KR102466056B1 - 반도체 장치의 제조 방법 및 반도체 제조 장치 - Google Patents

반도체 장치의 제조 방법 및 반도체 제조 장치 Download PDF

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Publication number
KR102466056B1
KR102466056B1 KR1020170121612A KR20170121612A KR102466056B1 KR 102466056 B1 KR102466056 B1 KR 102466056B1 KR 1020170121612 A KR1020170121612 A KR 1020170121612A KR 20170121612 A KR20170121612 A KR 20170121612A KR 102466056 B1 KR102466056 B1 KR 102466056B1
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South Korea
Prior art keywords
semiconductor wafer
adhesive
grinding
semiconductor
trimming
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Korean (ko)
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KR20180033088A (ko
Inventor
타카히코 미츠이
에이치 야마모토
Original Assignee
가부시키가이샤 오카모도 코사쿠 기카이 세이사쿠쇼
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Publication of KR20180033088A publication Critical patent/KR20180033088A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • H01L21/31051—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/008—Machines comprising two or more tools or having several working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B24B55/08—Dust extraction equipment on grinding or polishing machines specially designed for belt grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H01L21/02013—
    • H01L21/02016—
    • H01L21/02052—
    • H01L21/6704—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/124—Preparing bulk and homogeneous wafers by processing the backside of the wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020170121612A 2016-09-23 2017-09-21 반도체 장치의 제조 방법 및 반도체 제조 장치 Active KR102466056B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-185300 2016-09-23
JP2016185300A JP6850099B2 (ja) 2016-09-23 2016-09-23 半導体装置の製造方法及び半導体製造装置

Publications (2)

Publication Number Publication Date
KR20180033088A KR20180033088A (ko) 2018-04-02
KR102466056B1 true KR102466056B1 (ko) 2022-11-10

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KR1020170121612A Active KR102466056B1 (ko) 2016-09-23 2017-09-21 반도체 장치의 제조 방법 및 반도체 제조 장치

Country Status (4)

Country Link
JP (1) JP6850099B2 (https=)
KR (1) KR102466056B1 (https=)
CN (1) CN107866724A (https=)
TW (1) TWI746645B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10388535B1 (en) * 2018-05-25 2019-08-20 Powertech Technology Inc. Wafer processing method with full edge trimming
CN108857601A (zh) * 2018-07-25 2018-11-23 浙江工业大学 钴基合金的光催化加工方法及其设备
JP7258489B2 (ja) * 2018-08-21 2023-04-17 株式会社岡本工作機械製作所 半導体装置の製造方法及び製造装置
JP7270373B2 (ja) * 2018-12-20 2023-05-10 株式会社岡本工作機械製作所 樹脂を含む複合基板の研削方法及び研削装置
KR102455146B1 (ko) * 2020-02-10 2022-10-17 주식회사 나노인 기판의 구조충진을 위한 가역적 코팅 방법 및 봉지 방법
TW202209548A (zh) * 2020-08-27 2022-03-01 日商富士軟片股份有限公司 經加工的基材的製造方法、半導體元件的製造方法、及暫時黏合劑層形成用組成物
CN115302345B (zh) * 2022-08-30 2024-03-15 福建融玻科技有限公司 一种防眩光玻璃显示屏薄板划痕修复平磨抛光机
JP2026046161A (ja) * 2024-09-02 2026-03-13 株式会社荏原製作所 複数の基板が接合された積層基板の作成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074545A (ja) * 2010-09-29 2012-04-12 Okamoto Machine Tool Works Ltd 保護フィルム貼付半導体基板の裏面研削方法
JP2015032679A (ja) * 2013-08-02 2015-02-16 株式会社岡本工作機械製作所 半導体装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109679A (ja) * 1991-10-15 1993-04-30 Nec Corp 半導体装置の製造方法
JP2004207459A (ja) * 2002-12-25 2004-07-22 Disco Abrasive Syst Ltd 半導体ウェーハの研削方法
JP2004311767A (ja) * 2003-04-08 2004-11-04 Disco Abrasive Syst Ltd 半導体ウェーハの製造方法
JP2005116610A (ja) * 2003-10-03 2005-04-28 Nitto Denko Corp 半導体ウエハの加工方法および半導体ウエハ加工用粘着シート
JP4447280B2 (ja) * 2003-10-16 2010-04-07 リンテック株式会社 表面保護用シートおよび半導体ウエハの研削方法
JP4752384B2 (ja) * 2005-08-02 2011-08-17 株式会社東京精密 ウェーハ外周研削方法及びウェーハ外周研削装置
JP4463326B2 (ja) * 2008-02-22 2010-05-19 日本ミクロコーティング株式会社 半導体ウェーハ外周端部の研削方法及び研削装置
JP2010023119A (ja) * 2008-07-15 2010-02-04 Okamoto Machine Tool Works Ltd 半導体基板の平坦化装置および平坦化方法
JP2013008915A (ja) * 2011-06-27 2013-01-10 Toshiba Corp 基板加工方法及び基板加工装置
JP2013084770A (ja) * 2011-10-11 2013-05-09 Disco Abrasive Syst Ltd ウェーハの研削方法
JP5959188B2 (ja) * 2011-12-05 2016-08-02 株式会社ディスコ ウエーハの加工方法
JP2013247135A (ja) * 2012-05-23 2013-12-09 Disco Abrasive Syst Ltd ウエーハの加工方法
JP6057592B2 (ja) * 2012-08-06 2017-01-11 株式会社ディスコ ウエーハの加工方法
JP2014053351A (ja) * 2012-09-05 2014-03-20 Disco Abrasive Syst Ltd ウエーハの加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074545A (ja) * 2010-09-29 2012-04-12 Okamoto Machine Tool Works Ltd 保護フィルム貼付半導体基板の裏面研削方法
JP2015032679A (ja) * 2013-08-02 2015-02-16 株式会社岡本工作機械製作所 半導体装置の製造方法

Also Published As

Publication number Publication date
TWI746645B (zh) 2021-11-21
JP6850099B2 (ja) 2021-03-31
KR20180033088A (ko) 2018-04-02
CN107866724A (zh) 2018-04-03
TW201814847A (zh) 2018-04-16
JP2018049973A (ja) 2018-03-29

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