JPWO2021106581A1 - - Google Patents

Info

Publication number
JPWO2021106581A1
JPWO2021106581A1 JP2021561285A JP2021561285A JPWO2021106581A1 JP WO2021106581 A1 JPWO2021106581 A1 JP WO2021106581A1 JP 2021561285 A JP2021561285 A JP 2021561285A JP 2021561285 A JP2021561285 A JP 2021561285A JP WO2021106581 A1 JPWO2021106581 A1 JP WO2021106581A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021561285A
Other versions
JPWO2021106581A5 (ja
JP7098072B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021106581A1 publication Critical patent/JPWO2021106581A1/ja
Publication of JPWO2021106581A5 publication Critical patent/JPWO2021106581A5/ja
Application granted granted Critical
Publication of JP7098072B2 publication Critical patent/JP7098072B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • General Factory Administration (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021561285A 2019-11-26 2020-11-12 制御装置、基板処理システム、および制御方法 Active JP7098072B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019212843 2019-11-26
JP2019212843 2019-11-26
PCT/JP2020/042170 WO2021106581A1 (ja) 2019-11-26 2020-11-12 制御装置、基板処理システム、および制御方法

Publications (3)

Publication Number Publication Date
JPWO2021106581A1 true JPWO2021106581A1 (ja) 2021-06-03
JPWO2021106581A5 JPWO2021106581A5 (ja) 2022-03-09
JP7098072B2 JP7098072B2 (ja) 2022-07-08

Family

ID=76130206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561285A Active JP7098072B2 (ja) 2019-11-26 2020-11-12 制御装置、基板処理システム、および制御方法

Country Status (5)

Country Link
JP (1) JP7098072B2 (ja)
KR (1) KR102506832B1 (ja)
CN (1) CN114651318B (ja)
TW (1) TW202137366A (ja)
WO (1) WO2021106581A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06176032A (ja) * 1992-12-03 1994-06-24 Nippon Telegr & Teleph Corp <Ntt> 生産管理システムおよび方法
JP2001102425A (ja) * 1999-09-30 2001-04-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理装置のシミュレート装置並びにコンピュータ読み取り可能な記録媒体
JP2003173204A (ja) * 2001-12-07 2003-06-20 Mitsubishi Electric Corp 処理装置への割り付け方法
JP2010129600A (ja) * 2008-11-25 2010-06-10 Dainippon Screen Mfg Co Ltd 基板処理システム及びそのスケジュール作成方法
JP2010225982A (ja) * 2009-03-25 2010-10-07 Toshiba Corp 被処理物の処理方法、処理装置および半導体装置の製造方法
JP2019197761A (ja) * 2018-05-07 2019-11-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、電力制御装置、基板処理方法および電力制御方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000030185A (ko) * 2000-01-31 2000-06-05 강용호 인터넷 사이트 운용방법
JP4073186B2 (ja) * 2001-09-20 2008-04-09 大日本スクリーン製造株式会社 基板処理装置のスケジュール作成方法及びそのプログラム
JP5032048B2 (ja) * 2006-03-31 2012-09-26 東京エレクトロン株式会社 基板処理装置の制御装置，制御方法および制御プログラムを記憶した記録媒体
JP5118530B2 (ja) * 2008-03-26 2013-01-16 大日本スクリーン製造株式会社 基板処理装置のスケジュール作成方法及びそのプログラム
JP6176032B2 (ja) 2013-01-30 2017-08-09 日亜化学工業株式会社 半導体発光素子

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06176032A (ja) * 1992-12-03 1994-06-24 Nippon Telegr & Teleph Corp <Ntt> 生産管理システムおよび方法
JP2001102425A (ja) * 1999-09-30 2001-04-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理装置のシミュレート装置並びにコンピュータ読み取り可能な記録媒体
JP2003173204A (ja) * 2001-12-07 2003-06-20 Mitsubishi Electric Corp 処理装置への割り付け方法
JP2010129600A (ja) * 2008-11-25 2010-06-10 Dainippon Screen Mfg Co Ltd 基板処理システム及びそのスケジュール作成方法
JP2010225982A (ja) * 2009-03-25 2010-10-07 Toshiba Corp 被処理物の処理方法、処理装置および半導体装置の製造方法
JP2019197761A (ja) * 2018-05-07 2019-11-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、電力制御装置、基板処理方法および電力制御方法

Also Published As

Publication number Publication date
KR102506832B1 (ko) 2023-03-06
CN114651318B (zh) 2023-04-14
TW202137366A (zh) 2021-10-01
KR20220103994A (ko) 2022-07-25
CN114651318A (zh) 2022-06-21
WO2021106581A1 (ja) 2021-06-03
JP7098072B2 (ja) 2022-07-08

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