KR102355209B1 - 전자 회로 조립체를 플러드 코팅하기 위한 배합 폴리우레탄 수지 조성물 - Google Patents

전자 회로 조립체를 플러드 코팅하기 위한 배합 폴리우레탄 수지 조성물 Download PDF

Info

Publication number
KR102355209B1
KR102355209B1 KR1020157036488A KR20157036488A KR102355209B1 KR 102355209 B1 KR102355209 B1 KR 102355209B1 KR 1020157036488 A KR1020157036488 A KR 1020157036488A KR 20157036488 A KR20157036488 A KR 20157036488A KR 102355209 B1 KR102355209 B1 KR 102355209B1
Authority
KR
South Korea
Prior art keywords
electrical circuit
coat composition
flood coat
mils
circuit assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157036488A
Other languages
English (en)
Korean (ko)
Other versions
KR20160014677A (ko
Inventor
리차드 데이비드 주니어 조단
토마스 씨. 4세 스칸론
Original Assignee
엘란타스 피디쥐, 인코포레이티드.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘란타스 피디쥐, 인코포레이티드. filed Critical 엘란타스 피디쥐, 인코포레이티드.
Publication of KR20160014677A publication Critical patent/KR20160014677A/ko
Application granted granted Critical
Publication of KR102355209B1 publication Critical patent/KR102355209B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/16Catalysts
    • C08G18/22Catalysts containing metal compounds
    • C08G18/24Catalysts containing metal compounds of tin
    • C08G18/244Catalysts containing metal compounds of tin tin salts of carboxylic acids
    • C08G18/246Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • C08G18/36Hydroxylated esters of higher fatty acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/48Polyethers
    • C08G18/4825Polyethers containing two hydroxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/74Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2/00Addition polymers of aldehydes or cyclic oligomers thereof or of ketones; Addition copolymers thereof with less than 50 molar percent of other substances
    • C08G2/10Polymerisation of cyclic oligomers of formaldehyde
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Paints Or Removers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020157036488A 2013-05-31 2014-05-31 전자 회로 조립체를 플러드 코팅하기 위한 배합 폴리우레탄 수지 조성물 Active KR102355209B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361829681P 2013-05-31 2013-05-31
US61/829,681 2013-05-31
PCT/US2014/040421 WO2014194303A1 (en) 2013-05-31 2014-05-31 Formulated polyurethane resin compositions for flood coating electronic circuit assemblies

Publications (2)

Publication Number Publication Date
KR20160014677A KR20160014677A (ko) 2016-02-11
KR102355209B1 true KR102355209B1 (ko) 2022-01-25

Family

ID=51014655

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157036488A Active KR102355209B1 (ko) 2013-05-31 2014-05-31 전자 회로 조립체를 플러드 코팅하기 위한 배합 폴리우레탄 수지 조성물

Country Status (13)

Country Link
US (1) US9699917B2 (https=)
EP (1) EP2997099B1 (https=)
JP (3) JP6574413B2 (https=)
KR (1) KR102355209B1 (https=)
CN (2) CN105358638B (https=)
CA (2) CA2913996C (https=)
ES (1) ES2839083T3 (https=)
HU (1) HUE053002T2 (https=)
MX (2) MX381812B (https=)
PL (1) PL2997099T3 (https=)
PT (1) PT2997099T (https=)
SI (1) SI2997099T1 (https=)
WO (1) WO2014194303A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102764618B1 (ko) 2023-09-15 2025-02-11 (주)이에스피켐 폴리우레탄 수지 조성물

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105358638B (zh) 2013-05-31 2018-08-07 艾伦塔斯Pdg有限公司 用于溢流涂布电子电路组件的配制的树脂组合物
US9832902B2 (en) 2013-05-31 2017-11-28 Elantas Pdg, Inc. Formulated resin compositions for flood coating electronic circuit assemblies
US9808765B2 (en) 2014-03-12 2017-11-07 Elantas Pdg, Inc. Polyurethane adhesives for reverse osmosis modules
CN107001572B (zh) 2014-11-26 2020-07-28 艾伦塔斯Pdg有限公司 多部分聚氨酯组合物、其制品及制造方法
KR102478434B1 (ko) * 2015-04-09 2022-12-15 엘란타스 피디쥐, 인코포레이티드. 역삼투 모듈용 폴리우레탄 접착제
JP2017147388A (ja) * 2016-02-19 2017-08-24 株式会社デンソー 電子装置の製造方法
EP3850028A1 (en) 2018-09-10 2021-07-21 Huntsman International LLC Oxazolidinedione-terminated prepolymer
WO2020053062A1 (en) * 2018-09-10 2020-03-19 Huntsman International Llc Oxazolidinedione-terminated prepolymer
WO2020092800A1 (en) * 2018-10-31 2020-05-07 H.B. Fuller Company Two component polyurethane system for liquid applied sound deadener
KR102913604B1 (ko) * 2021-02-10 2026-01-19 캐보트 코포레이션 열가소성 엘라스토머의 제조 방법 및 그에 의해 얻어진 중합체 복합체
GB2613561A (en) * 2021-12-03 2023-06-14 H K Wentworth Ltd Expandable protective coating

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040012936A1 (en) * 2002-07-18 2004-01-22 Gravelin Pascal A. Device and method for enclosure of electronic printed circuit board based products

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3747037A (en) 1968-01-11 1973-07-17 Gen Electric Petroleum based oil modified castor oil-urethane composition for electrical potting
BE792621A (fr) 1971-12-15 1973-03-30 Western Electric Co Procede et produit pour chasser l'eau infiltree dans des cablestelephoniques et analogues
US3962094A (en) 1973-09-18 1976-06-08 The Dow Chemical Company Hollow fiber separatory device
US4008197A (en) 1974-01-11 1977-02-15 N L Industries, Inc. Mineral oil extended polyurethane system containing a coupling agent for decontaminating and sealing the interior spaces of an insulated electrical device
US4170559A (en) 1976-11-05 1979-10-09 N L Industries, Inc. Hollow fiber separatory device
US4224164A (en) 1978-10-20 1980-09-23 Nl Industries, Inc. Non-wicking polyurethane casting systems
JPS5489269A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Coating method of printed board
US4168258A (en) 1978-02-15 1979-09-18 N L Industries, Inc. Grease compatible, mineral oil extended polyurethane
US4267044A (en) 1978-04-10 1981-05-12 Nl Industries, Inc. Thixotropic polyurethane compositions as sealants for membrane separatory devices
US4300184A (en) 1979-07-11 1981-11-10 Johnson Controls, Inc. Conformal coating for electrical circuit assemblies
US4256617A (en) 1979-11-01 1981-03-17 Nl Industries, Inc. Catalyzed non-toxic polyurethane forming compositions and separatory devices employing the same
US4284506A (en) 1979-12-26 1981-08-18 Nl Industries, Inc. Biomedical devices
US4395530A (en) 1980-10-24 1983-07-26 Colamco, Inc. Catalyst initiated prepolymer systems
DE3046409A1 (de) * 1980-12-10 1982-07-15 Bayer Ag, 5090 Leverkusen Beschichtungsmittel und ein verfahren zur herstellung von ueberzuegen
US4375521A (en) 1981-06-01 1983-03-01 Communications Technology Corporation Vegetable oil extended polyurethane systems
US4454176A (en) 1981-10-21 1984-06-12 E. I. Du Pont De Nemours And Company Supported reverse osmosis membranes
JPS5933605A (ja) * 1982-08-17 1984-02-23 Fuji Photo Film Co Ltd 電子スチルカメラの音声記録方式
US4444976A (en) * 1982-12-20 1984-04-24 The Goodyear Tire & Rubber Company Sag resistant two component adhesive and sealant
JPS6027441U (ja) * 1983-08-01 1985-02-25 日本電気株式会社 混成集積回路装置
US4518631A (en) 1983-11-14 1985-05-21 Dow Corning Corporation Thixotropic curable coating compositions
US4879032A (en) 1984-06-04 1989-11-07 Allied Resin Corporation Fluid separatory devices having improved potting and adhesive compositions
US4876303A (en) 1984-06-15 1989-10-24 American Telephone And Telegraph Company, At&T Bell Laboratories Mineral-oil-free encapsulant composition
US4603188A (en) 1985-07-10 1986-07-29 Itoh Seiyu Kabushiki Kaisha Curable urethane composition
US5266145A (en) 1986-03-05 1993-11-30 Teroson Gmbh Sealant and adhesive
US4826894A (en) * 1987-05-19 1989-05-02 Mobay Corporation Aqueous polyurethane-ureas dispersions and their use for the production of coatings having improved humidity resistance
US4923756A (en) 1987-08-20 1990-05-08 Ashland Oil, Inc. Primerless adhesive for fiberglass reinforced polyester substrates
US4886600A (en) 1988-02-18 1989-12-12 Caschem, Inc. Moisture and glycerine resistant polyurethane compositions for separatory devices
US4865735A (en) 1988-02-18 1989-09-12 Caschem, Inc. Amine containing polyurethane compositions for separatory devices
US4842736A (en) 1988-09-06 1989-06-27 Desalination Systems, Inc. Spiral wound membrane
JPH03217473A (ja) 1990-01-23 1991-09-25 Toyobo Co Ltd 被覆剤組成物およびそれを用いた印刷配線板
CA2041532C (en) 1991-04-30 2002-01-01 Hamdy Khalil Urethane sealant having improved sag properties
DE4134693A1 (de) * 1991-10-21 1993-04-22 Basf Ag Transparente, heissdampfsterilisierbare, nicht zytotoxische, im wesentlichen kompakte polyurethan-vergussmassen, verfahren zu ihrer herstellung und ihre verwendung, insbesondere fuer medizinisch-technische artikel
US5360543A (en) 1992-06-05 1994-11-01 Caschem, Inc. Polyurethane compositions
JP3340762B2 (ja) 1992-08-11 2002-11-05 横浜ゴム株式会社 ケーブル接続部密封用混和物
US5556934A (en) 1993-09-03 1996-09-17 H. B. Fuller Licensing & Financing Inc. Isocyanurate embedment compound
US5863597A (en) 1996-01-23 1999-01-26 Sundstrand Corporation Polyurethane conformal coating process for a printed wiring board
JPH101607A (ja) * 1996-06-14 1998-01-06 M C Kogyo Kk 多成分形揺変性ポリウレタン樹脂組成物
US5871822A (en) 1996-09-26 1999-02-16 Honeywell Inc. Low emissions method for spray application of conformal coating to electronic assemblies
US6130268A (en) 1997-06-23 2000-10-10 Polyfoam Products, Inc. Two component polyurethane construction adhesive
DE10108025A1 (de) 2001-02-19 2002-09-05 Henkel Kgaa Zweikomponentiger Polyurethan-Klebstoff für Holzwerkstoffe
US20060076047A1 (en) 2001-04-23 2006-04-13 Green David R Potted domed solar panel capsule and traffic warning lamps incorporating same
KR100442843B1 (ko) * 2002-03-13 2004-08-02 삼성에스디아이 주식회사 연료전지 단위체, 그 제조 방법 및 이를 채용한 연료전지
ATE443565T1 (de) 2002-06-21 2009-10-15 Ge Osmonics Inc Blasenschutz für spiralförmig gewickelte elemente
US20040072953A1 (en) 2002-10-15 2004-04-15 Ju-Ming Hung Reactive hot melt adhesive with non-polymeric aliphatic difunctionals
US6992134B2 (en) * 2002-10-29 2006-01-31 Tim Croley Polyurethane system and application thereof
US6797799B1 (en) * 2003-04-02 2004-09-28 Bayer Materialscience Llc High 2,4′-diphenylmethane diisocyanate content prepolymers
JP2005161191A (ja) * 2003-12-02 2005-06-23 Mitsui Kagaku Sanshi Kk 防水性2液型ポリウレタン塗膜
JP4328645B2 (ja) * 2004-02-26 2009-09-09 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板
JP4548072B2 (ja) 2004-09-30 2010-09-22 横浜ゴム株式会社 2液硬化型ポリウレタン樹脂組成物
DE102004062551A1 (de) * 2004-12-24 2006-07-06 Rhein Chemie Rheinau Gmbh Mikrogel-enthaltende duroplastische Zusammensetzung
DE602007010346D1 (de) * 2006-12-21 2010-12-16 Dow Global Technologies Inc Zusammensetzung, die zur verwendung als klebstoff beim einbau von fahrzeugfenstern brauchbar ist
JP2007227981A (ja) * 2007-06-11 2007-09-06 Hitachi Chem Co Ltd 樹脂ペースト及びこれを用いたフレキシブル配線板
US20100197878A1 (en) 2007-08-06 2010-08-05 Dow Global Technologies Inc. Polyol blends for use in making polymers
JP2010540699A (ja) 2007-09-21 2010-12-24 ダウ グローバル テクノロジーズ インコーポレイティド ポリウレタンポリマー系
TWI453253B (zh) * 2007-10-18 2014-09-21 Ajinomoto Kk Resin composition
US7781513B2 (en) 2007-11-14 2010-08-24 Momentive Performance Materials Inc. Two-part moisture-curable resin composition and adhesive, sealant and coating compositions based thereon
US8349123B2 (en) 2008-04-01 2013-01-08 Henkel Corporation High heat resistant adhesive and sealant compositions
DE102008021980A1 (de) * 2008-05-02 2009-11-05 Bayer Materialscience Ag Neue Katalysatoren und deren Einsatz bei der Herstellung von Polyurethanen
US20090294015A1 (en) * 2008-06-02 2009-12-03 Larry Gluck Weather-resistant illuminated ornamental stepping stones and method of manufacture thereof
US8187696B2 (en) * 2008-07-18 2012-05-29 World Properties, Inc. Circuit materials, circuits laminates, and method of manufacture thereof
CN101412860B (zh) * 2008-12-04 2011-02-16 中国科学院长春应用化学研究所 一种抗氧阻效应的紫外光-热双固化涂料组合物及其制备方法
US8360390B2 (en) 2009-01-13 2013-01-29 Enphase Energy, Inc. Method and apparatus for potting an electronic device
EP2596039A1 (en) 2010-07-22 2013-05-29 Construction Research & Technology GmbH Sealant&adhesive using green prepolymer
US8822844B1 (en) * 2010-09-27 2014-09-02 Rockwell Collins, Inc. Shielding and potting for electrical circuits
US8697188B2 (en) 2011-09-02 2014-04-15 Construction Research & Technology Gmbh Polyurethane systems having non-sag and paintability
CN102757722B (zh) * 2012-07-13 2014-12-10 江苏苏博特新材料股份有限公司 一种双组份聚氨酯涂料及其制备方法
CN102850989B (zh) 2012-09-26 2014-04-09 贵阳时代沃顿科技有限公司 一种双组分聚氨酯胶粘剂及其制备方法
CN102911636B (zh) 2012-09-26 2013-12-18 贵阳时代沃顿科技有限公司 一种双组分聚氨酯胶粘剂及其制备方法和应用
JP2014187287A (ja) * 2013-03-25 2014-10-02 Mitsubishi Heavy Ind Ltd 回路基板の製造方法
US9832902B2 (en) * 2013-05-31 2017-11-28 Elantas Pdg, Inc. Formulated resin compositions for flood coating electronic circuit assemblies
CN105358638B (zh) 2013-05-31 2018-08-07 艾伦塔斯Pdg有限公司 用于溢流涂布电子电路组件的配制的树脂组合物
US9808765B2 (en) 2014-03-12 2017-11-07 Elantas Pdg, Inc. Polyurethane adhesives for reverse osmosis modules
CN107001572B (zh) 2014-11-26 2020-07-28 艾伦塔斯Pdg有限公司 多部分聚氨酯组合物、其制品及制造方法
KR102478434B1 (ko) 2015-04-09 2022-12-15 엘란타스 피디쥐, 인코포레이티드. 역삼투 모듈용 폴리우레탄 접착제

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040012936A1 (en) * 2002-07-18 2004-01-22 Gravelin Pascal A. Device and method for enclosure of electronic printed circuit board based products

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102764618B1 (ko) 2023-09-15 2025-02-11 (주)이에스피켐 폴리우레탄 수지 조성물

Also Published As

Publication number Publication date
JP2016529333A (ja) 2016-09-23
JP6600681B2 (ja) 2019-11-06
MX2015016483A (es) 2016-07-07
CA2913996A1 (en) 2014-12-04
US20140355225A1 (en) 2014-12-04
JP2017524794A (ja) 2017-08-31
KR20160014677A (ko) 2016-02-11
EP2997099B1 (en) 2020-10-14
ES2839083T3 (es) 2021-07-05
MX381812B (es) 2025-03-13
JP2020077847A (ja) 2020-05-21
CN105683316A (zh) 2016-06-15
CN105683316B (zh) 2019-12-31
US9699917B2 (en) 2017-07-04
WO2014194303A1 (en) 2014-12-04
EP2997099A1 (en) 2016-03-23
MX2015016482A (es) 2016-06-21
JP6811818B2 (ja) 2021-01-13
JP6574413B2 (ja) 2019-09-11
CA2913996C (en) 2021-08-31
SI2997099T1 (sl) 2021-03-31
HUE053002T2 (hu) 2021-06-28
PL2997099T3 (pl) 2021-04-19
CA2913565A1 (en) 2015-11-30
CN105358638B (zh) 2018-08-07
CN105358638A (zh) 2016-02-24
PT2997099T (pt) 2021-01-11

Similar Documents

Publication Publication Date Title
KR102355209B1 (ko) 전자 회로 조립체를 플러드 코팅하기 위한 배합 폴리우레탄 수지 조성물
US9832902B2 (en) Formulated resin compositions for flood coating electronic circuit assemblies
CN102102006B (zh) 一种双组分聚氨酯灌封胶的制备方法及其制品
KR20160145532A (ko) 폴리우레탄 수지 조성물 제조용 폴리올 조성물
JP2016529333A5 (https=)
WO2012058806A1 (en) Two-component polyurethane adhesives with τηiχοtropic effect
TWI911799B (zh) 電子基材組合件及塗布保護塗層之方法
KR102880445B1 (ko) 경화성 조성물
KR102764618B1 (ko) 폴리우레탄 수지 조성물
KR20170013145A (ko) 전자 회로 조립체를 플러드 코팅하기 위한 배합 폴리우레탄 수지 조성물
JP7849106B2 (ja) 硬化性組成物
JP2008156501A (ja) 一液湿気硬化型ポリウレタンコーティング剤、それを用いて防湿絶縁処理された実装回路板、及びその実装回路板の製造方法
KR102910615B1 (ko) 경화성 조성물
JP7772470B2 (ja) 硬化性組成物
JP5865537B1 (ja) 電気絶縁用ポリウレタン樹脂組成物
JP2022156107A (ja) 防湿コート剤、防湿コート層、及び電子基板

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20151223

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190531

Comment text: Request for Examination of Application

N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20190823

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200901

Patent event code: PE09021S01D

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20210407

Patent event code: PE09021S02D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20211102

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20220120

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20220121

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20250107

Start annual number: 4

End annual number: 4