KR102556112B1 - 접착 필름 - Google Patents

접착 필름 Download PDF

Info

Publication number
KR102556112B1
KR102556112B1 KR1020160141348A KR20160141348A KR102556112B1 KR 102556112 B1 KR102556112 B1 KR 102556112B1 KR 1020160141348 A KR1020160141348 A KR 1020160141348A KR 20160141348 A KR20160141348 A KR 20160141348A KR 102556112 B1 KR102556112 B1 KR 102556112B1
Authority
KR
South Korea
Prior art keywords
layer
resin composition
thermosetting resin
adhesive film
wiring
Prior art date
Application number
KR1020160141348A
Other languages
English (en)
Korean (ko)
Other versions
KR20170049448A (ko
Inventor
히로유키 사카우치
시게오 나카무라
겐진 마고
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20170049448A publication Critical patent/KR20170049448A/ko
Application granted granted Critical
Publication of KR102556112B1 publication Critical patent/KR102556112B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/04—Printing inks based on proteins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020160141348A 2015-10-28 2016-10-27 접착 필름 KR102556112B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015212211 2015-10-28
JPJP-P-2015-212211 2015-10-28

Publications (2)

Publication Number Publication Date
KR20170049448A KR20170049448A (ko) 2017-05-10
KR102556112B1 true KR102556112B1 (ko) 2023-07-18

Family

ID=58710763

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160141348A KR102556112B1 (ko) 2015-10-28 2016-10-27 접착 필름

Country Status (4)

Country Link
JP (1) JP6852332B2 (zh)
KR (1) KR102556112B1 (zh)
CN (2) CN106912158B (zh)
TW (1) TWI734704B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6926817B2 (ja) * 2017-08-21 2021-08-25 味の素株式会社 樹脂組成物、樹脂シート、プリント配線板及び半導体装置
JP6504533B1 (ja) * 2017-08-31 2019-04-24 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP7465093B2 (ja) 2017-10-10 2024-04-10 味の素株式会社 硬化体及びその製造方法、樹脂シート及び樹脂組成物
CN107804043A (zh) * 2017-10-25 2018-03-16 苏州巨峰电气绝缘系统股份有限公司 适用于风力发电机或电动汽车电机的槽绝缘材料及其应用
CN107867035A (zh) * 2017-10-25 2018-04-03 苏州巨峰电气绝缘系统股份有限公司 一种耐变速箱油h级槽绝缘材料及其应用
CN107901556A (zh) * 2017-11-03 2018-04-13 苏州巨峰电气绝缘系统股份有限公司 一种适用于风电和太阳能变压器的点胶绝缘纸及其应用
JP6496066B1 (ja) * 2017-11-20 2019-04-03 日東電工株式会社 補強フィルム
CN111601860B (zh) * 2018-02-09 2022-12-20 Dic株式会社 胶粘带、物品和物品的制造方法
SG11202001674WA (en) 2018-03-12 2020-03-30 Hitachi Chemical Co Ltd Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor device
JP7424743B2 (ja) * 2018-09-04 2024-01-30 味の素株式会社 樹脂組成物、樹脂インク、樹脂インク層、樹脂シート及び半導体チップパッケージ
JP7047750B2 (ja) 2018-12-21 2022-04-05 味の素株式会社 積層配線板の製造方法
KR20210108953A (ko) * 2018-12-27 2021-09-03 주식회사 쿠라레 관통공을 포함하는 구조체를 갖는 적층체
JP6589172B1 (ja) * 2019-01-11 2019-10-16 吉川工業株式会社 積層鉄心
WO2020157828A1 (ja) * 2019-01-29 2020-08-06 日立化成株式会社 樹脂組成物、半導体装置の製造方法及び半導体装置
TWI719419B (zh) * 2019-03-11 2021-02-21 台光電子材料股份有限公司 環氧樹脂組成物及由其製成的物品
JP7417008B2 (ja) 2021-03-24 2024-01-17 太陽ホールディングス株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電気電子部品
CN113840478A (zh) * 2021-09-08 2021-12-24 景旺电子科技(珠海)有限公司 印刷线路板的制作方法及印刷线路板
EP4279540A1 (en) * 2022-05-17 2023-11-22 ALLNEX GERMANY GmbH Adhesion-promoting system for a rubber composition

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014015608A (ja) 2012-06-12 2014-01-30 Ajinomoto Co Inc 樹脂組成物
JP2015017247A (ja) * 2013-06-12 2015-01-29 味の素株式会社 樹脂組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005281673A (ja) * 2004-03-02 2005-10-13 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよび製品
JP2006241252A (ja) * 2005-03-01 2006-09-14 Sekisui Chem Co Ltd エポキシ樹脂硬化物、エポキシ樹脂硬化物からなるシート及びエポキシ樹脂硬化物の製造方法
JP5193925B2 (ja) * 2009-03-31 2013-05-08 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びその硬化物
JP6133542B2 (ja) * 2012-02-29 2017-05-24 日立化成株式会社 フィルム状接着剤、接着シート及び半導体装置
JP6123243B2 (ja) * 2012-11-12 2017-05-10 味の素株式会社 絶縁樹脂材料
JP6308344B2 (ja) * 2013-04-08 2018-04-11 味の素株式会社 硬化性樹脂組成物
TWI629306B (zh) * 2013-07-19 2018-07-11 Ajinomoto Co., Inc. Resin composition
JP6156020B2 (ja) * 2013-09-26 2017-07-05 味の素株式会社 樹脂組成物
JP6427861B2 (ja) 2013-10-21 2018-11-28 味の素株式会社 回路基板の製造方法
JP6225643B2 (ja) * 2013-10-31 2017-11-08 味の素株式会社 積層板の製造方法
JP6761224B2 (ja) * 2014-02-19 2020-09-23 味の素株式会社 プリント配線板、半導体装置及び樹脂シートセット
JP6164113B2 (ja) * 2014-02-19 2017-07-19 味の素株式会社 支持体付き樹脂シート
JP6467774B2 (ja) * 2014-02-28 2019-02-13 味の素株式会社 プリント配線板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014015608A (ja) 2012-06-12 2014-01-30 Ajinomoto Co Inc 樹脂組成物
JP2015017247A (ja) * 2013-06-12 2015-01-29 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP6852332B2 (ja) 2021-03-31
TW201730300A (zh) 2017-09-01
JP2017082201A (ja) 2017-05-18
TWI734704B (zh) 2021-08-01
KR20170049448A (ko) 2017-05-10
CN112601344A (zh) 2021-04-02
CN106912158B (zh) 2020-12-25
CN106912158A (zh) 2017-06-30

Similar Documents

Publication Publication Date Title
KR102556112B1 (ko) 접착 필름
KR102573941B1 (ko) 수지 조성물
JP7405182B2 (ja) 樹脂組成物
TWI701289B (zh) 樹脂組成物
TWI745425B (zh) 樹脂組成物
KR102324901B1 (ko) 수지 시트
KR102561850B1 (ko) 배선판의 제조 방법
KR102314255B1 (ko) 열경화성 수지 조성물
KR102566064B1 (ko) 수지 조성물
KR20180108482A (ko) 수지 조성물
KR20170077044A (ko) 수지 조성물
JP6866858B2 (ja) 樹脂組成物層
KR102422859B1 (ko) 수지 시트
JP2017103329A (ja) 樹脂シート
KR102490658B1 (ko) 수지 조성물
TWI780250B (zh) 樹脂組成物
KR102511657B1 (ko) 지지체 부착 수지 시트
JP2017103332A (ja) 半導体チップパッケージの製造方法
JP2021120466A (ja) 樹脂シート、プリント配線板及び半導体装置
JP6911311B2 (ja) 樹脂組成物
JP7264194B2 (ja) 樹脂組成物
JP7371606B2 (ja) プリント配線板の製造方法
JP6610612B2 (ja) 支持体付き樹脂シート

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant