KR102574758B1 - 박리층 형성용 조성물 및 박리층 - Google Patents

박리층 형성용 조성물 및 박리층 Download PDF

Info

Publication number
KR102574758B1
KR102574758B1 KR1020197030618A KR20197030618A KR102574758B1 KR 102574758 B1 KR102574758 B1 KR 102574758B1 KR 1020197030618 A KR1020197030618 A KR 1020197030618A KR 20197030618 A KR20197030618 A KR 20197030618A KR 102574758 B1 KR102574758 B1 KR 102574758B1
Authority
KR
South Korea
Prior art keywords
group
release layer
carbon atoms
formula
forming
Prior art date
Application number
KR1020197030618A
Other languages
English (en)
Korean (ko)
Other versions
KR20190129103A (ko
Inventor
첸지아 예
카즈야 에바라
Original Assignee
닛산 가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛산 가가쿠 가부시키가이샤 filed Critical 닛산 가가쿠 가부시키가이샤
Publication of KR20190129103A publication Critical patent/KR20190129103A/ko
Application granted granted Critical
Publication of KR102574758B1 publication Critical patent/KR102574758B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020197030618A 2017-03-30 2018-03-28 박리층 형성용 조성물 및 박리층 KR102574758B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-067349 2017-03-30
JP2017067349 2017-03-30
PCT/JP2018/012809 WO2018181496A1 (ja) 2017-03-30 2018-03-28 剥離層形成用組成物及び剥離層

Publications (2)

Publication Number Publication Date
KR20190129103A KR20190129103A (ko) 2019-11-19
KR102574758B1 true KR102574758B1 (ko) 2023-09-06

Family

ID=63676040

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197030618A KR102574758B1 (ko) 2017-03-30 2018-03-28 박리층 형성용 조성물 및 박리층

Country Status (5)

Country Link
JP (1) JP7092114B2 (ja)
KR (1) KR102574758B1 (ja)
CN (1) CN110520478B (ja)
TW (1) TW201900727A (ja)
WO (1) WO2018181496A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6917017B2 (ja) * 2019-02-26 2021-08-11 大日本印刷株式会社 熱転写シート
JP7376274B2 (ja) * 2019-08-06 2023-11-08 旭化成株式会社 ポリイミド前駆体樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016129546A1 (ja) 2015-02-10 2016-08-18 日産化学工業株式会社 剥離層形成用組成物
WO2016158990A1 (ja) 2015-03-31 2016-10-06 日産化学工業株式会社 剥離層形成用組成物及び剥離層
WO2016158988A1 (ja) * 2015-03-31 2016-10-06 日産化学工業株式会社 剥離層形成用組成物及び剥離層

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03121132A (ja) * 1989-03-07 1991-05-23 Japan Carlit Co Ltd:The 新規ポリイミド
JP4619462B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜素子の転写方法
JP4619461B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜デバイスの転写方法、及びデバイスの製造方法
JP3809681B2 (ja) 1996-08-27 2006-08-16 セイコーエプソン株式会社 剥離方法
GB0327093D0 (en) 2003-11-21 2003-12-24 Koninkl Philips Electronics Nv Active matrix displays and other electronic devices having plastic substrates
KR100981852B1 (ko) * 2004-09-24 2010-09-13 가부시키가이샤 가네카 높은 접착성을 갖는 폴리이미드 필름의 제조 방법
TWI429684B (zh) * 2005-01-21 2014-03-11 Mitsubishi Gas Chemical Co 聚醯亞胺樹脂、聚醯亞胺薄膜及聚醯亞胺積層體
KR101363224B1 (ko) * 2005-05-25 2014-02-12 닛산 가가쿠 고교 가부시키 가이샤 액정 배향 처리제 및 그것을 이용한 액정 표시 소자
JP5310346B2 (ja) * 2009-07-17 2013-10-09 東洋紡株式会社 剥離性ポリイミドフィルム積層体
JP5429375B2 (ja) * 2011-04-15 2014-02-26 東洋紡株式会社 積層体とその製造方法および、この積層体を用いたデバイス構造体の作成方法
JP6172139B2 (ja) * 2012-02-23 2017-08-02 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、及びこれを用いたポリイミド樹脂膜、ディスプレイ基板とその製造方法
JP6067740B2 (ja) * 2012-11-08 2017-01-25 旭化成株式会社 フレキシブルデバイスの製造方法、積層体及びその製造方法、並びに、樹脂組成物
KR101773651B1 (ko) * 2013-04-09 2017-08-31 주식회사 엘지화학 적층체 및 이를 이용하여 제조된 기판을 포함하는 소자
JP6557963B2 (ja) * 2014-02-25 2019-08-14 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
JP6555126B2 (ja) * 2014-02-26 2019-08-07 東レ株式会社 ポリイミド樹脂、これを用いた樹脂組成物および積層フィルム
JP2016138236A (ja) * 2014-12-26 2016-08-04 Jsr株式会社 組成物、液晶配向剤、液晶配向膜及び液晶表示素子
JP6620805B2 (ja) * 2015-03-04 2019-12-18 日産化学株式会社 剥離層形成用組成物
TWI653494B (zh) * 2015-08-18 2019-03-11 奇美實業股份有限公司 液晶配向劑、液晶配向膜以及液晶顯示元件
JP6776687B2 (ja) * 2015-09-02 2020-10-28 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子、並びにこれらの製造方法
JP7131384B2 (ja) * 2016-06-14 2022-09-06 日産化学株式会社 液晶配向剤、液晶配向膜及び液晶表示素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016129546A1 (ja) 2015-02-10 2016-08-18 日産化学工業株式会社 剥離層形成用組成物
WO2016158990A1 (ja) 2015-03-31 2016-10-06 日産化学工業株式会社 剥離層形成用組成物及び剥離層
WO2016158988A1 (ja) * 2015-03-31 2016-10-06 日産化学工業株式会社 剥離層形成用組成物及び剥離層

Also Published As

Publication number Publication date
TW201900727A (zh) 2019-01-01
JP7092114B2 (ja) 2022-06-28
WO2018181496A1 (ja) 2018-10-04
JPWO2018181496A1 (ja) 2020-02-06
CN110520478A (zh) 2019-11-29
CN110520478B (zh) 2022-05-17
KR20190129103A (ko) 2019-11-19

Similar Documents

Publication Publication Date Title
JP6775769B2 (ja) 剥離層形成用組成物
TWI638843B (zh) 聚醯胺醯亞胺及其製備方法、聚醯胺醯亞胺膜以及顯示器用覆蓋基板
KR102576363B1 (ko) 박리층 형성용 조성물 및 박리층
KR102097312B1 (ko) 투명 폴리이미드 공중합체, 폴리이미드 수지 조성물 및 성형체, 및 이 공중합체의 제조 방법
JP6599620B2 (ja) ポリイミドを貼り合わせ接着層とする光学部材
KR102212979B1 (ko) 디스플레이 기판용 수지 조성물, 디스플레이 기판용 수지 박막 및 디스플레이 기판용 수지 박막의 제조 방법
JP7384170B2 (ja) ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
KR102574758B1 (ko) 박리층 형성용 조성물 및 박리층
US20210189126A1 (en) Detachable layer-forming composition and detachable layer
KR20190038846A (ko) 박리층 형성용 조성물
KR20170132803A (ko) 박리층 형성용 조성물 및 박리층
KR102608548B1 (ko) 가접착층 형성용 조성물 및 가접착층
KR102500563B1 (ko) 기판 보호층 형성용 조성물
KR20210146889A (ko) 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름
KR20210132030A (ko) 폴리아미드산 수지 조성물, 폴리이미드 수지막 및 그의 제조 방법, 적층체, 그리고 전자 디바이스 및 그의 제조 방법
JP2015155483A (ja) 樹脂組成物
TW202336156A (zh) 剝離層形成用組成物及剝離層
TW202424048A (zh) 聚醯亞胺樹脂、聚醯亞胺清漆、聚醯亞胺薄膜及暫時固定材組成物
JP2024046625A (ja) ポリイミド、ポリイミドフィルム、及び、積層体
KR20220144510A (ko) 신규한 디아자스피로 화합물 및 이의 용도
KR20230059447A (ko) 폴리아미드이미드 전구체, 이로부터 제조된 폴리아미드이미드 및 이를 포함하는 폴리아미드이미드 필름

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right