KR102500546B1 - 엔드 이펙터를 제공하기 위한 장치, 시스템 및 방법 - Google Patents

엔드 이펙터를 제공하기 위한 장치, 시스템 및 방법 Download PDF

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Publication number
KR102500546B1
KR102500546B1 KR1020170165948A KR20170165948A KR102500546B1 KR 102500546 B1 KR102500546 B1 KR 102500546B1 KR 1020170165948 A KR1020170165948 A KR 1020170165948A KR 20170165948 A KR20170165948 A KR 20170165948A KR 102500546 B1 KR102500546 B1 KR 102500546B1
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South Korea
Prior art keywords
wafer
end effector
support pads
support
clamp
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KR1020170165948A
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Korean (ko)
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KR20180064996A (ko
Inventor
제로엔 보스봄
바박 나데리
리차드 먼로
타티아나 판코바 메이저
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자빌 인코퍼레이티드
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    • H01L21/68735—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • H01L21/67742—
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • B25J19/025—Optical sensing devices including optical fibres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Paper (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
KR1020170165948A 2016-12-06 2017-12-05 엔드 이펙터를 제공하기 위한 장치, 시스템 및 방법 Active KR102500546B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/370,125 US9919430B1 (en) 2016-12-06 2016-12-06 Apparatus, system and method for providing an end effector
US15/370,125 2016-12-06

Publications (2)

Publication Number Publication Date
KR20180064996A KR20180064996A (ko) 2018-06-15
KR102500546B1 true KR102500546B1 (ko) 2023-02-15

Family

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KR1020170165948A Active KR102500546B1 (ko) 2016-12-06 2017-12-05 엔드 이펙터를 제공하기 위한 장치, 시스템 및 방법

Country Status (6)

Country Link
US (6) US9919430B1 (https=)
EP (1) EP3333886B1 (https=)
JP (2) JP7301260B2 (https=)
KR (1) KR102500546B1 (https=)
CN (2) CN116936449A (https=)
TW (2) TWI732975B (https=)

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US9975255B1 (en) * 2016-12-15 2018-05-22 Jabil Inc. Apparatus, system and method for providing a conformable vacuum cup for an end effector
US10553472B2 (en) * 2018-06-22 2020-02-04 Jabil Inc. Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner
CN109037109A (zh) * 2018-08-03 2018-12-18 德淮半导体有限公司 一种半导体设备及清洗晶圆的方法
KR102204884B1 (ko) * 2018-09-27 2021-01-19 세메스 주식회사 기판 반송 로봇 및 기판 처리 설비
US12165906B2 (en) * 2018-10-30 2024-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and methods for handling semiconductor part carriers
CN111319047A (zh) * 2018-12-13 2020-06-23 上海新昇半导体科技有限公司 一种晶圆夹持机械手臂组件
EP3898192B1 (en) * 2018-12-19 2023-11-01 Jabil Inc. System for kinematic-based heating of an additive manufacturing print filament
CN111376284A (zh) * 2018-12-29 2020-07-07 江苏鲁汶仪器有限公司 机械手及其机械手指
US12334387B2 (en) 2019-06-28 2025-06-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer apparatus
JP7299808B2 (ja) * 2019-09-19 2023-06-28 川崎重工業株式会社 傾き調整装置、及びそれを備えるロボット
JP7454385B2 (ja) * 2020-01-23 2024-03-22 浜松ホトニクス株式会社 ウェハ搬送ユニット及びウェハ搬送方法
EP4107778B1 (en) * 2020-02-17 2026-04-01 Jabil Inc. Apparatus, system and method for providing self extracting grips for an end effector
CN111660309A (zh) * 2020-06-05 2020-09-15 中国科学院微电子研究所 一种用于转移晶圆的机器臂
JP7740921B2 (ja) * 2020-08-17 2025-09-17 東京エレクトロン株式会社 搬送装置およびエンドエフェクタ
US20220063113A1 (en) * 2020-08-26 2022-03-03 WaferPath, Inc. Protective cap for a robot end effector
CN112018024B (zh) * 2020-09-11 2024-12-24 北京北方华创微电子装备有限公司 机械手
US11862507B2 (en) * 2020-11-25 2024-01-02 Kawasaki Jukogyo Kabushiki Kaisha Robot system, and slip determination method
US12217997B2 (en) 2022-02-07 2025-02-04 Kla Corporation Cleanroom compatible robotic end effector exchange system
CN115847464B (zh) * 2022-11-30 2024-09-20 西安奕斯伟材料科技股份有限公司 一种机械手及机械手夹取状态检测方法
TWI814679B (zh) * 2023-02-13 2023-09-01 盛詮科技股份有限公司 載板懸浮手臂
CN116682781A (zh) * 2023-07-04 2023-09-01 上海广川科技有限公司 一种用于半导体晶圆运输系统的智能化末端执行器结构
JP7766657B2 (ja) * 2023-09-21 2025-11-10 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板処理装置ならびに基板処理システム
CN117182683A (zh) * 2023-10-25 2023-12-08 华海清科(北京)科技有限公司 一种基板传输装置和基板磨削装备
CN118366917B (zh) * 2024-05-29 2025-05-02 深圳市鹏乐智能系统有限公司 晶圆夹取设备
CN119795155A (zh) * 2025-03-03 2025-04-11 赛光半导体科技(苏州)有限公司 一种多功能晶圆手臂

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Also Published As

Publication number Publication date
TWI732975B (zh) 2021-07-11
US20200306990A1 (en) 2020-10-01
US12042930B2 (en) 2024-07-23
CN108155143B (zh) 2023-08-01
JP2023092532A (ja) 2023-07-03
US9919430B1 (en) 2018-03-20
KR20180064996A (ko) 2018-06-15
US20220143843A1 (en) 2022-05-12
CN116936449A (zh) 2023-10-24
CN108155143A (zh) 2018-06-12
EP3333886A1 (en) 2018-06-13
US10576639B2 (en) 2020-03-03
US20180161989A1 (en) 2018-06-14
US12496733B2 (en) 2025-12-16
JP7301260B2 (ja) 2023-07-03
JP7663623B2 (ja) 2025-04-16
TW201826440A (zh) 2018-07-16
TWI776551B (zh) 2022-09-01
US20230278235A1 (en) 2023-09-07
EP3333886B1 (en) 2023-06-07
JP2018111200A (ja) 2018-07-19
US20240424688A1 (en) 2024-12-26
TW202143381A (zh) 2021-11-16
US11059183B2 (en) 2021-07-13
US11602859B2 (en) 2023-03-14

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