CN116936449A - 用于提供末端执行器的装置、系统和方法 - Google Patents

用于提供末端执行器的装置、系统和方法 Download PDF

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Publication number
CN116936449A
CN116936449A CN202310877255.5A CN202310877255A CN116936449A CN 116936449 A CN116936449 A CN 116936449A CN 202310877255 A CN202310877255 A CN 202310877255A CN 116936449 A CN116936449 A CN 116936449A
Authority
CN
China
Prior art keywords
end effector
wafer
support
low friction
moving clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310877255.5A
Other languages
English (en)
Chinese (zh)
Inventor
J·鲍斯布姆
B·纳德力
R·曼罗
T·P·麦哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jabil Inc
Original Assignee
Jabil Circuit Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jabil Circuit Inc filed Critical Jabil Circuit Inc
Publication of CN116936449A publication Critical patent/CN116936449A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • B25J19/025—Optical sensing devices including optical fibres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Paper (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
CN202310877255.5A 2016-12-06 2017-12-06 用于提供末端执行器的装置、系统和方法 Pending CN116936449A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/370,125 US9919430B1 (en) 2016-12-06 2016-12-06 Apparatus, system and method for providing an end effector
US15/370,125 2016-12-06
CN201711278199.4A CN108155143B (zh) 2016-12-06 2017-12-06 用于提供末端执行器的装置、系统和方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201711278199.4A Division CN108155143B (zh) 2016-12-06 2017-12-06 用于提供末端执行器的装置、系统和方法

Publications (1)

Publication Number Publication Date
CN116936449A true CN116936449A (zh) 2023-10-24

Family

ID=60629488

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202310877255.5A Pending CN116936449A (zh) 2016-12-06 2017-12-06 用于提供末端执行器的装置、系统和方法
CN201711278199.4A Active CN108155143B (zh) 2016-12-06 2017-12-06 用于提供末端执行器的装置、系统和方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201711278199.4A Active CN108155143B (zh) 2016-12-06 2017-12-06 用于提供末端执行器的装置、系统和方法

Country Status (6)

Country Link
US (6) US9919430B1 (https=)
EP (1) EP3333886B1 (https=)
JP (2) JP7301260B2 (https=)
KR (1) KR102500546B1 (https=)
CN (2) CN116936449A (https=)
TW (2) TWI732975B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN117182683A (zh) * 2023-10-25 2023-12-08 华海清科(北京)科技有限公司 一种基板传输装置和基板磨削装备

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US10553472B2 (en) * 2018-06-22 2020-02-04 Jabil Inc. Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner
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CN116682781A (zh) * 2023-07-04 2023-09-01 上海广川科技有限公司 一种用于半导体晶圆运输系统的智能化末端执行器结构
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Publication number Priority date Publication date Assignee Title
CN117182683A (zh) * 2023-10-25 2023-12-08 华海清科(北京)科技有限公司 一种基板传输装置和基板磨削装备

Also Published As

Publication number Publication date
TWI732975B (zh) 2021-07-11
US20200306990A1 (en) 2020-10-01
US12042930B2 (en) 2024-07-23
KR102500546B1 (ko) 2023-02-15
CN108155143B (zh) 2023-08-01
JP2023092532A (ja) 2023-07-03
US9919430B1 (en) 2018-03-20
KR20180064996A (ko) 2018-06-15
US20220143843A1 (en) 2022-05-12
CN108155143A (zh) 2018-06-12
EP3333886A1 (en) 2018-06-13
US10576639B2 (en) 2020-03-03
US20180161989A1 (en) 2018-06-14
US12496733B2 (en) 2025-12-16
JP7301260B2 (ja) 2023-07-03
JP7663623B2 (ja) 2025-04-16
TW201826440A (zh) 2018-07-16
TWI776551B (zh) 2022-09-01
US20230278235A1 (en) 2023-09-07
EP3333886B1 (en) 2023-06-07
JP2018111200A (ja) 2018-07-19
US20240424688A1 (en) 2024-12-26
TW202143381A (zh) 2021-11-16
US11059183B2 (en) 2021-07-13
US11602859B2 (en) 2023-03-14

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