KR102440282B1 - 흡인 노즐을 접속하는 조립 구조 - Google Patents

흡인 노즐을 접속하는 조립 구조 Download PDF

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Publication number
KR102440282B1
KR102440282B1 KR1020170181918A KR20170181918A KR102440282B1 KR 102440282 B1 KR102440282 B1 KR 102440282B1 KR 1020170181918 A KR1020170181918 A KR 1020170181918A KR 20170181918 A KR20170181918 A KR 20170181918A KR 102440282 B1 KR102440282 B1 KR 102440282B1
Authority
KR
South Korea
Prior art keywords
suction nozzle
nozzle base
assembly structure
positioning
fixed seat
Prior art date
Application number
KR1020170181918A
Other languages
English (en)
Korean (ko)
Other versions
KR20190032158A (ko
Inventor
옌-추안 린
Original Assignee
옌-추안 린
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW105143608A external-priority patent/TWI605995B/zh
Priority claimed from TW105219833U external-priority patent/TWM543858U/zh
Application filed by 옌-추안 린 filed Critical 옌-추안 린
Publication of KR20190032158A publication Critical patent/KR20190032158A/ko
Application granted granted Critical
Publication of KR102440282B1 publication Critical patent/KR102440282B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Gasket Seals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Seal Device For Vehicle (AREA)
KR1020170181918A 2016-12-28 2017-12-28 흡인 노즐을 접속하는 조립 구조 KR102440282B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW105143608 2016-12-28
TW105219833 2016-12-28
TW105143608A TWI605995B (zh) 2016-12-28 2016-12-28 Connection nozzle assembly structure (a)
TW105219833U TWM543858U (zh) 2016-12-28 2016-12-28 連接吸嘴的組裝結構(一)

Publications (2)

Publication Number Publication Date
KR20190032158A KR20190032158A (ko) 2019-03-27
KR102440282B1 true KR102440282B1 (ko) 2022-09-02

Family

ID=62722242

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170181918A KR102440282B1 (ko) 2016-12-28 2017-12-28 흡인 노즐을 접속하는 조립 구조

Country Status (3)

Country Link
JP (1) JP7055339B2 (ja)
KR (1) KR102440282B1 (ja)
CN (1) CN108257904B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108247661B (zh) * 2016-12-28 2022-08-30 林彦全 连接吸嘴的组装结构
CN109300832A (zh) * 2018-08-28 2019-02-01 湖州景盛新能源有限公司 一种太阳能电池片生产用吸取装置
CN110202603B (zh) * 2019-07-01 2022-11-11 深圳市周大福珠宝制造有限公司 一种真空吸盘以及吸盘本体的制造方法
CN110482211A (zh) * 2019-08-13 2019-11-22 苏州富强科技有限公司 一种吸嘴转动机构
CN111015193A (zh) * 2019-12-26 2020-04-17 东莞东聚电子电讯制品有限公司 一种转轮式多工位螺丝吸取装置
CN112499245B (zh) * 2020-12-08 2022-08-16 苏州富强科技有限公司 包胶吸嘴组件
US11693197B2 (en) 2021-06-25 2023-07-04 Google Llc Fixture and method for attaching fibers to V-grooves of photonic integrated circuit
CN113732671B (zh) * 2021-10-26 2023-03-14 无锡隆盛科技股份有限公司 一种天然气流量喷嘴外壳新型压装装置
CN114890135A (zh) * 2022-05-27 2022-08-12 杭州长川科技股份有限公司 浮动吸嘴机构、浮动吸嘴装置及辅助检测系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117869A (ja) * 2001-10-11 2003-04-23 B L Auto Tec Kk ロボットアームカップリング装置
JP2006049485A (ja) * 2004-08-03 2006-02-16 Renesas Technology Corp 半導体装置の製造方法
JP2007123834A (ja) * 2005-09-29 2007-05-17 New Machine:Kk 半導体チップ用吸着ヘッド
KR100833597B1 (ko) * 2007-03-15 2008-05-30 주식회사 하이닉스반도체 본딩 헤드 및 이를 갖는 반도체 칩 어탯치 장치
KR100843222B1 (ko) * 2006-12-22 2008-07-02 삼성전자주식회사 반도체 칩 이송 장치 및 이를 이용한 반도체 칩의 이송방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0453910Y2 (ja) * 1987-08-07 1992-12-17
CN202888144U (zh) * 2012-02-29 2013-04-17 矽菱企业股份有限公司 芯片吸放装置及其固定座与吸嘴
CN103066001B (zh) * 2012-12-28 2015-04-22 无锡中微高科电子有限公司 共晶焊机拾取芯片用的万向调平吸嘴
JP5776828B1 (ja) 2014-08-08 2015-09-09 Tdk株式会社 ガスパージユニット、ロードポート装置およびパージ対象容器の設置台
CN104339362B (zh) * 2014-10-17 2016-06-29 深圳雷柏科技股份有限公司 磁性真空吸具结构和由其构成的取料装置
CN205810778U (zh) * 2016-07-14 2016-12-14 吴振维 吸附装置
CN106044215B (zh) * 2016-08-01 2018-06-29 深圳市银浩自动化设备有限公司 一种吸嘴吸气装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117869A (ja) * 2001-10-11 2003-04-23 B L Auto Tec Kk ロボットアームカップリング装置
JP2006049485A (ja) * 2004-08-03 2006-02-16 Renesas Technology Corp 半導体装置の製造方法
JP2007123834A (ja) * 2005-09-29 2007-05-17 New Machine:Kk 半導体チップ用吸着ヘッド
KR100843222B1 (ko) * 2006-12-22 2008-07-02 삼성전자주식회사 반도체 칩 이송 장치 및 이를 이용한 반도체 칩의 이송방법
KR100833597B1 (ko) * 2007-03-15 2008-05-30 주식회사 하이닉스반도체 본딩 헤드 및 이를 갖는 반도체 칩 어탯치 장치

Also Published As

Publication number Publication date
CN108257904B (zh) 2021-10-22
KR20190032158A (ko) 2019-03-27
JP2018110224A (ja) 2018-07-12
JP7055339B2 (ja) 2022-04-18
CN108257904A (zh) 2018-07-06

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