TW201439129A - An encapsulant composition used for high conventrated photovoltaic devices - Google Patents

Abstract

An encapsulant composition used for a high concentrated photovoltaic device is provided, including at least a resin comprising the copolymer of a silicone-acrylic resin monomer, an epoxy-acrylic resin monomer, and an urethane-acrylic resin monomer, a filler and a photoinitiator, wherein the filler has a weight percentage of about 0.1 to 30% of the encapsulant composition.

Description

Packaging material composition for concentrating solar cell

The present invention relates to an encapsulating material composition for a concentrating solar cell, and has excellent physical properties such as high light transmittance, rapid curing, high adhesion strength and low oxygen permeability, and is suitable for concentrating solar energy. The package of the battery.

In the field of concentrating solar cells, the efficiency of converting light energy into electrical energy is very important. However, these components are highly susceptible to the influence of moisture and oxygen in the air and shorten their service life. Therefore, the concentrating solar cell needs to be properly packaged to prevent the electronic components inside it from contacting the outside water and oxygen to enhance its service life.

Conventional encapsulating materials are obtained by first synthesizing a resin monomer into a resin, and then adding a filler and a hardener. After that, it is hardened by a hot process. Such a hot process is extremely time consuming and usually takes several hours or even ten hours to complete. In addition, there is still room for improvement in the gas barrier capability of the conventional packaging materials, resulting in unsatisfactory service life of the current concentrating solar cells.

Therefore, there is a need for a novel encapsulating material composition that can be applied to relatively fast-hardening and high-resistance packaging materials to improve the time-consuming and high manufacturing cost of conventional encapsulation materials using hot process curing, and to enhance concentrating. The life of a solar cell.

In view of this, the present invention provides an encapsulating material composition which has advantages of low manufacturing cost, high gas barrier property, and rapid hardening.

According to an embodiment, the encapsulating material composition of the present invention comprises: at least one resin, wherein the resin is composed of a ruthenium resin monomer, an epoxy-acrylic resin monomer, and a urethane acrylic resin monomer. a copolymer obtained by copolymerization; a filler, wherein the filler accounts for about 0.1 to 30% by weight of the encapsulating material composition; and a photoinitiator.

The above and other objects, features, and advantages of the present invention will become more apparent and understood.

One of the features of the present invention is that an encapsulation material having a low manufacturing cost, high gas barrier property, and rapid hardening can be prepared by a resin monomer design and an in-situ process. The disclosed encapsulating material has excellent water-blocking gas barrier properties and light transmittance, and is therefore suitable for packaging of concentrating solar cells.

The main components of the disclosed encapsulating material composition are a resin monomer, a filler and an initiator, which can be formulated according to different ratios to form a transparent encapsulating material having high light transmittance and colorlessness. The encapsulated material composition filler is about 0.1 to 30 parts by weight.

The above resin monomers include a ruthenium acrylate resin monomer, an epoxy-acrylic resin monomer, and a urethane acrylate resin monomer.

The above-mentioned ruthenium resin monomer has the following chemical formula: Wherein R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ and R ¹² are each independently a phenyl group, an alkylphenyl group having a carbon number of from 1 to 12, an alkyl group having a carbon number of from 1 to 12, and a carbon number An ether group of 1 to 12, an alkoxy group having a carbon number of 1 to 12, or a cycloalkoxy group having a carbon number of 1 to 12. The ruthenium resin single system is used as a polymer substrate to improve the adhesive properties of the package material.

The above epoxy-acrylic resin monomer has the following chemical formula: Wherein R ¹ and R ² are each independently a phenyl group, an alkylphenyl group having a carbon number of 1 to 12, an alkyl group having a carbon number of 1 to 12, and an ether group having a carbon number of 1 to 12; An alkoxy group having a carbon number of 1 to 12 or a cycloalkoxy group having a carbon number of 1 to 12. The epoxy-acrylic resin single system acts as a polymer substrate to enhance the adhesion properties of the encapsulating material.

The above urethane acryl monomer has the following chemical formula: Wherein R ³ , R ⁴ and R ⁵ are each independently a phenyl group, an alkylphenyl group having a carbon number of 1 to 12, an alkyl group having a carbon number of 1 to 12, and a carbon number of 1 to 12; An ether group, an alkoxy group having a carbon number of 1 to 12 or a cycloalkoxy group having a carbon number of 1 to 12; R ⁶ and R ⁷ are each independently a phenyl group, and the carbon number is between 1 and 12 alkylphenyl, an alkyl group having a carbon number of 1 to 12, an ether group having a carbon number of 1 to 12, an alkoxy group having a carbon number of 1 to 12, and a carbon number of 1 to 12 cycloalkoxy or hydrogen. The urethane acryl single system acts as a polymer substrate to enhance the adhesion properties of the encapsulating material.

The above-mentioned resin monomer disclosed in the epoxy-acrylic resin monomer, the ruthenium acrylic resin monomer, the urethane acrylic resin monomer, wherein the molar ratio of each monomer is 1:1~3:1~3 Preferably, it is 1:2:1~3, more preferably 1:2:2.

The filler in the disclosed encapsulating material composition is, for example, an oxidized metal of cerium oxide or aluminum oxide, a halogenated metal such as zinc chloride, a metal nitride such as aluminum nitride, such as [Ca(II)Al. (III) ₂ (OH) ₂ ] ⁶⁺ (CO ₃ ^2- ) ₃ . Hydrotalcite of mH ₂ O or other powder such as calcium carbonate.

The initiator in the disclosed encapsulating composition comprises a photoinitiator, a thermal initiator, or a combination of the foregoing. The thermal initiator is, for example, a free radical initiator such as a peroxide, an azo compound or 1-Hydroxy-cyclohexyl-phenyl-ketone. The photoinitiator may be a cationic initiator such as iodonium (4-methylphenyl) [4-(2-methyl-propyl)phenyl]-hexafluorophosphate or a cyclopentadienyl transition metal complex such as Bis (eta 5-2,4-cyclopentadien-1-yl)Bis[2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl]titanium.

The above-described encapsulating material composition is mixed and sequentially subjected to an polymerization process and a curing process in an in-situ manner to form the encapsulating material of the present invention.

After the above resin monomers are copolymerized, a hardening process is performed to complete the fabrication of the encapsulating material. For example, an illumination procedure can be utilized to cause a crosslinking reaction in the epoxy group in the resin. The light source of the illumination program can be selected according to the type of photoinitiator used in the encapsulating material composition to be applied, such as one of an ultraviolet light source, a visible light source or an infrared light source, and the illumination procedure takes about 1 time. ~200 minutes, the applied light source power is about 1~20,000 watts. The hardening program is, for example, an illumination program in which the light source is an ultraviolet light source, and the illumination procedure is performed for about 1-100 minutes, preferably about 1-20 minutes, and the light source power is about 1-10000 watts. The good condition is between 1 and 1000 watts.

The disclosed encapsulating material composition can adjust the light transmittance of the formed encapsulating material by the formulation of the filler to prepare a transparent encapsulating material having a light transmittance higher than 85% or even higher than 90%. The adhesion degree can reach K2.0 Kgf/cm ² ; and its water-blocking and gas-blocking characteristics are excellent, which helps to improve the service life of electronic components, and is especially suitable for concentrating solar cells. In addition, the encapsulating material of the present invention can also be used in various optoelectronic products such as inorganic light-emitting diodes, organic light-emitting diodes, solar cells, and the like. It can also be applied to some waterproof and food and beverage packagings for people's livelihood industries such as wood plastics, which are resistant to water and gas.

The preferred embodiment of the invention has the following advantages:

(1) Shorten the process time. In one embodiment, the hardening can be accomplished in 30 seconds using an ultraviolet light curing procedure.

(2) The dispersibility of the filler in the obtained encapsulating material is excellent, which can improve the water-blocking and gas-blocking performance of the encapsulating material, thereby improving the service life of the packaged component.

[Example 1] Weigh 100 g of glycidyl methacrylate

(Glycidylmethacrylate, GMA), 100 g of polyurethane-acrylic co-monomer, 100 g Acrylic conjugated monomer (as shown in reaction formula (1)), 100 g of propylene glycol monomethyl ether acetate (PGMEA; propylene glycol monomethyl ether acetate), 50 g of cerium oxide and 6 g of initiator Nitrogen diisobutyronitrile (AIBN; azobisiso butyro-nitrile) and the above materials are placed in a container, and the above materials are stirred and mixed with a mechanical stirrer at normal temperature and pressure to obtain a package material composition. Then, it was heated to 100 ° C, and the heating time was 30 minutes. After being allowed to stand at room temperature, 10 g of I-250 (Ciba Co.; photoinitiator) and 10 g of I-184 (Ciba Co.; The photoinitiator was stirred with 10 g of Tinuvin 622 (Ciba Co.; antioxidant) using a mechanical stirrer for 30 minutes to synthesize an acrylic/epoxy/polyurethane/ruthenium acrylic copolymer I. It is 7,310 cps (measured in Viscolite 700 at 25 ° C). Here, the above-mentioned encapsulating material composition is polymerized into the copolymer according to the reaction represented by the following reaction formula (1) (wherein x, y, and z represent the number of repetitions of the monomer).

Next, measure the physical properties of the resulting acrylic/epoxy/polyurethane/ruthenium acrylic copolymer I (such as strength, hardness, light transmittance, refractive index, water vapor permeability, and oxygen permeability). The physical properties, the results obtained are shown in Table 1. About aggregation The measuring instrument/measuring method of the physical properties of the object is as shown in Table 2 below, wherein the measurement of the properties such as strength, hardness, light transmittance, refractive index, water vapor permeability and oxygen permeability may be Applying the prepared polymer to a substrate such as a glass slide to form a sample of 5 cm X 5 cm square, and subjecting the sample to a deep ultraviolet light source for 3 minutes to harden it, followed by hardening. Subsequent physical quality measurements are performed by metering instruments and measurement methods.

[Example 2] Weigh 100 g of glycidyl methacrylate

(Glycidylmethacrylate, GMA), 100 g of polyurethane-acrylic co-monomer, 100 g of hydrazine comonomer (as shown in reaction formula (2)), 100 g of propylene glycol methyl ether acetate (PGMEA; propylene Glycol monomethyl ether acetate), 50 g of hydrotalcite ([Ca(II)Al(III) ₂ (OH) ₂ ] ⁶⁺ (CO ₃ ^2- ) ₃ .mH ₂ O) and 6 g of initiator azo Isobutyronitrile and the above materials are placed in a container, and the above materials are stirred and mixed with a mechanical stirrer at normal temperature and pressure to obtain a package material composition. Then, it was heated to 100 ° C for 30 minutes, and after standing to room temperature, 10 g of I-250 (Ciba Co.; photoinitiator), 10 g of I-184 (Ciba Co.) was added. ; Photoinitiator) and 10 g of Tinuvin 622 (Ciba Co.; antioxidant)) were stirred for 30 minutes using a mechanical stirrer to synthesize an acrylic/epoxy/polyurethane/ruthenium acrylic copolymer II. The viscosity is 7,830 cps (Viscolite 700 measurement, temperature is 25 ° C). Here, the above-mentioned encapsulating material composition is polymerized into the copolymer according to the reaction represented by the following reaction formula (2) (wherein x, y, and z represent the number of repetitions of the monomer).

As can be seen from the results of Table 1, the packaging materials prepared in the first embodiment and the second embodiment of the present invention are superior in physical properties compared to the commercial packaging material Dow Corning PV6010.

[Example 3]

The acrylic/epoxy/polyurethane/ruthenium acryl copolymers I and II prepared in the foregoing Examples 1 and 2 were used as encapsulation materials, and were packaged in a concentrating solar cell by a dispensing device. . We dispensed at a pressure of 20 psi, dispensed for 5 seconds, and irradiated with a UV point source (UV-spot 100; exposure energy: 50 mJ/mg) for 25 seconds to complete the encapsulation of the concentrating solar cell.

As can be seen from the results of Table 3, the photoelectric conversion properties of the concentrating solar cells encapsulated in Embodiments 1 and 2 of the present invention are superior to those of the commercial packaging material Dow Corning PV6010.

Claims (10)

A package material composition comprising: a resin, a copolymer obtained by copolymerizing a ruthenium resin monomer, an epoxy-acrylic resin monomer, a urethane acrylic resin monomer; a filler, Wherein the filler comprises from about 0.1 to 30% by weight of the encapsulating material composition; and a photoinitiator. The encapsulating material composition of claim 1, wherein the encapsulating material composition has a viscosity of from 1 to 100,000 cps at 25 °C. The encapsulating material composition of claim 1, wherein the encapsulating material composition has a light transmittance higher than 90%. The encapsulating material composition according to claim 1, wherein the hydrazine acrylate resin monomer has the following chemical formula: Wherein R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ and R ¹² are each independently a phenyl group, an alkylphenyl group having a carbon number of from 1 to 12, an alkyl group having a carbon number of from 1 to 12, and a carbon number An ether group of 1 to 12, an alkoxy group having a carbon number of 1 to 12, or a cycloalkoxy group having a carbon number of 1 to 12. The encapsulating material composition according to claim 1, wherein the epoxy-acrylic resin monomer has the following chemical formula: Wherein R ¹ and R ² are each independently a phenyl group, an alkylphenyl group having a carbon number of 1 to 12, an alkyl group having a carbon number of 1 to 12, and an ether group having a carbon number of 1 to 12; An alkoxy group having a carbon number of 1 to 12 or a cycloalkoxy group having a carbon number of 1 to 12. The encapsulating material composition of claim 1, wherein the bifunctional urethane acryl monomer has the following chemical formula: Wherein R ³ , R ⁴ and R ⁵ are each independently a phenyl group, an alkylphenyl group having a carbon number of 1 to 12, an alkyl group having a carbon number of 1 to 12, and a carbon number of 1 to 12; An ether group, an alkoxy group having a carbon number of 1 to 12 or a cycloalkoxy group having a carbon number of 1 to 12; R ⁶ and R ⁷ are each independently a phenyl group, and the carbon number is between 1 and 12 alkylphenyl, an alkyl group having a carbon number of 1 to 12, an ether group having a carbon number of 1 to 12, an alkoxy group having a carbon number of 1 to 12, and a carbon number of 1 to 12 cycloalkoxy or hydrogen. The encapsulating material composition of claim 1, wherein the filler comprises an oxidized metal, a halogenated metal, a metal nitride or a hydrotalcite. The encapsulating material composition according to claim 7, wherein the hydrotalcite has the following chemical formula: [M(II) _1-x M(III) _x (OH) ₂ ] ^X+ (A ^n- _x/n ) . mH ₂ O(0≦x≦1) wherein M(II) is a positively divalent metal such as barium, magnesium, calcium or the like. M(III) is a metal having a positive trivalent such as aluminum, gallium, indium or the like. A ^n- is a non-metal CO ₃ ^2- , NO ₃ ^- , PO ₄ ^3-, etc. with a negative valence. . The encapsulating material composition of claim 1, wherein the initiator comprises a photoinitiator and a thermal initiator. The encapsulating material composition of claim 9, wherein the photoinitiator comprises a free radical initiator, a cationic initiator or a cyclopentadienyl transition metal complex.