JP5033886B2 - 基板搬送用のロボットハンド - Google Patents
基板搬送用のロボットハンド Download PDFInfo
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- JP5033886B2 JP5033886B2 JP2009552494A JP2009552494A JP5033886B2 JP 5033886 B2 JP5033886 B2 JP 5033886B2 JP 2009552494 A JP2009552494 A JP 2009552494A JP 2009552494 A JP2009552494 A JP 2009552494A JP 5033886 B2 JP5033886 B2 JP 5033886B2
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- substrate
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- 239000000758 substrate Substances 0.000 title claims description 158
- 230000002093 peripheral effect Effects 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
Claims (7)
- 基板を搬送するための搬送ロボットに設けられ、基板を載置した状態で支持する基板搬送用のロボットハンドにおいて、
ロボットハンドの上面に、基板の下面外周部が着座する第1の座面が設けられ、この第1の座面の外周に上方への段差が形成されると共に、
基板の外周部から離れたロボットハンドの上面部分に、基板が下方に凹状に反ったときに基板の下面が着座する、基板の中心に向けて下方に傾斜した第2の座面が設けられていることを特徴とする基板搬送用のロボットハンド。 - 前記段差には、階段状の複数の段が付けられていることを特徴とする請求項1記載の基板搬送用のロボットハンド。
- 前記段の基板の外周縁と接触する部分をアール面としたことを特徴とする請求項2記載の基板搬送用のロボットハンド。
- 基板を搬送するための搬送ロボットに設けられ、基板を載置した状態で支持する基板搬送用のロボットハンドにおいて、
ロボットハンドの上面に、基板の外径より小さな所定径の同一円周に沿って帯状にのびる、上方に突出する突条を備え、突条の上面が、径方向外方及び径方向内方に向けて下り勾配の付いた曲面に形成されていることを特徴とする基板搬送用のロボットハンド。 - 前記所定径は、基板に対する成膜処理で膜が回り込んで成膜される可能性がある基板の下面外周部よりも径方向内方の部分が前記突条に着座するように設定されることを特徴とする請求項4記載の基板搬送用のロボットハンド。
- 前記突条の上面の径方向中間が平坦面に形成されていることを特徴とする請求項4記載の基板搬送用のロボットハンド。
- 前記突条が前記円周上の複数部分に分離して形成され、各突条の端面が傾斜面に形成されていることを特徴とする請求項4記載の基板搬送用のロボットハンド。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009552494A JP5033886B2 (ja) | 2008-02-06 | 2009-02-04 | 基板搬送用のロボットハンド |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008025979 | 2008-02-06 | ||
JP2008025979 | 2008-02-06 | ||
PCT/JP2009/051898 WO2009099107A1 (ja) | 2008-02-06 | 2009-02-04 | 基板搬送用のロボットハンド |
JP2009552494A JP5033886B2 (ja) | 2008-02-06 | 2009-02-04 | 基板搬送用のロボットハンド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009099107A1 JPWO2009099107A1 (ja) | 2011-05-26 |
JP5033886B2 true JP5033886B2 (ja) | 2012-09-26 |
Family
ID=40952181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009552494A Active JP5033886B2 (ja) | 2008-02-06 | 2009-02-04 | 基板搬送用のロボットハンド |
Country Status (7)
Country | Link |
---|---|
US (2) | US8141926B2 (ja) |
JP (1) | JP5033886B2 (ja) |
KR (1) | KR101209018B1 (ja) |
CN (1) | CN101939834B (ja) |
DE (1) | DE112009000297B4 (ja) |
TW (1) | TWI455236B (ja) |
WO (1) | WO2009099107A1 (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5033886B2 (ja) | 2008-02-06 | 2012-09-26 | 株式会社アルバック | 基板搬送用のロボットハンド |
JPWO2011077678A1 (ja) * | 2009-12-22 | 2013-05-02 | 株式会社アルバック | 基板保持装置 |
JP5589790B2 (ja) * | 2010-03-31 | 2014-09-17 | 株式会社安川電機 | 基板搬送用ハンドおよび基板搬送ロボット |
JP5548163B2 (ja) * | 2010-09-14 | 2014-07-16 | 株式会社日立国際電気 | 基板搬送機構、基板処理装置および半導体装置の製造方法 |
JP5403378B2 (ja) * | 2011-09-08 | 2014-01-29 | 株式会社安川電機 | ロボットハンド及びロボット |
JP5903282B2 (ja) * | 2012-01-24 | 2016-04-13 | 株式会社アルバック | 静電チャック付きロボットハンド |
WO2014107351A1 (en) * | 2013-01-04 | 2014-07-10 | Rudolph Technologies, Inc. | Edge grip substrate handler |
CN103943545A (zh) * | 2013-01-21 | 2014-07-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 机械手和半导体设备 |
CN103811401A (zh) * | 2014-03-11 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | 晶圆托架及包含该晶圆托架的工艺腔室 |
US9425076B2 (en) * | 2014-07-03 | 2016-08-23 | Applied Materials, Inc. | Substrate transfer robot end effector |
CN104308063B (zh) * | 2014-09-26 | 2017-01-18 | 浙江中集铸锻有限公司 | 离合器轴承凹槽挡边机械手 |
US10332767B2 (en) * | 2015-12-17 | 2019-06-25 | Asm Ip Holding B.V. | Substrate transport device and substrate processing apparatus |
JP6276317B2 (ja) * | 2016-03-31 | 2018-02-07 | 平田機工株式会社 | ハンドユニットおよび移載方法 |
JP6757646B2 (ja) * | 2016-10-27 | 2020-09-23 | 川崎重工業株式会社 | 基板把持ハンド及びそれを備える基板搬送装置 |
US9919430B1 (en) * | 2016-12-06 | 2018-03-20 | Jabil Inc. | Apparatus, system and method for providing an end effector |
US10399231B2 (en) * | 2017-05-22 | 2019-09-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate handling contacts and methods |
CN108382844A (zh) * | 2018-02-28 | 2018-08-10 | 武汉华星光电技术有限公司 | 衬垫组件及传送装置 |
KR102204884B1 (ko) * | 2018-09-27 | 2021-01-19 | 세메스 주식회사 | 기판 반송 로봇 및 기판 처리 설비 |
CN109407359A (zh) * | 2018-10-29 | 2019-03-01 | 武汉华星光电技术有限公司 | 机械手 |
KR20200078773A (ko) * | 2018-12-21 | 2020-07-02 | 세메스 주식회사 | 반전 유닛 및 이를 가지는 기판 처리 장치 |
CN112470249B (zh) * | 2019-05-14 | 2022-05-27 | 玛特森技术公司 | 具有聚焦环调整组件的等离子处理设备 |
CN111470283A (zh) * | 2020-04-24 | 2020-07-31 | 上海世禹精密机械有限公司 | 一种载具的循环回收设备 |
JP7415782B2 (ja) * | 2020-05-11 | 2024-01-17 | 東京エレクトロン株式会社 | 基板搬送機構及び基板搬送方法 |
JP7005690B2 (ja) * | 2020-06-17 | 2022-02-10 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法、およびプログラム |
US11654578B2 (en) * | 2020-09-17 | 2023-05-23 | Kawasaki Jukogyo Kabushiki Kaisha | Robot system and offset acquisition method |
CN113113340B (zh) * | 2021-03-30 | 2024-07-23 | 北京北方华创微电子装备有限公司 | 半导体设备的机械手 |
WO2023205176A1 (en) * | 2022-04-18 | 2023-10-26 | Dextrous Robotics, Inc. | System and/or method for grasping objects |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3395799B2 (ja) | 1993-12-24 | 2003-04-14 | 東京エレクトロン株式会社 | 基板搬送装置および熱処理装置 |
JPH0855814A (ja) | 1994-08-09 | 1996-02-27 | Nissin High Voltage Co Ltd | イオン注入装置用エンドステーション |
US6267423B1 (en) * | 1995-12-08 | 2001-07-31 | Applied Materials, Inc. | End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector |
JPH09266239A (ja) | 1996-03-27 | 1997-10-07 | Kokusai Electric Co Ltd | 基板搬送プレート |
US6276731B1 (en) * | 1997-07-15 | 2001-08-21 | Kabushiki Kaisha Yaskawa Denki | Wafer carrying fork |
US6183026B1 (en) * | 1999-04-07 | 2001-02-06 | Gasonics International Corporation | End effector |
TW434176B (en) | 1999-05-03 | 2001-05-16 | Applied Materials Inc | Anti-rotation robot blade with minimum contact |
JP2002353291A (ja) | 2001-05-30 | 2002-12-06 | Ulvac Japan Ltd | 基板搬送装置 |
US7048316B1 (en) * | 2002-07-12 | 2006-05-23 | Novellus Systems, Inc. | Compound angled pad end-effector |
US6896304B2 (en) * | 2002-09-03 | 2005-05-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Automatic sensing wafer blade and method for using |
US6942265B1 (en) * | 2002-10-23 | 2005-09-13 | Kla-Tencor Technologies Corporation | Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto |
JP2004200576A (ja) * | 2002-12-20 | 2004-07-15 | Anelva Corp | 基板搬送ロボット用エンドエフェクタ |
US7290813B2 (en) | 2004-12-16 | 2007-11-06 | Asyst Technologies, Inc. | Active edge grip rest pad |
JP4616731B2 (ja) | 2005-09-01 | 2011-01-19 | 東京エレクトロン株式会社 | 塗布、現像装置 |
DE102006031434B4 (de) * | 2006-07-07 | 2019-11-14 | Erich Thallner | Handhabungsvorrichtung sowie Handhabungsverfahren für Wafer |
JP5033886B2 (ja) | 2008-02-06 | 2012-09-26 | 株式会社アルバック | 基板搬送用のロボットハンド |
-
2009
- 2009-02-04 JP JP2009552494A patent/JP5033886B2/ja active Active
- 2009-02-04 DE DE112009000297.8T patent/DE112009000297B4/de active Active
- 2009-02-04 WO PCT/JP2009/051898 patent/WO2009099107A1/ja active Application Filing
- 2009-02-04 CN CN200980104088.9A patent/CN101939834B/zh active Active
- 2009-02-04 US US12/863,331 patent/US8141926B2/en active Active
- 2009-02-04 KR KR1020107018676A patent/KR101209018B1/ko active IP Right Grant
- 2009-02-06 TW TW098103872A patent/TWI455236B/zh active
-
2011
- 2011-11-03 US US13/288,206 patent/US8393662B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW200947598A (en) | 2009-11-16 |
CN101939834A (zh) | 2011-01-05 |
DE112009000297T5 (de) | 2011-03-10 |
JPWO2009099107A1 (ja) | 2011-05-26 |
TWI455236B (zh) | 2014-10-01 |
DE112009000297B4 (de) | 2024-07-04 |
KR20100105785A (ko) | 2010-09-29 |
WO2009099107A1 (ja) | 2009-08-13 |
US8393662B2 (en) | 2013-03-12 |
US20120049555A1 (en) | 2012-03-01 |
US8141926B2 (en) | 2012-03-27 |
US20110049921A1 (en) | 2011-03-03 |
CN101939834B (zh) | 2012-08-08 |
KR101209018B1 (ko) | 2012-12-06 |
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