KR102553101B1 - 진공 호환 ｌｅｄ 기판 가열기 - Google Patents

진공 호환 ｌｅｄ 기판 가열기 Download PDF

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Publication number
KR102553101B1
KR102553101B1 KR1020187002306A KR20187002306A KR102553101B1 KR 102553101 B1 KR102553101 B1 KR 102553101B1 KR 1020187002306 A KR1020187002306 A KR 1020187002306A KR 20187002306 A KR20187002306 A KR 20187002306A KR 102553101 B1 KR102553101 B1 KR 102553101B1
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South Korea
Prior art keywords
leds
recessed portion
disposed
window
substrate
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KR1020187002306A
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English (en)
Korean (ko)
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KR20180014436A (ko
Inventor
로버트 브렌트 보파트
그레이 이. 와이카
데이비드 블라닉
제이슨 엠. 샬러
윌리엄 티. 위버
Original Assignee
베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
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Publication of KR20180014436A publication Critical patent/KR20180014436A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H01L21/67098—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H01L21/67207—
    • H01L33/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Control Of Resistance Heating (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020187002306A 2015-06-29 2016-06-24 진공 호환 ｌｅｄ 기판 가열기 Active KR102553101B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/753,991 2015-06-29
US14/753,991 US20160379854A1 (en) 2015-06-29 2015-06-29 Vacuum Compatible LED Substrate Heater
PCT/US2016/039262 WO2017003866A1 (en) 2015-06-29 2016-06-24 Vacuum compatible led substrate heater

Publications (2)

Publication Number Publication Date
KR20180014436A KR20180014436A (ko) 2018-02-08
KR102553101B1 true KR102553101B1 (ko) 2023-07-07

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Application Number Title Priority Date Filing Date
KR1020187002306A Active KR102553101B1 (ko) 2015-06-29 2016-06-24 진공 호환 ｌｅｄ 기판 가열기

Country Status (6)

Country Link
US (1) US20160379854A1 (https=)
JP (1) JP6886928B2 (https=)
KR (1) KR102553101B1 (https=)
CN (1) CN107710395A (https=)
TW (1) TW201701428A (https=)
WO (1) WO2017003866A1 (https=)

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US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧高温下のアニールチャンバ
SG11202001450UA (en) 2017-09-12 2020-03-30 Applied Materials Inc Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
EP4321649B1 (en) 2017-11-11 2025-08-20 Micromaterials LLC Gas delivery system for high pressure processing chamber
JP7330181B2 (ja) 2017-11-16 2023-08-21 アプライド マテリアルズ インコーポレイテッド 高圧蒸気アニール処理装置
JP2021503714A (ja) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧処理システムのためのコンデンサシステム
FR3076431A1 (fr) * 2017-12-28 2019-07-05 Aeroform France Dispositif de chauffage sans contact
SG11202008256WA (en) 2018-03-09 2020-09-29 Applied Materials Inc High pressure annealing process for metal containing materials
KR102078157B1 (ko) * 2018-04-16 2020-02-17 세메스 주식회사 기판 가열 유닛 및 이를 갖는 기판 처리 장치
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
KR101961864B1 (ko) 2018-08-17 2019-03-26 남윤종 폐엘이디 칩 분리 장치
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
JP7077989B2 (ja) 2019-02-20 2022-05-31 株式会社デンソー 車両用空調ユニット
JP7198434B2 (ja) * 2019-03-27 2023-01-04 ウシオ電機株式会社 加熱処理方法及び光加熱装置
CN114026674B (zh) * 2019-06-24 2025-11-07 朗姆研究公司 衬底表面的蒸气清洁
KR102747715B1 (ko) * 2019-10-15 2024-12-31 주식회사 케이씨텍 복사 열원을 이용한 기판 처리 장치
JP7398935B2 (ja) * 2019-11-25 2023-12-15 東京エレクトロン株式会社 載置台、及び、検査装置
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
JP7717717B2 (ja) * 2020-04-01 2025-08-04 ラム リサーチ コーポレーション 熱エッチングのための急速かつ正確な温度制御
JP7677797B2 (ja) * 2021-01-07 2025-05-15 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
US12568781B2 (en) 2021-01-25 2026-03-03 Lam Research Corporation Selective silicon trim by thermal etching

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JP2012023330A (ja) 2010-06-14 2012-02-02 Tokyo Electron Ltd 加熱源装置及びアニール装置

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Publication number Publication date
WO2017003866A1 (en) 2017-01-05
JP6886928B2 (ja) 2021-06-16
JP2018523305A (ja) 2018-08-16
CN107710395A (zh) 2018-02-16
TW201701428A (zh) 2017-01-01
US20160379854A1 (en) 2016-12-29
KR20180014436A (ko) 2018-02-08

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