TW201701428A - 真空相容的發光二極體基板加熱器 - Google Patents

真空相容的發光二極體基板加熱器 Download PDF

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Publication number
TW201701428A
TW201701428A TW105117295A TW105117295A TW201701428A TW 201701428 A TW201701428 A TW 201701428A TW 105117295 A TW105117295 A TW 105117295A TW 105117295 A TW105117295 A TW 105117295A TW 201701428 A TW201701428 A TW 201701428A
Authority
TW
Taiwan
Prior art keywords
light emitting
recess
emitting diodes
disposed
light
Prior art date
Application number
TW105117295A
Other languages
English (en)
Chinese (zh)
Inventor
羅伯特 布然特 寶佩特
蓋瑞 Ｅ‧ 維卡
大衛 伯拉尼克
傑森 Ｍ‧ 夏勒
威廉 Ｔ‧ 維弗
Original Assignee
瓦里安半導體設備公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瓦里安半導體設備公司 filed Critical 瓦里安半導體設備公司
Publication of TW201701428A publication Critical patent/TW201701428A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Control Of Resistance Heating (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Vapour Deposition (AREA)
TW105117295A 2015-06-29 2016-06-02 真空相容的發光二極體基板加熱器 TW201701428A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/753,991 US20160379854A1 (en) 2015-06-29 2015-06-29 Vacuum Compatible LED Substrate Heater

Publications (1)

Publication Number Publication Date
TW201701428A true TW201701428A (zh) 2017-01-01

Family

ID=57602729

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105117295A TW201701428A (zh) 2015-06-29 2016-06-02 真空相容的發光二極體基板加熱器

Country Status (6)

Country Link
US (1) US20160379854A1 (https=)
JP (1) JP6886928B2 (https=)
KR (1) KR102553101B1 (https=)
CN (1) CN107710395A (https=)
TW (1) TW201701428A (https=)
WO (1) WO2017003866A1 (https=)

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TWI868169B (zh) * 2019-06-24 2025-01-01 美商蘭姆研究公司 基板表面的蒸氣清潔
TWI918268B (zh) 2019-06-24 2026-03-11 美商蘭姆研究公司 基板表面的蒸氣清潔

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SG11202001450UA (en) 2017-09-12 2020-03-30 Applied Materials Inc Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
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JP7330181B2 (ja) 2017-11-16 2023-08-21 アプライド マテリアルズ インコーポレイテッド 高圧蒸気アニール処理装置
JP2021503714A (ja) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧処理システムのためのコンデンサシステム
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KR102078157B1 (ko) * 2018-04-16 2020-02-17 세메스 주식회사 기판 가열 유닛 및 이를 갖는 기판 처리 장치
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
KR101961864B1 (ko) 2018-08-17 2019-03-26 남윤종 폐엘이디 칩 분리 장치
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
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JP7198434B2 (ja) * 2019-03-27 2023-01-04 ウシオ電機株式会社 加熱処理方法及び光加熱装置
KR102747715B1 (ko) * 2019-10-15 2024-12-31 주식회사 케이씨텍 복사 열원을 이용한 기판 처리 장치
JP7398935B2 (ja) * 2019-11-25 2023-12-15 東京エレクトロン株式会社 載置台、及び、検査装置
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
JP7717717B2 (ja) * 2020-04-01 2025-08-04 ラム リサーチ コーポレーション 熱エッチングのための急速かつ正確な温度制御
JP7677797B2 (ja) * 2021-01-07 2025-05-15 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
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TWI868169B (zh) * 2019-06-24 2025-01-01 美商蘭姆研究公司 基板表面的蒸氣清潔
US12467147B2 (en) 2019-06-24 2025-11-11 Lam Research Corporation Vapor cleaning of substrate surfaces
TWI918268B (zh) 2019-06-24 2026-03-11 美商蘭姆研究公司 基板表面的蒸氣清潔

Also Published As

Publication number Publication date
WO2017003866A1 (en) 2017-01-05
JP6886928B2 (ja) 2021-06-16
JP2018523305A (ja) 2018-08-16
CN107710395A (zh) 2018-02-16
KR102553101B1 (ko) 2023-07-07
US20160379854A1 (en) 2016-12-29
KR20180014436A (ko) 2018-02-08

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