KR102389115B1 - 경화성 조성물, 드라이 필름, 경화물, 프린트 배선판 및 프린트 배선판의 제조 방법 - Google Patents

경화성 조성물, 드라이 필름, 경화물, 프린트 배선판 및 프린트 배선판의 제조 방법 Download PDF

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KR102389115B1
KR102389115B1 KR1020150134542A KR20150134542A KR102389115B1 KR 102389115 B1 KR102389115 B1 KR 102389115B1 KR 1020150134542 A KR1020150134542 A KR 1020150134542A KR 20150134542 A KR20150134542 A KR 20150134542A KR 102389115 B1 KR102389115 B1 KR 102389115B1
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KR20160035994A (ko
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모토노리 다카하시
아이코 요다
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다이요 잉키 세이조 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020150134542A 2014-09-24 2015-09-23 경화성 조성물, 드라이 필름, 경화물, 프린트 배선판 및 프린트 배선판의 제조 방법 Active KR102389115B1 (ko)

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Application Number Priority Date Filing Date Title
JP2014193922A JP6383621B2 (ja) 2014-09-24 2014-09-24 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
JPJP-P-2014-193922 2014-09-24

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KR20160035994A KR20160035994A (ko) 2016-04-01
KR102389115B1 true KR102389115B1 (ko) 2022-04-21

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JP (1) JP6383621B2 (enrdf_load_stackoverflow)
KR (1) KR102389115B1 (enrdf_load_stackoverflow)
TW (1) TWI689780B (enrdf_load_stackoverflow)

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CN108350203B (zh) * 2015-11-06 2021-07-06 株式会社钟化 黑色树脂组合物、附带黑色树脂固化膜的聚酰亚胺及其制造方法
US10851216B2 (en) * 2016-06-14 2020-12-01 Kuraray Co., Ltd. Black film
JP7167429B2 (ja) * 2017-01-16 2022-11-09 東洋インキＳｃホールディングス株式会社 感光性着色組成物、カラーフィルタ用感光性着色組成物、およびカラーフィルタ
CN110520794B (zh) * 2017-06-20 2025-04-04 株式会社艾迪科 聚合性组合物、黑色矩阵用感光性组合物及黑色柱状间隔物用感光性组合物
JP6409106B1 (ja) * 2017-08-30 2018-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP7029267B2 (ja) * 2017-10-06 2022-03-03 日鉄ケミカル＆マテリアル株式会社 感光性樹脂組成物及び樹脂膜付き基板の製造方法
JP6766104B2 (ja) * 2018-08-03 2020-10-07 株式会社タムラ製作所 インクジェット用硬化性樹脂組成物およびプリント配線基板
JP6820982B2 (ja) * 2018-08-03 2021-01-27 株式会社タムラ製作所 黒色硬化性樹脂組成物およびプリント配線基板
JP6843949B2 (ja) * 2018-12-27 2021-03-17 株式会社タムラ製作所 黒色感光性樹脂組成物
JP7300619B2 (ja) * 2019-01-11 2023-06-30 太陽ホールディングス株式会社 積層構造体、ドライフィルム、その硬化物および電子部品
JP7536481B2 (ja) * 2019-03-29 2024-08-20 日鉄ケミカル＆マテリアル株式会社 感光性樹脂組成物、感光性樹脂組成物を硬化してなる硬化膜、硬化膜付き基板および硬化膜付き基板の製造方法
CN111752102A (zh) * 2019-03-29 2020-10-09 日铁化学材料株式会社 感光性树脂组合物、硬化膜、带有硬化膜的基板及带有硬化膜的基板的制造方法
JP7297499B2 (ja) * 2019-04-04 2023-06-26 東京応化工業株式会社 感光性樹脂組成物、パターン化された硬化膜の製造方法、及びパターン化された硬化膜
JP7525295B2 (ja) * 2020-04-30 2024-07-30 サカタインクス株式会社 ブラックマトリックス用顔料分散組成物、ブラックマトリックス用レジスト組成物、及び、ブラックマトリックス
WO2023190454A1 (ja) * 2022-03-29 2023-10-05 太陽ホールディングス株式会社 感光性樹脂組成物およびプリント配線板の製造方法

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JP2014156583A (ja) * 2013-01-15 2014-08-28 Taiyo Ink Mfg Ltd 硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

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JP4994923B2 (ja) 2007-04-06 2012-08-08 太陽ホールディングス株式会社 黒色ソルダーレジスト組成物およびその硬化物
JP5352175B2 (ja) 2008-03-26 2013-11-27 太陽ホールディングス株式会社 感光性樹脂組成物及びその硬化物、並びにその硬化物からなるソルダーレジスト層を有するプリント配線基板
JP5380034B2 (ja) 2008-10-09 2014-01-08 太陽ホールディングス株式会社 黒色ソルダーレジスト組成物及びその硬化物
CN102792225B (zh) * 2010-03-31 2016-01-20 太阳控股株式会社 光固化性树脂组合物
EP2681327B1 (en) * 2011-03-04 2018-11-21 Intrexon Corporation Vectors conditionally expressing protein
JP5806491B2 (ja) * 2011-03-31 2015-11-10 太陽インキ製造株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
CN103477282A (zh) * 2011-04-13 2013-12-25 太阳油墨制造株式会社 光固化性树脂组合物、干膜、固化物及印刷电路板

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Publication number Priority date Publication date Assignee Title
JP2014156583A (ja) * 2013-01-15 2014-08-28 Taiyo Ink Mfg Ltd 硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

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KR20160035994A (ko) 2016-04-01
JP6383621B2 (ja) 2018-08-29
TWI689780B (zh) 2020-04-01
TW201621465A (zh) 2016-06-16

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