MX381812B - Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante. - Google Patents

Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.

Info

Publication number
MX381812B
MX381812B MX2015016482A MX2015016482A MX381812B MX 381812 B MX381812 B MX 381812B MX 2015016482 A MX2015016482 A MX 2015016482A MX 2015016482 A MX2015016482 A MX 2015016482A MX 381812 B MX381812 B MX 381812B
Authority
MX
Mexico
Prior art keywords
electronic circuit
mils
circuit assemblies
polyurethane resin
resin compositions
Prior art date
Application number
MX2015016482A
Other languages
English (en)
Spanish (es)
Other versions
MX2015016482A (es
Inventor
Jr Richard David Jordan
Iv Thomas C Scanlon
Original Assignee
Cytec Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Ind Inc filed Critical Cytec Ind Inc
Publication of MX2015016482A publication Critical patent/MX2015016482A/es
Publication of MX381812B publication Critical patent/MX381812B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/22—Catalysts containing metal compounds
    • C08G18/24—Catalysts containing metal compounds of tin
    • C08G18/244—Catalysts containing metal compounds of tin tin salts of carboxylic acids
    • C08G18/246—Catalysts containing metal compounds of tin tin salts of carboxylic acids containing also tin-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/36—Hydroxylated esters of higher fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2/00—Addition polymers of aldehydes or cyclic oligomers thereof or of ketones; Addition copolymers thereof with less than 50 molar percent of other substances
    • C08G2/10—Polymerisation of cyclic oligomers of formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Paints Or Removers (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
MX2015016482A 2013-05-31 2014-05-31 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante. MX381812B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361829681P 2013-05-31 2013-05-31
PCT/US2014/040421 WO2014194303A1 (en) 2013-05-31 2014-05-31 Formulated polyurethane resin compositions for flood coating electronic circuit assemblies

Publications (2)

Publication Number Publication Date
MX2015016482A MX2015016482A (es) 2016-06-21
MX381812B true MX381812B (es) 2025-03-13

Family

ID=51014655

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2015016482A MX381812B (es) 2013-05-31 2014-05-31 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.
MX2015016483A MX2015016483A (es) 2013-05-31 2014-11-29 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.

Family Applications After (1)

Application Number Title Priority Date Filing Date
MX2015016483A MX2015016483A (es) 2013-05-31 2014-11-29 Composiciones de resina de poliuretano formuladas para montajes de circuitos electrónicos con recubrimiento aglutinante.

Country Status (13)

Country Link
US (1) US9699917B2 (https=)
EP (1) EP2997099B1 (https=)
JP (3) JP6574413B2 (https=)
KR (1) KR102355209B1 (https=)
CN (2) CN105358638B (https=)
CA (2) CA2913996C (https=)
ES (1) ES2839083T3 (https=)
HU (1) HUE053002T2 (https=)
MX (2) MX381812B (https=)
PL (1) PL2997099T3 (https=)
PT (1) PT2997099T (https=)
SI (1) SI2997099T1 (https=)
WO (1) WO2014194303A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
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CN105358638B (zh) 2013-05-31 2018-08-07 艾伦塔斯Pdg有限公司 用于溢流涂布电子电路组件的配制的树脂组合物
US9832902B2 (en) 2013-05-31 2017-11-28 Elantas Pdg, Inc. Formulated resin compositions for flood coating electronic circuit assemblies
US9808765B2 (en) 2014-03-12 2017-11-07 Elantas Pdg, Inc. Polyurethane adhesives for reverse osmosis modules
CN107001572B (zh) 2014-11-26 2020-07-28 艾伦塔斯Pdg有限公司 多部分聚氨酯组合物、其制品及制造方法
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JP2017147388A (ja) * 2016-02-19 2017-08-24 株式会社デンソー 電子装置の製造方法
EP3850028A1 (en) 2018-09-10 2021-07-21 Huntsman International LLC Oxazolidinedione-terminated prepolymer
WO2020053062A1 (en) * 2018-09-10 2020-03-19 Huntsman International Llc Oxazolidinedione-terminated prepolymer
WO2020092800A1 (en) * 2018-10-31 2020-05-07 H.B. Fuller Company Two component polyurethane system for liquid applied sound deadener
KR102913604B1 (ko) * 2021-02-10 2026-01-19 캐보트 코포레이션 열가소성 엘라스토머의 제조 방법 및 그에 의해 얻어진 중합체 복합체
GB2613561A (en) * 2021-12-03 2023-06-14 H K Wentworth Ltd Expandable protective coating
KR102764618B1 (ko) 2023-09-15 2025-02-11 (주)이에스피켐 폴리우레탄 수지 조성물

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Also Published As

Publication number Publication date
JP2016529333A (ja) 2016-09-23
JP6600681B2 (ja) 2019-11-06
MX2015016483A (es) 2016-07-07
CA2913996A1 (en) 2014-12-04
US20140355225A1 (en) 2014-12-04
JP2017524794A (ja) 2017-08-31
KR20160014677A (ko) 2016-02-11
EP2997099B1 (en) 2020-10-14
KR102355209B1 (ko) 2022-01-25
ES2839083T3 (es) 2021-07-05
JP2020077847A (ja) 2020-05-21
CN105683316A (zh) 2016-06-15
CN105683316B (zh) 2019-12-31
US9699917B2 (en) 2017-07-04
WO2014194303A1 (en) 2014-12-04
EP2997099A1 (en) 2016-03-23
MX2015016482A (es) 2016-06-21
JP6811818B2 (ja) 2021-01-13
JP6574413B2 (ja) 2019-09-11
CA2913996C (en) 2021-08-31
SI2997099T1 (sl) 2021-03-31
HUE053002T2 (hu) 2021-06-28
PL2997099T3 (pl) 2021-04-19
CA2913565A1 (en) 2015-11-30
CN105358638B (zh) 2018-08-07
CN105358638A (zh) 2016-02-24
PT2997099T (pt) 2021-01-11

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