TW201900834A - Package composition - Google Patents

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TW201900834A
TW201900834A TW107110858A TW107110858A TW201900834A TW 201900834 A TW201900834 A TW 201900834A TW 107110858 A TW107110858 A TW 107110858A TW 107110858 A TW107110858 A TW 107110858A TW 201900834 A TW201900834 A TW 201900834A
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composition
ethylenically unsaturated
mass
compound
acrylate
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TW107110858A
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Chinese (zh)
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TWI771397B (en
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大橋賢
山本有希
久保有希
名取□輝
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日商味之素股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymerisation Methods In General (AREA)
  • Electroluminescent Light Sources (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The present invention provides a sealing composition that comprises: a compound having two or more ethylenically unsaturated groups per molecule; a half-calcined hydrotalcite; and a radical polymerization initiator.

Description

封裝用之組成物Composition for encapsulation

本發明係有關封裝用之組成物,特別是有關可適合於有機EL(Electroluminescence)元件等之發光元件或太陽能電池等之受光元件等之封裝的封裝用之組成物。The present invention relates to a composition for encapsulation, and more particularly to a composition for encapsulation suitable for encapsulation of a light-emitting element such as an organic EL (Electroluminescence) element or a light-receiving element such as a solar cell.

有機EL元件為發光材料使用有機物質的發光元件,以低電壓可得到高亮度之發光,故近年受矚目。但是有機EL元件對水分極弱,有發光材料(發光層)因水分而變質,亮度降低或變得不會發光,或電極與發光層之界面因水分的影響而剝離,或金屬氧化,而高電阻化的問題。因此,元件內部為了遮斷外氣中的水分,例如藉由組成物以覆蓋形成於基板上之發光層之全面,而形成封裝層,封裝有機EL元件。這種有機EL元件之封裝層,要求高的水分遮斷性。此外,在顯示器或觸控面板、照明等的用途,自封裝面取出光之構造或透過型的構造時,封裝層也要求高透明性。如此,要求可形成兼具高的水分遮斷性與透明性之封裝層的組成物。The organic EL element is a light-emitting element using an organic substance as a light-emitting material, and can obtain high-brightness light emission at a low voltage, so it has attracted attention in recent years. However, organic EL elements are extremely weak to moisture. Some light-emitting materials (light-emitting layers) are deteriorated due to moisture, the brightness is reduced or no light is emitted, or the interface between the electrode and the light-emitting layer is peeled off due to the influence of moisture, or the metal is oxidized. The problem of resistance. Therefore, in order to block the moisture in the outside air, for example, a composition is used to cover the entire surface of the light-emitting layer formed on the substrate to form an encapsulation layer to encapsulate the organic EL element. The packaging layer of such an organic EL element requires a high moisture blocking property. In addition, in applications such as displays, touch panels, and lighting, and a structure in which light is taken out from the packaging surface or a transmissive structure, the packaging layer is also required to have high transparency. In this way, there is a demand for a composition capable of forming an encapsulating layer having both high moisture blocking properties and transparency.

專利文獻1記載包含氫化環狀烯烴系聚合物及聚異丁烯樹脂的接著性封入用組成物。專利文獻1記載在前述組成物中再調配光硬化型樹脂及光聚合起始劑。又,專利文獻2記載含有硬化性化合物、聚合起始劑、吸水率為30重量%以上之第1吸濕劑、及吸水率為5重量%以上未達30重量%之第2吸濕劑的硬化性組成物。但是專利文獻1及2均未記載兼具高的水分遮斷性與透明性的封裝層。 [先前技術文獻] [專利文獻]Patent Document 1 describes a composition for adhesive sealing containing a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin. Patent Document 1 describes that a photocurable resin and a photopolymerization initiator are further blended in the composition. Further, Patent Document 2 describes a composition containing a curable compound, a polymerization initiator, a first moisture absorbent having a water absorption of 30% by weight or more, and a second moisture absorbent having a water absorption of 5% by weight or more and less than 30% by weight. Hardening composition. However, neither of Patent Documents 1 and 2 describes an encapsulation layer having both high moisture blocking properties and transparency. [Prior Art Literature] [Patent Literature]

[專利文獻1] 日本特表2009-524705號公報   [專利文獻2] 日本特開2016-51700號公報[Patent Document 1] Japanese Patent Publication No. 2009-524705 [Patent Document 2] Japanese Patent Publication No. 2016-51700

[發明所欲解決之課題][Problems to be Solved by the Invention]

本發明係提供可形成水分遮斷性及透明性之兩者優異之封裝層(硬化物層)的封裝用之組成物為目的。 [用以解決課題之手段]This invention aims at providing the composition for encapsulation which can form the encapsulation layer (hardened | cured material layer) excellent in both moisture blocking property and transparency. [Means to solve the problem]

本發明人等為了達成上述目的,而精心研究的結果,發現包含1分子中具有2個以上之乙烯性不飽和基的化合物、半燒成水滑石及自由基聚合起始劑的組成物可形成水分遮斷性及透明性之兩者優異之封裝層(硬化物層)。依據這種見解的本發明係如下述。As a result of careful research in order to achieve the above object, the present inventors have found that a composition containing a compound having two or more ethylenically unsaturated groups in one molecule, a semi-fired hydrotalcite, and a radical polymerization initiator can be formed. An encapsulation layer (cured material layer) having excellent moisture blocking properties and transparency. The present invention based on such findings is as follows.

[1] 一種封裝用之組成物,其係包含1分子中具有2個以上之乙烯性不飽和基的化合物、半燒成水滑石及自由基聚合起始劑。   [2] 如前述[1]之組成物,其中1分子中具有2個以上之乙烯性不飽和基的化合物為包含1分子中具有3個以上之乙烯性不飽和基的化合物。   [3] 如前述[1]或[2]之組成物,其中1分子中具有2個以上之乙烯性不飽和基的化合物為包含1分子中具有2個以上之乙烯性不飽和基及脂環式構造的化合物。   [4] 如前述[1]~[3]中任一項之組成物,其係進一步包含稀釋劑。   [5] 如前述[4]之組成物,其中稀釋劑為1分子中具有1個乙烯性不飽和基的化合物。   [6] 如前述[1]~[5]中任一項之組成物,其中乙烯性不飽和基為(甲基)丙烯醯基。   [7] 如前述[1]~[6]中任一項之組成物,其中1分子中具有2個以上之乙烯性不飽和基的化合物之量,在組成物全體中,為20~78質量%。   [8] 如前述[1]~[7]中任一項之組成物,其中半燒成水滑石之量,在組成物全體中,為10~70質量%。   [9] 如前述[1]~[8]中任一項之組成物,其中自由基聚合起始劑為光自由基聚合起始劑及/或熱自由基聚合起始劑。   [10] 如前述[1]~[9]中任一項之組成物,其中自由基聚合起始劑之量,相對於具有乙烯性不飽和基的化合物100質量份,為0.5~10質量份。   [11] 如前述[1]~[10]中任一項之組成物,其係進一步包含矽烷偶合劑。   [12] 如前述[1]~[11]中任一項之組成物,其中厚度為20μm之組成物之硬化物層在D65光下的全光線穿透率為85%以上。   [13] 如前述[1]~[12]中任一項之組成物,其中厚度為20μm之組成物之硬化物層的霧度為未達3.0%。   [14] 如前述[1]~[13]中任一項之組成物,其為液狀。   [15] 如前述[1]~[14]中任一項之組成物,其係有機EL元件之封裝用。   [16] 一種有機EL裝置,其係以如前述[1]~[15]中任一項之組成物之硬化物封裝有機EL元件。 [發明效果][1] A composition for encapsulation, comprising a compound having two or more ethylenically unsaturated groups in one molecule, a semi-fired hydrotalcite, and a radical polymerization initiator. [2] The composition according to the aforementioned [1], wherein the compound having two or more ethylenically unsaturated groups in one molecule is a compound containing three or more ethylenically unsaturated groups in one molecule. [3] The composition according to the above [1] or [2], wherein the compound having two or more ethylenically unsaturated groups in one molecule is a compound containing two or more ethylenically unsaturated groups in one molecule and an alicyclic ring Formulated compounds. [4] The composition according to any one of [1] to [3], further comprising a diluent. [5] The composition as described in [4] above, wherein the diluent is a compound having one ethylenically unsaturated group in one molecule. [6] The composition according to any one of [1] to [5] above, wherein the ethylenically unsaturated group is a (meth) acrylic fluorenyl group. [7] The composition according to any one of the above [1] to [6], wherein the amount of the compound having two or more ethylenically unsaturated groups in one molecule is 20 to 78 masses in the entire composition %. [8] The composition according to any one of the above [1] to [7], wherein the amount of the semi-calcined hydrotalcite is 10 to 70% by mass in the entire composition. [9] The composition according to any one of the aforementioned [1] to [8], wherein the radical polymerization initiator is a photo radical polymerization initiator and / or a thermal radical polymerization initiator. [10] The composition according to any one of [1] to [9], wherein the amount of the radical polymerization initiator is 0.5 to 10 parts by mass relative to 100 parts by mass of the compound having an ethylenically unsaturated group. . [11] The composition according to any one of [1] to [10], further comprising a silane coupling agent. [12] The composition according to any one of [1] to [11] above, wherein the hardened layer of the composition having a thickness of 20 μm has a total light transmittance of 85% or more under D65 light. [13] The composition according to any one of the aforementioned [1] to [12], wherein the haze of the hardened layer of the composition having a thickness of 20 μm is less than 3.0%. [14] The composition according to any one of [1] to [13] above, which is liquid. [15] The composition according to any one of [1] to [14] above, which is used for packaging an organic EL element. [16] An organic EL device which encapsulates an organic EL element with a hardened body of a composition as described in any one of [1] to [15] above. [Inventive effect]

由本發明之組成物,可形成水分遮斷性及透明性之兩者優異的封裝層。 [實施發明之形態]From the composition of the present invention, an encapsulation layer excellent in both moisture blocking property and transparency can be formed. [Form of Implementing Invention]

<組成物>   本發明之組成物為包含1分子中具有2個以上之乙烯性不飽和基的化合物、半燒成水滑石、及自由基聚合起始劑。在此,「乙烯性不飽和基」係指具有乙烯性雙鍵之官能基。本發明之組成物,可藉由將上述成分及必要時,將其他之成分使用混練滾輪或旋轉混合機等混合來製造。<Composition> The composition of the present invention is a compound containing two or more ethylenically unsaturated groups in one molecule, a semi-fired hydrotalcite, and a radical polymerization initiator. Here, the "ethylenically unsaturated group" means a functional group having an ethylenic double bond. The composition of the present invention can be produced by mixing the above-mentioned components and, if necessary, other components using a kneading roller or a rotary mixer.

本發明之組成物,例如可被使用於半導體、太陽能電池、高亮度LED、LCD、EL元件等之電子零件,較佳為有機EL元件、太陽能電池等之光學半導體之封裝。本發明之組成物,特別是適合使用於有機EL元件之封裝。具體而言,使用於有機EL元件之發光部之上部及/或周圍(側部),為了從外部保護有機EL元件之發光部,可使用本發明之組成物。The composition of the present invention can be used, for example, in electronic components such as semiconductors, solar cells, high-brightness LEDs, LCDs, and EL elements, and is preferably a package of optical semiconductors such as organic EL elements and solar cells. The composition of the present invention is particularly suitable for packaging organic EL devices. Specifically, the composition of the present invention can be used for the upper portion and / or the surrounding (side portion) of the light emitting portion of the organic EL element, and in order to protect the light emitting portion of the organic EL element from the outside.

本發明之組成物,較佳為液狀的封裝用組成物。在此,「液狀的封裝用組成物」係指常溫(25℃)及常壓(一大氣壓)下,具有流動性的封裝用組成物。例如,包含無機填充劑的封裝用組成物,在常溫及常壓下也具有流動性時,可相當於本發明中之液狀的封裝用組成物。液狀的封裝材料(封裝用組成物),相較於薄膜狀的封裝材料,一般在具有電路之發光元件面之埋入性、封裝面為大面積的情形之空隙之抑制、封裝層之膜厚調整之容易度、封裝前形成堤壩(Dam),藉由對位可達成之高對位精度等方面有利的情形較多。The composition of the present invention is preferably a liquid composition for encapsulation. Here, the "liquid packaging composition" refers to a packaging composition having flowability at normal temperature (25 ° C) and normal pressure (atmospheric pressure). For example, when the sealing composition containing an inorganic filler has fluidity at normal temperature and pressure, it may correspond to the liquid sealing composition in the present invention. Liquid packaging materials (compositions for packaging), compared with film packaging materials, generally have the embedding property of the light-emitting element surface of the circuit, the suppression of voids when the packaging surface is large, and the film of the packaging layer. The ease of thickness adjustment, the formation of a dam before packaging, and the high alignment accuracy that can be achieved by alignment are often advantageous.

本發明之組成物係以不含溶劑等揮發份為佳。又,本發明之組成物包含溶劑等揮發份的情形時,各成分量之基準為不包含溶劑等之揮發份。亦即,本發明之組成物包含揮發分的情形時,各成分量之基準的「組成物全體中」係指「組成物之不揮發分全體中」。The composition of the present invention is preferably free of volatile components such as solvents. When the composition of the present invention contains a volatile component such as a solvent, the reference amount of each component is a volatile component that does not include a solvent and the like. That is, in the case where the composition of the present invention contains volatile matter, "in the entire composition" based on the amount of each component means "in the entire nonvolatile matter of the composition".

<1分子中具有2個以上之乙烯性不飽和基的化合物>   本發明之組成物係包含1分子中具有2個以上之乙烯性不飽和基的化合物(以下有時簡稱「多官能乙烯性不飽和化合物」)。多官能乙烯性不飽和化合物,可僅單獨使用1種,也可併用2種以上。多官能乙烯性不飽和化合物在可發揮本發明之效果的範圍內,也可包含環氧基等之其他的官能基。又,包含環氧基的多官能乙烯性不飽和化合物,在本發明中,非環氧樹脂,被分類為多官能乙烯性不飽和化合物。<A compound having two or more ethylenically unsaturated groups in one molecule> 之 The composition of the present invention includes a compound having two or more ethylenically unsaturated groups in one molecule (hereinafter sometimes referred to as "multifunctional ethylenically unsaturated group"). Saturated compound "). The polyfunctional ethylenically unsaturated compound may be used singly or in combination of two or more kinds. The polyfunctional ethylenically unsaturated compound may contain other functional groups, such as an epoxy group, in the range which can exhibit the effect of this invention. Moreover, in the present invention, a polyfunctional ethylenically unsaturated compound containing an epoxy group is classified as a polyfunctional ethylenically unsaturated compound other than an epoxy resin.

多官能乙烯性不飽和化合物,為了將本發明之封裝用組成物形成液狀,故以液狀為佳。在此,「液狀」係指在常溫(25℃)及常壓(一大氣壓)下之多官能乙烯性不飽和化合物的狀態。多官能乙烯性不飽和化合物為2種以上之化合物的混合物時,此等混合物為液狀較佳。例如,使用固形的多官能乙烯性不飽和化合物與液狀的多官能乙烯性化合物時,此等化合物之混合物為液狀較佳。The polyfunctional ethylenically unsaturated compound is preferably liquid in order to form the sealing composition of the present invention into a liquid state. Here, "liquid" means the state of a polyfunctional ethylenically unsaturated compound at normal temperature (25 ° C) and normal pressure (atmospheric pressure). When the polyfunctional ethylenically unsaturated compound is a mixture of two or more compounds, it is preferable that these mixtures are liquid. For example, when a solid polyfunctional ethylenically unsaturated compound and a liquid polyfunctional ethylenic compound are used, a mixture of these compounds is preferably liquid.

多官能乙烯性不飽和化合物,就形成高密度的交聯構造,發揮高水分遮斷性的觀點,較佳為包含1分子中具有3個以上之乙烯性不飽和基的化合物,更佳為1分子中具有4個以上之乙烯性不飽和基,又更佳為1分子中具有5個以上之乙烯性不飽和基的化合物,又特佳為1分子中具有6個以上之乙烯性不飽和基的化合物。多官能乙烯性不飽和化合物中,1分子中所包含之乙烯性不飽和基數之上限無特別限定,但是其數,較佳為15以下,更佳為12以下,又更佳為10以下。The polyfunctional ethylenically unsaturated compound has a high-density crosslinked structure and exhibits high moisture-barrier properties, and is preferably a compound containing three or more ethylenically unsaturated groups in one molecule, more preferably 1 A compound having 4 or more ethylenically unsaturated groups in a molecule, and more preferably a compound having 5 or more ethylenically unsaturated groups in one molecule, and particularly preferably a compound having 6 or more ethylenically unsaturated groups in one molecule compound of. Among the polyfunctional ethylenically unsaturated compounds, the upper limit of the number of ethylenically unsaturated groups contained in one molecule is not particularly limited, but the number is preferably 15 or less, more preferably 12 or less, and even more preferably 10 or less.

使用1分子中具有3個以上之乙烯性不飽和基的化合物時,其量就發揮高水分遮斷性的觀點,組成物全體中,較佳為2質量%以上,更佳為3質量%以上,又更佳為4質量%以上,較佳為70質量%以下,更佳為65質量%以下,又更佳為60質量%以下。When a compound having three or more ethylenically unsaturated groups in one molecule is used, the amount of the compound exhibits a high moisture blocking property. The entire composition is preferably 2% by mass or more, and more preferably 3% by mass or more. It is more preferably 4% by mass or more, more preferably 70% by mass or less, more preferably 65% by mass or less, and still more preferably 60% by mass or less.

多官能乙烯性不飽和化合物,就提高水分遮斷性的觀點,較佳為包含1分子中具有2個以上之乙烯性不飽和基及脂環式構造的化合物,更佳為1分子中具有2個乙烯性不飽和基及脂環式構造的化合物。脂環式構造,可列舉例如具有碳原子數5~12之脂環式烴環的構造。脂環式烴環,可列舉例如三環[5.2.1.02,6 ]癸烷環、莰烷( bornane)環、異莰烷環、環己烷環、雙環辛烷環、降莰烷環、環癸烷環、金剛烷環、環戊烷環等。脂環式構造中可具有雜原子。又,脂環式構造也可鍵結烷基、烷氧基、伸烷基等之取代基。The polyfunctional ethylenically unsaturated compound is preferably a compound having two or more ethylenically unsaturated groups and an alicyclic structure in one molecule, and more preferably two in one molecule, from the viewpoint of improving the moisture blocking property. A compound of ethylenically unsaturated group and alicyclic structure. Examples of the alicyclic structure include a structure having an alicyclic hydrocarbon ring having 5 to 12 carbon atoms. Examples of the alicyclic hydrocarbon ring include a tricyclic [5.2.1.0 2,6 ] decane ring, a bornane ring, an isoxane ring, a cyclohexane ring, a bicyclooctane ring, a norbornane ring, Cyclodecane ring, adamantane ring, cyclopentane ring and the like. The alicyclic structure may have a hetero atom. The alicyclic structure may be substituted with a substituent such as an alkyl group, an alkoxy group, or an alkylene group.

使用1分子中具有2個以上之乙烯性不飽和基及脂環式構造的化合物(特別是1分子中具有2個乙烯性不飽和基及脂環式構造的化合物)時,其量係在組成物全體中,較佳為5質量%以上,更佳為10質量%以上,又更佳為15質量%以上,較佳為75質量%以下,更佳為70質量%以下,又更佳為65質量%以下。When using a compound having two or more ethylenically unsaturated groups and alicyclic structures in one molecule (especially a compound having two ethylenically unsaturated groups and alicyclic structures in one molecule), the amount is based on the composition Of the total material, it is preferably 5 mass% or more, more preferably 10 mass% or more, still more preferably 15 mass% or more, more preferably 75 mass% or less, more preferably 70 mass% or less, and even more preferably 65 Mass% or less.

乙烯性不飽和基,較佳為(甲基)丙烯醯基。亦即,具有乙烯性不飽和基的化合物係以具有(甲基)丙烯醯基之(甲基)丙烯酸酯為佳。本說明書中,「(甲基)丙烯醯基」係指「丙烯醯基及/或甲基丙烯醯基」,「(甲基)丙烯酸酯」係指「丙烯酸酯及/或甲基丙烯酸酯」。又,1分子中具有2個以上之(甲基)丙烯醯基的(甲基)丙烯酸酯,以下有時僅簡稱為「多官能(甲基)丙烯酸酯」。又,1分子中具有2個(甲基)丙烯醯基之(甲基)丙烯酸酯有時僅簡稱為「2官能(甲基)丙烯酸酯」。The ethylenically unsaturated group is preferably a (meth) acrylfluorenyl group. That is, the compound having an ethylenically unsaturated group is preferably a (meth) acrylate having a (meth) acrylfluorenyl group. In this specification, "(meth) acrylfluorenyl" means "acrylfluorenyl and / or methacrylfluorenyl", and "(meth) acrylate" means "acrylate and / or methacrylate" . In addition, a (meth) acrylate having two or more (meth) acrylfluorenyl groups in one molecule may be simply referred to as "multifunctional (meth) acrylate" hereinafter. In addition, a (meth) acrylate having two (meth) acrylfluorenyl groups in one molecule may be simply referred to simply as "difunctional (meth) acrylate".

多官能(甲基)丙烯酸酯,可使用寡聚物。寡聚物可列舉例如,聚酯多元醇與丙烯酸之反應合成的聚酯寡聚物、具有胺基甲酸酯鍵之胺基甲酸酯寡聚物、環氧丙醚與丙烯酸或具有羧基之丙烯酸酯之反應合成的環氧基寡聚物等。As a polyfunctional (meth) acrylate, an oligomer can be used. Examples of the oligomer include polyester oligomers synthesized by the reaction of polyester polyol and acrylic acid, urethane oligomers having a urethane bond, propylene ether and acrylic acid, or oligomers having a carboxyl group. Epoxy oligomers synthesized by the reaction of acrylates.

2官能(甲基)丙烯酸酯,可列舉例如DAICEL-ALLNEX公司製「DPGDA」(二丙二醇二丙烯酸酯)、「HDDA」(1、6-己二醇二丙烯酸酯)、「TPGDA」(三丙二醇二丙烯酸酯)、「EBECRYL145」(PO改質新戊二醇二丙烯酸酯)、「EBECRYL150」(改質雙酚A二丙烯酸酯)、「IRR214-K」(三環癸烷二甲醇二丙烯酸酯)、「EBECRYL11」(PEG600 二丙烯酸酯)、「HPNDA」(新戊二醇羥基新戊酸酯 二丙烯酸酯)、共榮社化學公司製「LIGHT ESTEREG」(乙二醇二甲基丙烯酸酯)、「LIGHT ESTERNP-A」(新戊二醇 二甲基丙烯酸酯)、「LIGHT ESTER2EG」(二乙二醇 二甲基丙烯酸酯)、「LIGHT ESTER1.6HX」(1、6-己二醇 二甲基丙烯酸酯)、「LIGHT ESTER1.9ND」(1、9-壬二醇 二甲基丙烯酸酯)、「LIGHT ESTERG-101P」(丙三醇 二甲基丙烯酸酯)、「LIGHT ESTER BP-2EMK」(雙酚A之EO加成物 二甲基丙烯酸酯)、「Light AcrylateNP-A」(新戊二醇 二丙烯酸酯)、「Light Acrylate1.9ND-A」(1、9-壬二醇 二丙烯酸酯)、「Light Acrylate BP-4EAL」(雙酚A之EO加成物 二丙烯酸酯)、「Light AcrylateBP-4PA」(雙酚A之PO加成物 二丙烯酸酯)、新中村化學工業公司製「NK Ester701A」(2-羥基-3-甲基丙烯醯基丙基丙烯酸酯)、「NK EsterA-200」(聚乙二醇#200 二丙烯酸酯)、「NK EsterAPG-400」(聚丙二醇#400 二丙烯酸酯)、「NK EsterA-PTMG-65」(聚伸丁基乙二醇#650 二丙烯酸酯)、「NK EsterA-1206PE」(聚乙烯聚丙二醇 二丙烯酸酯)、「NK Ester酯A-BPEF」(9,9-雙[4-(2-羥基乙氧基)苯基]茀 二丙烯酸酯)、「NK Ester酯A-BPE30」(乙氧基化雙酚A 二丙烯酸酯)、「NK EsterA-BPP-3」(丙氧基化雙酚A 二丙烯酸酯)、「NK EsterBG」(1,3-丁二醇 二甲基丙烯酸酯)、「NK Ester701」(2-羥基-1,3-二甲基丙烯醯氧基丙烷)、「NK Ester3PG」(三丙二醇 二甲基丙烯酸酯)、「NK Ester酯1206PE」(聚乙烯聚丙二醇 二甲基丙烯酸酯)、「NK EsterDCP」(三環癸烷二甲醇 二甲基丙烯酸酯)、日本化藥公司製「KAYARAD FM-400」、「KAYARAD HX-220」、「KAYARAD HX-620」(新戊基改質 二丙烯酸酯)、「KAYARAD R-604」、(二噁烷乙二醇 二丙烯酸酯)、「KAYARAD UX-3204」(1分子中具有2個丙烯醯基的寡聚物)、大阪有機化學工業公司製「Viscoat#195」(1,4-丁二醇 二丙烯酸酯)、「Viscoat#540」(雙酚A二環氧丙醚 丙烯酸加成物)、arkema公司製「CD406」(環己烷二甲醇 二丙烯酸酯)、「SR562」(烷氧基化己二醇 二丙烯酸酯)、DAICEL-ALLNEX公司製「EBECRYL600」(1分子中具有2個丙烯醯基之雙酚A型環氧丙烯酸酯)、「EBECRYL210」(1分子中具有2個丙烯醯基之芳香族胺基甲酸酯寡聚物)、「EBECRYL230」(1分子中具有2個丙烯醯基之脂肪族胺基甲酸酯寡聚物)、「EBECRYL436」(1分子中具有2個丙烯醯基之酯寡聚物)、arkema公司製「CN959」(1分子中具有2個丙烯醯基之胺基甲酸酯寡聚物)、根上工業公司製「ART RESIN UN-9000PEP」(1分子中具有2個丙烯醯基之胺基甲酸酯寡聚物)、「ART RESIN UN-333」(1分子中具有2個丙烯醯基之寡聚物)等。Examples of the bifunctional (meth) acrylate include "DPGDA" (dipropylene glycol diacrylate), "HDDA" (1,6-hexanediol diacrylate), and "TPGDA" (tripropylene glycol) manufactured by DAICEL-ALLNEX Corporation. Diacrylate), `` EBECRYL145 '' (PO modified neopentyl glycol diacrylate), `` EBECRYL150 '' (modified bisphenol A diacrylate), `` IRR214-K '' (tricyclodecane dimethanol diacrylate) ), `` EBECRYL11 '' (PEG600 diacrylate), `` HPNDA '' (neopentyl glycol hydroxypivalate diacrylate), `` LIGHT ESTEREG '' (ethylene glycol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd. , "LIGHT ESTERNP-A" (neopentyl glycol dimethacrylate), "LIGHT ESTER2EG" (diethylene glycol dimethacrylate), "LIGHT ESTER1.6HX" (1,6-hexanediol di (Methacrylate), `` LIGHT ESTER1.9ND '' (1, 9-nonanediol dimethacrylate), `` LIGHT ESTERG-101P '' (glycerol dimethacrylate), `` LIGHT ESTER BP-2EMK "(EO adduct of bisphenol A dimethacrylate)," Light AcrylateNP-A "(neopentyl glycol diacrylate)," Light Acrylate1.9ND-A "(1, 9-nonanediol diacrylate)," Light Acrylate BP-4EAL "(EO adduct diacrylate of bisphenol A)," Light Acrylate BP-4PA "(PO adduct of bisphenol A Diacrylate), `` NK Ester701A '' (2-hydroxy-3-methacryl propyl propyl acrylate), `` NK EsterA-200 '' (polyethylene glycol # 200 diacrylate) manufactured by Shin Nakamura Chemical Industry Co., Ltd. "NK EsterAPG-400" (polypropylene glycol # 400 diacrylate), "NK EsterA-PTMG-65" (polyethylene glycol # 650 diacrylate), "NK EsterA-1206PE" (polyethylene polymer Propylene glycol diacrylate), `` NK Ester ester A-BPEF '' (9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene diacrylate), `` NK Ester ester A-BPE30 '' (ethyl Oxylated bisphenol A diacrylate), `` NK EsterA-BPP-3 '' (propoxylated bisphenol A diacrylate), `` NK EsterBG '' (1,3-butanediol dimethacrylate) `` NK Ester701 '' (2-hydroxy-1,3-dimethylpropylene methoxypropane), `` NK Ester3PG '' (tripropylene glycol dimethacrylate), `` NK Ester ester 1206PE '' (polyethylene polypropylene glycol di Methacrylate), "NK EsterDCP" ( Cyclodecane dimethanol dimethacrylate), `` KAYARAD FM-400 '', `` KAYARAD HX-220 '', `` KAYARAD HX-620 '' (neopentyl modified diacrylate), `` KAYARAD '' "R-604", (dioxane ethylene glycol diacrylate), "KAYARAD UX-3204" (oligomer with two acryl fluorene groups in one molecule), "Viscoat # 195" manufactured by Osaka Organic Chemical Industry Co., Ltd. (1,4-butanediol diacrylate), "Viscoat # 540" (bisphenol A diglycidyl ether acrylic acid adduct), "CD406" (cyclohexanedimethanol diacrylate) manufactured by arkema, `` SR562 '' (alkoxylated hexamethylene glycol diacrylate), `` EBECRYL600 '' made by DAICEL-ALLNEX (bisphenol A type epoxy acrylate with two acryl fluorenyl groups in one molecule), `` EBECRYL210 '' (1 Aromatic urethane oligomer with two acryl fluorenyl groups in the molecule), "EBECRYL230" (aliphatic urethane oligomer with two acryl fluorenyl groups in one molecule), "EBECRYL436" (Ester oligomer with two acryl fluorenyl groups in one molecule), "CN959" manufactured by Arkema Corporation (urethane oligomer with two acryl fluorenyl groups in one molecule ), "ART RESIN UN-9000PEP" (urethane oligomer with 2 acryl fluorene groups in 1 molecule), "ART RESIN UN-333" (2 propylene fluorene in 1 molecule) Based oligomers).

1分子中具有3個以上之(甲基)丙烯醯基之(甲基)丙烯酸酯,可列舉例如共榮社化學公司製「LIGHT ESTERTMP」(三羥甲基丙烷 三甲基丙烯酸酯)、Light AcrylatePE-3A」(季戊四醇 三丙烯酸酯)、「Light AcrylatePE-4A」(季戊四醇 四丙烯酸酯)、「Light AcrylateDGE-4A」(EO加成物改質二丙三醇 四丙烯酸酯)、DAICEL-ALLNEX公司製「PETIA」(季戊四醇 (三/四)丙烯酸酯)、TMPTA(三羥甲基丙烷 三丙烯酸酯)、TMPEOTA(三羥甲基丙烷乙氧基 三丙烯酸酯)、「EBECRYL135」(三羥甲基丙烷丙氧基 三丙烯酸酯)、「PETA」(季戊四醇 (三/四)丙烯酸酯)、「DPHA」(二季戊四醇 六丙烯酸酯)、新中村化學工業公司製「NK EsterA-TMPT」(三羥甲基丙烷 三丙烯酸酯)、「NK EsterA-TMPT-3PO」(丙氧基化三羥甲基丙烷 三丙烯酸酯)、「NK EsterA-GLY-6E」(乙氧基化丙三醇 三丙烯酸酯)、「NK EsterA-GLY-6P」(丙氧基化丙三醇 三丙烯酸酯)、「NK EsterA-9300」(三-(2-丙烯醯氧基乙基)異氰脲酸酯)、「NK EsterA-9200」(雙/三-(2-丙烯醯氧基乙基)異氰脲酸酯)、「NK EsterA-9300-1CL」(己內酯改質三-(2-丙烯醯氧基乙基)異氰脲酸酯)、「NK EsterATM-4EL」(乙氧基化季戊四醇(三/四)丙烯酸酯)、日本化藥公司製「KAYARAD DPCA-20」(6官能丙烯酸酯)、「KAYARAD DPCA-60」(6官能丙烯酸酯)、「T-1420(T)」(4官能丙烯酸酯)、「DPEA-12」(6官能丙烯酸酯)、「KAYARAD DPHA-40H」(1分子中具有10個丙烯醯基之寡聚物)、大阪有機化學工業公司製「Viscoat#802」(季戊四醇丙烯酸酯)、「Viscoat#1000」(樹枝狀聚合物(Dendrimer)丙烯酸酯)、arkema公司製「CN989NS」(1分子中具有3個丙烯醯基之脂肪族胺基甲酸酯寡聚物)、「CN9039」(1分子中具有6個丙烯醯基之脂肪族胺基甲酸酯寡聚物)、根上工業公司製「UN-3320HA」、「UN-3320HC」、「UN-906S」(1分子中具有6個丙烯醯基之脂肪族胺基甲酸酯寡聚物)、DIC公司製「DICLITE UE-8740」(1分子中具有3個丙烯醯基之苯酚酚醛清漆型環氧丙烯酸酯)等。又,「季戊四醇(三/四)丙烯酸酯」係指季戊四醇三丙烯酸酯及季戊四醇四丙烯酸酯的混合物。其他的「(三/四)」等也相同。(Meth) acrylates having three or more (meth) acrylfluorenyl groups in one molecule include, for example, "LIGHT ESTERTMP" (trimethylolpropane trimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., and Light AcrylatePE-3A "(Pentaerythritol Triacrylate)," Light AcrylatePE-4A "(Pentaerythritol Tetraacrylate)," Light AcrylateDGE-4A "(EO Adduct Modified Diglycerol Tetraacrylate), DAICEL-ALLNEX Corporation Made of "PETIA" (pentaerythritol (tri / tetra) acrylate), TMPTA (trimethylolpropane triacrylate), TMPEOTA (trimethylolpropane ethoxy triacrylate), "EBECRYL135" (trimethylol Propane propoxy triacrylate), `` PETA '' (pentaerythritol (tri / tetra) acrylate), `` DPHA '' (dipentaerythritol hexaacrylate), `` NK EsterA-TMPT '' (trimethylol) manufactured by Shin Nakamura Chemical Industry Co., Ltd. Propane triacrylate), `` NK EsterA-TMPT-3PO '' (propoxylated trimethylolpropane triacrylate), `` NK EsterA-GLY-6E '' (ethoxylated glycerol triacrylate) , "NK EsterA-GLY-6P" (propoxylated glycerol triacrylate), "NK Este "rA-9300" (tri- (2-propenyloxyethyl) isocyanurate), "NK EsterA-9200" (bis / tri- (2-propenyloxyethyl) isocyanurate) ), `` NK EsterA-9300-1CL '' (caprolactone modified tri- (2-propenyloxyethyl) isocyanurate), `` NK EsterATM-4EL '' (ethoxylated pentaerythritol (tri / 4) Acrylate), `` KAYARAD DPCA-20 '' (6-functional acrylate), `` KAYARAD DPCA-60 '' (6-functional acrylate), `` T-1420 (T) '' (4-functional acrylate) ), "DPEA-12" (6-functional acrylate), "KAYARAD DPHA-40H" (oligomer with 10 acryl fluorenyl groups in one molecule), "Viscoat # 802" (Pentaerythritol Acrylic Acid) manufactured by Osaka Organic Chemical Industry Co., Ltd. (Ester), "Viscoat # 1000" (Dendrimer acrylate), "CN989NS" (ark fatty urethane oligomer with 3 acryl fluorenyl groups in one molecule), " CN9039 "(aliphatic urethane oligomer with 6 acrylamino groups in 1 molecule)," UN-3320HA "," UN-3320HC "," UN-906S "(1 molecule) Aliphatic amine group with 6 acrylyl groups Formate oligomer), "DICLITE UE-8740" (a phenol novolac epoxy acrylate having three acryl fluorenyl groups in one molecule) manufactured by DIC Corporation, and the like. The "pentaerythritol (tri / tetra) acrylate" refers to a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate. The same applies to other "(3/4)" etc.

具有脂環式構造之多官能(甲基)丙烯酸酯,可列舉例如具有三環[5.2.1.02,6 ]癸烷環構造之DAICEL-ALLNEX公司製「IRR214-K」(三環癸烷二甲醇二丙烯酸酯)、三菱氣體化學公司製之1,3-金剛烷二醇二丙烯酸酯等。Examples of the polyfunctional (meth) acrylate having an alicyclic structure include, for example, "IRR214-K" (tricyclodecanedi) manufactured by DAICEL-ALLNEX Corporation having a tricyclic [5.2.1.0 2,6 ] decane ring structure. Methanol diacrylate), 1,3-adamantanediol diacrylate manufactured by Mitsubishi Gas Chemical Co., Ltd., and the like.

多官能乙烯性不飽和化合物的量,在組成物全體中,較佳為20~78質量%,更佳為25~75質量%,又更佳為30~70質量%。The amount of the polyfunctional ethylenically unsaturated compound in the entire composition is preferably 20 to 78% by mass, more preferably 25 to 75% by mass, and still more preferably 30 to 70% by mass.

<1分子中具有1個乙烯性不飽和基的化合物>   本發明之封裝用組成物,也可含有1分子中具有1個乙烯性不飽和基的化合物(以下有時僅簡稱為「單官能乙烯性不飽和化合物」的情形)。「單官能乙烯性不飽和化合物」係如後述,有時可作為稀釋劑包含於本發明之封裝用組成物中的情形。單官能乙烯性不飽和化合物,在發揮本發明之效果的範圍內,也可含有環氧基等之其他的官能基。這種化合物,可列舉例如1分子中具有1個以上之環氧基及具有1個乙烯性不飽和基的化合物。又,包含環氧基之單官能乙烯性不飽和化合物,在本發明中,非環氧樹脂,而被非類成單官能乙烯性不飽和化合物。<Compound having one ethylenically unsaturated group in one molecule> 封装 The encapsulating composition of the present invention may contain a compound having one ethylenically unsaturated group in one molecule (hereinafter sometimes referred to simply as "monofunctional ethylene" Sexually unsaturated compounds "). The "monofunctional ethylenically unsaturated compound" is a case where it may be contained in the sealing composition of the present invention as a diluent as described later. The monofunctional ethylenically unsaturated compound may contain other functional groups such as an epoxy group within the range in which the effects of the present invention are exhibited. Examples of such a compound include compounds having one or more epoxy groups and one ethylenically unsaturated group in one molecule. Moreover, in the present invention, a monofunctional ethylenically unsaturated compound containing an epoxy group is not an epoxy resin, but is not classified as a monofunctional ethylenically unsaturated compound.

1分子中具有環氧基及1個乙烯性不飽和基的化合物的市售品,可列舉例如DAICEL-ALLNEX公司製「CyclomerM100」(3,4-環氧基環己基甲基甲基丙烯酸酯)、「UVACURE1561」(1分子中具有環氧基及1個丙烯醯基之化合物(含量:78~82質量%)與雙酚A型環氧樹脂(含量:18~22質量%)的混合物)、日本化成公司製「4HBAGE」(4-羥基丁基丙烯酸酯環氧丙醚)等。Commercial products of compounds having an epoxy group and one ethylenically unsaturated group in one molecule include, for example, "CyclomerM100" (3,4-epoxycyclohexyl methacrylate) manufactured by DAICEL-ALLNEX Corporation. "UVACURE1561" (mixture of a compound having an epoxy group and a propenyl group in one molecule (content: 78 to 82% by mass) and a bisphenol A type epoxy resin (content: 18 to 22% by mass)), "4HBAGE" (4-hydroxybutyl acrylate glycidyl ether) and the like manufactured by Nippon Kasei Corporation.

本發明之封裝用組成物包含單官能乙烯性不飽和化合物時,其量係在組成物全體中,較佳為0.5質量%以上,更佳為1質量%以上,又更佳為1.5質量%以上,較佳為55質量%以下,更佳為50質量%以下,又更佳為40質量%以下。When the encapsulating composition of the present invention contains a monofunctional ethylenically unsaturated compound, the amount is in the entire composition, preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 1.5% by mass or more. It is preferably 55 mass% or less, more preferably 50 mass% or less, and still more preferably 40 mass% or less.

<具有乙烯性不飽和基的化合物>   綜合上述「多官能乙烯性不飽和化合物」及「單官能乙烯性不飽和化合物」稱為「具有乙烯性不飽和基的化合物」。此具有乙烯性不飽和基的化合物的量,在組成物全體中,較佳為30~80質量%,更佳為35~80質量%,又更佳為40~80質量%。<The compound which has an ethylenically unsaturated group> The said "multifunctional ethylenically unsaturated compound" and "monofunctional ethylenically unsaturated compound" are called "the compound which has an ethylenically unsaturated group." The amount of the compound having an ethylenically unsaturated group is preferably 30 to 80% by mass, more preferably 35 to 80% by mass, and even more preferably 40 to 80% by mass in the entire composition.

<稀釋劑>   本發明之封裝用組成物係作為液狀封裝用組成物,為了達成適當的黏度,也可含有稀釋劑。以B型黏度計,在25℃之溫度條件下測量之稀釋劑的黏度,較佳為0.1~5000mPa・s,更佳為0.1~2500mPa・s,又更佳為0.1~1000mPa・s。<Diluent> The sealing composition of the present invention is a liquid sealing composition, and may contain a diluent in order to achieve a suitable viscosity. The viscosity of the diluent measured with a B-type viscosity meter at a temperature of 25 ° C is preferably 0.1 to 5000 mPa ・ s, more preferably 0.1 to 2500 mPa ・ s, and still more preferably 0.1 to 1000 mPa ・ s.

稀釋劑係以反應性稀釋劑為佳。反應性稀釋劑係以1分子中具有1個乙烯性不飽和基的化合物(以下有時簡稱為「單官能乙烯性不飽和化合物」的情形)為佳。The diluent is preferably a reactive diluent. The reactive diluent is preferably a compound having one ethylenically unsaturated group in one molecule (hereinafter sometimes referred to simply as a "monofunctional ethylenically unsaturated compound").

又,本發明中,被分類為「多官能乙烯性不飽和化合物」之1分子中具有2個乙烯性不飽和基的化合物(有時簡稱為「2官能乙烯性不飽和化合物」的情形),只要在上述黏度範圍者時,有作為反應性稀釋劑功能的情形。摻合作為反應性稀釋劑功能之2官能乙烯性不飽和化合物時,可不調配稀釋劑或調配時也減少調配量。作為稀釋劑產生功能之2官能乙烯性不飽和化合物,可列舉例如「DPGDA」(二丙二醇二丙烯酸酯)、「HDDA」(1、6-己二醇二丙烯酸酯)、「TPGDA」(三丙二醇二丙烯酸酯)、「EBECRYL145」(PO改質新戊二醇二丙烯酸酯)、「HPNDA」(新戊二醇羥基新戊酸酯二丙烯酸酯)、共榮社化學公司製「LIGHT ESTERNP」(新戊二醇二甲基丙烯酸酯)、「LIGHT ESTEREG」(乙二醇二甲基丙烯酸酯)、「LIGHT ESTER2EG」(二乙二醇二甲基丙烯酸酯)、「LIGHT ESTER1.6HX」(1、6-己二醇二甲基丙烯酸酯)、「LIGHT ESTER1.9ND」(1、9-壬二醇 二甲基丙烯酸酯)、「Light AcrylateNP-A」(新戊二醇 二丙烯酸酯)、「Light Acrylate1.9ND-A」(1、9-壬二醇 二丙烯酸酯)、新中村化學工業公司製「NK Ester701A」(2-羥基-3-甲基丙烯醯基丙基丙烯酸酯)、「NK EsterA-200」(聚乙二醇#200 二丙烯酸酯)、「NK EsterAPG-400」(聚丙二醇#400 二丙烯酸酯)、「NK EsterBG」(1,3-丁二醇 二甲基丙烯酸酯)、「NK Ester701」(2-羥基-1,3-二甲基丙烯醯氧基丙烷)、「NK Ester3PG」(三丙二醇 二甲基丙烯酸酯)、大阪有機化學工業公司製「Viscoat#195」(1,4-丁二醇 二丙烯酸酯)、arkema公司製「SR562」(烷氧基化己二醇 二丙烯酸酯)等。乙烯性不飽和基,較佳為(甲基)丙烯醯基,反應性稀釋劑,特別是以1分子中具有1個(甲基)丙烯醯基之(甲基)丙烯酸酯為更佳(有時簡稱為「單官能(甲基)丙烯酸酯」的情形)。In addition, in the present invention, a compound having two ethylenically unsaturated groups in one molecule is classified as a "multifunctional ethylenically unsaturated compound" (sometimes referred to as "bifunctional ethylenically unsaturated compounds"), As long as it is in the above viscosity range, it may function as a reactive diluent. When the difunctional ethylenically unsaturated compound is blended with the function of a reactive diluent, the diluent can be dispensed or the amount of the diluent can be reduced. Examples of difunctional ethylenically unsaturated compounds that function as diluents include "DPGDA" (dipropylene glycol diacrylate), "HDDA" (1,6-hexanediol diacrylate), and "TPGDA" (tripropylene glycol) Diacrylate), `` EBECRYL145 '' (PO modified neopentyl glycol diacrylate), `` HPNDA '' (neopentyl glycol hydroxypivalate diacrylate), `` LIGHT ESTERNP '' (made by Kyoeisha Chemical Co., Ltd.) Neopentyl glycol dimethacrylate), `` LIGHT ESTEREG '' (ethylene glycol dimethacrylate), `` LIGHT ESTER2EG '' (diethylene glycol dimethacrylate), `` LIGHT ESTER1.6HX '' (1 , 6-hexanediol dimethacrylate), "LIGHT ESTER1.9ND" (1, 9-nonanediol dimethacrylate), "Light AcrylateNP-A" (neopentyl glycol diacrylate), "Light Acrylate 1.9ND-A" (1, 9-nonanediol diacrylate), "NK Ester701A" (2-hydroxy-3-methacryl propyl propyl acrylate) manufactured by Shin Nakamura Chemical Industry Co., Ltd., " "NK EsterA-200" (polyethylene glycol # 200 diacrylate), "NK EsterAPG-400" (polypropylene glycol # 400 diacrylate), "NK EsterBG" (1,3-butanediol dimethacrylate), `` NK Ester701 '' (2-hydroxy-1,3-dimethylpropylene ethoxypropane), `` NK Ester3PG '' (tripropylene glycol dimethacrylate) ), "Viscoat # 195" (1,4-butanediol diacrylate) manufactured by Osaka Organic Chemical Industry Co., Ltd., "SR562" (alkoxylated hexanediol diacrylate) manufactured by arkema Corporation, and the like. The ethylenically unsaturated group is preferably a (meth) acrylfluorenyl group, and a reactive diluent, especially a (meth) acrylic acid ester having one (meth) acrylfluorenyl group in one molecule is more preferable (there is When it is simply called "monofunctional (meth) acrylate").

作為稀釋劑使用之單官能(甲基)丙烯酸酯,可列舉例如DAICEL-ALLNEX公司製、「ODA-N」(辛基/癸基丙烯酸酯,亦即,具有長鏈烷基之單官能丙烯酸酯)、「EBECRYL 110」、「EBECRYL1114」(乙氧基化苯基丙烯酸酯)、共榮社化學公司製「LIGHT ESTERE」(乙基甲基丙烯酸酯)、「LIGHT ESTERNB」(n-丁基甲基丙烯酸酯)、「LIGHT ESTERIB」(異丁基甲基丙烯酸酯)、「LIGHT ESTERTB」(t-丁基甲基丙烯酸酯)、「LIGHT ESTEREH」(2-乙基己基甲基丙烯酸酯)、「LIGHT ESTERID」(異癸基甲基丙烯酸酯)、「LIGHT ESTERL」(n-月桂基甲基丙烯酸酯)、「LIGHT ESTERS」(n-十八烷基甲基丙烯酸酯)、「LIGHT ESTERCH」(環己基甲基丙烯酸酯)、「LIGHT ESTERTHF(1000)」(四氫糠基甲基丙烯酸酯)、「LIGHT ESTERBZ」(苄基甲基丙烯酸酯)、「LIGHT ESTERPO」(苄基苯氧基乙基甲基丙烯酸酯)、「LIGHT ESTERIB-X」(異莰基甲基丙烯酸酯)、「LIGHT ESTERHO-250」(2-羥基乙基甲基丙烯酸酯)、「LIGHT ESTERHOA」(羥基乙基丙烯酸酯)、「LIGHT ESTERG」(環氧丙基甲基丙烯酸酯)、「Light AcrylateIAA」(異戊基丙烯酸酯,亦即,具有分支烷基之單官能丙烯酸酯)、「Light AcrylateS-A」(十八烷基丙烯酸酯)、「Light AcrylateEC-A」(乙氧基-二乙二醇丙烯酸酯)、「Light AcrylateEHDG-AT」(2-乙基己基-二乙二醇丙烯酸酯)、「Light AcrylateDPM-A」(甲氧基二丙二醇丙烯酸酯)、「Light AcrylateIB-XA」(異莰基甲基丙烯酸酯,亦即,具有脂環式基之單官能甲基丙烯酸酯)、「Light AcrylatePO-A」(苯氧基乙基丙烯酸酯,亦即,具有芳香環之單官能丙烯酸酯)、「Light AcrylateP2H-A」(苯氧基二乙二醇丙烯酸酯)、「Light AcrylateP-200A」(苯氧基-聚乙二醇丙烯酸酯)、「Light AcrylatePOB-A」(m-苯氧基苄基丙烯酸酯)、「Light AcrylateTFH-A」(四氫糠基丙烯酸酯)、「LIGHT ESTERHOP-A(N)」(2-羥基丙基丙烯酸酯)、「HOA-MS(N)」(2-丙烯醯氧基乙基-琥珀酸)、「epoxy ester M-600A」(2-羥基-3-苯氧基丙基丙烯酸酯)、大阪有機化學工業公司製「IDAA」(異癸基丙烯酸酯)、「Viscoat#155」(環己基丙烯酸酯)、「Viscoat#160」(苄基丙烯酸酯)、「Viscoat#150」(四氫糠基丙烯酸酯)、「Viscoat#190」(乙基卡必醇丙烯酸酯)、「OXE-10」(3-乙基-3-氧雜環丁烷基甲基丙烯酸酯,亦即。具有氧雜環丁烷環之丙烯酸酯)、「MEDOL-10」(2-甲基-2-乙基-1、3-二氧雜環戊烷-4-基)甲基丙烯酸酯,亦即,具有二氧雜環戊烷環之丙烯酸酯)、東亞合成公司製「AronixM-101A」(苯酚EO改質丙烯酸酯)、新中村化學工業公司製「NK EsterA-LEN-10」(乙氧基化鄰苯基苯酚丙烯酸酯)、「NK EsterEH-4E」(乙氧基化乙基己基聚乙二醇甲基丙烯酸酯)、日立化成公司製「FA-511AS」(二環戊烯基丙烯酸酯)、「FA-512AS」(二環戊烯氧基乙基丙烯酸酯)、「FA-513AS」(二環戊基丙烯酸酯)、arkema公司製「SR217NS」(4-tert-丁基環己醇丙烯酸酯)、「SR420NS」(3,3,5-三甲基環己醇丙烯酸酯)、「SR531」(環三羥甲基丙烷縮醛丙烯酸酯)、「CD421」(3,3,5-三甲基環己醇甲基丙烯酸酯)、「CD535」(二環戊二烯基甲基丙烯酸酯)、日本觸媒公司製「VEEA」(丙烯酸2-(2-乙烯氧基乙氧基)乙基)、「VEEM」(甲基丙烯酸2-(2-乙烯氧基乙氧基)乙基)等。又,「辛基/癸基丙烯酸酯」係指辛基丙烯酸酯及癸基丙烯酸酯的混合物。Examples of the monofunctional (meth) acrylate used as a diluent include, for example, "ODA-N" (octyl / decyl acrylate, that is, monofunctional acrylate having a long-chain alkyl group) manufactured by DAICEL-ALLNEX Corporation. ), `` EBECRYL 110 '', `` EBECRYL1114 '' (ethoxylated phenyl acrylate), `` LIGHT ESTERE '' (ethyl methacrylate), `` LIGHT ESTERNB '' (n-butyl methacrylic acid) manufactured by Kyoeisha Chemical Co., Ltd. Ester), LIGHT ESTERIB (isobutyl methacrylate), LIGHT ESTERTB (t-butyl methacrylate), LIGHT ESTEREH (2-ethylhexyl methacrylate), LIGHT ESTERID (iso Decyl methacrylate), LIGHT ESTERL (n-lauryl methacrylate), LIGHT ESTERS (n-octadecyl methacrylate), LIGHT ESTERCH (cyclohexyl methacrylate) (Ester), `` LIGHT ESTERTHF (1000) '' (tetrahydrofurfuryl methacrylate), `` LIGHT ESTERBZ '' (benzyl methacrylate), `` LIGHT ESTERPO '' (benzylphenoxyethyl methacrylate) ), "LIGHT ESTERIB-X" (isofluorenyl methacrylate), "LIGHT ESTERHO-250" (2 -Hydroxyethyl methacrylate), "LIGHT ESTERHOA" (hydroxyethyl acrylate), "LIGHT ESTERG" (epoxypropyl methacrylate), "Light AcrylateIAA" (isoamyl acrylate, also known as , Monofunctional acrylate with branched alkyl group), "Light AcrylateS-A" (octadecyl acrylate), "Light AcrylateEC-A" (ethoxy-diethylene glycol acrylate), "Light AcrylateEHDG- "AT" (2-ethylhexyl-diethylene glycol acrylate), "Light AcrylateDPM-A" (methoxydipropylene glycol acrylate), "Light AcrylateIB-XA" (isoamyl methacrylate, also known as , A monofunctional methacrylate having an alicyclic group), "Light AcrylatePO-A" (phenoxyethyl acrylate, that is, a monofunctional acrylate having an aromatic ring), "Light AcrylateP2H-A" ( Phenoxy diethylene glycol acrylate), "Light AcrylateP-200A" (phenoxy-polyethylene glycol acrylate), "Light AcrylatePOB-A" (m-phenoxybenzyl acrylate), "Light "AcrylateTFH-A" (tetrahydrofurfuryl acrylate), "LIGHT ESTERHOP-A (N)" (2-hydroxypropyl propylene Acid ester), "HOA-MS (N)" (2-propenyloxyethyl-succinic acid), "epoxy ester M-600A" (2-hydroxy-3-phenoxypropyl acrylate), Osaka "IDAA" (isodecyl acrylate), "Viscoat # 155" (cyclohexyl acrylate), "Viscoat # 160" (benzyl acrylate), "Viscoat # 150" (tetrahydrofurfuryl) Acrylate), "Viscoat # 190" (ethyl carbitol acrylate), "OXE-10" (3-ethyl-3-oxetanyl methacrylate), that is, acrylate. Acrylate with oxetane ring), "MEDOL-10" (2-methyl-2-ethyl-1, 3-dioxolane-4-yl) methacrylate, that is, Acrylate with dioxolane), "AronixM-101A" (phenol EO modified acrylate) manufactured by Toa Kosei, "NK EsterA-LEN-10" (ethoxy group) manufactured by Shin Nakamura Chemical Industry Co., Ltd. O-phenylphenol acrylate), NK EsterEH-4E (ethoxylated ethylhexyl polyethylene glycol methacrylate), Hitachi Chemical Co., Ltd. "FA-511AS" (dicyclopentenyl acrylate) ), "FA-512AS" (dicyclopentenyloxyethyl acrylate), "FA-513AS" (dicyclopentyl acrylate), "SR217NS" (4-tert-butylcyclohexanol) manufactured by arkema Acrylate), "SR420NS" (3,3,5-trimethylcyclohexanol acrylate), "SR531" (cyclotrimethylolpropane acetal acrylate), "CD421" (3,3,5- Trimethylcyclohexanol methacrylate), "CD535" (dicyclopentadienyl methacrylate), "VEEA" (2- (2-vinyloxyethoxy) acrylate) made by Japan Catalyst Corporation Ethyl), VEEM (2- (2-vinyloxy methacrylate) Yloxy) ethyl) and the like. The "octyl / decyl acrylate" refers to a mixture of octyl acrylate and decyl acrylate.

作為稀釋劑使用的單官能(甲基)丙烯酸酯,特別是以具有脂環式構造之單官能甲基丙烯酸酯為佳。脂環式構造係與前述同義。市售具有脂環式構造之單官能(甲基)丙烯酸酯,可列舉例如具有莰烷環構造之共榮社化學公司製「LIGHT ESTERIB-X」(異莰基甲基丙烯酸酯)、「Light AcrylateIB-XA」(異莰基甲基丙烯酸酯)、具有環己基構造之共榮社化學公司製「LIGHT ESTERCH」(環己基甲基丙烯酸酯)、大阪有機化學工業公司製「Viscoat#155」(環己基丙烯酸酯)、arkema公司製「SR217NS」(4-tert-丁基環己醇丙烯酸酯)、「SR420NS」(3,3,5-三甲基環己醇丙烯酸酯)、「CD421」(3,3,5-三甲基環己醇甲基丙烯酸酯)、「CD535」(二環戊二烯基甲基丙烯酸酯)、具有二環結構之日立化成公司製「FA-511AS」(二環戊烯基丙烯酸酯)、「FA-512AS」(二環戊烯氧基乙基丙烯酸酯)、「FA-513AS」(二環戊基丙烯酸酯)、arkema公司製「CD535」(二環戊二烯基甲基丙烯酸酯)、日本觸媒公司製「VEEA」(丙烯酸2-(2-乙烯氧基乙氧基)乙酯)、「VEEM」(甲基丙烯酸2-(2-乙烯氧基乙氧基)乙酯)等。The monofunctional (meth) acrylate used as a diluent is preferably a monofunctional methacrylate having an alicyclic structure. The alicyclic structure is synonymous with the foregoing. Commercially available monofunctional (meth) acrylates having an alicyclic structure include, for example, "LIGHT ESTERIB-X" (isofluorenyl methacrylate), "Light" "AcrylateIB-XA" (isoamyl methacrylate), "LIGHT ESTERCH" (cyclohexyl methacrylate) manufactured by Kyoeisha Chemical Co., Ltd. with a cyclohexyl structure, and "Viscoat # 155" (manufactured by Osaka Organic Chemical Industry Co., Ltd.) Cyclohexyl acrylate), "SR217NS" (4-tert-butylcyclohexanol acrylate), "SR420NS" (3,3,5-trimethylcyclohexanol acrylate), "CD421" (manufactured by arkema) 3,3,5-trimethylcyclohexanol methacrylate), "CD535" (dicyclopentadienyl methacrylate), "FA-511AS" (two manufactured by Hitachi Chemical Co., Ltd.) (Cyclopentenyl acrylate), "FA-512AS" (dicyclopentenyl ethyl acrylate), "FA-513AS" (dicyclopentyl acrylate), "CD535" (dicyclopentyl) manufactured by arkema Dienyl methacrylate), "VEEA" (2- (2-vinyloxyethoxy) ethyl acrylate), "VEEM" (2-methacrylic acid 2- (2-vinyloxyethoxy) ethyl ester) and the like.

使用稀釋劑時,其量(包含作為稀釋劑產生功能之「2官能乙烯性不飽和化合物」的情形時,也包含其量)係組成物全體中,較佳為2質量%以上,更佳為5質量%以上,又更佳為10質量%以上,較佳為60質量%以下,更佳為55質量%以下,又更佳為50質量%以下。When a diluent is used, its amount (including the amount of "difunctional ethylenically unsaturated compound" which functions as a diluent is also included) is preferably 2% by mass or more in the entire composition, and more preferably 5 mass% or more, more preferably 10 mass% or more, preferably 60 mass% or less, more preferably 55 mass% or less, and even more preferably 50 mass% or less.

<半燒成水滑石>   本發明之組成物係包含半燒成水滑石。半燒成水滑石可僅1種,也可為2種以上。<Semi-fired hydrotalcite> The composition of the present invention contains semi-fired hydrotalcite. The semi-calcined hydrotalcite may be used alone or in combination of two or more.

水滑石可分類為未燒成水滑石、半燒成水滑石及燒成水滑石。Hydrotalcite can be classified into unfired hydrotalcite, semi-fired hydrotalcite, and fired hydrotalcite.

未燒成水滑石,例如天然水滑石(Mg6 Al2 (OH)16 CO3 ・4H2 O)所代表之具有層狀之結晶構造的金屬氫氧化物,例如由基本骨架的層[Mg1-X AlX (OH)2 ]X+ 與中間層[(CO3 )X/2 ・mH2 O]X- 所成。本發明中之未燒成水滑石係包含合成水滑石等之水滑石樣化合物的概念。水滑石樣化合物,可列舉例如下述式(I)及下述式(II)表示者。Unfired hydrotalcites, such as metal hydroxides with a layered crystalline structure represented by natural hydrotalcites (Mg 6 Al 2 (OH) 16 CO 3 ・ 4H 2 O), such as a layer with a basic skeleton [Mg 1 -X Al X (OH) 2 ] X + and intermediate layer [(CO 3 ) X / 2 ・ mH 2 O] X- . The unfired hydrotalcite in the present invention includes the concept of synthetic hydrotalcite-like compounds such as hydrotalcite. Examples of the hydrotalcite-like compound include those represented by the following formula (I) and the following formula (II).

(式中,M2+ 表示Mg2+ 、Zn2+ 等之2價金屬離子,M3+ 表示Al3+ 、Fe3+ 等之3價金屬離子,An- 表示CO3 2- 、Cl- 、NO3 - 等之n價的陰離子,0<x<1,0≦m<1,n為正之數。)   式(I)中,M2+ 較佳為Mg2+ ,M3+ 較佳為Al3+ ,An- 較佳為CO3 2- (In the formula, M 2+ represents a divalent metal ion such as Mg 2+ , Zn 2+, etc., M 3+ represents a trivalent metal ion such as Al 3+ , Fe 3+ , and A n- represents CO 3 2- , Cl. - , NO 3 - and other n-valent anions, 0 <x <1, 0 ≦ m <1, n is a positive number.) In formula (I), M 2+ is preferably Mg 2+ , and M 3+ is more than Al 3+ is preferred, and A n- is preferably CO 3 2- .

(式中,M2+ 表示Mg2+ 、Zn2+ 等之2價金屬離子,An- 表示CO3 2- 、Cl- 、NO3- 等之n價陰離子,x為2以上的正數,z為2以下的正數,m為正數,n為正數。)   式(II)中,M2+ 較佳為Mg2+ ,An- 較佳為CO3 2- (In the formula, M 2+ represents Mg 2+, Zn 2+ and other divalent metal ions of, A n- represents CO 3 2-, Cl -, NO 3- , etc. The n-valent anion, x is a positive number of 2 or more, z is a positive number of 2 or less, m is a positive number, and n is a positive number.) In formula (II), M 2+ is preferably Mg 2+ and A n- is preferably CO 3 2- .

半燒成水滑石係指將未燒成水滑石進行燒成而得之層間水的量減少或消失之具有層狀結晶構造的金屬氫氧化物。「層間水」係指使用組成式說明時,係指上述未燒成之天然水滑石及水滑石樣化合物的組成式所記載的「H2 O」。本發明之特徵之一係使用此半燒成水滑石。The semi-calcined hydrotalcite refers to a metal hydroxide having a layered crystal structure in which the amount of interlayer water obtained by firing an uncalcined hydrotalcite is reduced or disappeared. "Interlayer water" refers to the "H 2 O" described in the composition formula of the unfired natural hydrotalcite and hydrotalcite-like compounds when explained using the composition formula. One of the features of the present invention is the use of this semi-fired hydrotalcite.

此外,燒成水滑石係將未燒成水滑石或半燒成水滑石進行燒成而得,不僅層間水,羥基也因縮合脫水而消失之具有非晶質構造之金屬氧化物。In addition, the calcined hydrotalcite is obtained by firing an uncalcined hydrotalcite or a semi-calcined hydrotalcite, and not only interlayer water, but also a metal oxide having an amorphous structure that disappears due to condensation and dehydration.

未燒成水滑石、半燒成水滑石及燒成水滑石,可藉由飽和吸水率來區別。半燒成水滑石之飽和吸水率係1質量%以上未達20質量%。此外,未燒成水滑石之飽和吸水率係未達1質量%,燒成水滑石之飽和吸水率為20質量%以上。Uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished by saturated water absorption. The saturated water absorption of the semi-calcined hydrotalcite is 1 mass% or more and less than 20 mass%. In addition, the saturated water absorption of the uncalcined hydrotalcite is less than 1% by mass, and the saturated water absorption of the calcined hydrotalcite is 20% by mass or more.

本發明中之「飽和吸水率」係指將未燒成水滑石、半燒成水滑石或燒成水滑石使用天秤量取1.5g,測量初期質量後,在大氣壓下,設定為60℃、90%RH(相對濕度)之小型環境試驗器(ESPEC公司製SH-222)中靜置200小時之相對於初期質量之質量增加率,可使用下述式(i):    飽和吸水率(質量%)   =100×(吸濕後之質量-初期質量)/初期質量 (i) 求得。The "saturated water absorption rate" in the present invention refers to measuring 1.5 g of uncalcined hydrotalcite, semi-calcined hydrotalcite or calcined hydrotalcite using a balance, and after measuring the initial mass, it is set to 60 ° C, 90 ° C under atmospheric pressure. The mass increase rate relative to the initial mass in a small-scale environmental tester (SH-222 manufactured by ESPEC) at% RH (relative humidity) can be used for the following formula (i): Saturated water absorption (mass%) = 100 × (mass after moisture absorption-initial mass) / initial mass (i).

半燒成水滑石之飽和吸水率,較佳為3質量%以上未達20質量%,更佳為5質量%以上未達20質量%。The saturated water absorption of the semi-calcined hydrotalcite is preferably from 3% by mass to 20% by mass, and more preferably from 5% by mass to 20% by mass.

又,未燒成水滑石、半燒成水滑石及燒成水滑石,可藉由使用熱重量分析測量之熱重量減少率來區別。半燒成水滑石在280℃下之熱重量減少率為未達15質量%,且其380℃下之熱重量減少率為12質量%以上。此外,未燒成水滑石在280℃下之熱重量減少率為15質量%以上,燒成水滑石在380℃下之熱重量減少率為未達12質量%。In addition, uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished by the thermal weight reduction rate measured by thermogravimetric analysis. The thermal weight reduction rate of the semi-calcined hydrotalcite at 280 ° C. is less than 15% by mass, and the thermal weight reduction rate thereof at 380 ° C. is 12% by mass or more. In addition, the thermal weight reduction rate of the unfired hydrotalcite at 280 ° C is 15 mass% or more, and the thermal weight reduction rate of the fired hydrotalcite at 380 ° C is less than 12 mass%.

熱重量分析可使用Hitachi High-Tech Science公司製TG/DTA EXSTAR6300,以鋁製之樣品盤量秤水滑石5mg,不加蓋、烘烤的狀態下,氮流量200mL/分鐘之環境下,由30℃至550℃以昇溫速度10℃/分鐘的條件下進行。熱重量減少率可以下述式(ii):    熱重量減少率(質量%)   =100×(加熱前之質量-到達所定溫度時之質量)/加熱前之質量 (ii) 而得到。For thermogravimetric analysis, TG / DTA EXSTAR6300 manufactured by Hitachi High-Tech Science can be used to measure 5 mg of hydrotalcite with aluminum sample pan. Under the condition of no cover and baking, the nitrogen flow rate is 200mL / min. The process is carried out at a temperature-raising rate of 10 ° C / min to 550 ° C. The thermal weight reduction rate can be obtained by the following formula (ii): Thermal weight reduction rate (mass%) = 100 × (mass before heating-mass when reaching a predetermined temperature) / mass before heating (ii).

又,未燒成水滑石、半燒成水滑石及燒成水滑石,可藉由以粉末X光繞射測量之波峰及相對強度比來區別。半燒成水滑石,藉由粉末X射線繞射,於2θ為8~18°附近顯示分裂為二個的波峰、或藉由二個波峰之合成而具有肩峰(shoulder)之波峰,出現於低角度側之波峰或肩峰之繞射強度(=低角度側繞射強度)、與出現於高角度側之波峰或肩峰之繞射強度(=高角度側繞射強度)的相對強度比(低角度側繞射強度/高角度側繞射強度)為0.001~ 1,000。另一方面,未燒成水滑石於8~18°附近僅具有一個波峰、或出現於低角度側之波峰或肩峰與出現於高角度側之波峰或肩峰之繞射強度的相對強度比落在前述範圍外。燒成水滑石於8°~18°之區域不具有特徵性波峰,於43°具有特徵性波峰。粉末X射線繞射測定,可藉由粉末X射線繞射裝置(PANalytical公司製,Empyrean),以對陰極CuKα(1.5405Å)、電壓:45V、電流:40mA、取樣寬:0.0260°、掃描速度:0.0657°/S、測定繞射角範圍(2θ):5.0131~79.9711°之條件進行。波峰搜尋可利用繞射裝置附屬之軟體的波峰搜尋功能,以「最小顯著度:0.50、最小波峰晶片:0.01°、最大波峰晶片:1.00°、峰底寬:2.00°、方法:2次微分之最小值」的條件進行。In addition, uncalcined hydrotalcite, semi-calcined hydrotalcite, and calcined hydrotalcite can be distinguished by peaks and relative intensity ratios measured by powder X-ray diffraction. The semi-calcined hydrotalcite, which is diffracted by powder X-rays, shows two peaks splitting around 2θ from 8 to 18 °, or a peak with a shoulder by the combination of the two peaks. Relative intensity ratio (low) of diffraction intensity of peaks or shoulders on the low-angle side (= diffraction intensity on the low-angle side) and diffraction intensity of peaks or shoulders on the high-angle side (= diffraction intensity on the high-angle side) Angle side diffraction intensity / high angle side diffraction intensity) is 0.001 to 1,000. On the other hand, the uncalcined hydrotalcite has only one peak near 8 to 18 °, or the relative intensity ratio of the diffraction intensity of the peak or shoulder that appears on the low-angle side to the peak or shoulder that appears on the high-angle side Outside the aforementioned range. The calcined hydrotalcite does not have characteristic peaks in the region of 8 ° -18 °, and has characteristic peaks at 43 °. For powder X-ray diffraction measurement, a powder X-ray diffraction device (Empyrean, manufactured by PANalytical Corporation) can be used for the cathode CuKα (1.5405Å), voltage: 45V, current: 40mA, sampling width: 0.0260 °, scanning speed: 0.0657 ° / S, measurement of diffraction angle range (2θ): 5.0131 to 79.9711 °. The peak search can use the peak search function of the software attached to the diffraction device to "minimum significance: 0.50, minimum peak chip: 0.01 °, maximum peak chip: 1.00 °, peak bottom width: 2.00 °, method: 2 times of differential "Minimum" condition.

半燒成水滑石之BET比表面積係以1~250m2 /g為佳,更佳為5~200m2 /g。半燒成水滑石之BET比表面積係依據BET法,使用比表面積測量裝置(Macsorb HM Model 1210 MOUNTECH 公司製),使試料表面吸附氮氣,可使用BET多點法來算出。Semi calcined hydrotalcite BET specific surface area is based at 1 ~ 250m 2 / g is preferable, more preferably 5 ~ 200m 2 / g. The BET specific surface area of the semi-calcined hydrotalcite is based on the BET method, and a specific surface area measuring device (Macsorb HM Model 1210 MOUNTECH Co., Ltd.) is used to adsorb nitrogen on the surface of the sample.

半燒成水滑石之平均粒徑係以1~1,000nm為佳,更佳為10~800nm。半燒成水滑石之平均粒徑係藉由雷射繞射散射式粒度分布測量(JIS Z 8825),以體積基準製作粒度分布時之該粒度分布的中值粒徑。The average particle diameter of the semi-calcined hydrotalcite is preferably 1 to 1,000 nm, and more preferably 10 to 800 nm. The average particle diameter of the semi-calcined hydrotalcite is the median particle diameter of the particle size distribution when the particle size distribution is produced on a volume basis by laser diffraction scattering particle size distribution measurement (JIS Z 8825).

半燒成水滑石可使用以表面處理劑進行表面處理者。表面處理所使用的表面處理劑,可使用例如高級脂肪酸、烷基矽烷類、矽烷偶合劑等,其中,較佳為高級脂肪酸、烷基矽烷類。表面處理劑可使用1種或2種以上。The semi-calcined hydrotalcite can be used as a surface treatment agent with a surface treatment agent. Examples of the surface treatment agent used for the surface treatment include higher fatty acids, alkylsilanes, and silane coupling agents. Among them, higher fatty acids and alkylsilanes are preferred. The surface treatment agent may be used singly or in combination of two or more kinds.

高級脂肪酸可列舉例如硬脂酸、二十八碳酸、肉豆蔻酸、棕櫚酸等之碳數18以上之高級脂肪酸,其中較佳為硬脂酸。此等可使用1種或2種以上。Examples of the higher fatty acid include higher fatty acids having a carbon number of 18 or more, such as stearic acid, octacosanoic acid, myristic acid, and palmitic acid. Among them, stearic acid is preferred. These may be used singly or in combination of two or more kinds.

烷基矽烷類可列舉例如,甲基三甲氧基矽烷、乙基三甲氧基矽烷、己基三甲氧基矽烷、辛基三甲氧基矽烷、癸基三甲氧基矽烷、十八烷基三甲氧基矽烷、二甲基二甲氧基矽烷、辛基三乙氧基矽烷、n-十八烷基二甲基(3-(三甲氧基矽烷基)丙基)銨氯化物等。此等可使用1種或2種以上。Examples of the alkylsilanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, and octadecyltrimethoxysilane. , Dimethyldimethoxysilane, octyltriethoxysilane, n-octadecyldimethyl (3- (trimethoxysilyl) propyl) ammonium chloride, and the like. These may be used singly or in combination of two or more kinds.

矽烷偶合劑可列舉例如,3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基(二甲氧基)甲基矽烷及2-(3,4-環氧基環己基)乙基三甲氧基矽烷等之環氧系矽烷偶合劑;3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、3-巰基丙基甲基二甲氧基矽烷及11-巰基十一烷基三甲氧基矽烷等之巰基系矽烷偶合劑;3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-胺基丙基二甲氧基甲基矽烷、N-苯基-3-胺基丙基三甲氧基矽烷、N-甲基胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷及N-(2-胺基乙基)-3-胺基丙基二甲氧基甲基矽烷等之胺基系矽烷偶合劑;3-脲基丙基三乙氧基矽烷等之脲基系矽烷偶合劑、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷及乙烯基甲基二乙氧基矽烷等之乙烯基系矽烷偶合劑;p-苯乙烯基三甲氧基矽烷等之苯乙烯基系矽烷偶合劑;3-丙烯醯氧基丙基三甲氧基矽烷及3-甲基丙烯醯氧基丙基三甲氧基矽烷等之丙烯酸酯系矽烷偶合劑;3-異氰酸酯丙基三甲氧基矽烷等之異氰酸酯系矽烷偶合劑、雙(三乙氧基矽烷基丙基)二硫醚、雙(三乙氧基矽烷基丙基)四硫醚等之硫醚系矽烷偶合劑;苯基三甲氧基矽烷、甲基丙烯醯氧基丙基三甲氧基矽烷、咪唑矽烷、三嗪矽烷等。此等可使用1種或2種以上。Examples of the silane coupling agent include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, and 3-glycidoxypropyl (dimethoxy) ) Epoxy-based silane coupling agents such as methylsilane and 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethyl Mercapto-based silane coupling agents such as methoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 11-mercaptoundecyltrimethoxysilane; 3-aminopropyltrimethoxysilane, 3-amine Propyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxy Silane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, and N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane Amine-based silane coupling agents; urea-based silane coupling agents such as 3-ureidopropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, and vinylmethyldiethoxy Silane and other vinyl silane coupling agents; p-styryltrimethoxy Styryl-based silane coupling agents such as alkane; 3-acrylic methoxypropyltrimethoxysilane and 3-methacrylic methoxypropyltrimethoxysilane; acrylate-based silane coupling agents; 3-isocyanate Isocyanate-based silane coupling agents such as propyltrimethoxysilane, thioether-based silane coupling agents such as bis (triethoxysilylpropyl) disulfide, and bis (triethoxysilylpropyl) tetrasulfide Mixture; phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, imidazolesilane, triazinesilane, etc. These may be used singly or in combination of two or more kinds.

半燒成水滑石之表面處理,例如可將未處理之半燒成水滑石使用混合機在常溫下攪拌分散,同時添加表面處理劑進行噴霧,藉由5~60分鐘攪拌來進行。混合機可使用公知的混合機,可列舉例如,V摻混機、螺帶式摻混機(ribbon blender) 、雙圓錐摻混機等之摻混機、V型混合機及混凝土攪拌機等之混合機、球磨機、切割刀磨等。又,使用球磨機等將半燒成水滑石粉碎時,也可添加前述高級脂肪酸、烷基矽烷類或矽烷偶合劑,進行表面處理。表面處理劑之使用量係因半燒成水滑石之種類或表面處理劑的種類等而異,相對於未經表面處理之半燒成水滑石100質量份,以1~10質量份為佳。本發明中,經表面處理之半燒成水滑石也包含於本發明之「半燒成水滑石」中。For surface treatment of semi-calcined hydrotalcite, for example, untreated semi-calcined hydrotalcite can be stirred and dispersed at room temperature using a mixer, and a surface treatment agent is added for spraying, followed by stirring for 5 to 60 minutes. Mixing mixer known mixer can be used include, for example, V blender, ribbon blender (ribbon blender), blender, etc. double cone blender, V type blender and concrete mixer etc. Machine, ball mill, cutting knife, etc. When the semi-calcined hydrotalcite is pulverized using a ball mill or the like, the above-mentioned higher fatty acid, alkylsilane, or silane coupling agent may be added for surface treatment. The amount of the surface treatment agent used varies depending on the type of the semi-calcined hydrotalcite or the type of the surface treatment agent, and is preferably 1 to 10 parts by mass relative to 100 parts by mass of the semi-calcined hydrotalcite without surface treatment. In the present invention, the surface-treated semi-fired hydrotalcite is also included in the "semi-fired hydrotalcite" of the present invention.

本發明之組成物中之半燒成水滑石的量,只要發揮本發明之效果時,即無特別限定,但是組成物全體中,以10~70質量%為佳,更佳為25~60質量%,又更佳為30~50質量%。半燒成水滑石係吸濕性能優異,故其量增加時,所得之硬化物的水分遮斷性提高。但是其量超過70質量%時,產生組成物之黏度上昇,潤濕性降低,導致封裝對象之基板等與組成物之密著性降低,硬化物的強度降低,變脆等問題的傾向。又,因半燒成水滑石之層間水,封裝層(亦即,硬化物)中之水分量變多,故例如有機EL裝置之製造中,因封裝層中之水分所致,對發光材料(發光層)或電極層之不良影響明顯,有初期階段之暗點發生變多等的疑慮。The amount of the semi-calcined hydrotalcite in the composition of the present invention is not particularly limited as long as the effect of the present invention is exhibited, but the entire composition is preferably 10 to 70% by mass, more preferably 25 to 60% by mass. %, And more preferably 30 to 50% by mass. The semi-calcined hydrotalcite is excellent in moisture absorption performance, so when the amount is increased, the moisture blocking property of the obtained hardened product is improved. However, when the amount exceeds 70% by mass, the viscosity of the composition increases, and the wettability decreases, which causes problems such as a decrease in adhesion between the substrate to be packaged and the composition, a decrease in the strength of the hardened material, and brittleness. In addition, since the interlayer water of the semi-fired hydrotalcite increases the amount of water in the encapsulation layer (that is, the hardened material), for example, in the manufacture of organic EL devices, due to the moisture in the encapsulation layer, the light-emitting material (light emitting Layer) or the electrode layer, and there is a concern that dark spots may increase in the initial stage.

本發明之組成物,在不阻礙本發明之效果時,也可包含未燒成水滑石。其量係在組成物全體中,較佳為0~20質量%,更佳為0。亦即,本發明之組成物不包含未燒成水滑石最佳。未燒成水滑石不會影響組成物之硬化物的透過率,但是就水分含量大,因增量可看見水分遮蔽性降低,例如其量超過質量%時,與半燒成水滑石同樣,初期階段之暗點發生有變多等的疑慮。半燒成水滑石:未燒成水滑石的質量比,較佳為70:30~100:0。The composition of the present invention may contain uncalcined hydrotalcite if the effect of the present invention is not hindered. The amount is in the entire composition, preferably 0 to 20% by mass, and more preferably 0. That is, it is preferable that the composition of the present invention does not contain unfired hydrotalcite. Uncalcined hydrotalcite does not affect the transmittance of the hardened material of the composition, but the moisture content is reduced due to the increase in moisture content. For example, when the amount exceeds the mass%, it is the same as semi-calcined hydrotalcite. Initially, There are many doubts about the dark spots of the stage. The mass ratio of semi-calcined hydrotalcite: uncalcined hydrotalcite is preferably 70:30 to 100: 0.

半燒成水滑石,可列舉例如「DHT-4C」(協和化學工業公司製、平均粒徑:400nm)、「DHT-4A-2」(協和化學工業公司製、平均粒徑:400nm)等。而燒成水滑石,可列舉例如「KW-2200」(協和化學工業公司製、平均粒徑:400nm)等,未燒成水滑石可列舉例如「DHT-4A」(協和化學工業公司製、平均粒徑:400nm)等。Examples of the semi-calcined hydrotalcite include "DHT-4C" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm), "DHT-4A-2" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm), and the like. Examples of the calcined hydrotalcite include "KW-2200" (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm). Examples of the uncalcined hydrotalcite include "DHT-4A" (manufactured by Kyowa Chemical Industry Co., Ltd.). Particle size: 400 nm).

<自由基聚合起始劑>   本發明之組成物係包含自由基聚合起始劑。自由基聚合起始劑,可為僅1種,也可為2種以上。自由基聚合起始劑,可為光自由基聚合起始劑,也可為熱自由基聚合起始劑。亦即,自由基聚合起始劑係光自由基聚合起始劑及/或熱自由基聚合起始劑。自由基聚合起始劑,較佳為光自由基聚合起始劑或熱自由基聚合起始劑。光自由基聚合起始劑及熱自由基聚合起始劑,均可為僅1種,也可為2種以上。<Radical polymerization initiator> The composition system of this invention contains a radical polymerization initiator. The radical polymerization initiator may be only one kind, or two or more kinds. The radical polymerization initiator may be a photo radical polymerization initiator or a thermal radical polymerization initiator. That is, the radical polymerization initiator is a photo radical polymerization initiator and / or a thermal radical polymerization initiator. The radical polymerization initiator is preferably a photo radical polymerization initiator or a thermal radical polymerization initiator. Each of a photoradical polymerization initiator and a thermal radical polymerization initiator may be only one kind, and may be two or more kinds.

光自由基聚合起始劑,可列舉例如,苯乙酮、二乙氧基苯乙酮、2-[4-(甲基硫基)甲基-1-苯基]-2-嗎啉基丙酮、苯偶因、苯偶因乙醚、苄基甲基縮醛、二苯甲酮、2-乙基蒽醌、噻噸酮、二乙基噻噸酮、2,4,6-三甲基苯甲醯基二苯基氧化磷、2,4,6-三甲基苯甲醯基二苯基乙氧基氧化磷、雙(2,4,6-三甲基苯甲醯基)苯基氧化磷、2-羥基-2-甲基-1-苯基丙烷-1-酮、4-(2-羥基乙氧基)苯基(2-羥基-2-丙基)酮、1-羥基環己基苯基酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、1-(4-十二烷基苯基)-2-羥基-2-甲基丙烷-1-酮、2-甲基-2-嗎啉基(4-硫代甲基苯基)丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、N,N’-八亞甲基雙吖啶、丙烯醯基二苯甲酮、2-(苯甲醯氧基亞胺基)-1-[4’-(苯硫基)苯基]-1-辛酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥基-環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥基乙氧基)苯基]-2-甲基-1-丙烷-1-酮、2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)-苄基]苯基}-2-甲基丙烷-1-酮、苯甲醯甲酸甲基酯、2-甲基-1-[4-(甲基硫基)苯基]-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-二甲基胺基-2-(4-甲基苄基)-1-(4-嗎啉-4-苯基)-丁酮、雙(2,4,6-三甲基苯甲醯基)苯基膦氧化物、2,4,6-三甲基苯甲醯基-二苯基膦氧化物、雙(η5 -2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)苯基)鈦、1-[4-(苯硫基)苯基]-1,2-辛烷二酮 2-(O-苯甲醯肟)、1-[6-(2-甲基苯甲醯基)-9-乙基-9H-咔唑-3-基]乙酮O-乙醯氧基肟等。Examples of the photoradical polymerization initiator include acetophenone, diethoxyacetophenone, 2- [4- (methylthio) methyl-1-phenyl] -2-morpholinylacetone Benzoin, benzoin ether, benzylmethyl acetal, benzophenone, 2-ethylanthraquinone, thioxanthone, diethylthioxanthone, 2,4,6-trimethylbenzene Formamyl diphenyl phosphorus oxide, 2,4,6-trimethylbenzyl diphenylethoxy phosphorus oxide, bis (2,4,6-trimethylbenzyl) phenyl oxide Phosphorus, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) one, 1-hydroxycyclohexyl Phenyl ketone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropane-1-one, 1- (4-dodecylphenyl) -2-hydroxy-2-methyl Propane-1-one, 2-methyl-2-morpholinyl (4-thiomethylphenyl) propane-1-one, 2-benzyl-2-dimethylamino-1- (4 -Morpholinylphenyl) -butanone, N, N'-octamethylenebisacridine, allyl benzophenone, 2- (benzyloxyimino) -1- [4 ' -(Phenylthio) phenyl] -1-octanone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexylphenyl ketone, 2- Hydroxy-2-methyl-1-phenylpropane-1-one, 1- [4 -(2-hydroxyethoxy) phenyl] -2-methyl-1-propane-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propanone) ) -Benzyl] phenyl} -2-methylpropane-1-one, benzoic acid methyl ester, 2-methyl-1- [4- (methylthio) phenyl] -2- Morpholinylpropane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinylphenyl) -butanone, 2-dimethylamino-2- (4- Methylbenzyl) -1- (4-morpholine-4-phenyl) -butanone, bis (2,4,6-trimethylbenzyl) phenylphosphine oxide, 2,4,6 -Trimethylbenzylidene-diphenylphosphine oxide, bis (η 5 -2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrole 1-yl) phenyl) titanium, 1- [4- (phenylthio) phenyl] -1,2-octanedione 2- (O-benzidineoxime), 1- [6- (2 -Methylbenzylidene) -9-ethyl-9H-carbazol-3-yl] ethanone O-acetamidooxime and the like.

光自由基聚合起始劑之市售品,可列舉例如,IGM Resins公司製「Omnirad651」、「Omnirad184」、「Omnirad1173」、「Omnirad500」、「Omnirad2959」、「Omnirad127」、「Omnirad754」、「Omnirad907」「Omnirad369」、「Omnirad379」、「Omnirad819」、「OmniradTPO」、「Omnirad784」、BASF公司製「Irgacure OXE-01」、「Irgacure OXE-02」等。Examples of commercially available photoradical polymerization initiators include "Omnirad651", "Omnirad184", "Omnirad1173", "Omnirad500", "Omnirad2959", "Omnirad127", "Omnirad754", "Omnirad907" manufactured by IGM Resins. "Omnirad369", "Omnirad379", "Omnirad819", "OmniradTPO", "Omnirad784", "Irgacure OXE-01", "Irgacure OXE-02" made by BASF, etc.

熱自由基聚合起始劑,可列舉例如偶氮化合物、有機過氧化物等。   偶氮化合物,可列舉例如2,2’-偶氮雙(異丁腈)、2,2’-偶氮雙(2,4-二甲基戊腈)、2,2’-偶氮雙(2-甲基丁腈)、4,4’-偶氮雙(4-氰基戊酸)、2,2’-偶氮雙(2-甲基)二鹽酸鹽、1,1’-偶氮雙(1-乙醯氧基-1-苯基乙烷、1,1’-偶氮雙(環己烷-1-甲腈)、二甲基2,2’-偶氮雙(異丁酸酯)、2,2’-偶氮雙(4-甲氧基-2,4-二甲基戊腈)、2,2’-偶氮雙(2-甲基丙腈)、2,2’-偶氮雙(2-甲基丁腈)、1-[(1-氰基-1-甲基乙基)偶氮]甲醯胺、2-苯基偶氮-4-甲氧基-2,4-二甲基戊腈、二甲基 2,2’-偶氮雙(2-甲基丙酸酯)、2,2’-偶氮雙(N-丁基-2-甲基丙醯胺等。Examples of the thermal radical polymerization initiator include azo compounds and organic peroxides. Examples of the azo compound include 2,2'-azobis (isobutyronitrile), 2,2'-azobis (2,4-dimethylvaleronitrile), and 2,2'-azobis ( 2-methylbutyronitrile), 4,4'-azobis (4-cyanovaleric acid), 2,2'-azobis (2-methyl) dihydrochloride, 1,1'-couple Azobis (1-acetamido-1-phenylethane, 1,1'-azobis (cyclohexane-1-carbonitrile), dimethyl2,2'-azobis (isobutyl Acid ester), 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis (2-methylpropionitrile), 2,2 '-Azobis (2-methylbutyronitrile), 1-[(1-cyano-1-methylethyl) azo] formamidine, 2-phenylazo-4-methoxy- 2,4-dimethylvaleronitrile, dimethyl 2,2'-azobis (2-methylpropionate), 2,2'-azobis (N-butyl-2-methylpropane) Amidine and so on.

有機過氧化物,可列舉例如過氧化苯甲醯基、tert-丁基氫過氧化物、異丙苯氫過氧化物、二-tert-丁基過氧化物、甲基乙基酮過氧化物、1,1-二(t-己基過氧)環己烷、2,2-二(t-丁基過氧)丁烷、n-丁基 4,4-二(t-丁基過氧)特戊酸酯、2,2-二(4,4-二(t-丁基過氧)環己基)丙烷、p-薄荷烷氫過氧化物、二異丙氧基苯過氧化物、1,1,3,3-四甲基丁基氫過氧化物、異丙苯氫過氧化物、t-丁基氫過氧化物、二(2-t-丁基過氧異丙基)苯、二枯基過氧化物、2,5-二甲基-2,5-二(t-丁基過氧)己烷、t-丁基枯基過氧化物、二-t-己基過氧化物、2,5-二甲基-2,5-二(t-丁基過氧)己烷-3、二異丁醯基過氧化物、二(3,5,5-t-甲基己醯基)過氧化物、二月桂醯基過氧化物、二琥珀酸過氧化物、二(3-甲基苯甲醯基)過氧化物、二過氧化苯甲醯、二-n-丙基過氧碳酸酯、二-異丙基過氧二碳酸酯、二(4-t-丁基環己基)過氧碳酸酯、二(2-乙基己基)過氧碳酸酯、二-sec-丁基過氧碳酸酯、枯基過氧新癸酸酯、1,1,3,3-四甲基丁基過氧新癸酸酯、t-己基過氧新癸酸酯、t-丁基過氧新癸酸酯、t-己基過氧三甲基乙酸酯、t-丁基過氧三甲基乙酸酯、1,1,3,3-四甲基丁基過氧ー2-乙基己酸酯、2,5-二甲基-2,5-二(t-乙基己醯基過氧)己烷、t-己基過氧-2-乙基己酸酯、t-丁基過氧-2-乙基己酸酯、t-己基過氧異丙基單碳酸酯、t-丁基過氧-3,5,5-三甲基己酸酯、t-丁基過氧月桂酸酯、t-丁基過氧異丙基單碳酸酯、t-丁基過氧-2-乙基己基單碳酸酯、t-己基過氧苯甲酸酯、2,5-二甲基-2,5-二(苯甲醯基過氧)己烷、t-丁基過氧乙酸酯、t-丁基過氧-3-甲基苯甲酸酯與過氧苯酸第三丁酯之混合物、過氧苯酸第三丁酯、t-丁基過氧烯丙基單碳酸酯、3,3’,4,4’-四(t-丁基過氧羰基)二苯甲酮等。Examples of the organic peroxide include benzyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide, di-tert-butyl peroxide, and methyl ethyl ketone peroxide. , 1,1-bis (t-hexylperoxy) cyclohexane, 2,2-bis (t-butylperoxy) butane, n-butyl4,4-bis (t-butylperoxy) Pivalate, 2,2-bis (4,4-bis (t-butylperoxy) cyclohexyl) propane, p-menthane hydroperoxide, diisopropoxybenzene peroxide, 1, 1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, t-butyl hydroperoxide, bis (2-t-butylperoxyisopropyl) benzene, di Cumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, t-butylcumyl peroxide, di-t-hexyl peroxide, 2 , 5-dimethyl-2,5-bis (t-butylperoxy) hexane-3, diisobutylfluorenyl peroxide, bis (3,5,5-t-methylhexyl) peroxide Compounds, dilauryl methoxide, disuccinic acid peroxide, bis (3-methylbenzyl) peroxide, benzamidine dioxide, di-n-propyl peroxycarbonate, Di-isopropylperoxydicarbonate, bis (4-t-butylcyclohexyl) peroxycarbonic acid Ester, bis (2-ethylhexyl) peroxycarbonate, di-sec-butylperoxycarbonate, cumylperoxyneodecanate, 1,1,3,3-tetramethylbutylperoxy Neodecanoate, t-hexylperoxynedecanoate, t-butylperoxynedecanoate, t-hexylperoxytrimethylacetate, t-butylperoxytrimethylacetate , 1,1,3,3-tetramethylbutylperoxyfluoren-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (t-ethylhexylperoxy) hexyl Alkane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-hexylperoxyisopropylmonocarbonate, t-butylperoxy- 3,5,5-trimethylhexanoate, t-butylperoxylaurate, t-butylperoxyisopropylmonocarbonate, t-butylperoxy-2-ethylhexylmonocarbonate Ester, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-bis (benzylideneperoxy) hexane, t-butylperoxyacetate, t-butyl Mixture of peroxy-3-methylbenzoate and third butyl peroxybenzoate, third butyl peroxybenzoate, t-butylperoxyallyl monocarbonate, 3,3 ', 4,4'-tetra (t-butylperoxycarbonyl) benzophenone and the like.

熱自由基聚合起始劑之市售品,可列舉例如和光純藥工業公司製「AIBN」(2,2’-偶氮雙(異丁腈))、「V-40」(1,1’-偶氮雙(環己烷-1-甲腈)、「VAm-110」(2,2’-偶氮雙(N-丁基-2-甲基丙醯胺)、「V-601」(二甲基2,2’-偶氮雙(異丁酸酯))、大塚化學公司製「OTAZO-15」(1,1’-偶氮雙(1-乙醯氧基-1-苯基乙烷)、「MAIB」(二甲基2,2’-偶氮二異丁酸酯)等。Commercial products of the thermal radical polymerization initiator include, for example, "AIBN" (2,2'-azobis (isobutyronitrile)), "V-40" (1,1 ') manufactured by Wako Pure Chemical Industries, Ltd. -Azobis (cyclohexane-1-carbonitrile), "VAm-110" (2,2'-Azobis (N-butyl-2-methylpropanamide), "V-601" ( Dimethyl 2,2'-azobis (isobutyrate)), "OTAZO-15" (1,1'-azobis (1-ethoxyl-1-phenylethyl), manufactured by Otsuka Chemical Co., Ltd. Alkane), "MAIB" (dimethyl 2,2'-azobisisobutyrate) and the like.

自由基聚合起始劑之量係相對於「具有乙烯性不飽和基的化合物」100質量份,較佳為0.5~10質量份,更佳為0.5~8質量份,又更佳為0.5~6質量份。在此,「具有乙烯性不飽和基的化合物」係如前述,包含「多官能乙烯性不飽和化合物」及「單官能乙烯性不飽和化合物」。The amount of the radical polymerization initiator is preferably 0.5 to 10 parts by mass, more preferably 0.5 to 8 parts by mass, and still more preferably 0.5 to 6 parts with respect to 100 parts by mass of the "compound having an ethylenically unsaturated group". Parts by mass. Here, the "compound having an ethylenically unsaturated group" refers to the "multifunctional ethylenically unsaturated compound" and the "monofunctional ethylenically unsaturated compound" as described above.

使用光自由基聚合起始劑時,其量係相對於「具有乙烯性不飽和基的化合物」100質量份,較佳為0.5~10質量份,更佳為0.5~8質量份,又更佳為0.5~6質量份。When a photoradical polymerization initiator is used, the amount is preferably 0.5 to 10 parts by mass, more preferably 0.5 to 8 parts by mass, and more preferably 100 parts by mass of the "compound having an ethylenically unsaturated group". It is 0.5 to 6 parts by mass.

使用熱自由基聚合起始劑時,其量係相對於「具有乙烯性不飽和基的化合物」100質量份,較佳為0.5~10質量份,更佳為0.5~8質量份,又更佳為0.5~6質量份。When a thermal radical polymerization initiator is used, the amount is preferably 0.5 to 10 parts by mass, more preferably 0.5 to 8 parts by mass, and more preferably 100 parts by mass of the "compound having an ethylenically unsaturated group". It is 0.5 to 6 parts by mass.

<其他之成分>   本發明之組成物,在不損及其效果的範圍內,也可含有與上述成分不同之其他的成分。<Other components> 之 The composition of the present invention may contain other components different from those described above, as long as the effect is not impaired.

本發明之組成物,為了抑制硬化物之收縮等之目的,也可含有環氧樹脂。環氧樹脂可為僅1種,也可為2種以上。1分子中具有1個環氧基之環氧樹脂有時簡稱為「單官能環氧樹脂」,1分子中具有2個環氧基之環氧樹脂有時簡稱為「2官能環氧樹脂」。1分子中具有3個以上之環氧基之環氧樹脂也同樣簡稱。The composition of the present invention may contain an epoxy resin for the purpose of suppressing shrinkage of the cured product and the like. The epoxy resin may be only one kind, or two or more kinds. An epoxy resin having one epoxy group in one molecule is sometimes referred to as "monofunctional epoxy resin", and an epoxy resin having two epoxy groups in one molecule is sometimes referred to as "bifunctional epoxy resin". An epoxy resin having three or more epoxy groups in one molecule is similarly abbreviated.

如上述,1分子中具有1個以上之環氧基及2個以上之乙烯性不飽和基的化合物,可作為本發明中之多官能乙烯性不飽和化合物產生功能,故本發明中,被分類成上述多官能乙烯性不飽和化合物。又,如上述,1分子中具有1個以上之環氧基及1個乙烯性不飽和基的化合物,在本發明中,被分類為單官能乙烯性不飽和化合物。As described above, a compound having one or more epoxy groups and two or more ethylenically unsaturated groups in one molecule can function as a polyfunctional ethylenically unsaturated compound in the present invention. Therefore, in the present invention, it is classified It becomes the above-mentioned polyfunctional ethylenically unsaturated compound. As described above, a compound having one or more epoxy groups and one ethylenically unsaturated group in one molecule is classified as a monofunctional ethylenically unsaturated compound in the present invention.

環氧樹脂可列舉例如,氫化環氧樹脂(氫化雙酚A型環氧樹脂、氫化雙酚F型環氧樹脂等)、含氟環氧樹脂、鏈狀脂肪族型環氧樹脂、環狀脂肪族型環氧樹脂、雙酚A型環氧樹脂、聯苯型環氧樹脂、聯苯基芳烷基型環氧樹脂、萘酚型環氧樹脂、萘型環氧樹脂、雙酚F型環氧樹脂、含磷環氧樹脂、雙酚S型環氧樹脂、芳香族環氧丙基胺型環氧樹脂(例如、四環氧丙基二胺基二苯基甲烷、三環氧丙基-p-胺基苯酚、二環氧丙基甲苯胺、二環氧丙基苯胺等)、脂環式環氧樹脂、苯酚酚醛清漆型環氧樹脂、甲酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂、具有丁二烯構造之環氧樹脂、雙酚之二環氧丙醚化物、萘二酚之二環氧丙醚化物、酚類之二環氧丙醚化物、及醇類之二環氧丙醚化物、及此等之環氧樹脂之烷基取代體等。Examples of the epoxy resin include a hydrogenated epoxy resin (hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, etc.), a fluorine-containing epoxy resin, a chain aliphatic epoxy resin, and a cyclic fat. Family epoxy resin, bisphenol A epoxy resin, biphenyl epoxy resin, biphenylaralkyl epoxy resin, naphthol epoxy resin, naphthalene epoxy resin, bisphenol F ring Oxygen resin, phosphorus-containing epoxy resin, bisphenol S-type epoxy resin, aromatic epoxypropylamine type epoxy resin (e.g., tetraglycidylaminodiphenylmethane, triglycidyl- p-aminophenol, diglycidyl toluidine, diglycidyl aniline, etc.), alicyclic epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol A phenolic Varnish-type epoxy resin, epoxy resin with butadiene structure, diglycidyl etherate of bisphenol, diglycidyl etherate of naphthalenediol, diglycidyl etherate of phenols, and alcohols Dipropylene oxide ethers, and alkyl substituents of these epoxy resins.

環氧樹脂之環氧當量,就反應性等的觀點,較佳為50~1,000,更佳為50~750,又更佳為100~750,又特佳為100~500。又,「環氧當量」係指包含1克當量之環氧基之樹脂之克數(g/eq),可依據JIS K 7236所規定的方法測量。The epoxy equivalent of the epoxy resin is preferably 50 to 1,000, more preferably 50 to 750, still more preferably 100 to 750, and particularly preferably 100 to 500 from the viewpoint of reactivity and the like. The "epoxy equivalent" refers to the gram number (g / eq) of a resin containing 1 gram equivalent of an epoxy group, and can be measured in accordance with a method prescribed by JIS K 7236.

環氧樹脂,較佳為選自氫化環氧樹脂、含氟環氧樹脂、鏈狀脂肪族型環氧樹脂、及環狀脂肪族型環氧樹脂之1種以上,更佳為選自氫化環氧樹脂、含氟環氧樹脂、及環狀脂肪族型環氧樹脂之1種以上,又更佳為選自氫化環氧樹脂及環狀脂肪族型環氧樹脂之1種以上。在此,「氫化環氧樹脂」係指含有芳香環之環氧樹脂進行氫化所得的環氧樹脂。氫化環氧樹脂之氫化率,較佳為50%以上,更佳為70%以上。「鏈狀脂肪族型環氧樹脂」係指具有直鏈狀或分支狀之烷基鏈、或烷醚鏈的環氧樹脂,「環狀脂肪族型環氧樹脂」係指分子內具有環狀脂肪族骨架,例如環烷骨架的環氧樹脂。The epoxy resin is preferably one or more selected from hydrogenated epoxy resin, fluorine-containing epoxy resin, chain aliphatic epoxy resin, and cyclic aliphatic epoxy resin, and more preferably selected from hydrogenated ring One or more kinds of oxygen resin, fluorine-containing epoxy resin, and cyclic aliphatic epoxy resin, and more preferably one or more kinds selected from hydrogenated epoxy resin and cyclic aliphatic epoxy resin. Here, the "hydrogenated epoxy resin" refers to an epoxy resin obtained by hydrogenating an epoxy resin containing an aromatic ring. The hydrogenation rate of the hydrogenated epoxy resin is preferably 50% or more, and more preferably 70% or more. "Chained aliphatic epoxy resin" refers to an epoxy resin having a linear or branched alkyl chain or alkyl ether chain, and "cyclic aliphatic epoxy resin" refers to a cyclic molecule in the molecule. Aliphatic backbones, such as epoxy resins with a naphthenic backbone.

氫化雙酚A型環氧樹脂,可列舉例如,液狀氫化雙酚A型環氧樹脂(例如、「YX8000」(三菱化學公司製、環氧當量:約205)、「Denacol EX-252」(nagasechemtex公司製、環氧當量:約213))、固形氫化雙酚A型環氧樹脂(例如、「YX8040」(三菱化學公司製、環氧當量:約1000))。Examples of the hydrogenated bisphenol A epoxy resin include liquid hydrogenated bisphenol A epoxy resin (for example, "YX8000" (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: about 205)), "Denacol EX-252" ( Nagasechemtex Corporation, epoxy equivalent: about 213)), solid hydrogenated bisphenol A type epoxy resin (for example, "YX8040" (Mitsubishi Chemical Corporation, epoxy equivalent: about 1000)).

含氟環氧樹脂,例如可使用WO2011/089947所記載之含氟環氧樹脂。As the fluorine-containing epoxy resin, for example, the fluorine-containing epoxy resin described in WO2011 / 089947 can be used.

鏈狀脂肪族型環氧樹脂,可列舉例如,聚丙三醇聚環氧丙醚(例如、「Denacol EX-512」、「Denacol EX-521」、nagasechemtex公司製)、季戊四醇聚環氧丙醚(例如、「Denacol EX-411」、nagasechemtex公司製)、二丙三醇聚環氧丙醚(例如、「Denacol EX-421」、nagasechemtex公司製)、丙三醇聚環氧丙醚(例如、「Denacol EX-313」、「Denacol EX-314」、nagasechemtex公司製)、三羥甲基丙烷聚環氧丙醚(例如、「Denacol EX-321」、nagasechemtex公司製)、新戊二醇二環氧丙醚(例如、「Denacol EX-211」、nagasechemtex公司製)、1,6-己二醇二環氧丙醚(例如、「Denacol EX-212」、nagasechemtex公司製)、乙二醇二環氧丙醚(例如、「Denacol EX-810」、「Denacol EX-811」、nagasechemtex公司製)、二乙二醇二環氧丙醚(例如、「Denacol EX-850」、「Denacol EX-851」、nagasechemtex公司製)、聚乙二醇二環氧丙醚(例如、「Denacol EX-821」、「Denacol EX-830」、「Denacol EX-832」、「Denacol EX-841」、「Denacol EX-861」、nagasechemtex公司製)、丙二醇二環氧丙醚(例如、「Denacol EX-911」、nagasechemtex公司製)、聚丙二醇二環氧丙醚(例如、「Denacol EX-941」、「Denacol EX-920」、「Denacol EX-931」、nagasechemtex公司製)等。Examples of the chain aliphatic epoxy resin include polyglycerol polyglycidyl ether (for example, "Denacol EX-512", "Denacol EX-521", manufactured by Nagasechemtex), pentaerythritol polyglycidyl ether ( For example, "Denacol EX-411", manufactured by nagasechemtex), diglycerol polyglycidyl ether (e.g., "Denacol EX-421", manufactured by nagasechemtex), glycerol polyglycidyl ether (e.g., " Denacol EX-313 '', `` Denacol EX-314 '', manufactured by nagasechemtex), trimethylolpropane polyoxypropylene ether (e.g., `` Denacol EX-321 '', manufactured by nagasechemtex), neopentyl glycol diepoxy Propylene ether (for example, "Denacol EX-211", manufactured by Nagasechemtex), 1,6-hexanediol diglycidyl ether (for example, "Denacol EX-212", manufactured by Nagasechemtex), ethylene glycol diepoxy Propyl ether (e.g., "Denacol EX-810", "Denacol EX-811", manufactured by nagasechemtex), diethylene glycol diglycidyl ether (e.g., "Denacol EX-850", "Denacol EX-851", (manufactured by Nagasechemtex), polyethylene glycol diglycidyl ether (e.g., "Denacol EX-821", "Denacol EX-830" , "Denacol EX-832", "Denacol EX-841", "Denacol EX-861", manufactured by nagasechemtex), propylene glycol diglycidyl ether (e.g., "Denacol EX-911", manufactured by nagasechemtex), polypropylene glycol Dipropylene oxide (for example, "Denacol EX-941", "Denacol EX-920", "Denacol EX-931", manufactured by Nagasechemtex), and the like.

環狀脂肪族型環氧樹脂,可列舉例如DAICEL化學工業公司製「EHPE-3150」等。Examples of the cyclic aliphatic epoxy resin include "EHPE-3150" manufactured by DAICEL Chemical Industries, Ltd. and the like.

使用環氧樹脂時,其量係在組成物全體中,較佳為5~40質量%,更佳為5~35質量%,又更佳為5~30質量%。When an epoxy resin is used, the amount is 5 to 40% by mass, more preferably 5 to 35% by mass, and still more preferably 5 to 30% by mass in the entire composition.

本發明之組成物可含有光致陽離子聚合引發劑。光致陽離子聚合引發劑,可為僅1種,也可為2種以上。The composition of the present invention may contain a photocationic polymerization initiator. The photocationic polymerization initiator may be only one kind, or two or more kinds.

光致陽離子聚合引發劑,可列舉例如芳香族鋶鹽、芳香族錪鹽、芳香族重氮鎓鹽、芳香族銨鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe鹽等。Examples of the photocationic polymerization initiator include aromatic sulfonium salts, aromatic sulfonium salts, aromatic diazonium salts, aromatic ammonium salts, (2,4-cyclopentadien-1-yl) ((1- Methylethyl) benzene) -Fe salts and the like.

芳香族鋶鹽,可列舉例如雙(4-(二苯基二氫硫基)苯基)硫醚雙六氟磷酸鹽、雙(4-(二苯基二氫硫基)苯基)硫醚雙六氟銻酸鹽、雙(4-(二苯基二氫硫基)苯基)硫醚雙四氟硼酸鹽、雙(4-(二苯基二氫硫基)苯基)硫醚四(五氟苯基)硼酸鹽、二苯基-4-(苯硫基)苯基鋶六氟磷酸酯、二苯基-4-(苯硫基)苯基鋶六氟銻酸鹽、二苯基-4-(苯硫基)苯基鋶四氟硼酸鹽、二苯基-4-(苯硫基)苯基鋶四(五氟苯基)硼酸鹽、三苯基鋶六氟磷酸鹽、三苯基鋶六氟銻酸鹽、三苯基鋶四氟硼酸鹽、三苯基鋶四(五氟苯基)硼酸鹽、雙(4-(二(4-(2-羥基乙氧基))苯基二氫硫基)苯基)硫醚雙六氟磷酸鹽、雙(4-(二(4-(2-羥基乙氧基))苯基二氫硫基)苯基)硫醚雙六氟銻酸鹽、雙(4-(二(4-(2-羥基乙氧基))苯基二氫硫基)苯基)硫醚雙四氟硼酸鹽、雙(4-(二(4-(2-羥基乙氧基))苯基二氫硫基)苯基)硫醚四(五氟苯基)硼酸鹽等。Examples of the aromatic sulfonium salt include bis (4- (diphenyldihydrothio) phenyl) sulfide, dihexafluorophosphate, and bis (4- (diphenyldihydrothio) phenyl) sulfide. Bishexafluoroantimonate, bis (4- (diphenyldihydrothio) phenyl) sulfide, bistetrafluoroborate, bis (4- (diphenyldihydrothio) phenyl) sulfide, tetra (Pentafluorophenyl) borate, diphenyl-4- (phenylthio) phenylsulfonium hexafluorophosphate, diphenyl-4- (phenylthio) phenylsulfonium hexafluoroantimonate, diphenyl 4- (phenylthio) phenylsulfonium tetrafluoroborate, diphenyl-4- (phenylthio) phenylsulfonium tetra (pentafluorophenyl) borate, triphenylsulfonium hexafluorophosphate, Triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrafluoroborate, triphenylsulfonium tetrakis (pentafluorophenyl) borate, bis (4- (bis (4- (2-hydroxyethoxy)) ) Phenyldihydrothio) phenyl) sulfide bishexafluorophosphate, bis (4- (bis (4- (2-hydroxyethoxy)) phenyldihydrothio) phenyl) sulfide bis Hexafluoroantimonate, bis (4- (bis (4- (2-hydroxyethoxy)) phenyldihydrothio) phenyl) sulfide, bistetrafluoroborate, bis (4- (bis (4 -(2-hydroxyethoxy)) phenyldihydrothio) phenyl) sulfide tetrakis (pentafluorophenyl) borate and the like.

芳香族錪鹽,可列舉例如二苯基錪六氟磷酸鹽、二苯基錪六氟銻酸鹽、二苯基錪四氟硼酸鹽、二苯基錪四(五氟苯基)硼酸鹽、雙(十二烷基苯基)錪六氟磷酸鹽、雙(十二烷基苯基)錪六氟銻酸鹽、雙(十二烷基苯基)錪四氟硼酸鹽、雙(十二烷基苯基)錪四(五氟苯基)硼酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪六氟磷酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪六氟銻酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪四氟硼酸鹽、4-甲基苯基-4-(1-甲基乙基)苯基錪四(五氟苯基)硼酸鹽等。Examples of the aromatic sulfonium salt include diphenylsulfonium hexafluorophosphate, diphenylsulfonium hexafluoroantimonate, diphenylsulfonium tetrafluoroborate, diphenylsulfonium tetrakis (pentafluorophenyl) borate, Bis (dodecylphenyl) fluorene hexafluorophosphate, bis (dodecylphenyl) fluorene hexafluoroantimonate, bis (dodecylphenyl) fluorene tetrafluoroborate, bis (dodecyl Alkylphenyl) fluorene tetrakis (pentafluorophenyl) borate, 4-methylphenyl-4- (1-methylethyl) phenylfluorene hexafluorophosphate, 4-methylphenyl-4- (1-methylethyl) phenylsulfonium hexafluoroantimonate, 4-methylphenyl-4- (1-methylethyl) phenylsulfonium tetrafluoroborate, 4-methylphenyl-4 -(1-methylethyl) phenylphosphonium tetrakis (pentafluorophenyl) borate and the like.

芳香族重氮鎓鹽,可列舉例如苯基重氮鎓六氟磷酸鹽、苯基重氮鎓六氟銻酸鹽、苯基重氮鎓四氟硼酸鹽、苯基氮鎓四(五氟苯基)硼酸鹽等。Examples of the aromatic diazonium salt include phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoroantimonate, phenyldiazonium tetrafluoroborate, and phenylazonium tetrakis (pentafluorobenzene). Group) borate and the like.

芳香族銨鹽,可列舉例如1-苄基-2-氰基吡啶鎓六氟磷酸鹽、1-苄基-2-氰基吡啶鎓六氟銻酸鹽、1-苄基-2-氰基吡啶鎓四氟硼酸鹽、1-苄基-2-氰基吡啶鎓四(五氟苯基)硼酸鹽、1-(萘基甲基)-2-氰基吡啶鎓六氟磷酸鹽、1-(萘基甲基)-2-氰基吡啶鎓六氟銻酸鹽、1-(萘基甲基)-2-氰基吡啶鎓四氟硼酸鹽、1-(萘基甲基)-2-氰基吡啶鎓四(五氟苯基)硼酸鹽等。Examples of the aromatic ammonium salt include 1-benzyl-2-cyanopyridinium hexafluorophosphate, 1-benzyl-2-cyanopyridinium hexafluoroantimonate, and 1-benzyl-2-cyano Pyridinium tetrafluoroborate, 1-benzyl-2-cyanopyridinium tetra (pentafluorophenyl) borate, 1- (naphthylmethyl) -2-cyanopyridinium hexafluorophosphate, 1- (Naphthylmethyl) -2-cyanopyridinium hexafluoroantimonate, 1- (naphthylmethyl) -2-cyanopyridinium tetrafluoroborate, 1- (naphthylmethyl) -2- Cyanopyridinium tetra (pentafluorophenyl) borate and the like.

(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe鹽,可列舉例如(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe(II)六氟磷酸鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe(II)六氟銻酸鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe(II)四氟硼酸鹽、(2,4-環戊二烯-1-基)((1-甲基乙基)苯)-Fe(II)四(五氟苯基)硼酸鹽等。Examples of (2,4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe salt include (2,4-cyclopentadien-1-yl) ((1- (Methylethyl) benzene) -Fe (II) hexafluorophosphate, (2,4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe (II) hexafluoroantimony Acid salt, (2,4-cyclopentadien-1-yl) ((1-methylethyl) benzene) -Fe (II) tetrafluoroborate, (2,4-cyclopentadiene-1- Group) ((1-methylethyl) benzene) -Fe (II) tetrakis (pentafluorophenyl) borate and the like.

光致陽離子聚合引發劑之市售品,可列舉例如ADEKA公司製「SP-150」、「SP-170」、「SP-082」、「SP-103」、san-apro公司製「CPI-100P」、「CPI-101A」、「CPI-200K」、IGM resins公司製「Omnirad270」、「Omnirad290」等。Examples of commercially available photocationic polymerization initiators include "SP-150", "SP-170", "SP-082", "SP-103", and "CPI-100P" manufactured by San-apro Corporation. "," CPI-101A "," CPI-200K "," Omnirad270 "and" Omnirad290 "made by IGM resins.

使用光致陽離子聚合引發劑時,其量係相對於具有環氧基之化合物之合計(例如具有環氧基之(甲基)丙烯酸酯及環氧樹脂之合計)100質量份,較佳為0.5~10質量份,更佳為1.0~8質量部,又更佳為2.0~6質量份。When a photocationic polymerization initiator is used, the amount is 100 parts by mass with respect to the total of the compound having an epoxy group (for example, the total of the (meth) acrylate having an epoxy group and an epoxy resin), preferably 0.5. ~ 10 parts by mass, more preferably 1.0 ~ 8 parts by mass, and even more preferably 2.0 ~ 6 parts by mass.

本發明之組成物也可含有矽烷偶合劑。矽烷偶合劑可為僅1種,也可為2種以上。The composition of the present invention may contain a silane coupling agent. The silane coupling agent may be only one kind, or two or more kinds.

矽烷偶合劑,可列舉例如3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基(二甲氧基)甲基矽烷及2-(3,4-環氧基環己基)乙基三甲氧基矽烷等之環氧系矽烷偶合劑;3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、3-巰基丙基甲基二甲氧基矽烷及11-巰基十一烷基三甲氧基矽烷等之巰基系矽烷偶合劑;3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-胺基丙基二甲氧基甲基矽烷、N-苯基-3-胺基丙基三甲氧基矽烷、N-甲基胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷及N-(2-胺基乙基)-3-胺基丙基二甲氧基甲基矽烷等之胺基系矽烷偶合劑;3-脲基丙基三乙氧基矽烷等之脲基系矽烷偶合劑;乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷及乙烯基甲基二乙氧基矽烷等之乙烯基系矽烷偶合劑;p-苯乙烯基三甲氧基矽烷等之苯乙烯基系矽烷偶合劑;3-丙烯醯氧基丙基三甲氧基矽烷及3-甲基丙烯醯氧基丙基三甲氧基矽烷等之丙烯酸酯系矽烷偶合劑;3-異氰酸酯丙基三甲氧基矽烷等之異氰酸酯系矽烷偶合劑;雙(三乙氧基矽烷基丙基)二硫醚、雙(三乙氧基矽烷基丙基)四硫醚等之硫醚系矽烷偶合劑;苯基三甲氧基矽烷、甲基丙烯醯氧基丙基三甲氧基矽烷、咪唑矽烷、三嗪矽烷等。此等之中,較佳為丙烯酸酯系矽烷偶合劑。Examples of the silane coupling agent include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, and 3-glycidoxypropyl (dimethoxy) ) Epoxy-based silane coupling agents such as methylsilane and 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethyl Mercapto-based silane coupling agents such as methoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 11-mercaptoundecyltrimethoxysilane; 3-aminopropyltrimethoxysilane, 3-amine Propyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxy Silane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, and N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane Amine-based silane coupling agents; Urea-based silane coupling agents such as 3-ureidopropyltriethoxysilane; vinyltrimethoxysilane, vinyltriethoxysilane, and vinylmethyldiethoxy Silane and other vinyl silane coupling agents; p-styryltrimethoxy Styryl-based silane coupling agents such as alkane; 3-acrylic methoxypropyltrimethoxysilane and 3-methacrylic methoxypropyltrimethoxysilane; acrylate-based silane coupling agents; 3-isocyanate Isocyanate-based silane coupling agents such as propyltrimethoxysilane; thioether-based silane coupling agents such as bis (triethoxysilylpropyl) disulfide and bis (triethoxysilylpropyl) tetrasulfide Mixture; phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, imidazolesilane, triazinesilane, etc. Among these, an acrylate-based silane coupling agent is preferred.

矽烷偶合劑之市售品,可列舉例如信越化學公司製「KBM-502」、「KBM-503」、「KBE-502」、「KBE-503」、「KBM-5103」、「KBM-5803」等。Examples of commercially available silane coupling agents include "KBM-502", "KBM-503", "KBE-502", "KBE-503", "KBM-5103", and "KBM-5803" manufactured by Shin-Etsu Chemical Co., Ltd. Wait.

使用矽烷偶合劑時,其量係在組成物全體中,較佳為0.10~5.00質量%,更佳為0.25~3.00質量%,又更佳為0.30~2.00質量%。When a silane coupling agent is used, the amount is in the entire composition, preferably 0.10 to 5.00 mass%, more preferably 0.25 to 3.00 mass%, and even more preferably 0.30 to 2.00 mass%.

本發明之組成物也可含有聚合抑制劑。聚合抑制劑可為僅1種,也可為2種以上。The composition of the present invention may contain a polymerization inhibitor. The polymerization inhibitor may be only one kind, or two or more kinds.

聚合抑制劑,可列舉例如t-丁基對苯二酚、p-苯醌、對苯二酚、p-甲氧基苯酚、N,N-二乙基羥基胺、N-亞硝基-N-苯基羥基胺銨鹽等。聚合抑制劑之市售品,可列舉例如和光純藥工業公司製「Q-1301」、「TBHQ」、「PBQ2」、「DEHA」、「MEHQ」、川崎化成工業公司製「QS-10」等。Examples of the polymerization inhibitor include t-butylhydroquinone, p-benzoquinone, hydroquinone, p-methoxyphenol, N, N-diethylhydroxylamine, and N-nitroso-N. -Phenylhydroxylamine ammonium salts and the like. Examples of commercially available polymerization inhibitors include "Q-1301", "TBHQ", "PBQ2", "DEHA", "MEHQ", and "QS-10" manufactured by Kawasaki Chemical Industries, Ltd., manufactured by Wako Pure Chemical Industries, Ltd. .

使用聚合抑制劑時,其量係相對於「具有乙烯性不飽和基的化合物」100質量份,較佳為10~200ppm,更佳為50~100ppm。又,前述「ppm」為質量基準。在此,「具有乙烯性不飽和基的化合物」係如前述,包含「多官能乙烯性不飽和化合物」及「單官能乙烯性不飽和化合物」。When a polymerization inhibitor is used, the amount is preferably 10 to 200 ppm, and more preferably 50 to 100 ppm, based on 100 parts by mass of the "compound having an ethylenically unsaturated group". The "ppm" is a mass standard. Here, the "compound having an ethylenically unsaturated group" refers to the "multifunctional ethylenically unsaturated compound" and the "monofunctional ethylenically unsaturated compound" as described above.

<硬化物層之全光線穿透率>   本發明之組成物之硬化物層(厚度:20μm)在D65光(白晝光)下之全光線穿透率,較佳為85%以上,更佳為88%以上,又更佳為90%以上。<Total light transmittance of hardened material layer> 全 The total light transmittance of the hardened material layer (thickness: 20 μm) of the composition of the present invention under D65 light (daylight) is preferably 85% or more, more preferably Above 88%, and more preferably above 90%.

硬化物層在D65光下之全光線穿透率係如後述實施例所記載,藉由在玻璃板之間形成挾著組成物之硬化物的積層體,並以空氣為參考(reference)而算出。又,上述D65光下之全光線穿透率之值係厚度為20μm之硬化物層之測量值,但是硬化物層之厚度,一般為3~200μm。The total light transmittance of the hardened material layer under D65 light is as described in the examples described later. It is calculated by forming a laminated body with a hardened material composition between the glass plates and using air as a reference. . In addition, the value of the total light transmittance under the above D65 light is a measured value of a hardened material layer having a thickness of 20 μm, but the thickness of the hardened material layer is generally 3 to 200 μm.

<硬化物層之霧度>   本發明之組成物之硬化物層(厚度:20μm)之霧度,較佳為未達3.0%。<Haze of hardened material layer> The haze of the hardened material layer (thickness: 20 μm) of the composition of the present invention is preferably less than 3.0%.

硬化物層之霧度係如後述之實施例所記載,藉由在玻璃板之間形成挾著組成物之硬化物的積層體,並以空氣為參考而算出。又,上述霧度之值係厚度為20μm之硬化物層之測量值,但是硬化物層之厚度,一般為3~200μm。The haze of the hardened material layer is as described in the examples described later, and is calculated by forming a laminated body of the hardened material with the composition between the glass plates and using air as a reference. The value of the haze is a measured value of a hardened material layer having a thickness of 20 μm, but the thickness of the hardened material layer is generally 3 to 200 μm.

全光線穿透率為85%以上,霧度未達3.0%的硬化物層可以目視辨識為透明。The total light transmittance is 85% or more, and the hardened layer with a haze of less than 3.0% can be visually recognized as transparent.

<有機EL裝置>   以本發明之組成物之硬化物封裝有機EL元件的有機EL裝置,例如可自基板上之有機EL元件上,塗佈本發明之組成物後,藉由使該組成物硬化來製造。<Organic EL device> 的 An organic EL device in which an organic EL device is encapsulated with a cured product of the composition of the present invention, for example, the composition of the present invention can be applied to the organic EL element on a substrate, and then the composition can be cured. To make.

本發明之組成物包含光自由基聚合起始劑時,硬化可藉由將紫外線照射於該組成物來進行。紫外線照射用的裝置,可列舉例如高壓水銀燈、超高壓水銀燈、金屬鹵素燈、高輸出金屬鹵素燈(metal halide lamp)、低壓水銀燈、LED光源等。紫外線照射時之組成物的溫度,較佳為20~120℃,更佳為25~110℃。紫外線之積算照射量,較佳為500~4000mJ/cm2 ,更佳為1000~3500mJ/cm2When the composition of the present invention contains a photo-radical polymerization initiator, curing can be performed by irradiating the composition with ultraviolet rays. Examples of the device for ultraviolet irradiation include high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, high-output metal halide lamps, low-pressure mercury lamps, and LED light sources. The temperature of the composition at the time of ultraviolet irradiation is preferably 20 to 120 ° C, and more preferably 25 to 110 ° C. The total amount of ultraviolet irradiation is preferably 500 to 4000 mJ / cm 2 , and more preferably 1000 to 3500 mJ / cm 2 .

本發明之組成物包含熱自由基聚合起始劑時,硬化可藉由使用乾燥機等,將該組成物加熱來進行。加熱溫度,較佳為80~120℃,更佳為100~110℃,加熱時間,較佳為15~120分鐘,更佳為30~90分鐘。此加熱可在大氣環境下進行,也可在惰性氣體(例如氮氣)環境下進行。When the composition of the present invention contains a thermal radical polymerization initiator, curing can be performed by heating the composition using a dryer or the like. The heating temperature is preferably 80 to 120 ° C, more preferably 100 to 110 ° C, and the heating time is preferably 15 to 120 minutes, and more preferably 30 to 90 minutes. This heating may be performed in an atmospheric environment, or in an inert gas (such as nitrogen) environment.

[實施例][Example]

以下舉實施例更具體說明本發明,但是本發明為不受以下實施例限制者,當然在符合上述・下述要旨的範圍內,可適當地加以變更來實施,彼等均包含於本發明之技術範圍內。   又,以下所記載之量中之「份」及飽和吸水率及熱重量減少率中之「%」,無特別記載時,分別表示「質量份」及「質量%」。又,「室溫」係指20~30℃。The present invention will be described in more detail with reference to the following examples. However, the present invention is not limited by the following examples. Of course, the present invention can be appropriately modified and implemented within a range that meets the above-mentioned gist. All of them are included in the present invention. Within technology. In addition, the "parts" in the quantities described below and the "%" in the saturated water absorption and thermal weight reduction ratios, unless otherwise noted, represent "mass parts" and "mass%", respectively. The "room temperature" means 20 to 30 ° C.

以下實施例及比較例中,作為稀釋劑使用之單官能丙烯酸酯(協榮社化學公司製「Light AcrylateIB-XA」)的黏度,在25℃之溫度條件下使用B型黏度計測量。測量結果,黏度為10mPa・s。In the following examples and comparative examples, the viscosity of a monofunctional acrylate ("Light AcrylateIB-XA" manufactured by Kyoeisha Chemical Co., Ltd.) used as a diluent was measured using a B-type viscometer at a temperature of 25 ° C. As a result, the viscosity was 10 mPa ・ s.

<實施例1>   將6官能丙烯酸酯(日本化藥公司製「KAYARAD DPCA-60」)20份、具有脂環式骨架之2官能丙烯酸酯(DAICEL-ALLNEX公司製「IRR214-K」)100份、2官能丙烯酸酯(雙酚A型環氧丙烯酸酯、DAICEL-ALLNEX公司製「EBECRYL600」)50份、矽烷偶合劑(信越SILICONES公司製「KBM-5103」)2份、市售之半燒成水滑石(BET比表面積:15m2 /g、平均粒徑:400nm)96份進行混練後,使用三輥磨機進行分散,得到混合物。接著所得的混合物中,調配具有脂環式骨架之單官能丙烯酸酯(協榮社化學公司製「Light AcrylateIB-XA」)(稀釋劑)50份、2官能丙烯酸酯(共榮社化學公司製「Light AcrylateNP-A」)(也作為稀釋劑產生功能)50份、熱自由基聚合起始劑(和光純藥工業公司製「V-601」)2份,然後使用高速旋轉混合機均勻地分散,得到組成物。<Example 1> 20 parts of a 6-functional acrylate ("KAYARAD DPCA-60" manufactured by Nippon Kayaku Co., Ltd.) and 100 parts of a 2-functional acrylate having an alicyclic skeleton ("IRR214-K" manufactured by DAICEL-ALLNEX) 2, 50 parts of a bifunctional acrylate (bisphenol A epoxy acrylate, "EBECRYL600" manufactured by DAICEL-ALLNEX Corporation), 2 parts of a silane coupling agent ("KBM-5103" manufactured by Shin-Etsu Silicone Co., Ltd.) 96 parts of hydrotalcite (BET specific surface area: 15 m 2 / g, average particle size: 400 nm) were kneaded, and then dispersed using a three-roll mill to obtain a mixture. 50 parts of a monofunctional acrylate ("Light AcrylateIB-XA" manufactured by Kyoeisha Chemical Co., Ltd.) (diluent) and a bifunctional acrylate (manufactured by Kyoeisha Chemical Co., Ltd. " Light AcrylateNP-A ") (also functions as a diluent) 50 parts, 2 parts of thermal radical polymerization initiator (" V-601 "manufactured by Wako Pure Chemical Industries, Ltd.), and then uniformly dispersed using a high-speed rotary mixer, A composition was obtained.

<實施例2>   除了將半燒成水滑石的量變更為170份外,與實施例1同樣得到組成物。<Example 2> A composition was obtained in the same manner as in Example 1 except that the amount of the semi-calcined hydrotalcite was changed to 170 parts.

<實施例3>   將6官能丙烯酸酯(日本化藥公司製「KAYARAD DPCA-60」)20份、具有脂環式骨架之2官能丙烯酸酯(DAICEL-ALLNEX公司製「IRR214-K」)80份、UVACURE1561(DAICEL-ALLNEX公司製、1分子中具有環氧基及1個丙烯醯基之化合物(含量:78~82%)與雙酚A型環氧樹脂(含量:18~22%)的混合物)20份、液狀氫化雙酚A型環氧樹脂(三菱化學公司製「YX8000」)30份、矽烷偶合劑(信越SILICONES公司製「KBM-5103」)2份、市售之半燒成水滑石(BET比表面積:15m2 /g、平均粒徑:400nm)150份進行混練後,使用三輥磨機進行分散,得到混合物。接著所得的混合物中,調配具有脂環式骨架之單官能丙烯酸酯(共榮社化學公司製「Light AcrylateIB-XA」)100份、熱自由基聚合起始劑(和光純藥工業公司製「V-601」)2份,然後使用高速旋轉混合機均勻地分散,得到組成物。<Example 3> 20 parts of a 6-functional acrylate ("KAYARAD DPCA-60" manufactured by Nippon Kayaku Co., Ltd.) and 80 parts of a 2-functional acrylate having an alicyclic skeleton ("IRR214-K" manufactured by DAICEL-ALLNEX) , UVACURE1561 (manufactured by DAICEL-ALLNEX Corporation, a mixture of a compound having an epoxy group and an acryl fluorenyl group in one molecule (content: 78 to 82%) and a bisphenol A type epoxy resin (content: 18 to 22%) ) 20 parts, liquid hydrogenated bisphenol A type epoxy resin ("YX8000" manufactured by Mitsubishi Chemical Corporation) 30 parts, 2 parts of silane coupling agent ("KBM-5103" manufactured by Shin-Etsu Silicone Co., Ltd.), commercially available semi-burned water After 150 parts of talc (BET specific surface area: 15 m 2 / g, average particle diameter: 400 nm) were kneaded, they were dispersed using a three-roll mill to obtain a mixture. 100 parts of a monofunctional acrylate ("Light AcrylateIB-XA" manufactured by Kyoeisha Chemical Co., Ltd.) and a thermal radical polymerization initiator ("V manufactured by Wako Pure Chemical Industries, Ltd." -601 ″) 2 parts, and then uniformly dispersed using a high-speed rotary mixer to obtain a composition.

<實施例4>   除了將半燒成水滑石的量變更為96份及將熱自由基聚合起始劑2份變更為光自由基聚合起始劑(BASF公司製「Omnirad OXE-01」)2份外,與實施例3同樣得到組成物。<Example 4> Except changing the amount of semi-calcined hydrotalcite to 96 parts and changing 2 parts of the thermal radical polymerization initiator to a photo radical polymerization initiator ("Omnirad OXE-01" manufactured by BASF) 2 A composition was obtained in the same manner as in Example 3 except for the rest.

<實施例5>   除了再添加光致陽離子聚合引發劑(ADEKA公司製「SP-152」)2份外,與實施例4同樣得到組成物。<Example 5> A composition was obtained in the same manner as in Example 4 except that 2 parts of a photocationic polymerization initiator ("SP-152" manufactured by ADEKA Corporation) was further added.

<比較例1>   除了將半燒成水滑石96份變更為氧化鎂(BET比表面積:8.9m2 /g、平均粒徑:500nm)96份外,與實施例1同樣得到組成物。<Comparative Example 1> A composition was obtained in the same manner as in Example 1 except that 96 parts of the semi-calcined hydrotalcite was changed to 96 parts of magnesium oxide (BET specific surface area: 8.9 m 2 / g, average particle size: 500 nm).

<比較例2>   具有脂環式骨架之2官能環氧樹脂(ADEKA公司製「EP4088SS」)100份、4官能環氧樹脂(三菱化學公司製「jER604」)20份、2官能環氧樹脂(新日鐵住金化學公司製「ZX-1059」)100份、矽烷偶合劑(信越SILICONES公司製「KBM-403」)2份、市售之半燒成水滑石(BET比表面積:15m2 /g、平均粒徑:400nm)96份進行混練後,使用三輥磨機進行分散得到混合物。接著,所得之混合物中,調配單官能環氧樹脂(nagasechemtex公司製「EX-121」)50份、熱陰離子聚合起始劑(北興化學工業公司製「TBPDA」)2份,使用高速旋轉混合機均勻地分散,得到組成物。<Comparative Example 2> 100 parts of a bifunctional epoxy resin ("EP4088SS" manufactured by ADEKA Corporation) having an alicyclic skeleton, 20 parts of a 4-functional epoxy resin ("jER604" manufactured by Mitsubishi Chemical Corporation), and a bifunctional epoxy resin ( 100 parts of "Nippon Steel & Sumitomo Chemical Co., Ltd." (ZX-1059)), 2 parts of a silane coupling agent ("KBM-403" manufactured by Shin-Etsu Silicone Co., Ltd.), and commercially available semi-fired hydrotalcite (BET specific surface area: 15 m 2 / g (Average particle diameter: 400 nm) 96 parts were kneaded, and then dispersed using a three-roll mill to obtain a mixture. Next, 50 parts of a monofunctional epoxy resin ("EX-121" manufactured by Nagasechemtex) and 2 parts of a thermal anion polymerization initiator ("TBPDA" manufactured by Beixing Chemical Industry Co., Ltd.) were prepared in the obtained mixture, and a high-speed rotary mixer was used. Disperse uniformly to obtain a composition.

<水滑石之吸水率>   以天秤量取1.5g量之實施例及比較例使用的水滑石,測量初期質量。大氣壓下,設定為60℃、90%RH(相對濕度)之小型環境試驗器(ESPEC公司製 SH-222)中,靜置200小時,測量吸濕後的質量,使用上述式(i)求飽和吸水率。結果如表1所示。<Water absorption of hydrotalcite> (1) The hydrotalcite used in the examples and comparative examples was measured on a scale with a weight of 1.5 g, and the initial mass was measured. In a small-scale environmental tester (SH-222, manufactured by ESPEC) set at 60 ° C and 90% RH (relative humidity) under atmospheric pressure, let stand for 200 hours, measure the mass after moisture absorption, and use the formula (i) to obtain saturation. Water absorption. The results are shown in Table 1.

<水滑石之熱重量減少率>   使用Hitachi High-Tech Science公司製TG/DTA EXSTAR6300,將實施例及比較例使用的水滑石進行熱重量分析。以鋁製之樣品盤量秤水滑石10mg,不加蓋、烘烤的狀態下,氮流量200mL/分鐘之環境下,以10℃/分鐘由30℃昇溫至550℃。使用上述式(ii),求280℃及380℃下之熱重量減少率。結果如表1所示。<Thermal weight reduction rate of hydrotalcite> 热 The hydrotalcite used in Examples and Comparative Examples was subjected to thermogravimetric analysis using TG / DTA EXSTAR 6300 manufactured by Hitachi High-Tech Science. An aluminum sample pan weighed 10 mg of hydrotalcite, and the temperature was increased from 30 ° C. to 550 ° C. at 10 ° C./min under a nitrogen flow rate of 200 mL / min in an uncovered and baked state. Using the above formula (ii), the thermal weight reduction rates at 280 ° C and 380 ° C were determined. The results are shown in Table 1.

<粉末X光繞射>   粉末X光繞射之測量係藉由粉末X光繞射裝置(PANalytical公司製,Empyrean),以對陰極CuKα(1.5405Å)、電壓:45V、電流:40mA、取樣寬:0.0260°、掃描速度:0.0657°/S、測量繞射角範圍(2θ):5.0131~79.9711°的條件進行。波峰搜尋係利用繞射裝置附屬之軟體的波峰搜尋功能,以「最小顯著度:0.50、最小波峰晶片:0.01°、最大波峰晶片:1.00°、峰底寬:2.00°、方法:2次微分之最小值」的條件進行。檢測於2θ為8~18°之範圍內出現之分裂為二個的波峰、或藉由二個波峰之合成而具有肩峰(shoulder)的波峰,測量出現於低角度側之波峰或肩峰之繞射強度(=低角度側繞射強度)、與出現於高角度側之波峰或肩峰之繞射強度(=高角度側繞射強度),算出相對強度比(低角度側繞射強度/高角度側繞射強度)。結果如表1所示。<Powder X-ray diffraction> Powder X-ray diffraction is measured using a powder X-ray diffraction device (Empyrean, manufactured by PANalytical, Inc.) for the cathode CuKα (1.5405Å), voltage: 45V, current: 40mA, sampling width : 0.0260 °, scanning speed: 0.0657 ° / S, measurement of diffraction angle range (2θ): 5.0131 to 79.9711 °. The crest search uses the crest search function of the software attached to the diffractive device to "minimum significance: 0.50, minimum crest chip: 0.01 °, maximum crest chip: 1.00 °, peak bottom width: 2.00 °, method: 2nd derivative "Minimum" condition. Detect peaks split into two peaks that appear in the range of 2θ from 8 to 18 °, or peaks that have shoulders by combining the two peaks, and measure the peaks or shoulders that appear on the low-angle side Calculate the relative intensity ratio (diffraction intensity on the low-angle side / diffraction angle on the high-angle side) and diffraction intensity (= diffraction intensity on the high-angle side) of the peak or shoulder on the high-angle side. Side diffraction intensity). The results are shown in Table 1.

藉由飽和吸水率、熱重量減少率及粉末X光繞射的結果,確認實施例及比較例使用的水滑石為「半燒成水滑石」。From the results of saturated water absorption, thermal weight reduction, and powder X-ray diffraction, it was confirmed that the hydrotalcites used in the examples and comparative examples were "semi-fired hydrotalcites".

<組成物之硬化物層之全光線穿透率及霧度>   將實施例及比較例製作的組成物滴下至無鹼玻璃板(長度50mm、寬度50mm、厚度700μm、Nippon Electric Glass(股)公司製OA-10G)後,重疊相同尺寸的無鹼玻璃板,製作積層體(無鹼玻璃板/樹脂組成物層/無鹼玻璃板)。接著,實施例1~3及比較例1及2係藉由將該積層體以100℃加熱30分鐘,使組成物硬化,製作評價用樣品(硬化物之厚度:20μm)。又,實施例4及5係在室溫下,藉由使用UV-LED(牛尾公司製、波長365nm),使積算照射量成為3,000mJ/cm2 ,並將紫外線照射於該積層體,使組成物硬化,製作評價用樣品(硬化物之厚度:20μm)。<Total light transmittance and haze of the hardened material layer of the composition> The compositions prepared in the examples and comparative examples were dropped onto an alkali-free glass plate (length 50 mm, width 50 mm, thickness 700 μm, Nippon Electric Glass Co., Ltd.) After the production of OA-10G), an alkali-free glass plate of the same size was stacked to produce a laminated body (alkali-free glass plate / resin composition layer / alkali-free glass plate). Next, in Examples 1 to 3 and Comparative Examples 1 and 2, the composition was cured by heating the laminated body at 100 ° C. for 30 minutes to prepare a sample for evaluation (thickness of the cured product: 20 μm). In addition, Examples 4 and 5 used UV-LEDs (produced by Oxtail Corporation, wavelength 365 nm) at room temperature to set the cumulative exposure to 3,000 mJ / cm 2 and irradiated ultraviolet rays to the laminate to make the composition The material was cured and a sample for evaluation (thickness of the cured material: 20 μm) was produced.

使用SUGA試驗機公司製霧度計HZ-V3(鹵素燈),以空氣為參考,使用D65光,測量評價用樣品之全光線穿透率及霧度,依據以下基準評價。結果如表2所示。 (全光線穿透率之基準)   良好(○):90%以上   可(△):未達90%、85%以上   不良(×):未達85% (霧度之基準)   良好(○):未達2.5%   可(△):2.5%以上、未達3.0%   不良(×):3.0%以上The haze meter HZ-V3 (halogen lamp) manufactured by SUGA Testing Machine Co., Ltd. was used to measure the total light transmittance and haze of the sample for evaluation with D65 light using air as a reference, and evaluated based on the following criteria. The results are shown in Table 2. (Baseline for total light transmittance) Good (○): 90% or more acceptable (△): Less than 90%, 85% or more Defective (×): Less than 85% (baseline of haze) Good (○): Less than 2.5% OK (△): 2.5% or more and less than 3.0% Poor (×): 3.0% or more

<裝置信賴性試驗(殘存發光面積率)>   使用有機EL元件,評價組成物之封裝性。詳細而言,首先,在附氧化銦錫(ITO)之玻璃基板(GEOMATEC公司製)上,以發光面積成為4mm2 來形成有機EL元件(有機膜的厚度:110nm、Al陰極的厚度:100nm)。其次,有機EL元件上使用化學氣相沉積法(CVD法),形成氮化膜(厚度:500nm)。<Device reliability test (residual light-emitting area ratio)> The organic EL device was used to evaluate the sealing performance of the composition. Specifically, first, an organic EL element was formed on a glass substrate (manufactured by GEOMATEC) with indium tin oxide (ITO) with a light emitting area of 4 mm 2 (thickness of organic film: 110 nm, thickness of Al cathode: 100 nm) . Next, a chemical vapor deposition method (CVD method) is used on the organic EL element to form a nitride film (thickness: 500 nm).

接著,將實施例2~5製作的組成物滴下至附氮化膜之有機EL元件後,其上重疊無鹼玻璃板,調製積層體(無鹼玻璃板/組成物層/附氮化膜之有機EL元件/附ITO玻璃基板)。實施例2及3係藉由將該積層體以100℃加熱30分鐘,使組成物硬化,製造封裝了有機EL元件的積層體(硬化物的厚度:100μm)。實施例4及5係在室溫下,藉由使用UV-LED(牛尾公司製、波長365nm),使積算照射量成為3,000mJ/cm2 ,並將紫外線照射於該積層體,使組成物硬化,製造封裝了有機EL元件的積層體(硬化物的厚度:100μm)。Next, the composition prepared in Examples 2 to 5 was dropped onto the organic EL element with a nitride film, and then an alkali-free glass plate was superposed thereon to prepare a laminated body (alkali-free glass plate / composition layer / nitride film Organic EL element / with ITO glass substrate). In Examples 2 and 3, the laminated body was heated at 100 ° C. for 30 minutes to harden the composition to produce a laminated body (thickness of the hardened body: 100 μm) in which the organic EL element was encapsulated. In Examples 4 and 5, at room temperature, UV-LEDs (manufactured by Oxtail Corporation, wavelength: 365 nm) were used to make the cumulative exposure to 3,000 mJ / cm 2 , and the laminated body was irradiated with ultraviolet rays to harden the composition. A laminated body (thickness of hardened material: 100 μm) in which the organic EL element was encapsulated was manufactured.

對封裝後之有機EL元件外加電壓,測量在恆濕恆溫槽中保管之前的初期發光面積。接著,將封裝了有機EL元件的積層體在設定為溫度85℃及濕度85%RH的恆濕恆溫槽中保管。保管開始1000小時後,自恆濕恆溫槽取出積層體,對有機EL元件外加電壓,測量保管後的發光面積。A voltage was applied to the packaged organic EL device, and the initial light-emitting area before storage in a constant-humidity and constant-temperature bath was measured. Next, the laminated body in which the organic EL element was encapsulated was stored in a constant-humidity constant-temperature bath set at a temperature of 85 ° C. and a humidity of 85% RH. 1,000 hours after the start of storage, the laminate was taken out from the constant-humidity thermostatic bath, a voltage was applied to the organic EL element, and the light-emitting area after storage was measured.

作為比較封裝層(硬化物)之阻隔(barrier)性的指標,由下述式:   殘存發光面積率(%)=100×(保管後之發光面積)/(初期發光面積)   算出殘存發光面積率,並依據以下基準評價。結果如表2所示。 (殘存發光面積率之基準)   非常良好(◎):95%以上   良好(○):85%以上未達95%   可(△):75%以上未達85%   不良(×):未達75%As an index for comparing the barrier properties of the encapsulation layer (cured material), the following formula is used: Residual light-emitting area ratio (%) = 100 × (Light-emitting area after storage) / (Initial light-emitting area) , And evaluated based on the following benchmarks. The results are shown in Table 2. (Baseline of residual luminous area ratio) Very good (◎): 95% or more Good (○): 85% or more and less than 95% Yes (△): 75% or more and less than 85% Poor (×): less than 75%

[產業上之可利用性] [Industrial availability]

依據本發明之封裝用之組成物時,可形成水分遮斷性及透明性之兩者優異的封裝層。因此,本發明之封裝用之組成物可適用於有機EL元件等對水分較弱之元件封裝。When the composition for encapsulation according to the present invention is used, it is possible to form an encapsulation layer excellent in both moisture blocking properties and transparency. Therefore, the composition for encapsulation of the present invention can be suitably used for encapsulation of components that are relatively weak to moisture, such as organic EL elements.

本案係以日本申請之特願2017-071985號為基礎,其內容全部包含於本案說明書中。This case is based on Japanese Patent Application No. 2017-071985, the contents of which are included in the description of this case.

Claims (16)

一種封裝用之組成物,其係包含1分子中具有2個以上之乙烯性不飽和基的化合物、半燒成水滑石及自由基聚合起始劑。A composition for encapsulation, comprising a compound having two or more ethylenically unsaturated groups in one molecule, a semi-fired hydrotalcite, and a radical polymerization initiator. 如請求項1之組成物,其中1分子中具有2個以上之乙烯性不飽和基的化合物為包含1分子中具有3個以上之乙烯性不飽和基的化合物。For example, the composition according to claim 1, wherein the compound having two or more ethylenically unsaturated groups in one molecule is a compound containing three or more ethylenically unsaturated groups in one molecule. 如請求項1或2之組成物,其中1分子中具有2個以上之乙烯性不飽和基的化合物為包含1分子中具有2個以上之乙烯性不飽和基及脂環式構造的化合物。For example, the composition of claim 1 or 2, wherein the compound having two or more ethylenically unsaturated groups in one molecule is a compound containing two or more ethylenically unsaturated groups in one molecule and an alicyclic structure. 如請求項1~3中任一項之組成物,其係進一步包含稀釋劑。The composition according to any one of claims 1 to 3, further comprising a diluent. 如請求項4之組成物,其中稀釋劑為1分子中具有1個乙烯性不飽和基的化合物。The composition according to claim 4, wherein the diluent is a compound having one ethylenically unsaturated group in one molecule. 如請求項1~5中任一項之組成物,其中乙烯性不飽和基為(甲基)丙烯醯基。The composition according to any one of claims 1 to 5, wherein the ethylenically unsaturated group is a (meth) acrylfluorenyl group. 如請求項1~6中任一項之組成物,其中1分子中具有2個以上之乙烯性不飽和基的化合物之量,在組成物全體中,為20~78質量%。For example, the composition of any one of claims 1 to 6, wherein the amount of the compound having two or more ethylenically unsaturated groups in one molecule is 20 to 78% by mass in the entire composition. 如請求項1~7中任一項之組成物,其中半燒成水滑石之量,在組成物全體中,為10~70質量%。According to the composition of any one of claims 1 to 7, the amount of the semi-calcined hydrotalcite is 10 to 70% by mass in the entire composition. 如請求項1~8中任一項之組成物,其中自由基聚合起始劑為光自由基聚合起始劑及/或熱自由基聚合起始劑。The composition according to any one of claims 1 to 8, wherein the radical polymerization initiator is a photo radical polymerization initiator and / or a thermal radical polymerization initiator. 如請求項1~9中任一項之組成物,其中自由基聚合起始劑之量,相對於具有乙烯性不飽和基的化合物100質量份,為0.5~10質量份。The composition according to any one of claims 1 to 9, wherein the amount of the radical polymerization initiator is 0.5 to 10 parts by mass relative to 100 parts by mass of the compound having an ethylenically unsaturated group. 如請求項1~10中任一項之組成物,其係進一步包含矽烷偶合劑。The composition according to any one of claims 1 to 10, further comprising a silane coupling agent. 如請求項1~11中任一項之組成物,其中厚度為20μm之組成物之硬化物層在D65光下的全光線穿透率為85%以上。For example, the composition of any one of claims 1 to 11, wherein the hardened layer of the composition having a thickness of 20 μm has a total light transmittance of 85% or more under D65 light. 如請求項1~12中任一項之組成物,其中厚度為20μm之組成物之硬化物層的霧度為未達3.0%。For example, the composition of any one of claims 1 to 12, wherein the haze of the hardened layer of the composition having a thickness of 20 μm is less than 3.0%. 如請求項1~13中任一項之組成物,其為液狀。The composition of any one of claims 1 to 13 is liquid. 如請求項1~14中任一項之組成物,其係有機EL元件之封裝用。The composition according to any one of claims 1 to 14 is for packaging an organic EL element. 一種有機EL裝置,其係以如請求項1~15中任一項之組成物之硬化物封裝有機EL元件。An organic EL device in which an organic EL element is encapsulated with a hardened body of a composition as claimed in any one of claims 1 to 15.
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