CN102214766A - 发光二极管封装结构 - Google Patents
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Abstract
本发明提供一种发光二极管封装结构,其包含一底部散热结构、一反光底座、一固晶电路板结构、一发光二极管芯片、一透明板以及一反光体。特别地,该反光体的顶部其结构使该发光二极管芯片发射且射向该反光体的顶部的光分散地反射至该反光底座的反光结构。该反光底座上的反光结构其结构反射由该反光体的顶部反射的光使该光朝该透明板前进。
Description
技术领域
本发明涉及一种发光二极管封装结构(1ight-emitting diode package),并且特别地,本发明涉及一种具有反光锥形体(light-reflecting cone or pyramid)的发光二极管封装结构。
背景技术
近年来,发光二极管(light-emitting diode,LED)的应用已从早先的指示灯、装饰灯,拓展到交通标志、照明、电子产品的背光源,等。
典型的发光二极管封装结构如美国专利公告号第5,998,925号专利所揭露的封装结构,请见图1所示。图1所示的发光二极管封装结构1包含一固晶导线15以及一内导线16。一发光二极管芯片(light-emitting chip)12固定于该固晶导线15的一杯状体15a。该固晶导线15并且具有一自杯状体15a延伸的导线。该杯状体15a以一包含一特定荧光粉的被覆树脂11来充填,进而覆盖该发光二极管芯片12。该发光二极管芯片12的n型态电极以及p型态电极藉由接线13分别连接至该固晶导线15以及该内导线16。该被覆材料11与成型材料14分开。该发光二极管芯片12可以是蓝光发光二极管芯片12,混入被覆树脂11中的荧光粉可以是转换成黄光的荧光粉,藉此,该发光二极管芯片12最终发出白光。图1所示的发光二极管封装结构1也可以应用在未混入荧光粉的其它色光的发光二极管封装结构。
然而,图1所示的发光二极管封装结构与大多数典型的发光二极管封装结构其发光二极管芯片所发射的光直接射出结构或经一次反射即射出封装结构,皆仅能作为点光源,不易制作成具有大面积封装结构。此外,典型的发光二极管在封装上常用的树脂在高温下容易劣化变色,而导致发光二极管封装结构整体的发光效率降低。
因此,本发明的一范畴即在提供一种单晶发光二极管封装结构及多晶发光二极管混光封装结构,并且特别地,本发明关于一种具有反光锥体的发光二极管封装结构。藉此,根据本发明的发光二极管封装结构可以作为面光源。
发明内容
根据本发明的一较佳具体实施例的发光二极管封装结构,其包含一底部散热结构(bottom heat sink structure)、一反光底座(light-reflecting base)、一固晶电路板结构(chip-mounting circuit board structure)、一发光二极管芯片(light-emitting diode chip)、一透明板(transparent plate)以及一反光体(light-reflecting body)。该反光底座具有一反光结构、一第一封装接口以及一第二封装接口。该固晶电路板结构与该底部散热结构紧密结合成一体,并且与该反光底座的该第二封装接口密封。该发光二极管芯片固定在该固晶电路板结构及底部散热结构上。该透明板与该反光底座的该第一封装接口密封。该反光体的一尾部固定在该透明板的一下表面上,致使该反光体的一顶部对齐该发光二极管芯片。特别地,该反光体的顶部其结构使该发光二极管芯片发射且射向该反光体的顶部的光分散地反射至该反光底座的反光结构。该反光结构其结构反射由该反光体的顶部反射的光使该光朝该透明板前进。
在另一较佳具体实施例中,根据本发明的发光二极管封装结构进一步包含一壳体(casing)。该壳体围绕该反光底座及该固晶电路板结构并与该反光底座及该固晶电路板结构密封。
在一具体实施例中,该反光结构其结构反射由该反光体的顶部反射的光使该光朝垂直该透明板的下表面的一方向前进。藉此,根据本发明的发光二极管封装结构可作为面光源。
在一具体实施例中,由该反光底座、该固晶电路板结构、该底部散热结构以及该透明板所形成的一密闭空间可充填氮气、一惰性气体或一透明充填材料。
在一具体实施例中,该固晶电路板结构包含两电极以及一将该两电极隔离的结构。该两电极从该密闭空间内延伸至该密闭空间外。
在一具体实施例中,该发光二极管芯片可以是一蓝光发光二极管芯片、一黄光发光二极管芯片、一绿光发光二极管芯片或一红光发光二极管芯片。
在一具体实施例中,该反光底座与该反光结构由一高分子材料以一射出制程所形成,该反光结构的表面并且被覆一反射膜。
在一具体实施例中,该反光体的顶部大体上成圆锥体、角锥体、尖锥体、半球体或不规则曲面。
在一具体实施例中,该反光体由一高分子材料所形成,并且该反光体的顶部的表面被覆一反射膜。
关于本发明的优点与精神可以藉由以下的发明详述及所附图式得到进一步的了解。
附图说明
图1为现有技术的发光二极管封装结构的剖面示意图。
图2为根据本发明一较佳具体实施例的发光二极管封装结构的剖面示意图。
图3为绘示图2中的反光体的数种实际案例。
图4A为根据本发明另一较佳具体实施例的发光二极管封装结构的剖面示意图。
图4B为图4A中固晶电路板结构以及其上多个发光二极管芯片的俯视图。
图5A为根据本发明另一较佳具体实施例的发光二极管封装结构的局部剖面示意图。
图5B为图5A的固晶电路板结构以及其上多个发光二极管芯片的俯视图。
图5C为图5A的发光二极管封装结构的另一局部剖面示意图。
【主要组件符号说明】
1、2、3:发光二极管封装结构 11:被覆树脂
12:发光二极管芯片 13:接线
14:成型材料 15:固晶导线
15a:杯状体 15b:延伸导线
16:内导线 20:底部散热结构
21:壳体 22:反光底座
222:反光结构 224:第一封装接口
226:第二封装接口 24:固晶电路板结构
242:电极 25:发光二极管芯片
25a:蓝光发光二极管芯片 25b:红光发光二极管芯片
25c:绿光发光二极管芯片 26:透明板
262:透明板的下表面 264:导光偏向结构
28、28a~28h:反光体 282:反光体的尾部
284:反光体的顶部
具体实施方式
以下将详述本发明的较佳具体实施例,藉以充分说明本发明的特征、精神及优点。
请参阅图2,图2为一示意的剖面视图藉以揭露根据本发明的一较佳具体实施例的发光二极管封装结构2。
如图2所示,根据本发明的发光二极管封装结构2包含一底部散热结构20、一反光底座22、一固晶电路板结构24、一发光二极管芯片25、一透明板26以及一反光体28。
该反光底座22具有一反光结构222、一第一封装接口224以及一第二封装接口226。
同样示于图2,该固晶电路板结构24与该底部散热结构20紧密结合成一体,并且与该反光底座22的第二封装接口226密封。
该发光二极管芯片25固定在该固晶电路板结构24及该底部散热结构20上。
该反光体28的一尾部282固定在该透明板26的一下表面262上,并且该透明板26与该反光底座22的第一封装接口224密封,致使该反光体28的一顶部284对齐该发光二极管芯片25,如图2所示。
在一具体实施例中,由该反光底座22、该固晶电路板结构24、该底部散热结构20以及该透明板26所形成的一密闭空间可充填氮气、一惰性气体或一透明充填材料(例如,环氧树脂、硅胶)。
在一具体实施例中,该固晶电路板结构24包含两电极242以及一将该两电极242隔离的高分子材料结构(未绘示于图2)。该两电极242从该密闭空间内延伸至该密闭空间外,如图2所示。
同样示于图2,特别地,该反光体28的顶部284其结构使该发光二极管芯片25发射且射向该反光体28的顶部284的光分散地反射至该反光底座22的该反光结构222。该反光结构222其结构反射由该反光体28的顶部284反射的光使该光朝该透明板26前进。该透明板26的下表面262具有高导入光微结构及导光偏向结构264可控制光线方向。
在一具体实施例中,该反光结构222其结构反射由该反光体28的顶部284反射的光使该光朝垂直该透明板26的下表面262的一方向前进,如图2所示。藉此,根据本发明的发光二极管封装结构2可作为面光源。
在实际应用中,该反光结构222环绕该发光二极管芯片25。该反光结构222的作用类似菲涅尔反射镜。菲涅尔反射镜的原理与菲涅尔透镜的原理相似,也是由小到大的同心圆,并每一圈的角度和厚薄程度都不一样,基本上相当于传统光学组件中的凹面镜。
在一具体实施例中,该发光二极管芯片25可以是一蓝光发光二极管芯片、一黄光发光二极管芯片、一绿光发光二极管芯片或一红光发光二极管芯片。
在一具体实施例中,该透明板26可以由压克力、硅胶、玻璃...等高透光度材料制成。
在一具体实施例中,该反光体28与该反光底座22系由一高分子材料以一射出制程所形成,该反光体的顶部284的表面与反光底座上的反光结构222的表面被覆一反射膜(例如,金属膜)。
在一具体实施例中,该反光体28即是反光锥形体,也就是说,该反光体28的顶部284大体上成圆锥体、角锥体、尖锥体、半球体或不规则曲面等。但是需强调的是,该反光体28的顶部284的曲面可以是对称的,也可以是不对称的。在实际应用中,该反光体28的顶部284的曲面需配合该反光结构28,让该发光二极管芯片25发射的光使该光朝垂直该透明板26的下表面262的方向前进。如图3所示,图3中号码标记28a~28h即为该反光体28的顶部284的数种实际案例,但该反光体28并不以图3所示的反光体28a~28h为限。
同样示于图2,于另一较佳具体实施例中,根据本发明的发光二极管封装结构2进一步包含一壳体(casing)21。该壳体21围绕该反光底座22及该固晶电路板结构24,并且与该反光底座22及该固晶电路板结构24密封。
请参阅图4A及图4B,图4A为一示意的剖面视图藉以揭露根据本发明的另一较佳具体实施例的发光二极管封装结构2。图4B为以一示意的俯视图绘示图4A的固晶电路板结构24以及其上多个发光二极管芯片25。
图4A所示的发光二极管封装结构2包含多个发光二极管芯片25。该固晶电路板结构24其结构配合让多个发光二极管芯片25固定。该多个发光二极管芯片25可经由该反光体28的顶部284以及该反光底座22上的反光结构222反射,进而充分混光可作为大型面光源。于图4A中具有与图2中相同号码标记的组件,其即为的前所述的组件,在此不再赘述。须强调的是,该多个发光二极管芯片25可以皆是发出同色光的发光二极管芯片,也可以是分别发出不同色光的发光二极管芯片。
在一具体实施例中,如图4B所示,该多个发光二极管芯片25包含数个蓝光发光二极管芯片25a、数个红光发光二极管芯片25b以及数个绿光发光二极管芯片25c。该多个发光二极管芯片(25a、25b、25c)并且依照光学设计来排列,进而充分混光成演色性佳的白光。
请参阅图5A、图5B及图5C,图5A为一示意的局部剖面视图藉以揭露根据本发明的另一较佳具体实施例的发光二极管封装结构3。图5B为以一示意的俯视图绘示图5A的固晶电路板结构24以及其上多个发光二极管芯片(25a、25b、25c)的排列。图5C为另一示意的局部剖面视图藉以揭露根据本发明的发光二极管封装结构3
如图5A、图5B及图5C所示,根据本发明的发光二极管封装结构3包含多个发光二极管芯片。该多个固晶电路板结构24上的每一个反光体28的两个曲面不尽相同,可产生不同方向的光源。藉由反光体28特殊的光学设计,因此,本发明的发光二极管封装结构3可充分混光产生一近似平行光源(光射向图5B的左方)。该平行光源若打在一曲面反光底座22上,该反光底座22上具有反光结构222可产生均匀的大型面光源。该固晶电路板结构24上的发光二极管芯片可以皆是发出同色光的发光二极管芯片,也可以是分别发出不同色光的发光二极管芯片。例如,图5B所示的发光二极管封装结构3包含数个蓝光发光二极管芯片25a、数个红光发光二极管芯片25b以及数个绿光发光二极管芯片25c,以混光成演色性佳的白光。于图5A、图5B、图5C中具有与图2中相同号码标记的组件,其即为的前所述的组件,在此不再赘述。
综上所述,可以轻易了解根据本发明的发光二极管封装结构利用反光锥形体,让发光二极管芯片发射的光至射出封装结构的间的光路不同于现有技术的发光二极管封装结构的设计。更可以轻易了解不同于现有技术仅能作为点光源的发光二极管封装结构,根据本发明的发光二极管封装结构可以作为面光源。
藉由以上较佳具体实施例的详述,希望能更加清楚描述本发明的特征与精神,而并非以上述所揭露的较佳具体实施例来对本发明的范畴加以限制。相反地,其目的是希望能涵盖各种改变及具相等性的安排于本发明所欲申请的专利范围的范畴内。因此,本发明所申请的专利范围的范畴应该根据上述的说明作最宽广的解释,以致使其涵盖所有可能的改变以及具相等性的安排。
Claims (10)
1.一种发光二极管封装结构(light-emitting diode package),包含:
一底部散热结构(bottom heat sink structure);
一反光底座(light-reflecting base),该反光底座具有一反光结构、一第一封装接口以及一第二封装接口;
一固晶电路板结构(chip-mounting circuit board structure),该固晶电路板结构与该底部散热结构紧密结合成一体并且与该反光底座的该第二封装接口密封;
一发光二极管芯片(light-emitting diode chip),该发光二极管芯片固定在该固晶电路板结构及底部散热结构上;
一透明板(transparent plate),该透明板与该反光底座的该第一封装接口密封;以及
一反光体(light-reflecting body),该反光体的一尾部固定在该透明板的一下表面上,致使该反光体的一顶部对齐该发光二极管芯片,其中该反光体的顶部其结构使该发光二极管芯片发射且射向该反光体的顶部的光分散地反射至该反光底座的反光结构,该反光结构其结构反射由该反光体的顶部反射的光使该光朝该透明板前进。
2.如权利要求1所述的发光二极管封装结构,其中该反光结构其结构系反射由该反光体的顶部反射的光使该光朝垂直该透明板的下表面的一方向前进。
3.如权利要求2所述的发光二极管封装结构,其中由该反光底座、该固晶电路板结构、该底部散热结构以及该透明板所形成的一密闭空间充填一透明充填材料、一氮气或一惰性气体。
4.如权利要求3所述的发光二极管封装结构,其中该固晶电路板结构包含两电极以及一将该两电极隔离的高分子材料结构,该两电极从该密闭空间内延伸至该密闭空间外。
5.如权利要求2所述的发光二极管封装结构,其中该发光二极管芯片选自由一蓝光发光二极管芯片、一黄光发光二极管芯片、一绿光发光二极管芯片以及一红光发光二极管芯片所组成的一群组中的其一。
6.如权利要求2所述的发光二极管封装结构,其中该发光二极管芯片藉由一表面黏着技术固定在该固晶电路板结构上。
7.如权利要求2所述的发光二极管封装结构,其中该反光底座与该反光结构由一高分子材料以一射出制程所形成,该反光结构的表面并且被覆一反射膜。
8.如权利要求2所述的发光二极管封装结构,其中该反光体的顶部大体上成圆锥体、角锥体、尖锥体、半球体或不规则曲面。
9.如权利要求2所述的发光二极管封装结构,其中该反光体由一高分子材料所形成,并且该反光体的顶部的表面被覆一反射膜。
10.如权利要求2所述的发光二极管封装结构,进一步包含一壳体(casing),该壳体围绕该反光底座及该固晶电路板结构并与该反光底座及该固晶电路板结构密封。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI486687B (zh) * | 2013-08-06 | 2015-06-01 | Global Lighting Technology Inc | 直下式背光模組 |
CN107710395A (zh) * | 2015-06-29 | 2018-02-16 | 瓦里安半导体设备公司 | 真空兼容的发光二极管基板加热器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020163808A1 (en) * | 2001-05-04 | 2002-11-07 | West Robert S. | Lens and Lens Cap with Sawtooth Portion for Light Emitting Diode |
CN2706872Y (zh) * | 2004-05-29 | 2005-06-29 | 无锡来德电子有限公司 | 发光二极管的散热装置 |
CN1722484A (zh) * | 2004-07-16 | 2006-01-18 | 奥斯兰姆施尔凡尼亚公司 | 用于发光二极管的管座装置 |
JP2007142476A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
CN101246945A (zh) * | 2008-02-29 | 2008-08-20 | 北京大学 | 一种边发射型led封装结构 |
-
2010
- 2010-04-02 CN CN2010101390016A patent/CN102214766A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020163808A1 (en) * | 2001-05-04 | 2002-11-07 | West Robert S. | Lens and Lens Cap with Sawtooth Portion for Light Emitting Diode |
CN2706872Y (zh) * | 2004-05-29 | 2005-06-29 | 无锡来德电子有限公司 | 发光二极管的散热装置 |
CN1722484A (zh) * | 2004-07-16 | 2006-01-18 | 奥斯兰姆施尔凡尼亚公司 | 用于发光二极管的管座装置 |
JP2007142476A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
CN101246945A (zh) * | 2008-02-29 | 2008-08-20 | 北京大学 | 一种边发射型led封装结构 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI486687B (zh) * | 2013-08-06 | 2015-06-01 | Global Lighting Technology Inc | 直下式背光模組 |
CN107710395A (zh) * | 2015-06-29 | 2018-02-16 | 瓦里安半导体设备公司 | 真空兼容的发光二极管基板加热器 |
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