatment of semi-calcined hydrotalcite can be performed, for example, by stirring and dispersing untreated semi-calcined hydrotalcite at room temperature with a mixer, adding and spraying a surface treatment agent, and stirring for 5 to 60 minutes. As the mixer, a known mixer can be used, and examples include blenders such as V blenders, ribbon blenders, and bubble cone blenders, mixers such as ball mills, Henschel mixers, and concrete mixers, ball mills, and cutter mills. Additionally, when pulverizing semi-calcined hydrotalcite with a ball mill or the like, the above-mentioned higher fatty acids, alkyl silanes, or silane coupling agents may be added to perform surface treatment. The amount of the surface treatment agent used varies depending on the type of semi-calcined hydrotalcite or the type of surface treatment agent, but is preferably 1 to 10 parts by mass per 100 parts by mass of semi-calcined hydrotalcite that has not been surface treated. In the present invention, surface-treated semi-baked hydrotalcite is also included in “semi-baked hydrotalcite” in the present invention.
본 발명의 조성물에서의 반소성 하이드로탈사이트의 양은, 본 발명의 효과가 발휘되면, 특별히 한정되는 것은 아니지만, 조성물 전체당, 10 내지 70질량%가 바람직하고, 25 내지 60질량%가 보다 바람직하고, 30 내지 50질량%가 더욱 바람직하다. 반소성 하이드로탈사이트는 흡습 성능이 우수하기 때문에, 그 양이 늘어나면, 얻어지는 경화물의 수분 차단성이 향상된다. 하지만, 그 양이 70질량%를 초과하면, 조성물의 점도가 상승하거나, 젖음성의 저하에 의해 밀봉 대상인 기판 등과 조성물과의 밀착성이 저하되거나, 경화물의 강도가 저하되어 물러지는 등의 문제가 생기는 경향이 된다. 또한, 반소성 하이드로탈사이트의 층간수에 의해, 밀봉층(즉, 경화물) 중의 수분량이 많아지기 때문에, 예를 들어, 유기 EL 디바이스의 제조에 있어서, 밀봉층 중의 수분에 의한 발광 재료(발광층)나 전극층에 대한 악영향이 현재화되어, 초기 단계의 다크 스팟 발생이 많아지는 등의 우려가 있다.The amount of semi-calcined hydrotalcite in the composition of the present invention is not particularly limited as long as the effect of the present invention is exhibited, but is preferably 10 to 70% by mass, and more preferably 25 to 60% by mass, per the entire composition. , 30 to 50% by mass is more preferable. Since semi-baked hydrotalcite has excellent moisture absorption performance, as its amount increases, the moisture barrier properties of the resulting cured product improve. However, if the amount exceeds 70% by mass, problems such as the viscosity of the composition increasing, the adhesion between the composition and the substrate to be sealed due to a decrease in wettability, or the strength of the cured product decreasing and becoming brittle tend to occur. This happens. In addition, since the moisture content in the sealing layer (i.e., cured product) increases due to the interlayer water of the semi-baked hydrotalcite, for example, in the production of an organic EL device, the moisture in the sealing layer causes the light-emitting material (light-emitting layer) to increase. ), there is concern that adverse effects on the electrode layer may become apparent and the occurrence of dark spots in the early stages may increase.
본 발명의 조성물은, 본 발명의 효과가 저해되지 않는 한, 미소성 하이드로탈사이트를 포함하고 있어도 좋다. 그 양은, 조성물 전체당, 0 내지 20질량%가 바람직하고, 0이 보다 바람직하다. 즉, 본 발명의 조성물이, 미소성 하이드로탈사이트를 포함하지 않는 것이 가장 바람직하다. 미소성 하이드로탈사이트는, 조성물의 경화물의 투과율에 영향을 미치지 않지만, 수분 함유량이 크기 때문에, 증량함으로써 수분 차단성의 저하가 보이고, 예를 들어, 그 양이 질량%를 초과하면, 반소성 하이드로탈사이트와 마찬가지로 초기 단계의 다크 스팟 발생이 많아지는 등의 우려가 있다. 반소성 하이드로탈사이트:미소성 하이드로탈사이트의 질량비는, 바람직하게는 70:30 내지 100:0이다.The composition of the present invention may contain uncalcined hydrotalcite as long as the effect of the present invention is not impaired. The amount is preferably 0 to 20% by mass, and more preferably 0, per the entire composition. That is, it is most preferable that the composition of the present invention does not contain uncalcined hydrotalcite. The uncalcined hydrotalcite does not affect the transmittance of the cured product of the composition, but since the water content is large, the moisture barrier property is seen to decrease as the amount increases. For example, if the amount exceeds % by mass, the semi-calcined hydrotalcite As with the site, there are concerns that dark spots in the early stages may increase. The mass ratio of semi-calcined hydrotalcite:microcalcined hydrotalcite is preferably 70:30 to 100:0.
반소성 하이드로탈사이트로서는, 예를 들어 「DHT-4C」(쿄와 카가쿠코교사 제조, 평균 입자직경: 400nm), 「DHT-4A-2」(쿄와 카가쿠코교사 제조, 평균 입자직경: 400nm) 등을 들 수 있다. 한편, 소성 하이드로탈사이트로서는, 예를 들어 「KW-2200」(쿄와 카가쿠코교사 제조, 평균 입자직경: 400nm) 등을 들 수 있고, 미소성 하이드로탈사이트로서는, 예를 들어 「DHT-4A」(쿄와 카가쿠코교사 제조, 평균 입자직경: 400nm) 등을 들 수 있다.As semi-calcined hydrotalcite, for example, "DHT-4C" (manufactured by Kyowa Chemical Co., Ltd., average particle diameter: 400 nm), "DHT-4A-2" (manufactured by Kyowa Chemical Co., Ltd., average particle diameter) : 400nm), etc. On the other hand, examples of calcined hydrotalcite include "KW-2200" (manufactured by Kyowa Chemical Co., Ltd., average particle diameter: 400 nm), and examples of calcined hydrotalcite include "DHT- 4A” (manufactured by Kyowa Chemical Co., Ltd., average particle diameter: 400 nm).
<라디칼 중합 개시제><Radical polymerization initiator>
본 발명의 조성물은, 라디칼 중합 개시제를 포함한다. 라디칼 중합 개시제는, 1종만이라도 좋고, 2종 이상이라도 좋다. 라디칼 중합 개시제는, 광 라디칼 중합 개시제라도 좋고, 열 라디칼 중합 개시제라도 좋다. 즉, 라디칼 중합 개시제는, 광 라디칼 중합 개시제 및/또는 열 라디칼 중합 개시제이다. 라디칼 중합 개시제는, 바람직하게는 광 라디칼 중합 개시제 또는 열 라디칼 중합 개시제이다. 광 라디칼 중합 개시제 및 열 라디칼 중합 개시제는, 모두 1종만이라도 좋고, 2종 이상이라도 좋다.The composition of the present invention contains a radical polymerization initiator. There may be only one type of radical polymerization initiator, and two or more types may be used. The radical polymerization initiator may be a photo radical polymerization initiator or a thermal radical polymerization initiator. That is, the radical polymerization initiator is a photo radical polymerization initiator and/or a thermal radical polymerization initiator. The radical polymerization initiator is preferably an optical radical polymerization initiator or a thermal radical polymerization initiator. There may be only one type of radical photopolymerization initiator and the thermal radical polymerization initiator, and two or more types may be used.
광 라디칼 중합 개시제로서는, 예를 들어, 아세토페논, 디에톡시아세토페논, 2-[4-(메틸티오)메틸-1-페닐]-2-모르폴리노프로판온, 벤조인, 벤조인에틸에테르, 벤질메틸케탈, 벤조페논, 2-에틸안트라퀴논, 티옥산톤, 디에틸티옥산톤, 2,4,6-트리메틸벤조일디페닐포스핀옥사이드, 2,4,6-트리메틸벤조일디페닐에톡시포스핀옥사이드, 비스(2,4,6-트리메틸벤조일)페닐포스핀옥사이드, 2-하이드록시-2-메틸-1-페닐프로판-1-온, 4-(2-하이드록시에톡시)페닐(2-하이드록시-2-프로필)케톤, 1-하이드록시사이클로헥실페닐케톤, 1-(4-이소프로필페닐)-2-하이드록시-2-메틸프로판-1-온, 1-(4-도데실페닐)-2-하이드록시-2-메틸프로판-1-온, 2-메틸-2-모르폴리노(4-티오메틸페닐)프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모르폴리노페닐)-부타논, N,N'-옥타메틸렌비스아크리딘, 아크릴로일벤조페논, 2-(벤조일옥시이미노)-1-[4'-(페닐티오)페닐]-1-옥타논, 2,2-디메톡시-1,2-디페닐에탄-1-온, 1-하이드록시-사이클로헥실페닐케톤, 2-하이드록시-2-메틸-1-페닐프로판-1-온, 1-[4-(2-하이드록시에톡시)페닐]-2-메틸-1-프로판-1-온, 2-하이드록시-1-{4-[4-(2-하이드록시-2-메틸-프로피오닐)-벤질]페닐}-2-메틸프로판-1-온, 페닐글리옥실릭애시드메틸에스테르, 2-메틸-1-[4-(메틸티오)페닐]-2-모르폴리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모르폴리노페닐)-부타논, 2-디메틸아미노-2-(4-메틸벤질)-1-(4-모르폴린-4-일 페닐)-부타논, 비스(2,4,6-트리메틸벤조일)페닐포스핀옥사이드, 2,4,6-트리메틸벤조일-디페닐포스핀옥사이드, 비스(η5-2,4-사이클로펜타디엔-1-일)-비스(2,6-디플루오로-3-(1H-피롤-1-일)페닐)티타늄, 1-[4-(페닐티오)페닐]-1,2-옥탄디온 2-(O-벤조일옥심), 1-[6-(2-메틸벤조일)-9-에틸-9H-카르바졸-3-일]에탄온 O-아세틸옥심 등을 들 수 있다.Examples of radical photopolymerization initiators include acetophenone, diethoxyacetophenone, 2-[4-(methylthio)methyl-1-phenyl]-2-morpholinopropanone, benzoin, benzoin ethyl ether, Benzylmethylketal, benzophenone, 2-ethylanthraquinone, thioxanthone, diethylthioxanthone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylethoxyphos Pin oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 4-(2-hydroxyethoxy)phenyl (2 -Hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenyl ketone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-(4-dodecyl Phenyl)-2-hydroxy-2-methylpropan-1-one, 2-methyl-2-morpholino (4-thiomethylphenyl)propan-1-one, 2-benzyl-2-dimethylamino-1-( 4-morpholinophenyl)-butanone, N,N'-octamethylenebisacridine, acryloylbenzophenone, 2-(benzoyloxyimino)-1-[4'-(phenylthio)phenyl]- 1-octanone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexylphenylketone, 2-hydroxy-2-methyl-1-phenylpropane-1- one, 1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2 -methyl-propionyl)-benzyl]phenyl}-2-methylpropan-1-one, phenylglyoxylic acid methyl ester, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino Propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholine -4-yl phenyl)-butanone, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, bis(η 5 -2,4- Cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl)titanium, 1-[4-(phenylthio)phenyl]-1,2- Octanedione 2-(O-benzoyloxime), 1-[6-(2-methylbenzoyl)-9-ethyl-9H-carbazol-3-yl]ethanone O-acetyloxime, etc. are mentioned.
광 라디칼 중합 개시제의 시판품으로서는, 예를 들어, IGM Resins사 제조 「「Omnirad651」, 「Omnirad184」, 「Omnirad1173」, 「Omnirad500」, 「Omnirad2959」, 「Omnirad127」, 「Omnirad754」, 「Omnirad907」, 「Omnirad369」,「Omnirad379」, 「Omnirad819」, 「OmniradTPO」, 「Omnirad784」, BASF사 제조 「Irgacure OXE-01」,「Irgacure OXE-02」 등을 들 수 있다.Commercially available radical photopolymerization initiators include, for example, “Omnirad651,” “Omnirad184,” “Omnirad1173,” “Omnirad500,” “Omnirad2959,” “Omnirad127,” “Omnirad754,” “Omnirad907,” manufactured by IGM Resins. Omnirad369", "Omnirad379", "Omnirad819", "OmniradTPO", "Omnirad784", BASF's "Irgacure OXE-01", "Irgacure OXE-02", etc. are mentioned.
열 라디칼 중합 개시제로서는, 예를 들어, 아조 화합물, 유기 과산화물 등을들 수 있다.Examples of thermal radical polymerization initiators include azo compounds and organic peroxides.
아조 화합물로서는, 예를 들어, 2,2'-아조비스(이소부티로니트릴), 2,2'-아조비스(2,4-디메틸발레로니트릴), 2,2'-아조비스(2-메틸부티로니트릴), 4,4'-아조비스(4-시아노발레르산), 2,2'-아조비스(2-메틸)2염산염, 1,1'-아조비스(1-아세톡시-1-페닐에탄), 1,1'-아조비스(사이클로헥산-1-카르보니트릴), 디메틸2,2'-아조비스(이소부티레이트), 2,2'-아조비스(4-메톡시-2,4-디메틸발레로니트릴), 2,2'-아조비스(2-메틸프로피오니트릴), 2,2'-아조비스(2-메틸부티로니트릴), 1-[(1-시아노-1-메틸에틸)아조]포름아미드, 2-페닐아조-4-메톡시-2,4-디메칠발레로니트릴, 디메틸 2,2'-아조비스(2-메틸프로피오네이트), 2,2'-아조비스(N-부틸-2-메틸프로피온아미드 등을 들 수 있다.Examples of azo compounds include 2,2'-azobis(isobutyronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(2- Methylbutyronitrile), 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobis(2-methyl)dihydrochloride, 1,1'-azobis(1-acetoxy- 1-phenylethane), 1,1'-azobis(cyclohexane-1-carbonitrile), dimethyl 2,2'-azobis(isobutyrate), 2,2'-azobis(4-methoxy-2) ,4-dimethylvaleronitrile), 2,2'-azobis(2-methylpropionitrile), 2,2'-azobis(2-methylbutyronitrile), 1-[(1-cyano- 1-methylethyl)azo]formamide, 2-phenylazo-4-methoxy-2,4-dimethylvaleronitrile, dimethyl 2,2'-azobis(2-methylpropionate), 2,2 '-Azobis(N-butyl-2-methylpropionamide, etc. are mentioned.
유기 과산화물로서는, 예를 들면, 과산화벤조일, tert-부틸하이드로퍼옥사이드, 쿠멘하이드로퍼옥사이드, 디-tert-부틸퍼옥사이드, 메틸에틸케톤퍼옥사이드, 1,1-디(t-헥실퍼옥시)사이클로헥산, 2,2-디(t-부틸퍼옥시)부탄, n-부틸 4,4-디(t-부틸퍼옥시)발레이트, 2,2-디(4,4-디(t-부틸퍼옥시)사이클로헥실)프로판, p-멘탄하이드로퍼옥사이드, 디이소프로폭실벤젠퍼옥사이드, 1,1,3,3-테트라메틸부틸하이드로퍼옥사이드, 쿠멘하이드로퍼옥사이드, t-부틸하이드로퍼옥사이드, 디(2-t-부틸퍼옥시이소프로필)벤젠, 디쿠밀퍼옥사이드, 2,5-디메틸-2,5-디(t-부틸퍼옥시)헥산, t-부틸쿠밀퍼옥사이드, 디-t-헥실퍼옥사이드, 2,5-디메틸-2,5-디(t-부틸퍼옥시)헥산-3, 디이소부티릴퍼옥사이드, 디(3,5,5-t-메틸헥사노일)퍼옥사이드, 디라우로일퍼옥사이드, 디석시닉산퍼옥사이드, 디(3-메틸벤조일)퍼옥사이드, 벤조일퍼옥사이드, 디-n-프로필퍼옥시카보네이트, 디-이소프로필퍼옥시디카보네이트, 디(4-t-부틸사이클로헥실)퍼옥시카보네이트, 디(2-에틸헥실)퍼옥시카보네이트, 디-sec-부틸퍼옥시카보네이트, 쿠밀퍼옥시네오데카노에이트, 1,1,3,3-테트라메틸부틸퍼옥시네오데카노에이트, t-헥실퍼옥시네오데카노에이트, t-부틸퍼옥시네오데카노에이트, t-헥실퍼옥시피발레이트, t-부틸퍼옥시피발레이트, 1,1,3,3-테트라메틸부틸퍼옥시-2-에틸헥사노에이트, 2,5-디메틸-2,5-디(t-에틸헥사노일퍼옥시)헥산, t-헥실퍼옥시-2-에틸헥사노에이트, t-부틸퍼옥시-2-에틸헥사노에이트, t-헥실퍼옥시이소프로필모노카보네이트, t-부틸퍼옥시-3,5,5-트리메틸헥사노에이트, t-부틸퍼옥시라우레이트, t-부틸퍼옥시이소프로필모노카보네이트, t-부틸퍼옥시-2-에틸헥실모노카보네이트, t-헥실퍼옥시벤조에이트, 2,5-디메틸-2,5-디(벤조일퍼옥시)헥산, t-부틸퍼옥시아세테이트, t-부틸퍼옥시-3-메틸벤조에이트와 t-부틸퍼옥시벤조에이트의 혼합물, t-부틸퍼옥시벤조에이트, t-부틸퍼옥시알릴모노카보네이트, 3,3',4,4'-테트라(t-부틸퍼옥시카르볼)벤조페논 등을 들 수 있다. Organic peroxides include, for example, benzoyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide, di-tert-butyl peroxide, methyl ethyl ketone peroxide, and 1,1-di(t-hexyl peroxy) cyclo. Hexane, 2,2-di(t-butylperoxy)butane, n-butyl 4,4-di(t-butylperoxy)valate, 2,2-di(4,4-di(t-butylperoxy)valate, Oxy)Cyclohexyl)propane, p-menthane hydroperoxide, diisopropoxylbenzene peroxide, 1,1,3,3-tetramethylbutylhydroperoxide, cumene hydroperoxide, t-butylhydroperoxide, di (2-t-butylperoxyisopropyl)benzene, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylcumyl peroxide, di-t-hexyl peroxide Oxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane-3, diisobutyryl peroxide, di(3,5,5-t-methylhexanoyl)peroxide, dilauro Il peroxide, disuccinic acid peroxide, di(3-methylbenzoyl) peroxide, benzoyl peroxide, di-n-propyl peroxycarbonate, di-isopropyl peroxydicarbonate, di(4-t-butylcyclohexyl) Peroxycarbonate, di(2-ethylhexyl)peroxycarbonate, di-sec-butylperoxycarbonate, cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, t-hexylperoxyneodecanoate, t-butylperoxyneodecanoate, t-hexylperoxypivalate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy- 2-ethylhexanoate, 2,5-dimethyl-2,5-di(t-ethylhexanoylperoxy)hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2- Ethylhexanoate, t-hexylperoxyisopropylmonocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, t-butylperoxyisopropylmonocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, t-butylperoxyacetate, t-butylper Mixture of oxy-3-methylbenzoate and t-butylperoxybenzoate, t-butylperoxybenzoate, t-butylperoxyallyl monocarbonate, 3,3',4,4'-tetra(t-butyl) Peroxycarbol) benzophenone, etc. are mentioned.
열 라디칼 중합 개시제의 시판품으로서는, 예를 들어, 와코 쥰야쿠코교사 제조 「AIBN」(2,2'-아조비스(이소부티로니트릴)), 「V-40」(1,1'-아조비스(사이클로헥산-1-카르보니트릴), 「VAm-110」(2,2'-아조비스(N-부틸-2-메틸프로피온아미드), 「V-601」(디메틸2,2'-아조비스(이소부티레이트)), 오츠카 카가쿠사 제조 「OTAZO-15」(1,1'-아조비스(1-아세톡시-1-페닐에탄), 「MAIB」(디메틸2,2'-아조비스이소부티레이트) 등을 들 수 있다. Commercially available thermal radical polymerization initiators include, for example, "AIBN" (2,2'-azobis(isobutyronitrile)), manufactured by Wako Pure Chemical Industries, Ltd., and "V-40" (1,1'-azobis(). Cyclohexane-1-carbonitrile), "VAm-110" (2,2'-azobis(N-butyl-2-methylpropionamide), "V-601" (dimethyl2,2'-azobis(iso butyrate), “OTAZO-15” (1,1'-azobis(1-acetoxy-1-phenylethane)), and “MAIB” (dimethyl 2,2'-azobisisobutyrate) manufactured by Otsuka Chemical Co., Ltd. I can hear it.
라디칼 중합 개시제의 양은, 「에틸렌성 불포화기를 갖는 화합물」 100질량부에 대하여, 바람직하게는 0.5 내지 10질량부, 보다 바람직하게는 0.5 내지 8질량부, 더욱 바람직하게는 0.5 내지 6질량부이다. 여기에서 「에틸렌성 불포화기를 갖는 화합물」은, 전술한 바와 같이, 「다관능 에틸렌성 불포화 화합물」 및 「단관능 에틸렌성 불포화 화합물」을 포함한다.The amount of the radical polymerization initiator is preferably 0.5 to 10 parts by mass, more preferably 0.5 to 8 parts by mass, and even more preferably 0.5 to 6 parts by mass, based on 100 parts by mass of the “compound having an ethylenically unsaturated group.” Here, the “compound having an ethylenically unsaturated group” includes “polyfunctional ethylenically unsaturated compound” and “monofunctional ethylenically unsaturated compound” as described above.
광 라디칼 중합 개시제를 사용하는 경우, 그 양은, 「에틸렌성 불포화기를 갖는 화합물」 100질량부에 대하여, 바람직하게는 0.5 내지 10질량부, 보다 바람직하게는 0.5 내지 8질량부, 더욱 바람직하게는 0.5 내지 6질량부이다. When using a radical photopolymerization initiator, the amount is preferably 0.5 to 10 parts by mass, more preferably 0.5 to 8 parts by mass, and even more preferably 0.5 parts by mass, based on 100 parts by mass of the “compound having an ethylenically unsaturated group.” to 6 parts by mass.
열 라디칼 중합 개시제를 사용하는 경우, 그 양은, 「에틸렌성 불포화기를 갖는 화합물」 100질량부에 대하여, 바람직하게는 0.5 내지 10질량부, 보다 바람직하게는 0.5 내지 8질량부, 더욱 바람직하게는 0.5 내지 6질량부이다.When using a thermal radical polymerization initiator, the amount is preferably 0.5 to 10 parts by mass, more preferably 0.5 to 8 parts by mass, and still more preferably 0.5 parts by mass, based on 100 parts by mass of the “compound having an ethylenically unsaturated group.” to 6 parts by mass.
<다른 성분><Other ingredients>
본 발명의 조성물은, 그 효과를 해치지 않는 범위에서, 상술한 성분과는 다른 다른 성분을 함유하여도 좋다.The composition of the present invention may contain other components different from the above-mentioned components as long as the effect is not impaired.
본 발명의 조성물은, 경화물의 수축을 억제하는 등의 목적으로, 에폭시 수지를 함유하고 있어도 좋다. 에폭시 수지는, 1종만이라도 좋고, 2종 이상이라도 좋다. 1분자 중에 1개의 에폭시기를 갖는 에폭시 수지를 「단관능 에폭시 수지」라고, 1분자 중에 2개의 에폭시기를 갖는 에폭시 수지를 「2관능 에폭시 수지」라고 약칭하는 경우가 있다. 1분자 중에 3개 이상의 에폭시기를 갖는 에폭시 수지도 마찬가지로 약칭하는 경우가 있다.The composition of the present invention may contain an epoxy resin for the purpose of suppressing shrinkage of the cured product. There may be only one type of epoxy resin, or two or more types may be used. An epoxy resin having one epoxy group per molecule is sometimes abbreviated as a “monofunctional epoxy resin,” and an epoxy resin having two epoxy groups per molecule is sometimes abbreviated as a “bifunctional epoxy resin.” Epoxy resins having three or more epoxy groups in one molecule are also sometimes abbreviated in the same way.
상술한 바와 같이, 1분자 중에 1개 이상의 에폭시기 및 2개 이상의 에틸렌성 불포화기를 갖는 화합물은, 본 발명에서의 다관능 에틸렌성 불포화 화합물로서 기능할 수 있기 때문에, 본 발명에서는, 상술한 다관능 에틸렌성 불포화 화합물로 분류된다. 또한, 상술한 바와 같이, 1분자 중에 1개 이상의 에폭시기 및 1개의 에틸렌성 불포화기를 갖는 화합물은, 본 발명에서는, 단관능 에틸렌성 불포화 화합물로 분류된다.As described above, a compound having one or more epoxy groups and two or more ethylenically unsaturated groups in one molecule can function as a polyfunctional ethylenically unsaturated compound in the present invention, and therefore, in the present invention, the above-mentioned polyfunctional ethylene It is classified as a sexually unsaturated compound. In addition, as described above, compounds having one or more epoxy groups and one ethylenically unsaturated group in one molecule are classified as monofunctional ethylenically unsaturated compounds in the present invention.
에폭시 수지로서는, 예를 들어, 수소 첨가 에폭시 수지(수소 첨가 비스페놀A 형 에폭시 수지, 수소 첨가 비스페놀F형 에폭시 수지 등), 불소 함유 에폭시 수지, 쇄상 지방족형 에폭시 수지, 환상 지방족형 에폭시 수지, 비스페놀A형 에폭시 수지, 비페닐형 에폭시 수지, 비페닐아랄킬형 에폭시 수지, 나프톨형 에폭시 수지, 나프탈렌형 에폭시 수지, 비스페놀F형 에폭시 수지, 인 함유 에폭시 수지, 비스페놀S형 에폭시 수지, 방향족 글리시딜아민형 에폭시 수지(예를 들어, 테트라글리시딜디아미노디페닐메탄, 트리글리시딜-p-아미노페놀, 디글리시딜톨루이딘, 디글리시딜아닐린 등), 지환식 에폭시 수지, 페놀노볼락형 에폭시 수지, 크레졸노볼락형 에폭시 수지, 비스페놀A 노볼락형 에폭시 수지, 부타디엔 구조를 갖는 에폭시 수지, 비스페놀의 디글리시딜에테르화물, 나프탈렌디올의 디글리시딜에테르화물, 페놀류의 디글리시딜에테르화물, 및 알코올류의 디글리시딜에테르화물, 및 이것들의 에폭시 수지의 알킬 치환체 등을 들 수 있다.Examples of epoxy resins include hydrogenated epoxy resins (hydrogenated bisphenol A epoxy resins, hydrogenated bisphenol F epoxy resins, etc.), fluorine-containing epoxy resins, linear aliphatic epoxy resins, cyclic aliphatic epoxy resins, and bisphenol A. type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, bisphenol F type epoxy resin, phosphorus-containing epoxy resin, bisphenol S type epoxy resin, aromatic glycidylamine type. Epoxy resins (e.g., tetraglycidyldiaminodiphenylmethane, triglycidyl-p-aminophenol, diglycidyltoluidine, diglycidylaniline, etc.), alicyclic epoxy resin, phenol novolac type epoxy Resin, cresol novolak-type epoxy resin, bisphenol A novolak-type epoxy resin, epoxy resin with butadiene structure, diglycidyl ether of bisphenol, diglycidyl ether of naphthalenediol, diglycidyl ether of phenols. compounds, diglycidyl ethers of alcohols, and alkyl-substituted products of these epoxy resins.
에폭시 수지의 에폭시 당량은, 반응성 등의 관점에서, 바람직하게는 50 내지 1,000, 보다 바람직하게는 50 내지 750, 더욱 바람직하게는 100 내지 750, 특히 바람직하게는 100 내지 500이다. 또한, 「에폭시 당량」이란, 1그램 당량의 에폭시기를 포함하는 수지의 그램수(g/eq)이고, JIS K 7236에 규정된 방법에 따라 측정된다.The epoxy equivalent of the epoxy resin is preferably 50 to 1,000, more preferably 50 to 750, further preferably 100 to 750, and particularly preferably 100 to 500 from the viewpoint of reactivity and the like. In addition, “epoxy equivalent weight” is the number of grams (g/eq) of resin containing epoxy groups equivalent to 1 gram, and is measured according to the method specified in JIS K 7236.
에폭시 수지는, 바람직하게는 수소 첨가 에폭시 수지, 불소 함유 에폭시 수지, 쇄상 지방족형 에폭시 수지, 및 환상 지방족형 에폭시 수지로부터 선택되는 1종 이상이고, 보다 바람직하게는 수소 첨가 에폭시 수지, 불소 함유 에폭시 수지, 및 환상 지방족형 에폭시 수지로부터 선택되는 1종 이상이며, 더욱 바람직하게는 수소 첨가 에폭시 수지 및 환상 지방족 에폭시 수지로부터 선택되는 1종 이상이다. 여기에서 「수소 첨가 에폭시 수지」란, 방향환 함유 에폭시 수지를 수소 첨가하여 얻어지는 에폭시 수지를 의미한다. 수소 첨가 에폭시 수지의 수첨화율은, 바람직하게는 50% 이상, 보다 바람직하게는 70% 이상이다. 「쇄상 지방족형 에폭시 수지」란, 직쇄상 또는 분기상의 알킬쇄, 또는 알킬에테르쇄를 갖는 에폭시 수지를 의미하고, 「환상 지방족형 에폭시 수지」란, 분자 내에 환상 지방족 골격, 예를 들어 사이클로알칸 골격을 갖는 에폭시 수지를 의미한다.The epoxy resin is preferably at least one selected from hydrogenated epoxy resins, fluorine-containing epoxy resins, linear aliphatic epoxy resins, and cyclic aliphatic epoxy resins, and more preferably hydrogenated epoxy resins and fluorine-containing epoxy resins. , and at least one type selected from cyclic aliphatic epoxy resins, and more preferably at least one type selected from hydrogenated epoxy resins and cyclic aliphatic epoxy resins. Here, “hydrogenated epoxy resin” means an epoxy resin obtained by hydrogenating an aromatic ring-containing epoxy resin. The hydrogenation rate of the hydrogenated epoxy resin is preferably 50% or more, and more preferably 70% or more. “Chain aliphatic epoxy resin” means an epoxy resin having a linear or branched alkyl chain or alkyl ether chain, and “cyclic aliphatic epoxy resin” means a cyclic aliphatic skeleton, for example, a cycloalkane skeleton, in the molecule. It means an epoxy resin having .
수소 첨가 비스페놀A형 에폭시 수지로서는, 예를 들어, 액상 수소 첨가 비스페놀A형 에폭시 수지(예를 들어, 「YX8000」(미츠비시 카가쿠사 제조, 에폭시 당량: 약 205), 「데나콜 EX-252」(나가세 켐텍스사 제조, 에폭시 당량: 약 213)), 고형 수소 첨가 비스페놀A형 에폭시 수지(예를 들어, 「YX8040」(미츠비시 카가쿠사 제조, 에폭시 당량: 1000))를 들 수 있다.As the hydrogenated bisphenol A type epoxy resin, for example, liquid hydrogenated bisphenol A type epoxy resin (e.g., “YX8000” (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205), “Denacol EX-252” ( A solid hydrogenated bisphenol A type epoxy resin (for example, "YX8040" (manufactured by Nagase Chemtex, epoxy equivalent: about 213)) is included.
불소 함유 에폭시 수지는, 예를 들어, WO2011/089947에 기재된 불소 함유 에폭시 수지를 사용할 수 있다.As the fluorine-containing epoxy resin, for example, the fluorine-containing epoxy resin described in WO2011/089947 can be used.
쇄상 지방족 에폭시 수지로서는, 예를 들어, 폴리글리세롤폴리글리시딜에테르(예를 들어, 「데나콜 EX-512」, 「데나콜 EX-521」, 나가세 켐텍스사 제조), 펜타에리스리톨폴리글리시딜에테르(예를 들어, 「데나콜 EX-411」, 나가세 켐텍스사 제조), 디글리세롤폴리글리시딜에테르(예를 들어, 「데나콜 EX-421」, 나가세 켐텍스사 제조), 글리세롤폴리글리시딜에테르(예를 들어, 「데나콜 EX-313」, 「데나콜 EX-314」, 나가세 켐텍스사 제조), 트리메틸올프로판폴리글리시딜에테르(예를 들어, 「데나콜 EX-321」, 나가세 켐텍스사 제조), 네오펜틸글리콜디글리시딜에테르(예를 들어, 「데나콜 EX-211」, 나가세 켐텍스사 제조), 1,6- 헥산디올디글리시딜에테르(예를 들어, 「데나콜 EX-212」, 나가세 켐텍스사 제조), 에틸렌글리콜디글리시딜에테르(예를 들어, 「데나콜 EX-810」, 「데나콜 EX-811」, 나가세 켐텍스사 제조), 디에틸렌글리콜디글리시딜에테르(예를 들어,「데나콜 EX-850」, 「데나콜 EX-851」, 나가세 켐텍스사 제조), 폴리에틸렌글리콜디글리시딜에테르(예를 들어, 「데나콜 EX-821」, 「데나콜 EX-830」, 「데나콜 EX-832」, 「데나콜 EX-841」, 「데나콜 EX-861」, 나가세 켐텍스사 제조), 프로필렌글리콜디글리시딜에테르(예를 들어, 「데나콜 EX-911」, 나가세 켐텍스사 제조), 폴리프로필렌글리콜디글리시딜에테르(예를 들어, 「데나콜 EX-941」, 「데나콜 EX-920」, 「데나콜 EX-931」, 나가세 켐텍스사 제조) 등을 들 수 있다.Examples of linear aliphatic epoxy resins include polyglycerol polyglycidyl ether (e.g., “Denacol EX-512”, “Denacol EX-521”, manufactured by Nagase Chemtex Corporation), and pentaerythritol polyglycidyl. Diglycerol (e.g., “Denacol EX-411”, manufactured by Nagase Chemtex), diglycerol polyglycidyl ether (e.g., “Denacol EX-421”, manufactured by Nagase Chemtex), glycerol Polyglycidyl ether (for example, “Denacol EX-313”, “Denacol EX-314”, manufactured by Nagase Chemtex Corporation), trimethylolpropane polyglycidyl ether (for example, “Denacol EX-314”) -321", manufactured by Nagase Chemtex Corporation), neopentyl glycol diglycidyl ether (e.g., "Denacol EX-211", manufactured by Nagase Chemtex Corporation), 1,6-hexanediol diglycidyl ether (For example, “Denacol EX-212”, manufactured by Nagase Chemtex Co., Ltd.), ethylene glycol diglycidyl ether (for example, “Denacol EX-810”, “Denacol EX-811”, Nagase Chemtex Co., Ltd.) manufactured by Tex Corporation), diethylene glycol diglycidyl ether (e.g. “Denacol EX-850”, “Denacol EX-851” manufactured by Nagase Chemtex Corporation), polyethylene glycol diglycidyl ether (e.g. For example, “Denacol EX-821”, “Denacol EX-830”, “Denacol EX-832”, “Denacol EX-841”, “Denacol EX-861”, manufactured by Nagase Chemtex Corporation), Propylene glycol diglycidyl ether (e.g., “Denacol EX-911”, manufactured by Nagase Chemtex Co., Ltd.), polypropylene glycol diglycidyl ether (e.g., “Denacol EX-941”, “Denacol EX-941”, “Chol EX-920”, “Denacol EX-931”, manufactured by Nagase Chemtex Co., Ltd.), and the like.
환상 지방족형 에폭시 수지로서는, 예를 들면, 다이셀 카가쿠코교사 제조 「EHPE-3150」 등을 들 수 있다. Examples of the cyclic aliphatic epoxy resin include "EHPE-3150" manufactured by Daicel Kagakukogyo Co., Ltd.
에폭시 수지를 사용하는 경우, 그 양은, 조성물 전체당, 바람직하게는 5 내지 40질량%, 보다 바람직하게는 5 내지 35질량%, 더욱 바람직하게는 5 내지 30질량%이다.When an epoxy resin is used, the amount is preferably 5 to 40% by mass, more preferably 5 to 35% by mass, and even more preferably 5 to 30% by mass, per the entire composition.
본 발명의 조성물은, 광 양이온 중합 개시제를 함유하고 있어도 좋다. 광 양이온 중합 개시제는, 1종만이라도 좋고, 2종 이상이라도 좋다.The composition of the present invention may contain a photocationic polymerization initiator. There may be only one type of photocationic polymerization initiator, and two or more types may be used.
광 양이온 중합 개시제로서는, 예를 들어, 방향족 설포늄염, 방향족 요드늄염, 방향족 디아조늄염, 방향족 암모늄염, (2,4-사이클로펜타디엔-1-일)((1-메틸에틸)벤젠)-Fe염 등을 들 수 있다.Examples of photocationic polymerization initiators include aromatic sulfonium salts, aromatic iodonium salts, aromatic diazonium salts, aromatic ammonium salts, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe. Salts, etc. can be mentioned.
방향족 설포늄염으로서는, 예를 들어, 비스(4-(디페닐설포니오)페닐)설파이드비스헥사플루오로포스페이트, 비스(4-(디페닐설포니오)페닐)설파이드비스헥사플루오로안티모네이트, 비스(4-(디페닐설포니오)페닐)설파이드비스테트라플루오로보레이트, 비스(4-(디페닐설포니오)페닐)설파이드테트라키스(펜타플루오로페닐)보레이트, 디페닐-4-(페닐티오)페닐설포늄헥사플루오로포스페이트, 디페닐-4-(훼닐티오)페닐설포늄헥사플루오로안티모네이트, 디페닐-4-(페닐티오)페닐설포늄테트라플루오로보레이트, 디페닐-4-(페닐티오)페닐설포늄테트라키스(펜타플루오로페닐)보레이트, 트리페닐설포늄헥사플루오로포스페이트, 트리페닐설포늄헥사플루오로안티모네이트, 트리페닐설포늄테트라플루오로보레이트, 트리페닐설포늄테트라키스(펜타플루오로페닐)보레이트, 비스(4-(디(4-(2-하이드록시에톡시))페닐설폰니오)페닐)설파이드비스헥사플루오로포스페이트, 비스(4-(디(4-(2-하이드록시에톡시))페닐설포니오)페닐)설파이드비스헥사플루오로안티모네이트, 비스(4-(디(4-(2-하이드록시에톡시))페닐설포니오)페닐)설파이드비스테트라플루오로보레이트, 비스(4-(디(4-2-하이드록시에톡시))페닐설포니오)페닐)설파이드테트라키스(펜타플루오로페닐)보레이트 등을 들 수 있다.As aromatic sulfonium salts, for example, bis(4-(diphenylsulfonio)phenyl)sulfide bishexafluorophosphate, bis(4-(diphenylsulfonio)phenyl)sulfide bishexafluoroantimonate. , bis(4-(diphenylsulfonio)phenyl)sulfide bistetrafluoroborate, bis(4-(diphenylsulfonio)phenyl)sulfidetetrakis(pentafluorophenyl)borate, diphenyl-4- (phenylthio)phenylsulfonium hexafluorophosphate, diphenyl-4-(phenylthio)phenylsulfonium hexafluoroantimonate, diphenyl-4-(phenylthio)phenylsulfonium tetrafluoroborate, diphenyl -4-(phenylthio)phenylsulfonium tetrakis(pentafluorophenyl)borate, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrafluoroborate, triphenylsulfonium tetrafluoroborate Phenylsulfonium tetrakis(pentafluorophenyl)borate, bis(4-(di(4-(2-hydroxyethoxy))phenylsulfonio)phenyl)sulfide bishexafluorophosphate, bis(4-(di (4-(2-hydroxyethoxy))phenylsulfonio)phenyl)sulfide bishexafluoroantimonate, bis(4-(di(4-(2-hydroxyethoxy))phenylsulfonio )Phenyl)sulfide bistetrafluoroborate, bis(4-(di(4-2-hydroxyethoxy))phenylsulfonio)phenyl)sulfidetetrakis(pentafluorophenyl)borate, etc.
방향족 요오드늄으로서는, 예를 들어, 디페닐요오드늄헥사플루오로포스페이트, 디페닐요오드늄헥사플루오로안티모네이트, 디페닐요오드늄테트라플루오로보레이트, 디페닐요오드늄테트라키스(펜타플루오로페닐)보레이트, 비스(도데실페닐)요오드늄헥사플루오로포스페이트, 비스(도데실페닐)요오드늄헥사플루오로안티모네이트, 비스(도데실페닐)요오드늄테트라플루오로보레이트, 비스(도데실페닐)요오드늄테트라키스(펜타플루오로페닐)보레이트, 4-메틸페닐-4-(1-메틸에틸)페닐요오드늄헥사플루오로포스페이트, 4-메틸페닐-4-(1-메틸에틸)페닐요오드늄헥사플루오로안티 모네이트, 4-메틸페닐-4-(1-메틸에틸)페닐요오드늄테트라플루오로보레이트, 4-메틸페닐-4-(1-메틸에틸)페닐요오드늄테트라키스(펜타플루오로페닐)보레이트 등을 들 수 있다.Examples of aromatic iodonium include diphenyl iodonium hexafluorophosphate, diphenyl iodonium hexafluoroantimonate, diphenyl iodonium tetrafluoroborate, and diphenyl iodonium tetrakis (pentafluorophenyl). Borate, bis(dodecylphenyl)iodonium hexafluorophosphate, bis(dodecylphenyl)iodonium hexafluoroantimonate, bis(dodecylphenyl)iodonium tetrafluoroborate, bis(dodecylphenyl)iodine Nium tetrakis(pentafluorophenyl)borate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium hexafluorophosphate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium hexafluoroanti. Monate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium tetrafluoroborate, 4-methylphenyl-4-(1-methylethyl)phenyliodonium tetrakis(pentafluorophenyl)borate, etc. You can.
방향족 디아조늄염으로서는, 예를 들어, 페닐디아조늄헥사플루오로포스페이트, 페닐디아조늄헥사플루오로안티모네이트, 페닐디아조늄테트라플루오로보레이트, 페닐디아조늄테트라키스(펜타플루오로페닐)보레이트 등을 들 수 있다.As aromatic diazonium salts, for example, phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, phenyldiazonium tetrakis(pentafluorophenyl)borate, etc. I can hear it.
방향족 암모늄염으로서는, 예를 들어, 1-벤질-2-시아노피리디늄헥사플루오로포스페이트, 1-벤질-2-시아노피리디늄헥사플루오로안티모네이트, 1-벤질-2-시아노피리디늄테트라플루오로보레이트, 1-벤질-2-시아노피리디늄테트라키스(펜타플루오로페닐)보레이트, 1-(나프틸메틸)-2-시아노피리디늄헥사플루오로포스페이트, 1-(나프틸메틸)-2-시아노피리디늄헥사플루오로안티모네이트, 1-(나프틸메틸)-2-시아노피리디늄테트라플루오로보레이트, 1-(나프틸메틸)-2-시아노피리디늄테트라키스(펜타플루오로페닐)보레이트 등을 들 수 있다. Examples of aromatic ammonium salts include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, and 1-benzyl-2-cyanopyridinium. Tetrafluoroborate, 1-benzyl-2-cyanopyridinium tetrakis(pentafluorophenyl)borate, 1-(naphthylmethyl)-2-cyanopyridinium hexafluorophosphate, 1-(naphthylmethyl )-2-Cyanopyridinium hexafluoroantimonate, 1-(naphthylmethyl)-2-cyanopyridinium tetrafluoroborate, 1-(naphthylmethyl)-2-cyanopyridinium tetrakis (pentafluorophenyl)borate, etc. can be mentioned.
(2,4-사이클로펜타디엔-1-일)((1-메틸에틸)벤젠)-Fe염으로서는, 예를 들어, (2,4-사이클로펜타디엔-1-일)((1-메틸에틸)벤젠)-Fe(II)헥사플루오로포스페이트, (2,4-사이클로펜타디엔-1-일)((1-메틸에틸)벤젠)-Fe(II)헥사플루오로안티모네이트, (2,4-사이클로펜타디엔-1-일)((1-메틸에틸)벤젠)-Fe(II)테트라플루오로보레이트, (2,4-사이클로펜타디엔-1-일)((1-메틸에틸)벤젠)-Fe(II)테트라키스(펜타플루오로페닐)보레이트 등을 들 수 있다. (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe salt, for example, (2,4-cyclopentadien-1-yl)((1-methylethyl )Benzene)-Fe(II)hexafluorophosphate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II)hexafluoroantimonate, (2, 4-Cyclopentadien-1-yl)((1-methylethyl)benzene)-Fe(II)tetrafluoroborate, (2,4-cyclopentadien-1-yl)((1-methylethyl)benzene )-Fe(II)tetrakis(pentafluorophenyl)borate, etc.
광 양이온 중합 개시제의 시판품으로서는, 예를 들어, ADEKA사 제조 「SP-150」, 「SP-170」, 「SP-082」, 「SP-103」, 산아프로사 제조 「CPI-100P」, 「CPI-101A」, 「CPI-200K」, IGM resins사 제조 「Omnirad270」, 「Omnirad290」 등을 들 수 있다. Commercially available photocationic polymerization initiators include, for example, "SP-150", "SP-170", "SP-082", and "SP-103" manufactured by ADEKA, and "CPI-100P" manufactured by San-Apro. Examples include “CPI-101A”, “CPI-200K”, “Omnirad270” manufactured by IGM Resins, and “Omnirad290”.
광 양이온 중합 개시제를 사용하는 경우, 그 양은, 에폭시기를 갖는 화합물의 합계(예를 들어, 에폭시기를 갖는 (메타)아크릴레이트 및 에폭시 수지의 합계) 100질량부에 대하여, 바람직하게는 0.5 내지 10질량부, 보다 바람직하게는 1.0 내지 8질량부, 더욱 바람직하게는 2.0 내지 6질량부이다.When using a photo cationic polymerization initiator, the amount is preferably 0.5 to 10 parts by mass based on 100 parts by mass of the total of compounds having an epoxy group (for example, the total of (meth)acrylates and epoxy resins having an epoxy group). parts, more preferably 1.0 to 8 parts by mass, and even more preferably 2.0 to 6 parts by mass.
본 발명의 조성물은, 실란 커플링제를 함유하고 있다. 실란 커플링제는, 1 종만이라도 좋고, 2종 이상이라도 좋다.The composition of the present invention contains a silane coupling agent. There may be only one type of silane coupling agent, or two or more types may be used.
실란 커플링제로서는, 예를 들어, 3-글리시딜옥시프로필트리메톡시실란, 3-글리시딜옥시프로필트리에톡시실란, 3-글리시딜옥시프로필(디메톡시)메틸실란 및 2-(3,4-에폭시사이클로헥실)에틸트리메톡시실란 등의 에폭시계 실란 커플링제; 3-머캅토프로필트리메톡시실란, 3-머캅토프로필트리에톡시실란, 3-머캅토프로필메틸디메톡시실란 및 11-머캅토운데실트리메톡시실란 등의 머캅토계 실란 커플링제; 3-아미노프로필트리메톡시실란, 3-아미노프로필트리에톡시실란, 3-아미노프로필디메톡시메틸실란, N-페닐-3-아미노프로필트리메톡시실란, N-메틸아미노프로필트리메톡시실란, N-(2-아미노에틸)-3-아미노프로필트리메톡시실란 및 N-(2-아미노에틸)-3-아미노프로필디메톡시메틸실란 등의 아미노계 실란 커플링제; 3-우레이드프로필트리에톡시실란 등의 우레이드계 실란 커플링제; 비닐트리메톡시실란, 비닐트리에톡시실란 및 비닐메틸디에톡시실란 등의 비닐계 실란 커플링제; p-스티릴트리메톡시실란 등의 스티릴계 실란 커플링제; 3-아크릴옥시프로필트리메톡시실란 및 3-메타 크릴옥시프로필트리메톡시실란 등의 아크릴레이트계 실란 커플링제; 3-이소시아네이트프로필트리메톡시실란 등의 이소시아네이트계 실란 커플링제; 비스(트리에톡시실릴프로필)디설파이드, 비스(트리에톡시실릴프로필)테트라설파이드 등의 설파이드계 실란 커플링제; 페닐트리메톡시실란, 메타크릴록시프로필트리메톡시실란, 이미 다졸실란, 트리아진실란 등을 들 수 있다. 이것들 중에서, 아크릴레이트계 실란 커플링제가 바람직하다.Silane coupling agents include, for example, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropyl(dimethoxy)methylsilane, and 2-( Epoxy-based silane coupling agents such as 3,4-epoxycyclohexyl)ethyltrimethoxysilane; Mercapto-based silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 11-mercaptoundecyltrimethoxysilane; 3-Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane, Amino silane coupling agents such as N-(2-aminoethyl)-3-aminopropyltrimethoxysilane and N-(2-aminoethyl)-3-aminopropyldimethoxymethylsilane; Uride-based silane coupling agents such as 3-ureide propyltriethoxysilane; Vinyl-based silane coupling agents such as vinyltrimethoxysilane, vinyltriethoxysilane, and vinylmethyldiethoxysilane; Styryl-based silane coupling agents such as p-styryltrimethoxysilane; Acrylate-based silane coupling agents such as 3-acryloxypropyltrimethoxysilane and 3-methacryloxypropyltrimethoxysilane; Isocyanate-based silane coupling agents such as 3-isocyanate propyltrimethoxysilane; Sulfide-based silane coupling agents such as bis(triethoxysilylpropyl)disulfide and bis(triethoxysilylpropyl)tetrasulfide; Phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, imidazole silane, triazine silane, etc. are mentioned. Among these, acrylate-based silane coupling agents are preferable.
실란 커플링제의 시판품으로서는, 예를 들어, 신에츠 카가쿠사 제조 「KBM-502」, 「KBM-503」, 「KBE-502」, 「KBE-503」, 「KBM-5103」, 「KBM-5803」 등을들 수 있다.Commercially available silane coupling agents include, for example, "KBM-502", "KBM-503", "KBE-502", "KBE-503", "KBM-5103", and "KBM-5803" manufactured by Shin-Etsu Chemical Co., Ltd. You can lift your back.
실란 커플링제를 사용하는 경우, 그 양은, 조성물 전체당, 바람직하게는 0.10 내지 5.00질량%, 보다 바람직하게는 0.25 내지 3.00질량%, 더욱 바람직하게는 0.30 내지 2.00질량%이다.When using a silane coupling agent, the amount is preferably 0.10 to 5.00% by mass, more preferably 0.25 to 3.00% by mass, and even more preferably 0.30 to 2.00% by mass, per the entire composition.
본 발명의 조성물은, 중합 금지제를 함유하고 있어도 좋다. 중합 금지제는, 1종만이라도 좋고, 2종 이상이라도 좋다.The composition of the present invention may contain a polymerization inhibitor. There may be only one type of polymerization inhibitor, and two or more types may be used.
중합 금지제로서는, 예를 들어, t-부틸하이드로퀴논, p-벤조퀴논, 하이드로퀴논, p-메톡시페놀, N,N-디에틸하이드록실아민, N-니트로소-N-페닐하이드록실아민암모늄염 등을 들 수 있다. 중합 금지제의 시판품으로서는, 예를 들어, 와코 쥰야쿠코교사 제조 「Q-1301」, 「TBHQ」, 「PBQ2」, 「DEHA」, 「MEHQ」, 카와사키 카세이코교사 제조 「QS-10」 등을 들 수 있다.Examples of polymerization inhibitors include t-butylhydroquinone, p-benzoquinone, hydroquinone, p-methoxyphenol, N,N-diethylhydroxylamine, and N-nitroso-N-phenylhydroxylamine. Ammonium salts, etc. can be mentioned. Commercially available products containing polymerization inhibitors include, for example, "Q-1301", "TBHQ", "PBQ2", "DEHA", and "MEHQ" manufactured by Wako Pure Chemical Industries, Ltd., and "QS-10" manufactured by Kawasaki Kaseiko Chemical Industries, Ltd. I can hear it.
중합 금지제를 사용하는 경우, 그 양은, 「에틸렌성 불포화기를 갖는 화합물」 100질량부에 대하여, 바람직하게는 10 내지 200ppm, 보다 바람직하게는 50 내지 100ppm이다. 또한, 상기 「ppm」은 질량 기준이다. 여기에서, 「에틸렌성 불포화기를 갖는 화합물」은, 전술한 바와 같이, 「다관능 에틸렌성 불포화 화합물」 및 「단관능 에틸렌성 불포화 화합물」을 포함한다.When a polymerization inhibitor is used, the amount is preferably 10 to 200 ppm, more preferably 50 to 100 ppm, based on 100 parts by mass of the “compound having an ethylenically unsaturated group.” In addition, the above “ppm” is based on mass. Here, the “compound having an ethylenically unsaturated group” includes “polyfunctional ethylenically unsaturated compound” and “monofunctional ethylenically unsaturated compound” as described above.
<경화물층의 전광선 투과율><Total light transmittance of the cured material layer>
본 발명의 조성물의 경화물층(두께: 20μm)의 D65광으로의 전광선 투과율은, 바람직하게는 85% 이상, 보다 바람직하게는 88% 이상, 더욱 바람직하게는 90% 이상이다.The total light transmittance of the cured layer (thickness: 20 μm) of the composition of the present invention to D65 light is preferably 85% or more, more preferably 88% or more, and even more preferably 90% or more.
경화물층의 D65광으로의 전광선 투과율은, 후술하는 실시예에 기재하도록, 유리판 사이에 조성물의 경화물이 끼인 적층체를 형성하고, 공기를 레퍼런스로 함으로써 산출된다. 또한, 상술한 D65광으로의 전광선 투과율의 값은, 두께가 20μm인 경화물층의 측정값이지만, 경화물층의 두께는, 일반적으로 3 내지 200μm이다.The total light transmittance of the cured material layer to D65 light is calculated by forming a laminate with the cured product of the composition sandwiched between glass plates and using air as a reference, as described in the Examples described later. In addition, the value of the total light transmittance to D65 light mentioned above is a measurement value of a cured layer having a thickness of 20 μm, but the thickness of the cured layer is generally 3 to 200 μm.
<경화물층의 헤이즈><Haze of hardened layer>
본 발명의 조성물의 경화물층(두께: 20μm)의 헤이즈는, 바람직하게는 3.0% 미만이다.The haze of the cured layer (thickness: 20 μm) of the composition of the present invention is preferably less than 3.0%.
경화물층의 헤이즈는, 후술하는 실시예에 기재하도록, 유리판 사이에 조성물의 경화물이 끼인 적층체를 형성하고, 공기를 레퍼런스로 함으로써 산출된다. 또한, 상술한 헤이즈의 값은, 두께가 20μm인 경화물층의 측정값이지만, 경화물층의 두께는, 일반적으로 3 내지 200μm이다.The haze of the cured layer is calculated by forming a laminate in which the cured product of the composition is sandwiched between glass plates and using air as a reference, as described in the Examples described later. In addition, the above-mentioned haze value is a measurement value of a cured material layer with a thickness of 20 μm, but the thickness of the cured material layer is generally 3 to 200 μm.
전광선 투과율이 85% 이상으로 헤이즈가 3.0% 미만인 경화물층은, 육안으로 투명이라고 인식할 수 있다.A cured layer with a total light transmittance of 85% or more and a haze of less than 3.0% can be recognized as transparent with the naked eye.
<유기 EL 디바이스><Organic EL device>
본 발명의 조성물의 경화물로 유기 EL 소자가 밀봉된 유기 EL 디바이스는, 예를 들어, 기판 위의 유기 EL 소자 위에서 본 발명의 조성물을 도포한 후, 당해 조성물을 경화시킴으로써 제조할 수 있다.An organic EL device in which an organic EL element is sealed with a cured product of the composition of the present invention can be manufactured, for example, by applying the composition of the present invention on an organic EL element on a substrate and then curing the composition.
본 발명의 조성물이 광 라디칼 중합 개시제를 포함하는 경우, 경화는, 당해 조성물에 자외선을 조사함으로써 행할 수 있다. 자외선 조사를 위한 장치로서는, 예를 들어, 고압 수은등, 초고압 수은등, 메탈 할라이드 램프, 하이파워 메탈 할라이드 램프, 저압 수은등, LED 광원 등을 들 수 있다. 자외선 조사시의 조성물의 온도는, 바람직하게는 20 내지 120℃, 보다 바람직하게는 25 내지 110℃이다. 자외선의 적산 조사량은, 바람직하게는 500 내지 4000mJ/㎠, 보다 바람직하게는 1000 내지 3500mJ/㎠이다. When the composition of the present invention contains a radical photopolymerization initiator, curing can be performed by irradiating the composition with ultraviolet rays. Examples of devices for ultraviolet irradiation include high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, high-power metal halide lamps, low-pressure mercury lamps, and LED light sources. The temperature of the composition when irradiated with ultraviolet rays is preferably 20 to 120°C, more preferably 25 to 110°C. The cumulative irradiation amount of ultraviolet rays is preferably 500 to 4000 mJ/cm2, more preferably 1000 to 3500 mJ/cm2.
본 발명의 조성물이 열 라디칼 중합 개시제를 포함하는 경우, 경화는, 건조기 등을 이용하여 당해 조성물을 가열함으로써 행할 수 있다. 가열 온도는, 바람직하게는 80 내지 120℃, 보다 바람직하게는 100 내지 110℃이고, 가열 시간은, 바람직하게는 15 내지 120분, 보다 바람직하게는 30 내지 90분이다. 이 가열은, 대기 분위기 하에서 행하여도 좋고, 불활성 가스(예를 들어, 질소 가스) 분위기 하에서 행할 수 있다.When the composition of the present invention contains a thermal radical polymerization initiator, curing can be performed by heating the composition using a dryer or the like. The heating temperature is preferably 80 to 120°C, more preferably 100 to 110°C, and the heating time is preferably 15 to 120 minutes, more preferably 30 to 90 minutes. This heating may be performed under an atmospheric atmosphere or an inert gas (for example, nitrogen gas) atmosphere.
실시예Example
이하, 실시예를 들어 본 발명을 보다 구체적으로 설명하지만, 본 발명은 이하의 실시예에 의해 제한을 받는 것이 아니고, 상기·하기의 취지에 적합할 수 있는 범위에서 적당히 변경을 가하여 실시하는 것도 물론 가능하고, 그것들은 모두 본 발명의 기술적 범위에 포함된다.Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following examples, and may of course be implemented with appropriate changes within the scope suitable for the above and below purposes. It is possible, and they are all included in the technical scope of the present invention.
또한, 이하에 기재된 양에서의 「부」, 및 포화 흡수율 및 열 중량 감소율에서의 「%」는, 특단의 기재가 없는 한, 각각 「질량부」및 「질량%」를 의미한다. 또한, 「실온」이란, 20 내지 30℃를 의미한다.In addition, “part” in the amount described below and “%” in the saturated water absorption and thermal weight reduction rate mean “part by mass” and “% by mass”, respectively, unless otherwise specified. In addition, “room temperature” means 20 to 30°C.
이하의 실시예 및 비교예에서 희석제로서 사용한 단관능 아크릴레이트(쿄에이샤 카가쿠사 제조 「라이트 아크릴레이트 IB-XA」)의 점도를, 25℃의 온도 조건 하 B형 점도계로 측정하였다. 그 결과, 점도는 10mPa·s였다.The viscosity of the monofunctional acrylate (“Light Acrylate IB-XA” manufactured by Kyoeisha Chemical Co., Ltd.) used as a diluent in the following examples and comparative examples was measured with a type B viscometer under a temperature condition of 25°C. As a result, the viscosity was 10 mPa·s.
<실시예 1><Example 1>
6관능 아크릴레이트(닛폰 카야쿠사 제조 「KAYARAD DPCA-60」) 20부와, 지환 식 골격을 갖는 2관능 아크릴레이트(다이셀 오르넥스사 제조 「IRR214-K」) 100부와, 2관능 아크릴레이트(비스페놀A형 에폭시아크릴레이트, 다이셀 오르넥스사 제조 「EBECRYL600」) 50부와, 실란 커플링제(신에츠 실리콘사 제조 「KBM-5103」) 2부와, 시판의 반소성 하이드로탈사이트(BET 비표면적: 15㎡/g, 평균 입자직경: 400nm) 96부를 혼련한 후, 3본 롤 밀로 분산을 행하여, 혼합물을 얻었다. 이어서 얻어진 혼합물에, 지환식 골격을 갖는 단관능 아크릴레이트(쿄에이샤 카가쿠사 제조 「라이트 아크릴레이트 IB-XA」)(희석제) 50부와 2관능 아크릴레이트(쿄에이샤 카가쿠사 제조 「라이트 아크릴레이트 NP-A」)(희석제로서도 기능함) 50부와 열 라디칼 중합 개시제(와코 쥰야쿠코교사 제조 「V-601」) 2부를 배합하여, 고속 회전 믹서로 균일하게 분산하여, 조성물을 얻었다.20 parts of hexafunctional acrylate (“KAYARAD DPCA-60” manufactured by Nippon Kayaku Co., Ltd.), 100 parts of bifunctional acrylate (“IRR214-K” manufactured by Daicel Ornex Co., Ltd.) having an alicyclic skeleton, and bifunctional acrylate 50 parts of (bisphenol A type epoxy acrylate, “EBECRYL600” manufactured by Daicel Ornex), 2 parts of silane coupling agent (“KBM-5103” manufactured by Shin-Etsu Silicone), and commercially available semi-calcined hydrotalcite (BET ratio) After kneading 96 parts (surface area: 15 m2/g, average particle diameter: 400 nm), dispersion was performed using a three-roll mill to obtain a mixture. Next, 50 parts of a monofunctional acrylate having an alicyclic skeleton (“Light Acrylate IB-XA” manufactured by Kyoeisha Chemical Co., Ltd.) (diluent) and a bifunctional acrylate (“Light Acrylate” manufactured by Kyoeisha Chemical Co., Ltd.) were added to the obtained mixture. 50 parts of "Rate NP-A" (which also functions as a diluent) and 2 parts of a thermal radical polymerization initiator ("V-601" manufactured by Wako Pure Chemical Industries, Ltd.) were mixed and uniformly dispersed with a high-speed rotating mixer to obtain a composition.
<실시예 2><Example 2>
반소성 하이드로탈사이트의 양을 170부로 변경한 것 이외에는 실시예 1과 동일하게 하여 조성물을 얻었다.A composition was obtained in the same manner as in Example 1, except that the amount of semi-calcined hydrotalcite was changed to 170 parts.
<실시예 3><Example 3>
6관능 아크릴레이트(닛폰 카야쿠사 제조 「KAYARAD DPCA-60」) 20부와, 지환 식 골격을 갖는 2관능 아크릴레이트(다이셀 오르넥스사 제조 「IRR214-K」) 80부와, UVACURE1561(다이셀 오르넥스사 제조, 에폭시기 및 1분자 중에 1개의 아크릴로일기를 갖는 화합물(함유량: 78 내지 82%)과 비스페놀A형 에폭시 수지(함유량: 18 내지 22%)의 혼합물) 20부와, 액상 수소 첨가 비스페놀A형 에폭시 수지(미츠비시 카가쿠사 제조 「YX8000」) 30부와, 실란 커플링제(신에츠 실리콘사 제조 「KBM-5103」) 2부와, 시판의 반소성 하이드로탈사이트(BET 비표면적: 15㎡/g, 평균 입자직경: 400nm) 150부를 혼련한 후, 3본 롤밀로 분산을 행하여, 혼합물을 얻었다. 이어서, 얻어진 혼합물에, 지환식 골격을 갖는 단관능 아크릴레이트(쿄에이샤 카가쿠사 제조 「라이트 아크릴레이트 IB-XA」) 100부와, 열 라디칼 중합 개시제(와코 쥰야쿠코교사 제조 「V-601」)를 배합하고, 고속 회전 믹서로 균일하게 분산하여, 조성물을 얻었다.20 parts of hexafunctional acrylate (“KAYARAD DPCA-60” manufactured by Nippon Kayaku Co., Ltd.), 80 parts of bifunctional acrylate (“IRR214-K” manufactured by Daicel Ornex Co., Ltd.) having an alicyclic skeleton, and UVACURE1561 (Daicel Manufactured by Ornex, 20 parts of a mixture of a compound having an epoxy group and one acryloyl group per molecule (content: 78 to 82%) and bisphenol A type epoxy resin (content: 18 to 22%), and addition of liquid hydrogen. 30 parts of bisphenol A type epoxy resin (“YX8000” manufactured by Mitsubishi Chemical Corporation), 2 parts of silane coupling agent (“KBM-5103” manufactured by Shin-Etsu Silicone Corporation), and commercially available semi-baked hydrotalcite (BET specific surface area: 15 m2) /g, average particle diameter: 400 nm) After kneading 150 parts, dispersion was performed using a three-roll mill to obtain a mixture. Next, 100 parts of a monofunctional acrylate having an alicyclic skeleton (“Light Acrylate IB-XA” manufactured by Kyoeisha Chemical Co., Ltd.) and a thermal radical polymerization initiator (“V-601” manufactured by Wako Pure Chemical Industries, Ltd.) were added to the obtained mixture. ) were mixed and uniformly dispersed with a high-speed rotating mixer to obtain a composition.
<실시예 4><Example 4>
반소성 하이드로탈사이트의 양을 96부로 변경한 것과, 열 라디칼 중합 개시제 2부를 광 라디칼 중합 개시제(BASF사 제조 「Omnirad OXE-01」) 2부로 변경한 것 이외에는 실시예 3과 동일하게 하여, 조성물을 얻었다.The composition was prepared in the same manner as in Example 3 except that the amount of semi-calcined hydrotalcite was changed to 96 parts and the thermal radical polymerization initiator was changed to 2 parts to 2 parts photo radical polymerization initiator (“Omnirad OXE-01” manufactured by BASF). got it
<실시예 5><Example 5>
광 양이온 중합 개시제(ADEKA사 제조 「SP-152」) 2부를 추가로 첨가한 것 이외에는 실시예 4와 동일하게 하여 조성물을 얻었다.A composition was obtained in the same manner as in Example 4 except that 2 parts of a photocationic polymerization initiator (“SP-152” manufactured by ADEKA) was additionally added.
<비교예 1><Comparative Example 1>
반소성 하이드로탈사이트 96부를 산화 마그네슘(BET 비표면적: 8.9㎡/g, 평균 입자직경: 500nm) 96부로 변경한 것 이외에는 실시예 1과 동일하게 하여 조성물을 얻었다.A composition was obtained in the same manner as in Example 1, except that 96 parts of semi-calcined hydrotalcite were replaced with 96 parts of magnesium oxide (BET specific surface area: 8.9 m2/g, average particle diameter: 500 nm).
<비교예 2><Comparative Example 2>
지환식 골격을 갖는 2관능 에폭시 수지(아데카사 제조 「EP4088SS」) 100부와, 4관능 에폭시 수지(미츠비시 카가쿠사 제조 「jER604」) 20부와, 2관능 에폭시 수지(신닛테츠 스미킨카가쿠사 제조 「ZX-1059」) 100부와, 실란 커플링제(신에츠 실리콘사 제조 「KBM-403」) 2부와, 시판의 반소성 하이드로탈사이트(BET 비표면적: 15㎡/g, 평균 입자직경: 400nm) 96부를 혼련한 후, 3본 롤 밀로 분산을 행하여, 혼합물을 얻었다. 이어서, 얻어진 혼합물에 단관능 에폭시 수지(나가세 켐텍스사 제조 「EX-121」) 50부와, 열 음이온 중합 개시제(홋코 카가쿠코교사 제조 「TBPDA」) 2부를 배합하고, 고속 회전 믹서로 균일하게 분산하여, 조성물을 얻었다.100 parts of a bifunctional epoxy resin having an alicyclic skeleton (“EP4088SS” manufactured by Adeka Corporation), 20 parts of a tetrafunctional epoxy resin (“jER604” manufactured by Mitsubishi Chemical Corporation), and 20 parts of a bifunctional epoxy resin (manufactured by Shinnittetsu Sumikinkaku Corporation) 100 parts of “ZX-1059”), 2 parts of silane coupling agent (“KBM-403” manufactured by Shin-Etsu Silicone Co., Ltd.), and commercially available semi-calcined hydrotalcite (BET specific surface area: 15 m2/g, average particle diameter: 400 nm) ) After kneading 96 parts, dispersion was performed using a three-roll mill to obtain a mixture. Next, 50 parts of a monofunctional epoxy resin (“EX-121” manufactured by Nagase Chemtex Co., Ltd.) and 2 parts of a thermal anionic polymerization initiator (“TBPDA” manufactured by Hokko Chemical Co., Ltd.) were added to the obtained mixture, and the mixture was uniformly mixed with a high-speed rotating mixer. By dispersing, a composition was obtained.
<하이드로탈사이트의 흡수율><Absorption rate of hydrotalcite>
실시예 및 비교예에서 사용한 하이드로탈사이트를 천칭으로 1.5g 달아서 초기 질량을 측정하였다. 대기압 하, 60℃, 90%RH(상대 습도)로 설정한 소형 환경 시험기(에스펙사 제조 SH-222)에 200시간 정치하여, 흡습 후의 질량을 측정하고, 상기 식 (i)를 사용하여 포화 흡수율을 구했다. 결과를 표 1에 나타낸다.The initial mass of the hydrotalcite used in the examples and comparative examples was measured by weighing 1.5 g on a balance. It was left standing in a small environmental tester (SH-222 manufactured by Espec) set at 60°C and 90%RH (relative humidity) under atmospheric pressure for 200 hours, the mass after moisture absorption was measured, and the saturated water absorption rate was determined using the formula (i) above. saved. The results are shown in Table 1.
<하이드로탈사이트의 열 중량 감소율><Thermal weight reduction rate of hydrotalcite>
히타치 하이테크 사이언스사 제조 TG/DTA EXSTAR6300을 이용하여, 실시예 및 비교예에서 사용한 하이드로탈사이트의 열 중량 분석을 행하였다. 알루미늄제 샘플 팬에 하이드로탈사이트를 10mg 칭량하고, 뚜껑을 덮지 않고 오픈 상태에서, 질소 유량 200mL/분의 분위기 하에서, 30℃에서 550℃까지 10℃/분으로 승온하였다. 상기 식 (ii)를 이용하여, 280℃ 및 380℃에서의 열 중량 감소율을 구하였다. 결과를 표 1에 나타낸다.Thermogravimetric analysis of the hydrotalcite used in the examples and comparative examples was performed using TG/DTA EXSTAR6300 manufactured by Hitachi High-Tech Science. 10 mg of hydrotalcite was weighed in an aluminum sample pan, and the temperature was raised from 30°C to 550°C at 10°C/min in an atmosphere with a nitrogen flow rate of 200 mL/min in an open state without covering the lid. Using equation (ii) above, the thermal weight reduction rate at 280°C and 380°C was obtained. The results are shown in Table 1.
<분말 X선 회절><Powder X-ray diffraction>
분말 X선 회절의 측정은, 분말 X선 회절 장치(PANalytical사 제조, Empyrean)에 의해, 카운터 음극 CuKα(1.5405Å), 전압: 45V, 전류: 40mA, 샘플링 폭: 0.0260°, 주사 속도: 0.0657°/s, 측정 회절각 범위(2θ): 5.0131 내지 79.9711°의 조건으로 행하였다. 피크 서치는, 회절 장치 부속 소프트웨어의 피크 서치 기능을 이용하여, 「최소 유의도: 0.50, 최소 피크 칩: 0.01°, 최대 피크 칩: 1.00°, 피크 베이스 폭: 2.00°, 방법: 2차 미분의 최소값」의 조건으로 행하였다. 2θ가 8 내지 18°의 범위 내에서 나타난 분할(split)된 두개의 피크, 또는 두개의 피크의 합성에 의해 숄더를 갖는 피크를 검출하고, 저각측에 나타난 피크 또는 숄더의 회절 강도(=저각측 회절 강도)와, 고각측에 나타나는 피크 또는 숄더의 회절 강도(=고각측 회절 강도)를 측정하고, 상대 강도비(=저각측 회절 강도/고각측 회절 강도)를 산출하였다. 결과를 표 1에 나타낸다.Powder X-ray diffraction was measured using a powder /s, the measurement diffraction angle range (2θ) was performed under the conditions of 5.0131 to 79.9711°. The peak search is performed using the peak search function of the software attached to the diffraction device, “minimum significance: 0.50, minimum peak chip: 0.01°, maximum peak chip: 1.00°, peak base width: 2.00°, method: second order differentiation. This was carried out under the conditions of “minimum value.” A peak with a shoulder is detected by combining two split peaks or two peaks that appear within the range of 2θ from 8 to 18°, and the diffraction intensity of the peak or shoulder appearing on the low angle side (=low angle side) Diffraction intensity) and the diffraction intensity of the peak or shoulder appearing on the high-angle side (=high-angle side diffraction intensity) were measured, and the relative intensity ratio (=low-angle side diffraction intensity/high-angle side diffraction intensity) was calculated. The results are shown in Table 1.
[표 1][Table 1]
포화 흡수율, 열중량 감소율 및 분말 X선 회절의 결과로부터, 실시예 및 비교예에서 사용한 하이드로탈사이트가 「반소성 하이드로탈사이트」임을 확인하였다.From the results of saturated water absorption, thermal weight reduction, and powder X-ray diffraction, it was confirmed that the hydrotalcite used in the examples and comparative examples was “semi-calcined hydrotalcite.”
<조성물의 경화물층의 전광선 투과율 및 헤이즈><Total light transmittance and haze of the cured layer of the composition>
실시예 및 비교예에서 제작한 조성물을 무알칼리 유리판(길이 50mm, 폭 50mm, 두께 700μm, 닛폰 덴키 카라스사 제조 OA-10G)에 적하한 후, 같은 사이즈의 무알칼리 유리판을 겹쳐서 적층체(무알칼리 유리판/수지 조성물층/무알칼리 유리판)를 조제하였다. 이어서 실시예 1 내지 3 및 비교예 1 및 2에서는, 당해 적층체를 100℃에서 30분간 가열함으로써 조성물을 경화시킴으로써, 평가용 샘플(경화물의 두께: 20μm)을 제작하였다. 또한, 실시예 4 및 5에서는, 실온에서 UV-LED(우시오사 제조, 파장 365nm)를 사용하여 적산 조사량이 3,000mJ/㎠가 될 때까지 자외선을 당해 적층체에 조사하여 조성물을 경화시킴으로써, 평가용 샘플(경화물의 두께: 20μm)을 제작하였다.The composition prepared in the examples and comparative examples was dropped onto an alkali-free glass plate (length 50 mm, width 50 mm, thickness 700 μm, OA-10G manufactured by Nippon Denki Karasu), and then alkali-free glass plates of the same size were overlapped to form a laminate (alkali-free). A glass plate/resin composition layer/alkali-free glass plate) was prepared. Next, in Examples 1 to 3 and Comparative Examples 1 and 2, the composition was cured by heating the laminate at 100°C for 30 minutes to produce an evaluation sample (thickness of the cured product: 20 μm). Additionally, in Examples 4 and 5, evaluation was conducted by curing the composition by irradiating ultraviolet rays to the laminate at room temperature using a UV-LED (manufactured by Ushiosa, wavelength 365 nm) until the cumulative irradiation amount reached 3,000 mJ/cm2. A sample (thickness of cured product: 20 μm) was produced.
스가 시켄키사 제조 헤이즈미터 HZ-V3(할로겐 램프)를 사용하여, 공기를 레퍼런스로 하여, D65광으로, 평가용 샘플의 전광선 투과율 및 헤이즈를 측정하고, 이하의 기준으로 평가하였다. 결과를 표 2에 나타낸다.Using a haze meter HZ-V3 (halogen lamp) manufactured by Suga Shikenki Co., Ltd., the total light transmittance and haze of the evaluation sample were measured with D65 light using air as a reference, and evaluated based on the following criteria. The results are shown in Table 2.
(전광선 투과율의 기준)(Standard for total light transmittance)
양호(○): 90% 이상Good (○): 90% or more
가능(△): 90% 미만, 85% 이상Possible (△): Less than 90%, more than 85%
불량(×): 85% 미만Defective (×): Less than 85%
(헤이즈의 기준)(Hayes' standard)
양호(○): 2.5% 미만Good (○): Less than 2.5%
가능(△): 2.5% 이상, 3.0% 미만Possible (△): 2.5% or more, less than 3.0%
불량(×): 3.0% 이상Defective (×): 3.0% or more
<디바이스 신뢰성 시험(잔존 발광 면적율)><Device reliability test (remaining light emission area ratio)>
유기 EL 소자를 이용하여 조성물의 밀봉성을 평가하였다. 상세하게는, 우선 산화인듐주석(ITO)부착 유리 기판(디오마텍사 제조)에 발광 면적이 4㎟가 되도록 유기 EL 소자(유기막의 두께: 110nm, Al 음극의 두께: 100nm)을 형성하였다. 다음에 유기 EL 소자 위에 화학 기상 성장법(CVD법)을 사용하여 질화막(두께: 500nm)을 형성하였다.The sealing properties of the composition were evaluated using an organic EL device. In detail, first, an organic EL device (thickness of organic film: 110 nm, thickness of Al cathode: 100 nm) was formed on an indium tin oxide (ITO)-coated glass substrate (manufactured by Diomatech) with an emission area of 4 mm2. Next, a nitride film (thickness: 500 nm) was formed on the organic EL device using a chemical vapor deposition method (CVD method).
이어서, 실시예 2-5에서 제작한 조성물을, 질화막 부착 유기 EL 소자에 적하 한 후, 그 위에서 무알칼리 유리판을 겹쳐서 적층체(무알칼리 유리판/조성물층/질화막 부착의 유기 EL 소자/ITO 부착 유리 기판)를 조제하였다. 실시예 2 및 3에서는, 당해 적층체를 100℃에서 30분간 가열하여 조성물을 경화시킴으로써, 유기 EL 소자를 밀봉한 적층체를 제조하였다(경화물의 두께: 100μm). 실시예 4 및 5에서는, 실온에서 UV-LED(우시오사 제조, 365nm)를 사용하여 적산 조사량이 3,000mJ/㎠가 될 때까지 자외선을 당해 적층체에 조사하여 조성물을 경화시킴으로써, 유기 EL 소자를 밀봉한 적층체를 제조하였다(경화물의 두께: 100μm).Next, the composition prepared in Example 2-5 was dropped onto an organic EL device with a nitride film, and then an alkali-free glass plate was placed on top of it to form a laminate (alkali-free glass plate/composition layer/organic EL device with a nitride film/glass with ITO). substrate) was prepared. In Examples 2 and 3, the laminate was heated at 100°C for 30 minutes to cure the composition, thereby producing a laminate sealing the organic EL element (thickness of the cured product: 100 μm). In Examples 4 and 5, the composition was cured by irradiating the laminate with ultraviolet rays at room temperature using a UV-LED (manufactured by Ushio, 365 nm) until the cumulative irradiation amount reached 3,000 mJ/cm2, thereby producing an organic EL device. A sealed laminate was manufactured (thickness of the cured product: 100 μm).
밀봉한 유기 EL 소자에 전압을 인가하고, 항습 항온조 중에서 보관하기 전에 초기 발광 면적을 측정하였다. 이어서, 유기 EL 소자를 밀봉한 적층체를 온도 85℃ 및 습도 85%RH로 설정한 항습 항온조에서 보관하였다. 보관하고 나서 1000시간 후에 적층체를 항습 항온조에서 꺼내어, 유기 EL 소자에 전압을 인가하고, 보관 후의 발광 면적을 측정하였다.Voltage was applied to the sealed organic EL device, and the initial emission area was measured before storage in a constant temperature and humidity bath. Next, the laminate in which the organic EL device was sealed was stored in a constant temperature and humidity bath set at a temperature of 85°C and a humidity of 85%RH. After 1000 hours of storage, the laminate was taken out of the constant temperature and humidity bath, voltage was applied to the organic EL element, and the light emitting area after storage was measured.
밀봉층(경화물)의 배리어성을 비교하는 지표로서, 잔존 발광 면적율을 하기 식: As an index for comparing the barrier properties of the sealing layer (cured product), the remaining luminous area ratio is expressed by the following equation:
잔존 발광 면적율(%)=100×(보관 후의 발광 면적)/(초기 발광 면적)Remaining light emitting area ratio (%) = 100 × (light emitting area after storage) / (initial light emitting area)
으로부터 산출하여, 이하의 기준으로 평가하였다. 결과를 표 2에 나타낸다.It was calculated from and evaluated based on the following standards. The results are shown in Table 2.
(잔존 발광 면적율의 기준)(Standard for remaining luminous area ratio)
매우 양호(◎): 95% 이상Very good (◎): 95% or more
양호(○): 85% 이상 95% 미만Good (○): 85% or more but less than 95%
가능(△): 75% 이상 85% 미만Possible (△): 75% or more but less than 85%
불량(×): 75% 미만Defective (×): Less than 75%
[표 2] [Table 2]
본 발명의 밀봉용 조성물에 의하면, 수분 차단성 및 투명성의 양쪽이 뛰어난 밀봉층을 형성할 수 있다. 따라서, 본 발명의 밀봉용 조성물은, 유기 EL 소자 등의 수분에 약한 소자의 밀봉에 적합하게 사용할 수 있다. According to the sealing composition of the present invention, a sealing layer excellent in both moisture barrier properties and transparency can be formed. Therefore, the sealing composition of the present invention can be suitably used for sealing devices that are vulnerable to moisture, such as organic EL devices.
본원은, 일본에서 출원된 특원2017-071985호를 기초로 하고 있고, 그 내용은 본원 명세서에 전부 포함된다. This application is based on Japanese Patent Application No. 2017-071985, the contents of which are entirely included in the specification of this application.
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017071985 | 2017-03-31 | ||
JPJP-P-2017-071985 | 2017-03-31 | ||
PCT/JP2018/013117 WO2018181664A1 (en) | 2017-03-31 | 2018-03-29 | Sealing composition |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190130012A KR20190130012A (en) | 2019-11-20 |
KR102578976B1 true KR102578976B1 (en) | 2023-09-18 |
Family
ID=63676031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197031922A KR102578976B1 (en) | 2017-03-31 | 2018-03-29 | Sealing composition |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7024785B2 (en) |
KR (1) | KR102578976B1 (en) |
CN (1) | CN110382561B (en) |
TW (1) | TWI771397B (en) |
WO (1) | WO2018181664A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111757910B (en) * | 2018-02-27 | 2022-06-24 | 味之素株式会社 | Sealing resin composition |
CN112996874B (en) * | 2018-11-22 | 2022-10-21 | 味之素株式会社 | Adhesive composition |
JPWO2021002375A1 (en) * | 2019-07-04 | 2021-01-07 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016025965A1 (en) * | 2014-08-11 | 2016-02-18 | Henkel IP & Holding GmbH | Optically clear hot melt adhesives and uses thereof |
WO2016158770A1 (en) * | 2015-03-27 | 2016-10-06 | 味の素株式会社 | Resin composition for sealing |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW321658B (en) * | 1992-09-17 | 1997-12-01 | Ciba Sc Holding Ag | |
JP3306222B2 (en) * | 1994-04-22 | 2002-07-24 | 東亞合成株式会社 | Resin composition |
JP4017091B2 (en) * | 1998-08-19 | 2007-12-05 | 昭和電工株式会社 | Polymerizable compound, polymer solid electrolyte using the same, and use thereof |
JP2004091647A (en) * | 2002-08-30 | 2004-03-25 | Kyowa Chem Ind Co Ltd | Blistering inhibitor for use in coating material and method for preventing blistering of coating film |
JP2006282958A (en) * | 2005-04-05 | 2006-10-19 | Shin Etsu Chem Co Ltd | Semiconductor-sealing epoxy resin composition and semiconductor device |
JP2007197517A (en) | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | Adhesive sealing composition, sealing film and organic el element |
JP5070972B2 (en) * | 2007-07-26 | 2012-11-14 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
JP5236587B2 (en) * | 2009-07-15 | 2013-07-17 | 太陽ホールディングス株式会社 | Photocurable resin composition |
CN102762652A (en) * | 2010-02-18 | 2012-10-31 | 株式会社普利司通 | Sealing film for photovoltaic modules and photovoltaic modules using same |
JP5540165B1 (en) * | 2013-06-28 | 2014-07-02 | 太陽インキ製造株式会社 | Photocurable resin composition, cured product thereof and printed wiring board |
JP6609439B2 (en) | 2014-08-29 | 2019-11-20 | 積水化学工業株式会社 | Curable composition and sealant for organic electroluminescence display element |
JP6821985B2 (en) * | 2015-07-21 | 2021-01-27 | 味の素株式会社 | Resin composition for sealing |
CN108026430B (en) * | 2015-09-30 | 2020-09-01 | 味之素株式会社 | Sealing resin composition |
KR102465011B1 (en) * | 2016-10-04 | 2022-11-09 | 아지노모토 가부시키가이샤 | Sealing resin composition and sealing sheet |
-
2018
- 2018-03-29 CN CN201880018056.6A patent/CN110382561B/en active Active
- 2018-03-29 KR KR1020197031922A patent/KR102578976B1/en active IP Right Grant
- 2018-03-29 WO PCT/JP2018/013117 patent/WO2018181664A1/en active Application Filing
- 2018-03-29 TW TW107110858A patent/TWI771397B/en active
- 2018-03-29 JP JP2019510102A patent/JP7024785B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016025965A1 (en) * | 2014-08-11 | 2016-02-18 | Henkel IP & Holding GmbH | Optically clear hot melt adhesives and uses thereof |
WO2016158770A1 (en) * | 2015-03-27 | 2016-10-06 | 味の素株式会社 | Resin composition for sealing |
Also Published As
Publication number | Publication date |
---|---|
TW201900834A (en) | 2019-01-01 |
JP7024785B2 (en) | 2022-02-24 |
CN110382561A (en) | 2019-10-25 |
JPWO2018181664A1 (en) | 2020-02-13 |
TWI771397B (en) | 2022-07-21 |
CN110382561B (en) | 2023-01-31 |
KR20190130012A (en) | 2019-11-20 |
WO2018181664A1 (en) | 2018-10-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7276312B2 (en) | Sealing resin composition | |
KR102578976B1 (en) | Sealing composition | |
KR20190034508A (en) | Curable resin composition and its use | |
TWI406364B (en) | Radiation curable cycloaliphatic barrier sealants | |
JP6854431B2 (en) | Ultraviolet curable resin composition, manufacturing method of organic EL light emitting device, organic EL light emitting device, and touch panel | |
JP7555002B2 (en) | Composition for sealing light-emitting element, and light-emitting device | |
WO2011016356A1 (en) | Acrylate composition | |
WO2011089947A1 (en) | Light-resistant sealing resin composition | |
KR101813432B1 (en) | Curable composition, cured product, optical material and electronic material containing semiconductor nanoparticles | |
KR20150139900A (en) | Solvent-free photocurable resin composition | |
KR20230161968A (en) | Photocurable resin composition, optical component, method for manufacturing optical component, and light emitting device | |
JP6726452B2 (en) | Curable resin composition for optics | |
TW201634608A (en) | Photocurable composition and method for producing electronic component | |
JP7457957B2 (en) | Method for manufacturing encapsulant and method for manufacturing light emitting device | |
KR102722508B1 (en) | Sealing resin composition | |
JP2013108057A (en) | Thermosetting composition for forming moisture capture body, moisture capture body, and electronic device | |
JP2021064541A (en) | UV curable resin composition, manufacturing method of light emitting device, light emitting device, and touch panel | |
JP2021055051A (en) | Ultraviolet curable resin composition, light-emitting device, and method for manufacturing light-emitting device | |
JP2021007948A (en) | Production method of curable film | |
JP2006131866A (en) | Resin composition, optical member using the same composition and method for producing the same optical member | |
JP7442121B2 (en) | Ultraviolet curable resin composition, color resist, color filter, light emitting device, and method for producing color resist | |
WO2016072458A1 (en) | Resin composition, resin film, resin cured product, electronic component, and method for manufacturing electronic component | |
WO2023021891A1 (en) | Ultraviolet-curable composition | |
KR20230022967A (en) | Encapsulant for display element, cured product thereof and display device | |
TW201925323A (en) | Replica mold material for imprint |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |