KR102393446B1 - 전자 재료용 몰리브덴산아연암모늄 수화물, 전자 재료용 수지 조성물, 프리프레그, 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판 - Google Patents

전자 재료용 몰리브덴산아연암모늄 수화물, 전자 재료용 수지 조성물, 프리프레그, 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판 Download PDF

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KR102393446B1
KR102393446B1 KR1020217031300A KR20217031300A KR102393446B1 KR 102393446 B1 KR102393446 B1 KR 102393446B1 KR 1020217031300 A KR1020217031300 A KR 1020217031300A KR 20217031300 A KR20217031300 A KR 20217031300A KR 102393446 B1 KR102393446 B1 KR 102393446B1
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electronic materials
resin composition
resin
compound
ammonium molybdate
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KR1020217031300A
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English (en)
Korean (ko)
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KR20210151799A (ko
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히로유키 구도우
다츠로 다카무라
노리히로 시다
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미츠비시 가스 가가쿠 가부시키가이샤
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Publication of KR20210151799A publication Critical patent/KR20210151799A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/10—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by a fibrous or filamentary layer reinforced with filaments
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G39/00—Compounds of molybdenum
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C261/00—Derivatives of cyanic acid
    • C07C261/02—Cyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020217031300A 2020-06-01 2021-05-25 전자 재료용 몰리브덴산아연암모늄 수화물, 전자 재료용 수지 조성물, 프리프레그, 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판 KR102393446B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-095711 2020-06-01
JP2020095711 2020-06-01
PCT/JP2021/019698 WO2021246231A1 (ja) 2020-06-01 2021-05-25 電子材料用モリブデン酸亜鉛アンモニウム水和物、電子材料用樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板

Publications (2)

Publication Number Publication Date
KR20210151799A KR20210151799A (ko) 2021-12-14
KR102393446B1 true KR102393446B1 (ko) 2022-05-02

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KR1020217031300A KR102393446B1 (ko) 2020-06-01 2021-05-25 전자 재료용 몰리브덴산아연암모늄 수화물, 전자 재료용 수지 조성물, 프리프레그, 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP7070846B1 (zh)
KR (1) KR102393446B1 (zh)
CN (1) CN114096337B (zh)
TW (1) TW202212267A (zh)
WO (1) WO2021246231A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202346402A (zh) * 2022-03-23 2023-12-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、樹脂片、疊層板、覆金屬箔疊層板、及印刷配線板
WO2023182123A1 (ja) * 2022-03-23 2023-09-28 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板

Citations (6)

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JP2011157509A (ja) 2010-02-02 2011-08-18 Hitachi Chem Co Ltd 熱硬化性絶縁樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板
JP2012025845A (ja) 2010-07-23 2012-02-09 Hitachi Chem Co Ltd 樹脂組成物ワニスの製造方法、プリプレグ、積層板
JP2013010860A (ja) 2011-06-29 2013-01-17 Hitachi Chemical Co Ltd プリント配線板用樹脂組成物、プリプレグ、積層板、及びプリント配線板
JP2015091949A (ja) 2013-10-11 2015-05-14 南亜塑膠工業股▲ふん▼有限公司 モリブデン化合物で被覆された無機充填剤およびその使用法
WO2016010033A1 (ja) 2014-07-18 2016-01-21 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
JP2019194345A (ja) 2019-07-11 2019-11-07 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板

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CA1009397A (en) * 1972-10-10 1977-04-26 Roy W. Flynn Corrosion-inhibiting latex paints
JP2004059643A (ja) 2002-07-25 2004-02-26 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
JP2009120702A (ja) 2007-11-14 2009-06-04 Sumitomo Bakelite Co Ltd 耐熱基板用樹脂組成物、プリプレグおよび耐熱基板
JP5682110B2 (ja) 2009-12-25 2015-03-11 日立化成株式会社 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板
US9714387B2 (en) * 2014-06-05 2017-07-25 Alliance For Sustainable Energy, Llc Catalysts and methods for converting carbonaceous materials to fuels
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011157509A (ja) 2010-02-02 2011-08-18 Hitachi Chem Co Ltd 熱硬化性絶縁樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板
JP2012025845A (ja) 2010-07-23 2012-02-09 Hitachi Chem Co Ltd 樹脂組成物ワニスの製造方法、プリプレグ、積層板
JP2013010860A (ja) 2011-06-29 2013-01-17 Hitachi Chemical Co Ltd プリント配線板用樹脂組成物、プリプレグ、積層板、及びプリント配線板
JP2015091949A (ja) 2013-10-11 2015-05-14 南亜塑膠工業股▲ふん▼有限公司 モリブデン化合物で被覆された無機充填剤およびその使用法
WO2016010033A1 (ja) 2014-07-18 2016-01-21 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
JP2019194345A (ja) 2019-07-11 2019-11-07 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板

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KR20210151799A (ko) 2021-12-14
WO2021246231A1 (ja) 2021-12-09
TW202212267A (zh) 2022-04-01
CN114096337B (zh) 2023-08-22
JP7070846B1 (ja) 2022-05-18
CN114096337A (zh) 2022-02-25
JPWO2021246231A1 (zh) 2021-12-09

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