KR102506832B1 - 제어 장치, 기판 처리 시스템, 및 제어 방법 - Google Patents

제어 장치, 기판 처리 시스템, 및 제어 방법 Download PDF

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Publication number
KR102506832B1
KR102506832B1 KR1020227020543A KR20227020543A KR102506832B1 KR 102506832 B1 KR102506832 B1 KR 102506832B1 KR 1020227020543 A KR1020227020543 A KR 1020227020543A KR 20227020543 A KR20227020543 A KR 20227020543A KR 102506832 B1 KR102506832 B1 KR 102506832B1
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KR
South Korea
Prior art keywords
processing
substrate
substrate processing
lot
schedule
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KR1020227020543A
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English (en)
Korean (ko)
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KR20220103994A (ko
Inventor
다카후미 츠치야
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20220103994A publication Critical patent/KR20220103994A/ko
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Publication of KR102506832B1 publication Critical patent/KR102506832B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • General Factory Administration (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020227020543A 2019-11-26 2020-11-12 제어 장치, 기판 처리 시스템, 및 제어 방법 KR102506832B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-212843 2019-11-26
JP2019212843 2019-11-26
PCT/JP2020/042170 WO2021106581A1 (ja) 2019-11-26 2020-11-12 制御装置、基板処理システム、および制御方法

Publications (2)

Publication Number Publication Date
KR20220103994A KR20220103994A (ko) 2022-07-25
KR102506832B1 true KR102506832B1 (ko) 2023-03-06

Family

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Application Number Title Priority Date Filing Date
KR1020227020543A KR102506832B1 (ko) 2019-11-26 2020-11-12 제어 장치, 기판 처리 시스템, 및 제어 방법

Country Status (5)

Country Link
JP (1) JP7098072B2 (ja)
KR (1) KR102506832B1 (ja)
CN (1) CN114651318B (ja)
TW (1) TW202137366A (ja)
WO (1) WO2021106581A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102425A (ja) 1999-09-30 2001-04-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理装置のシミュレート装置並びにコンピュータ読み取り可能な記録媒体
JP2003100576A (ja) 2001-09-20 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2003173204A (ja) 2001-12-07 2003-06-20 Mitsubishi Electric Corp 処理装置への割り付け方法
JP2010129600A (ja) 2008-11-25 2010-06-10 Dainippon Screen Mfg Co Ltd 基板処理システム及びそのスケジュール作成方法
JP2010225982A (ja) 2009-03-25 2010-10-07 Toshiba Corp 被処理物の処理方法、処理装置および半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06176032A (ja) * 1992-12-03 1994-06-24 Nippon Telegr & Teleph Corp <Ntt> 生産管理システムおよび方法
KR20000030185A (ko) * 2000-01-31 2000-06-05 강용호 인터넷 사이트 운용방법
JP5032048B2 (ja) * 2006-03-31 2012-09-26 東京エレクトロン株式会社 基板処理装置の制御装置，制御方法および制御プログラムを記憶した記録媒体
JP5118530B2 (ja) * 2008-03-26 2013-01-16 大日本スクリーン製造株式会社 基板処理装置のスケジュール作成方法及びそのプログラム
JP6176032B2 (ja) 2013-01-30 2017-08-09 日亜化学工業株式会社 半導体発光素子
JP7025279B2 (ja) 2018-05-07 2022-02-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、電力制御装置、基板処理方法および電力制御方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102425A (ja) 1999-09-30 2001-04-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理装置のシミュレート装置並びにコンピュータ読み取り可能な記録媒体
JP2003100576A (ja) 2001-09-20 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置のスケジュール作成方法及びそのプログラム
JP2003173204A (ja) 2001-12-07 2003-06-20 Mitsubishi Electric Corp 処理装置への割り付け方法
JP2010129600A (ja) 2008-11-25 2010-06-10 Dainippon Screen Mfg Co Ltd 基板処理システム及びそのスケジュール作成方法
JP2010225982A (ja) 2009-03-25 2010-10-07 Toshiba Corp 被処理物の処理方法、処理装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JPWO2021106581A1 (ja) 2021-06-03
JP7098072B2 (ja) 2022-07-08
TW202137366A (zh) 2021-10-01
KR20220103994A (ko) 2022-07-25
CN114651318A (zh) 2022-06-21
CN114651318B (zh) 2023-04-14
WO2021106581A1 (ja) 2021-06-03

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