KR102501074B1 - 베이퍼 챔버 및 전자 기기 - Google Patents

베이퍼 챔버 및 전자 기기 Download PDF

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Publication number
KR102501074B1
KR102501074B1 KR1020207034976A KR20207034976A KR102501074B1 KR 102501074 B1 KR102501074 B1 KR 102501074B1 KR 1020207034976 A KR1020207034976 A KR 1020207034976A KR 20207034976 A KR20207034976 A KR 20207034976A KR 102501074 B1 KR102501074 B1 KR 102501074B1
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South Korea
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passage
sheet
steam
condensate
region
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KR20210016537A (ko
Inventor
신이치로 다카하시
다카유키 오타
가즈노리 오다
도시히코 다케다
기요타카 다케마츠
데루토시 모모세
요코 나카무라
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다이니폰 인사츠 가부시키가이샤
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H01L23/36—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fuel Cell (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Push-Button Switches (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Casings For Electric Apparatus (AREA)
KR1020207034976A 2018-05-30 2019-05-30 베이퍼 챔버 및 전자 기기 Active KR102501074B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2018-103620 2018-05-30
JP2018103620 2018-05-30
JPJP-P-2018-103633 2018-05-30
JP2018103633 2018-05-30
PCT/JP2019/021609 WO2019230911A1 (ja) 2018-05-30 2019-05-30 ベーパーチャンバー、及び電子機器

Publications (2)

Publication Number Publication Date
KR20210016537A KR20210016537A (ko) 2021-02-16
KR102501074B1 true KR102501074B1 (ko) 2023-02-21

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KR1020207034976A Active KR102501074B1 (ko) 2018-05-30 2019-05-30 베이퍼 챔버 및 전자 기기

Country Status (6)

Country Link
US (3) US11903167B2 (https=)
JP (3) JP6806285B2 (https=)
KR (1) KR102501074B1 (https=)
CN (2) CN112166294B (https=)
TW (3) TWI812723B (https=)
WO (1) WO2019230911A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
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US20240240873A1 (en) * 2023-01-12 2024-07-18 Top Rank Technology Limited Integrated vapor chamber
US20250123059A1 (en) * 2023-10-11 2025-04-17 Dell Products L.P. Wick structure for thin heatpipes

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CN119812143A (zh) 2019-03-11 2025-04-11 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片
JP6923091B2 (ja) * 2019-06-21 2021-08-18 株式会社村田製作所 ベーパーチャンバー
WO2021045211A1 (ja) * 2019-09-06 2021-03-11 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体
JP7565002B2 (ja) * 2020-01-07 2024-10-10 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
WO2021141110A1 (ja) * 2020-01-10 2021-07-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
TWI738602B (zh) * 2020-01-22 2021-09-01 訊凱國際股份有限公司 多通道薄熱交換器
CN115136302B (zh) * 2020-02-26 2025-12-23 京瓷株式会社 散热构件
TWM614541U (zh) * 2020-09-02 2021-07-11 雙鴻科技股份有限公司 薄型均溫板
TWI804767B (zh) * 2020-11-05 2023-06-11 大陸商尼得科巨仲電子（昆山）有限公司 均溫板結構及其毛細層結構
US20240125559A1 (en) * 2021-02-03 2024-04-18 Dai Nippon Printing Co., Ltd. Body sheet for vapor chamber, vapor chamber, and electronic apparatus
KR20230136170A (ko) * 2021-02-26 2023-09-26 교세라 가부시키가이샤 열 디바이스
TWI878479B (zh) * 2021-03-04 2025-04-01 宸寰科技有限公司 薄型化封裝接著結構
KR102851862B1 (ko) * 2021-04-02 2025-08-28 에스케이하이닉스 주식회사 방열 모듈
JP2023006702A (ja) * 2021-06-30 2023-01-18 尼得科超▲しゅう▼科技股▲ふん▼有限公司 熱伝導部材
CN113473807A (zh) * 2021-07-06 2021-10-01 中国电子科技集团公司第三十八研究所 一种基于毛细力驱动的整体式两相流散热装置
TW202530625A (zh) 2024-01-25 2025-08-01 邁萪科技股份有限公司 溝槽式均溫板毛細回流結構

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240240873A1 (en) * 2023-01-12 2024-07-18 Top Rank Technology Limited Integrated vapor chamber
US12320593B2 (en) * 2023-01-12 2025-06-03 Top Rank Technology Limited Integrated vapor chamber
US20250123059A1 (en) * 2023-10-11 2025-04-17 Dell Products L.P. Wick structure for thin heatpipes

Also Published As

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JP6809643B1 (ja) 2021-01-06
CN112166294B (zh) 2023-03-24
US12382610B2 (en) 2025-08-05
WO2019230911A1 (ja) 2019-12-05
JP7318628B2 (ja) 2023-08-01
US20210168969A1 (en) 2021-06-03
US20240130083A1 (en) 2024-04-18
TW202012865A (zh) 2020-04-01
JP2021055992A (ja) 2021-04-08
TWI856760B (zh) 2024-09-21
US20250338441A1 (en) 2025-10-30
TW202500939A (zh) 2025-01-01
TWI812723B (zh) 2023-08-21
US11903167B2 (en) 2024-02-13
TW202344791A (zh) 2023-11-16
JP2021014981A (ja) 2021-02-12
TWI878179B (zh) 2025-03-21
CN112166294A (zh) 2021-01-01
JP6806285B2 (ja) 2021-01-06
KR20210016537A (ko) 2021-02-16
JPWO2019230911A1 (ja) 2020-12-17
CN112902717B (zh) 2022-03-11
CN112902717A (zh) 2021-06-04

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