KR102297015B1 - 수지 조성물, 프리프레그, 수지 시트, 적층 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판 - Google Patents

수지 조성물, 프리프레그, 수지 시트, 적층 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판 Download PDF

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KR102297015B1
KR102297015B1 KR1020187028847A KR20187028847A KR102297015B1 KR 102297015 B1 KR102297015 B1 KR 102297015B1 KR 1020187028847 A KR1020187028847 A KR 1020187028847A KR 20187028847 A KR20187028847 A KR 20187028847A KR 102297015 B1 KR102297015 B1 KR 102297015B1
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South Korea
Prior art keywords
resin composition
group
cyanate ester
compound
resin
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KR1020187028847A
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English (en)
Korean (ko)
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KR20190004698A (ko
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도모키 하마지마
가츠야 도미자와
메구루 이토
에이스케 시가
Original Assignee
미츠비시 가스 가가쿠 가부시키가이샤
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Priority to KR1020217027095A priority Critical patent/KR102418675B1/ko
Publication of KR20190004698A publication Critical patent/KR20190004698A/ko
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020187028847A 2016-05-02 2017-04-24 수지 조성물, 프리프레그, 수지 시트, 적층 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판 KR102297015B1 (ko)

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102418675B1 (ko) * 2016-05-02 2022-07-07 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 수지 시트, 적층 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판
JP7154475B2 (ja) * 2017-03-29 2022-10-18 三菱瓦斯化学株式会社 プリント配線板用樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP6994174B2 (ja) * 2017-11-14 2022-01-14 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
TWI830741B (zh) * 2018-06-27 2024-02-01 日商三菱瓦斯化學股份有限公司 樹脂組成物及其應用
TW202005800A (zh) 2018-07-18 2020-02-01 日商日立化成股份有限公司 覆銅積層板、印刷線路板、半導體封裝體及覆銅積層板的製造方法
JP7243077B2 (ja) * 2018-08-10 2023-03-22 株式会社レゾナック プリプレグ、プリプレグの硬化物、積層板、プリント配線板及び半導体パッケージ
KR102192274B1 (ko) * 2018-08-30 2020-12-17 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체 장치
JP7148859B2 (ja) * 2018-08-31 2022-10-06 三菱瓦斯化学株式会社 シアン酸エステル化合物の混合物及び硬化性組成物
KR102479615B1 (ko) * 2019-12-11 2022-12-20 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 수지 시트, 다층 프린트 배선판, 및 반도체 장치
JP7435454B2 (ja) * 2020-02-21 2024-02-21 東レ株式会社 繊維強化複合成形品およびその成形方法
WO2021261305A1 (ja) * 2020-06-24 2021-12-30 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及びプリント配線板
CA3240964A1 (en) * 2021-12-14 2023-06-22 Arxada Ag Novel compositions with improved characteristics
KR20240052716A (ko) * 2022-10-11 2024-04-23 셍기 테크놀로지 (쑤저우) 컴퍼니 리미티드 개질된 비스말레이미드 프리폴리머, 수지 조성물 및 수지 조성물의 용도

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012165423A1 (ja) 2011-05-31 2012-12-06 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び積層板
JP2016028164A (ja) 2011-01-18 2016-02-25 日立化成株式会社 樹脂組成物、及びこれを用いたプリプレグ、積層板、プリント配線板
WO2017006891A1 (ja) 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306405A (ja) * 1988-06-03 1989-12-11 Hitachi Ltd オルトジアリルビスシアナート系化合物、及び、この化合物を含む組成物
JPH02251518A (ja) * 1989-03-27 1990-10-09 Mitsui Toatsu Chem Inc 熱硬化性樹脂組成物
JP5024205B2 (ja) 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
TW201204548A (en) 2010-02-05 2012-02-01 Sumitomo Bakelite Co Prepreg, laminate, printed wiring board, and semiconductor device
CN103025775B (zh) * 2010-07-26 2015-04-15 三菱丽阳株式会社 树脂组合物、使用了该树脂组合物的预浸料及纤维强化复合材料
JP2013001807A (ja) 2011-06-16 2013-01-07 Panasonic Corp 電子回路基板材料用樹脂組成物、プリプレグ及び積層板
JP3173332U (ja) 2011-11-17 2012-02-02 奇▲こう▼科技股▲ふん▼有限公司 含油軸受ファン構造
JP2013216884A (ja) 2012-03-14 2013-10-24 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、プリプレグ及び積層板
JP5949249B2 (ja) * 2012-07-13 2016-07-06 日立化成株式会社 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板
JP6314830B2 (ja) * 2012-10-19 2018-04-25 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、及びプリント配線板
JP6107050B2 (ja) * 2012-10-26 2017-04-05 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板
TWI501444B (zh) * 2012-12-20 2015-09-21 Ind Tech Res Inst 鋰離子二次電池用的電解液添加劑
CN103724999A (zh) * 2013-05-30 2014-04-16 广东生益科技股份有限公司 一种氰酸酯树脂组合物及其用途
JP6639072B2 (ja) * 2014-02-06 2020-02-05 三菱瓦斯化学株式会社 プリント配線板用樹脂組成物、プリプレグ、積層板及びプリント配線板
KR102418675B1 (ko) 2016-05-02 2022-07-07 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 수지 시트, 적층 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016028164A (ja) 2011-01-18 2016-02-25 日立化成株式会社 樹脂組成物、及びこれを用いたプリプレグ、積層板、プリント配線板
WO2012165423A1 (ja) 2011-05-31 2012-12-06 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び積層板
WO2017006891A1 (ja) 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板

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