SG10201900168RA - Gas Sensor Package And Sensing Apparatus Including The Same - Google Patents
Gas Sensor Package And Sensing Apparatus Including The SameInfo
- Publication number
- SG10201900168RA SG10201900168RA SG10201900168RA SG10201900168RA SG10201900168RA SG 10201900168R A SG10201900168R A SG 10201900168RA SG 10201900168R A SG10201900168R A SG 10201900168RA SG 10201900168R A SG10201900168R A SG 10201900168RA SG 10201900168R A SG10201900168R A SG 10201900168RA
- Authority
- SG
- Singapore
- Prior art keywords
- fixing plate
- package substrate
- gas sensor
- hole
- same
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 7
- 230000001681 protective effect Effects 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/125—Composition of the body, e.g. the composition of its sensitive layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/048—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance for determining moisture content of the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/122—Circuits particularly adapted therefor, e.g. linearising circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/122—Circuits particularly adapted therefor, e.g. linearising circuits
- G01N27/123—Circuits particularly adapted therefor, e.g. linearising circuits for controlling the temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/128—Microapparatus
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/129—Diode type sensors, e.g. gas sensitive Schottky diodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Combustion & Propulsion (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Molecular Biology (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
A gas sensor package includes a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a gas sensor disposed in the hole of the package substrate; a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top 5 surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; and a protective film attached to the fixing plate. The protective film overlaps the vent hole when viewed in a plan view. 10 FIG. 2B
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180003171A KR102520038B1 (en) | 2018-01-10 | 2018-01-10 | Gas sensor package and Sensing apparatus including the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201900168RA true SG10201900168RA (en) | 2019-08-27 |
Family
ID=64564571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201900168RA SG10201900168RA (en) | 2018-01-10 | 2019-01-08 | Gas Sensor Package And Sensing Apparatus Including The Same |
Country Status (6)
Country | Link |
---|---|
US (1) | US11067554B2 (en) |
EP (1) | EP3511703B1 (en) |
JP (1) | JP7210271B2 (en) |
KR (1) | KR102520038B1 (en) |
CN (1) | CN110018202A (en) |
SG (1) | SG10201900168RA (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102437764B1 (en) * | 2017-12-20 | 2022-08-30 | 삼성전자주식회사 | Sensor package, Method of manufacturing sensor package, and Method of manufacturing lid structure |
KR102466332B1 (en) * | 2018-01-02 | 2022-11-15 | 삼성전자주식회사 | Gas sensor package |
JP7471947B2 (en) | 2020-08-01 | 2024-04-22 | Tdk株式会社 | Sensor Module |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59134055U (en) * | 1983-02-24 | 1984-09-07 | 三菱電機株式会社 | humidity sensor |
JPH0532764Y2 (en) * | 1987-06-17 | 1993-08-20 | ||
JPH087095B2 (en) | 1987-06-30 | 1996-01-29 | 株式会社東芝 | Detector |
JPH01250747A (en) * | 1988-03-31 | 1989-10-05 | Japan Gore Tex Inc | Measuring sensor of concentration of solute in water solution |
JP3888228B2 (en) | 2002-05-17 | 2007-02-28 | 株式会社デンソー | Sensor device |
JP4131694B2 (en) | 2003-10-06 | 2008-08-13 | 三洋電機株式会社 | Multilayer ceramic substrate and manufacturing method thereof |
KR100652571B1 (en) | 2004-11-11 | 2006-12-07 | 엘지전자 주식회사 | Micro package for gas sensor |
JP4732804B2 (en) | 2005-05-31 | 2011-07-27 | 日本特殊陶業株式会社 | Gas sensor and manufacturing method thereof |
US8333874B2 (en) * | 2005-12-09 | 2012-12-18 | Flexible Medical Systems, Llc | Flexible apparatus and method for monitoring and delivery |
JP4955349B2 (en) | 2006-09-07 | 2012-06-20 | 新光電気工業株式会社 | Semiconductor device |
KR100782405B1 (en) | 2006-10-27 | 2007-12-07 | 삼성전기주식회사 | Method of manufacturing printed circuit board |
JP2008241501A (en) * | 2007-03-28 | 2008-10-09 | Ngk Spark Plug Co Ltd | Gas sensor |
JP4382863B2 (en) | 2007-09-28 | 2009-12-16 | 太陽誘電株式会社 | Gas sensor and gas detection method |
KR20090124011A (en) | 2008-05-29 | 2009-12-03 | (주)엠투엔 | Packaging substrate and gas sensing device having the same, and method for manufacturing the same |
US8115286B2 (en) * | 2008-10-22 | 2012-02-14 | Honeywell International Inc. | Integrated sensor including sensing and processing die mounted on opposite sides of package substrate |
DE102008053909A1 (en) | 2008-10-30 | 2010-05-27 | Novar Gmbh | gas detector |
KR101078187B1 (en) | 2009-02-26 | 2011-11-10 | 전자부품연구원 | Micro Gas Sensor And Method of manufacturing the same |
US20110124113A1 (en) * | 2009-11-25 | 2011-05-26 | Abdul-Majeed Azad | Methods and devices for detecting unsaturated compounds |
DE102010018499A1 (en) | 2010-04-22 | 2011-10-27 | Schweizer Electronic Ag | PCB with cavity |
US9784708B2 (en) * | 2010-11-24 | 2017-10-10 | Spec Sensors, Llc | Printed gas sensor |
WO2016043848A2 (en) | 2014-07-24 | 2016-03-24 | Spec Sensors, Llc | Electrochemical sensors and packaging and related methods |
EP2857349B1 (en) | 2013-10-01 | 2020-08-05 | LG Innotek Co., Ltd. | Gas sensor package |
KR20150089749A (en) | 2014-01-28 | 2015-08-05 | 엘지이노텍 주식회사 | Radar apparatus |
KR102158068B1 (en) | 2014-02-05 | 2020-09-21 | 엘지이노텍 주식회사 | Embedded printed circuit substrate |
KR102212967B1 (en) | 2014-02-06 | 2021-02-08 | 엘지이노텍 주식회사 | Embedded printed circuit substrate |
JP6347618B2 (en) | 2014-02-07 | 2018-06-27 | 日本特殊陶業株式会社 | Gas detector |
TWI546913B (en) | 2014-04-02 | 2016-08-21 | 精材科技股份有限公司 | Chip package and method for forming the same |
KR20150116209A (en) | 2014-04-07 | 2015-10-15 | 주식회사 이노칩테크놀로지 | Senser device |
US9664661B2 (en) | 2014-05-08 | 2017-05-30 | Active-Semi, Inc. | Olfactory application controller integrated circuit |
JP6312205B2 (en) | 2014-05-19 | 2018-04-18 | 日立オートモティブシステムズ株式会社 | Gas sensor |
EP3001186B1 (en) | 2014-09-26 | 2018-06-06 | Sensirion AG | Sensor chip |
JP2016070670A (en) | 2014-09-26 | 2016-05-09 | 京セラ株式会社 | Sensor device |
US9598280B2 (en) | 2014-11-10 | 2017-03-21 | Nxp Usa, Inc. | Environmental sensor structure |
KR20160088111A (en) | 2015-01-15 | 2016-07-25 | 삼성전기주식회사 | Complex sensor, package having the same and manufacturing method thereof |
KR20160122439A (en) | 2015-04-14 | 2016-10-24 | 엘지이노텍 주식회사 | Embedded printed circuit substrate |
KR101709468B1 (en) | 2015-06-19 | 2017-03-09 | 주식회사 심텍 | PCB for POP structure, method of manufacturing the same and device package using the PCB |
JP6622593B2 (en) | 2016-01-06 | 2019-12-18 | 日本特殊陶業株式会社 | Sensor inspection method and sensor manufacturing method |
KR102522099B1 (en) | 2016-01-14 | 2023-04-17 | 엘지이노텍 주식회사 | Sensor and a manufacturing method thereof |
JP2017151064A (en) | 2016-02-26 | 2017-08-31 | セイコーエプソン株式会社 | Electronic device, altimeter, electronic equipment, and moving body |
CN106298704B (en) | 2016-10-11 | 2018-05-29 | 中国科学院地质与地球物理研究所 | A kind of band is heat sink and the MEMS package of magnetic screen and preparation method thereof |
-
2018
- 2018-01-10 KR KR1020180003171A patent/KR102520038B1/en active IP Right Grant
- 2018-09-07 US US16/124,385 patent/US11067554B2/en active Active
- 2018-11-29 EP EP18209061.3A patent/EP3511703B1/en active Active
- 2018-12-21 CN CN201811570923.5A patent/CN110018202A/en active Pending
- 2018-12-27 JP JP2018244486A patent/JP7210271B2/en active Active
-
2019
- 2019-01-08 SG SG10201900168RA patent/SG10201900168RA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2019120698A (en) | 2019-07-22 |
EP3511703B1 (en) | 2024-07-03 |
EP3511703A3 (en) | 2019-08-28 |
US11067554B2 (en) | 2021-07-20 |
CN110018202A (en) | 2019-07-16 |
EP3511703A2 (en) | 2019-07-17 |
KR20190085263A (en) | 2019-07-18 |
JP7210271B2 (en) | 2023-01-23 |
US20190212312A1 (en) | 2019-07-11 |
KR102520038B1 (en) | 2023-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201900168RA (en) | Gas Sensor Package And Sensing Apparatus Including The Same | |
USD886453S1 (en) | Case for electronic device | |
USD878538S1 (en) | Dispenser | |
USD930603S1 (en) | Electronic device housing | |
USD877090S1 (en) | Key device | |
PH12020050258A1 (en) | Display device and electronic device | |
EP4283572A3 (en) | Electronic device including biometric sensor | |
JP2015515760A5 (en) | ||
TW200618215A (en) | System and method for protecting microelectromechanical systems array using back-plate with non-flat portion | |
TW200713280A (en) | Electronic device including discontinuous storage elements | |
SG10201805041XA (en) | Image Sensor | |
USD958146S1 (en) | Case for electronic device | |
TW200614475A (en) | Semiconductor device | |
MY184452A (en) | Tape for electronic device packaging | |
EP3226102A3 (en) | Accessory for portable electronic device | |
TW200614665A (en) | Airtight package, piezoelectric device, and piezoelectric oscillator | |
EP4335369A3 (en) | Hearing device including an optical sensor | |
DE502007001637D1 (en) | STAMPING FILM DEVICE | |
EP3439050A3 (en) | Light emitting device package | |
EP3633732A3 (en) | Display device | |
USD876433S1 (en) | Key device | |
TW200720160A (en) | Package box | |
FR3070519B1 (en) | INPUT DEVICE ON A TACTILE SURFACE AND CORRESPONDING METHOD | |
USD889592S1 (en) | Containment device | |
MX2020012384A (en) | Opening device for a package adapted to contain a pourable product and package comprising an opening device. |