KR102520038B1 - 가스 센서 패키지 및 이를 포함하는 센싱 장치 - Google Patents

가스 센서 패키지 및 이를 포함하는 센싱 장치 Download PDF

Info

Publication number
KR102520038B1
KR102520038B1 KR1020180003171A KR20180003171A KR102520038B1 KR 102520038 B1 KR102520038 B1 KR 102520038B1 KR 1020180003171 A KR1020180003171 A KR 1020180003171A KR 20180003171 A KR20180003171 A KR 20180003171A KR 102520038 B1 KR102520038 B1 KR 102520038B1
Authority
KR
South Korea
Prior art keywords
package substrate
hole
gas sensor
ground
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020180003171A
Other languages
English (en)
Korean (ko)
Other versions
KR20190085263A (ko
Inventor
김민진
정영두
정은희
조성은
최인호
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020180003171A priority Critical patent/KR102520038B1/ko
Priority to US16/124,385 priority patent/US11067554B2/en
Priority to EP18209061.3A priority patent/EP3511703B1/en
Priority to CN201811570923.5A priority patent/CN110018202B/zh
Priority to JP2018244486A priority patent/JP7210271B2/ja
Priority to SG10201900168RA priority patent/SG10201900168RA/en
Publication of KR20190085263A publication Critical patent/KR20190085263A/ko
Application granted granted Critical
Publication of KR102520038B1 publication Critical patent/KR102520038B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/125—Composition of the body, e.g. the composition of its sensitive layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/048—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance for determining moisture content of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/122—Circuits particularly adapted therefor, e.g. linearising circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/122—Circuits particularly adapted therefor, e.g. linearising circuits
    • G01N27/123—Circuits particularly adapted therefor, e.g. linearising circuits for controlling the temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/128—Microapparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/129—Diode type sensors, e.g. gas sensitive Schottky diodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/406—Cells and probes with solid electrolytes
    • G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Combustion & Propulsion (AREA)
  • Inorganic Chemistry (AREA)
  • Molecular Biology (AREA)
  • Ceramic Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
KR1020180003171A 2018-01-10 2018-01-10 가스 센서 패키지 및 이를 포함하는 센싱 장치 Active KR102520038B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020180003171A KR102520038B1 (ko) 2018-01-10 2018-01-10 가스 센서 패키지 및 이를 포함하는 센싱 장치
US16/124,385 US11067554B2 (en) 2018-01-10 2018-09-07 Gas sensor package and sensing apparatus including the same
EP18209061.3A EP3511703B1 (en) 2018-01-10 2018-11-29 Gas sensor package
CN201811570923.5A CN110018202B (zh) 2018-01-10 2018-12-21 气体传感器封装件和包括其的感测设备
JP2018244486A JP7210271B2 (ja) 2018-01-10 2018-12-27 ガスセンサーパッケージ及びこれを含むセンシング装置
SG10201900168RA SG10201900168RA (en) 2018-01-10 2019-01-08 Gas Sensor Package And Sensing Apparatus Including The Same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180003171A KR102520038B1 (ko) 2018-01-10 2018-01-10 가스 센서 패키지 및 이를 포함하는 센싱 장치

Publications (2)

Publication Number Publication Date
KR20190085263A KR20190085263A (ko) 2019-07-18
KR102520038B1 true KR102520038B1 (ko) 2023-04-12

Family

ID=64564571

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180003171A Active KR102520038B1 (ko) 2018-01-10 2018-01-10 가스 센서 패키지 및 이를 포함하는 센싱 장치

Country Status (6)

Country Link
US (1) US11067554B2 (enrdf_load_stackoverflow)
EP (1) EP3511703B1 (enrdf_load_stackoverflow)
JP (1) JP7210271B2 (enrdf_load_stackoverflow)
KR (1) KR102520038B1 (enrdf_load_stackoverflow)
CN (1) CN110018202B (enrdf_load_stackoverflow)
SG (1) SG10201900168RA (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102437764B1 (ko) * 2017-12-20 2022-08-30 삼성전자주식회사 센서 패키지, 센서 패키지의 제조 방법, 및 리드 구조체의 제조 방법
KR102466332B1 (ko) * 2018-01-02 2022-11-15 삼성전자주식회사 가스 센서 패키지
JP7336729B2 (ja) * 2019-05-21 2023-09-01 パナソニックＩｐマネジメント株式会社 ガスセンサ
JP7471947B2 (ja) * 2020-08-01 2024-04-22 Tdk株式会社 センサーモジュール
GB202316747D0 (en) * 2023-11-01 2023-12-13 Faradalc Sensors Gmbh Gas sensor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008241501A (ja) * 2007-03-28 2008-10-09 Ngk Spark Plug Co Ltd ガスセンサ
US20100133629A1 (en) * 2008-10-22 2010-06-03 Honeywell International Inc. Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
US8333874B2 (en) * 2005-12-09 2012-12-18 Flexible Medical Systems, Llc Flexible apparatus and method for monitoring and delivery

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134055U (ja) * 1983-02-24 1984-09-07 三菱電機株式会社 湿度センサ−
JPH0532764Y2 (enrdf_load_stackoverflow) * 1987-06-17 1993-08-20
JPH087095B2 (ja) 1987-06-30 1996-01-29 株式会社東芝 検出器
JPH01250747A (ja) * 1988-03-31 1989-10-05 Japan Gore Tex Inc 水溶液中溶質濃度測定センサ
JP3888228B2 (ja) 2002-05-17 2007-02-28 株式会社デンソー センサ装置
JP4131694B2 (ja) 2003-10-06 2008-08-13 三洋電機株式会社 積層セラミックス基板及びその製造方法
KR100652571B1 (ko) 2004-11-11 2006-12-07 엘지전자 주식회사 가스센서용 초소형 패키지
JP4732804B2 (ja) 2005-05-31 2011-07-27 日本特殊陶業株式会社 ガスセンサ及びその製造方法
JP4955349B2 (ja) 2006-09-07 2012-06-20 新光電気工業株式会社 半導体装置
KR100782405B1 (ko) 2006-10-27 2007-12-07 삼성전기주식회사 인쇄회로기판 제조방법
JP4382863B2 (ja) 2007-09-28 2009-12-16 太陽誘電株式会社 ガスセンサ及びガス検出方法
KR20090124011A (ko) 2008-05-29 2009-12-03 (주)엠투엔 패키징 기판과 이를 포함하는 가스 센싱 장치 및 그 제조방법
DE102008053909A1 (de) 2008-10-30 2010-05-27 Novar Gmbh Gasdetektor
KR101078187B1 (ko) 2009-02-26 2011-11-10 전자부품연구원 마이크로 가스 센서 및 그 제조 방법
US20110124113A1 (en) * 2009-11-25 2011-05-26 Abdul-Majeed Azad Methods and devices for detecting unsaturated compounds
DE102010018499A1 (de) 2010-04-22 2011-10-27 Schweizer Electronic Ag Leiterplatte mit Hohlraum
WO2016015029A1 (en) 2014-07-24 2016-01-28 Spec Sensors, Llc Electrochemical sensors and packaging and related methods
US9784708B2 (en) * 2010-11-24 2017-10-10 Spec Sensors, Llc Printed gas sensor
EP2857349B1 (en) 2013-10-01 2020-08-05 LG Innotek Co., Ltd. Gas sensor package
KR20150089749A (ko) 2014-01-28 2015-08-05 엘지이노텍 주식회사 레이더 장치
KR102158068B1 (ko) 2014-02-05 2020-09-21 엘지이노텍 주식회사 임베디드 인쇄회로기판
KR102212967B1 (ko) 2014-02-06 2021-02-08 엘지이노텍 주식회사 임베디드 인쇄회로기판
JP6347618B2 (ja) 2014-02-07 2018-06-27 日本特殊陶業株式会社 ガス検出器
TWI546913B (zh) 2014-04-02 2016-08-21 精材科技股份有限公司 晶片封裝體及其製造方法
KR20150116209A (ko) 2014-04-07 2015-10-15 주식회사 이노칩테크놀로지 센서 소자
US9664661B2 (en) 2014-05-08 2017-05-30 Active-Semi, Inc. Olfactory application controller integrated circuit
JP6312205B2 (ja) 2014-05-19 2018-04-18 日立オートモティブシステムズ株式会社 ガスセンサ
EP3001186B1 (en) 2014-09-26 2018-06-06 Sensirion AG Sensor chip
JP2016070670A (ja) 2014-09-26 2016-05-09 京セラ株式会社 センサ装置
US9598280B2 (en) 2014-11-10 2017-03-21 Nxp Usa, Inc. Environmental sensor structure
KR20160088111A (ko) 2015-01-15 2016-07-25 삼성전기주식회사 복합 센서와 이를 구비하는 패키지 및 그 제조 방법
KR20160122439A (ko) 2015-04-14 2016-10-24 엘지이노텍 주식회사 임베디드 인쇄회로기판
KR101709468B1 (ko) 2015-06-19 2017-03-09 주식회사 심텍 Pop 구조용 인쇄회로기판, 그 제조 방법 및 이를 이용하는 소자 패키지
JP6622593B2 (ja) 2016-01-06 2019-12-18 日本特殊陶業株式会社 センサの検査方法及びセンサの製造方法
KR102522099B1 (ko) 2016-01-14 2023-04-17 엘지이노텍 주식회사 센서 및 이의 제조 방법
JP2017151064A (ja) 2016-02-26 2017-08-31 セイコーエプソン株式会社 電子デバイス、高度計、電子機器および移動体
CN106298704B (zh) 2016-10-11 2018-05-29 中国科学院地质与地球物理研究所 一种带热沉和磁屏蔽的mems封装及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8333874B2 (en) * 2005-12-09 2012-12-18 Flexible Medical Systems, Llc Flexible apparatus and method for monitoring and delivery
JP2008241501A (ja) * 2007-03-28 2008-10-09 Ngk Spark Plug Co Ltd ガスセンサ
US20100133629A1 (en) * 2008-10-22 2010-06-03 Honeywell International Inc. Integrated sensor including sensing and processing die mounted on opposite sides of package substrate

Also Published As

Publication number Publication date
US11067554B2 (en) 2021-07-20
SG10201900168RA (en) 2019-08-27
EP3511703A3 (en) 2019-08-28
CN110018202B (zh) 2024-09-27
KR20190085263A (ko) 2019-07-18
JP7210271B2 (ja) 2023-01-23
JP2019120698A (ja) 2019-07-22
EP3511703A2 (en) 2019-07-17
US20190212312A1 (en) 2019-07-11
EP3511703B1 (en) 2024-07-03
CN110018202A (zh) 2019-07-16

Similar Documents

Publication Publication Date Title
KR102520038B1 (ko) 가스 센서 패키지 및 이를 포함하는 센싱 장치
KR102466332B1 (ko) 가스 센서 패키지
US10304890B2 (en) Electronic device package and fabricating method thereof
CN108701681B (zh) 屏蔽emi的集成电路封装和及其制造方法
US11715701B2 (en) Semiconductor device and method of inspecting the same
US9613877B2 (en) Semiconductor packages and methods for forming semiconductor package
KR20170113743A (ko) 반도체 패키지
KR100818088B1 (ko) 반도체 패키지 및 그 제조 방법
KR19980079621A (ko) 적층 기판, 볼 그리드 어레이 모듈 및 캐비티 다운 볼 그리드 어레이 패키지의 제조방법
TW201707179A (zh) 具有電磁干擾屏蔽部的半導體封裝和製造其之方法
KR20090096174A (ko) 회로 기판 및 이를 이용한 반도체 패키지
KR930004248B1 (ko) 반도체소자패키지 및 반도체소자패키지 탑재배선회로기판
JP4534927B2 (ja) 半導体装置
US20070253148A1 (en) Printed wiring board, semiconductor package with printed wiring board and electronic device having printed circuit board
US10923434B2 (en) Semiconductor packages having EMI shielding layers
US20090260872A1 (en) Module for packaging electronic components by using a cap
JP5159750B2 (ja) 半田ボール及び半導体パッケージ
KR20120063202A (ko) 반도체 패키지 및 이를 포함하는 디스플레이 패널 어셈블리
KR101927896B1 (ko) 반도체 장치
US20070090356A1 (en) Semiconductor device
CN111081696A (zh) 半导体封装和制造半导体封装的方法
JP2020080398A (ja) パッケージ構造物
KR20010070157A (ko) Ｂｇａ형 반도체장치
JP2630294B2 (ja) 混成集積回路装置およびその製造方法
KR101613084B1 (ko) 지문센서 모듈 및 이를 구비한 휴대용 전자기기

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20180110

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20210106

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20180110

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20220520

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20230117

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20230405

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20230406

End annual number: 3

Start annual number: 1

PG1601 Publication of registration