KR102534203B1 - 기판 처리 시스템 - Google Patents

기판 처리 시스템 Download PDF

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Publication number
KR102534203B1
KR102534203B1 KR1020197027405A KR20197027405A KR102534203B1 KR 102534203 B1 KR102534203 B1 KR 102534203B1 KR 1020197027405 A KR1020197027405 A KR 1020197027405A KR 20197027405 A KR20197027405 A KR 20197027405A KR 102534203 B1 KR102534203 B1 KR 102534203B1
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KR
South Korea
Prior art keywords
substrate
wafer
area
sound wave
wave emitting
Prior art date
Application number
KR1020197027405A
Other languages
English (en)
Korean (ko)
Other versions
KR20190117685A (ko
Inventor
히토시 하시마
노부아키 마츠오카
즈네나가 나카시마
다카히로 야스타케
히데오 후나코시
히로시 나카무라
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20190117685A publication Critical patent/KR20190117685A/ko
Application granted granted Critical
Publication of KR102534203B1 publication Critical patent/KR102534203B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
KR1020197027405A 2017-02-24 2018-01-12 기판 처리 시스템 KR102534203B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017032961 2017-02-24
JPJP-P-2017-032961 2017-02-24
JPJP-P-2017-251489 2017-12-27
JP2017251489 2017-12-27
PCT/JP2018/000655 WO2018154993A1 (ja) 2017-02-24 2018-01-12 基板処理システム

Publications (2)

Publication Number Publication Date
KR20190117685A KR20190117685A (ko) 2019-10-16
KR102534203B1 true KR102534203B1 (ko) 2023-05-19

Family

ID=63253175

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197027405A KR102534203B1 (ko) 2017-02-24 2018-01-12 기판 처리 시스템

Country Status (5)

Country Link
JP (1) JP6902601B2 (zh)
KR (1) KR102534203B1 (zh)
CN (1) CN110313060B (zh)
TW (1) TWI770118B (zh)
WO (1) WO2018154993A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7072301B1 (ja) * 2021-09-01 2022-05-20 伸和コントロールズ株式会社 製造プラント及び製造プラントにおける機器の設置方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002041375A1 (fr) * 2000-11-15 2002-05-23 Nikon Corporation Procedes et dispositfs de transfert et d'exposition et procede servant a fabriquer un composant
JP2004260099A (ja) * 2003-02-27 2004-09-16 Dainippon Screen Mfg Co Ltd 処理流体供給装置およびこれを適用した基板処理装置、ならびに基板処理方法
JP2005354025A (ja) * 2004-05-13 2005-12-22 Tokyo Electron Ltd 基板搬送機構、該基板搬送機構を備える基板搬送装置、基板搬送機構のパーティクル除去方法、基板搬送装置のパーティクル除去方法、該方法を実行するためのプログラム、及び記憶媒体
JP2016178256A (ja) * 2015-03-23 2016-10-06 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ搬送装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4564742B2 (ja) * 2003-12-03 2010-10-20 キヤノン株式会社 露光装置及びデバイス製造方法
CN100584714C (zh) * 2004-05-13 2010-01-27 东京毅力科创株式会社 基板输送机构及输送装置、颗粒除去法及程序和存储介质
CN100592468C (zh) * 2006-02-02 2010-02-24 株式会社迅动 基板处理装置
JP4954728B2 (ja) * 2007-01-26 2012-06-20 東京エレクトロン株式会社 ゲートバルブの洗浄方法及び基板処理システム
JP5395405B2 (ja) * 2008-10-27 2014-01-22 東京エレクトロン株式会社 基板洗浄方法及び装置
JP5123820B2 (ja) * 2008-10-27 2013-01-23 東京エレクトロン株式会社 基板処理装置の真空排気方法及び基板処理装置
JP5557161B2 (ja) 2011-01-24 2014-07-23 住友電気工業株式会社 構造解析方法
TWI523134B (zh) * 2011-09-22 2016-02-21 東京威力科創股份有限公司 基板處理系統、基板搬運方法、及電腦記憶媒體
JP5956324B2 (ja) * 2012-12-13 2016-07-27 東京エレクトロン株式会社 搬送基台及び搬送システム
JP2015126203A (ja) * 2013-12-27 2015-07-06 東京エレクトロン株式会社 基板受け渡し装置及び基板受け渡し方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002041375A1 (fr) * 2000-11-15 2002-05-23 Nikon Corporation Procedes et dispositfs de transfert et d'exposition et procede servant a fabriquer un composant
JP2004260099A (ja) * 2003-02-27 2004-09-16 Dainippon Screen Mfg Co Ltd 処理流体供給装置およびこれを適用した基板処理装置、ならびに基板処理方法
JP2005354025A (ja) * 2004-05-13 2005-12-22 Tokyo Electron Ltd 基板搬送機構、該基板搬送機構を備える基板搬送装置、基板搬送機構のパーティクル除去方法、基板搬送装置のパーティクル除去方法、該方法を実行するためのプログラム、及び記憶媒体
JP2016178256A (ja) * 2015-03-23 2016-10-06 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ搬送装置

Also Published As

Publication number Publication date
CN110313060B (zh) 2023-10-24
JP6902601B2 (ja) 2021-07-14
KR20190117685A (ko) 2019-10-16
TWI770118B (zh) 2022-07-11
CN110313060A (zh) 2019-10-08
WO2018154993A1 (ja) 2018-08-30
JPWO2018154993A1 (ja) 2019-11-21
TW201843439A (zh) 2018-12-16

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