KR102305243B1 - 기판 반송 시스템, 리소그래피 장치, 반송 방법 및 물품의 제조 방법 - Google Patents

기판 반송 시스템, 리소그래피 장치, 반송 방법 및 물품의 제조 방법 Download PDF

Info

Publication number
KR102305243B1
KR102305243B1 KR1020180027234A KR20180027234A KR102305243B1 KR 102305243 B1 KR102305243 B1 KR 102305243B1 KR 1020180027234 A KR1020180027234 A KR 1020180027234A KR 20180027234 A KR20180027234 A KR 20180027234A KR 102305243 B1 KR102305243 B1 KR 102305243B1
Authority
KR
South Korea
Prior art keywords
substrate
holding
detecting
conveying
holding unit
Prior art date
Application number
KR1020180027234A
Other languages
English (en)
Korean (ko)
Other versions
KR20180106892A (ko
Inventor
히로아키 도키에
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20180106892A publication Critical patent/KR20180106892A/ko
Application granted granted Critical
Publication of KR102305243B1 publication Critical patent/KR102305243B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020180027234A 2017-03-16 2018-03-08 기판 반송 시스템, 리소그래피 장치, 반송 방법 및 물품의 제조 방법 KR102305243B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017051817A JP6440757B2 (ja) 2017-03-16 2017-03-16 基板搬送システム、リソグラフィ装置、および物品の製造方法
JPJP-P-2017-051817 2017-03-16

Publications (2)

Publication Number Publication Date
KR20180106892A KR20180106892A (ko) 2018-10-01
KR102305243B1 true KR102305243B1 (ko) 2021-09-28

Family

ID=63718318

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180027234A KR102305243B1 (ko) 2017-03-16 2018-03-08 기판 반송 시스템, 리소그래피 장치, 반송 방법 및 물품의 제조 방법

Country Status (3)

Country Link
JP (1) JP6440757B2 (ja)
KR (1) KR102305243B1 (ja)
TW (1) TWI673818B (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011161521A (ja) * 2010-02-04 2011-08-25 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法並びに記憶媒体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305233A (ja) * 2001-04-05 2002-10-18 Olympus Optical Co Ltd ウェハ搬送用アーム
JP3904843B2 (ja) * 2001-05-02 2007-04-11 大日本スクリーン製造株式会社 基板検出装置、基板処理装置及び基板検出方法
JP4794882B2 (ja) * 2005-03-25 2011-10-19 キヤノン株式会社 走査型露光装置、走査型露光方法
JP4718218B2 (ja) * 2005-03-30 2011-07-06 株式会社ダイヘン 基板支持機構
JP4652177B2 (ja) * 2005-09-02 2011-03-16 株式会社デンソー 半導体装置の製造方法およびその製造方法の実施に用いられる製造装置
JP2009200063A (ja) * 2006-05-22 2009-09-03 Tokyo Electron Ltd 基板の変形検出機構，処理システム，基板の変形検出方法及び記録媒体
US20080145957A1 (en) * 2006-12-14 2008-06-19 Lee Young-Sun Wafer transferring robot in semiconductor device fabrication equipmentand method of detecting wafer warpage using the same
JP2010056217A (ja) * 2008-08-27 2010-03-11 Dainippon Screen Mfg Co Ltd 基板昇降装置および基板処理装置
JP5665336B2 (ja) * 2009-04-06 2015-02-04 キヤノン株式会社 基板保持装置、及びそれを用いたリソグラフィー装置
US20110244396A1 (en) * 2010-04-01 2011-10-06 Nikon Corporation Exposure apparatus, exchange method of object, exposure method, and device manufacturing method
JP6042149B2 (ja) * 2012-09-21 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理装置、および、基板搬送方法
JP6087669B2 (ja) * 2013-03-06 2017-03-01 キヤノン株式会社 基板処理装置、リソグラフィ装置および物品の製造方法
JP5871845B2 (ja) * 2013-03-12 2016-03-01 東京エレクトロン株式会社 基板搬送装置、基板処理装置、基板取出方法および記憶媒体
JP5949741B2 (ja) * 2013-12-19 2016-07-13 株式会社安川電機 ロボットシステム及び検出方法
JP2015204420A (ja) * 2014-04-15 2015-11-16 株式会社ディスコ 板状物の搬送装置および切削装置
JP2016154168A (ja) * 2015-02-20 2016-08-25 株式会社ディスコ 被加工物の受け渡し方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011161521A (ja) * 2010-02-04 2011-08-25 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法並びに記憶媒体

Also Published As

Publication number Publication date
KR20180106892A (ko) 2018-10-01
JP6440757B2 (ja) 2018-12-19
TWI673818B (zh) 2019-10-01
JP2018157038A (ja) 2018-10-04
TW201836041A (zh) 2018-10-01

Similar Documents

Publication Publication Date Title
KR102211380B1 (ko) 반송 시스템, 노광 장치, 반송 방법, 노광 방법 및 디바이스 제조방법, 및 흡인 장치
US8735051B2 (en) Exposure method and exposure apparatus, and device manufacturing method
JPH10163099A (ja) 露光方法及び露光装置
KR100614954B1 (ko) 대물을 이송하는 이송장치와 그 사용 방법 및 이러한이송장치를 포함하는 리소그래피투영장치
KR102410381B1 (ko) 리소그래피 장치 및 리소그래피 장치를 작동시키는 방법
US8279406B2 (en) Article loading/unloading method and article loading/unloading device, exposure method and exposure apparatus, and method of manufacturing device
JP7030416B2 (ja) 基板保持装置、リソグラフィ装置、物品の製造方法
KR102305243B1 (ko) 기판 반송 시스템, 리소그래피 장치, 반송 방법 및 물품의 제조 방법
JP4685041B2 (ja) ステージ装置、露光装置及びデバイス製造方法
JP2006013090A (ja) 露光装置及びデバイス製造方法
JP7216568B2 (ja) 搬送装置、露光装置及び物品の製造方法
JP6723069B2 (ja) ステージ装置、リソグラフィ装置及び物品の製造方法
JPH1097982A (ja) 露光装置
JP2017181802A (ja) リソグラフィ装置およびその制御方法、ならびに物品の製造方法
JP2023048851A (ja) ステージ装置、リソグラフィ装置及び物品の製造方法
CN112965341B (en) Lithographic apparatus and method of operating a lithographic apparatus
JP6015983B2 (ja) 物体交換システム、露光装置、フラットパネルディスプレイの製造方法及びデバイス製造方法
KR20200049538A (ko) 스테이지 장치, 리소그래피 장치, 및 물품 제조 방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant