KR102561868B1 - 반도체 보호용 점착 테이프 및 반도체를 처리하는 방법 - Google Patents

반도체 보호용 점착 테이프 및 반도체를 처리하는 방법 Download PDF

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Publication number
KR102561868B1
KR102561868B1 KR1020197017861A KR20197017861A KR102561868B1 KR 102561868 B1 KR102561868 B1 KR 102561868B1 KR 1020197017861 A KR1020197017861 A KR 1020197017861A KR 20197017861 A KR20197017861 A KR 20197017861A KR 102561868 B1 KR102561868 B1 KR 102561868B1
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KR
South Korea
Prior art keywords
conductive layer
semiconductor
adhesive tape
pressure
sensitive adhesive
Prior art date
Application number
KR1020197017861A
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English (en)
Korean (ko)
Other versions
KR20200034942A (ko
Inventor
도루 도네가와
겐지 마스자와
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20200034942A publication Critical patent/KR20200034942A/ko
Application granted granted Critical
Publication of KR102561868B1 publication Critical patent/KR102561868B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
KR1020197017861A 2017-07-25 2018-07-24 반도체 보호용 점착 테이프 및 반도체를 처리하는 방법 KR102561868B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-143616 2017-07-25
JP2017143616 2017-07-25
PCT/JP2018/027627 WO2019022050A1 (ja) 2017-07-25 2018-07-24 半導体保護用粘着テープ及び半導体を処理する方法

Publications (2)

Publication Number Publication Date
KR20200034942A KR20200034942A (ko) 2020-04-01
KR102561868B1 true KR102561868B1 (ko) 2023-07-31

Family

ID=65041098

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197017861A KR102561868B1 (ko) 2017-07-25 2018-07-24 반도체 보호용 점착 테이프 및 반도체를 처리하는 방법

Country Status (5)

Country Link
JP (1) JP7181086B2 (ja)
KR (1) KR102561868B1 (ja)
CN (1) CN110446765A (ja)
TW (1) TWI810197B (ja)
WO (1) WO2019022050A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6749464B1 (ja) * 2019-03-20 2020-09-02 積水化学工業株式会社 粘着テープ及び粘着テープロール
CN112574686A (zh) * 2020-12-24 2021-03-30 苏州城邦达益材料科技有限公司 导电胶膜及其制备方法和应用

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US5091229A (en) * 1989-10-13 1992-02-25 E. I. Du Pont De Nemours And Company Electronics protective packaging film
JPH04204446A (ja) * 1990-11-29 1992-07-24 Daicel Chem Ind Ltd ペリクル用透明保護シート
JP3499957B2 (ja) * 1995-03-10 2004-02-23 リンテック株式会社 帯電防止粘着シート
JPH09207259A (ja) * 1996-12-16 1997-08-12 Achilles Corp 導電性透明保護フィルム
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JP2002069395A (ja) * 2000-08-28 2002-03-08 Fujimori Kogyo Co Ltd 半導体製造用粘着テープ
JP3894549B2 (ja) * 2001-09-26 2007-03-22 日東電工株式会社 半透過型偏光板、反射型偏光板及びそれらを用いた液晶表示装置
KR100624525B1 (ko) * 2003-10-15 2006-09-18 서광석 대전방지 점착 또는 접착 테이프 및 그 제조 방법
DE102007013181B4 (de) * 2007-03-20 2017-11-09 Evonik Degussa Gmbh Transparente, elektrisch leitfähige Schicht
CN101321426B (zh) * 2007-06-06 2013-02-27 3M创新有限公司 抗静电膜及包含该膜的制品
WO2011089787A1 (ja) * 2010-01-22 2011-07-28 凸版印刷株式会社 反射防止フィルムおよびその製造方法
JP5534896B2 (ja) 2010-03-30 2014-07-02 古河電気工業株式会社 帯電防止性半導体加工用粘着テープ
JP2012007093A (ja) * 2010-06-25 2012-01-12 Nitto Denko Corp 導電性粘着テープ
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JP6181958B2 (ja) 2013-03-28 2017-08-16 日東電工株式会社 帯電防止性粘着シート、及び、光学フィルム
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JP6890920B2 (ja) * 2014-12-08 2021-06-18 日東電工株式会社 粘着剤層付き透明導電性フィルム
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CN104893601B (zh) * 2015-05-19 2017-05-17 中国航空工业集团公司北京航空材料研究院 一种具有两种导电结构的导电胶膜及其制备方法
JP6757743B2 (ja) * 2015-12-25 2020-09-23 古河電気工業株式会社 半導体加工用テープ
CN106448824B (zh) * 2016-10-17 2017-09-08 北京石油化工学院 一种透明导电薄膜及其制备方法与应用
JP6831725B2 (ja) 2017-03-17 2021-02-17 リンテック株式会社 ワーク加工用粘着シートおよびその製造方法
JP7331307B2 (ja) 2017-04-03 2023-08-23 大日本印刷株式会社 電子機器部品製造工程用の粘着性積層体及びそれを用いた電子機器部品の製造方法

Also Published As

Publication number Publication date
KR20200034942A (ko) 2020-04-01
JPWO2019022050A1 (ja) 2020-05-28
JP7181086B2 (ja) 2022-11-30
TWI810197B (zh) 2023-08-01
TW201918539A (zh) 2019-05-16
WO2019022050A1 (ja) 2019-01-31
CN110446765A (zh) 2019-11-12

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