KR102276772B1 - 폴리아마이드이미드 수지 및 당해 폴리아마이드이미드 수지의 제조방법 - Google Patents

폴리아마이드이미드 수지 및 당해 폴리아마이드이미드 수지의 제조방법 Download PDF

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Publication number
KR102276772B1
KR102276772B1 KR1020150044922A KR20150044922A KR102276772B1 KR 102276772 B1 KR102276772 B1 KR 102276772B1 KR 1020150044922 A KR1020150044922 A KR 1020150044922A KR 20150044922 A KR20150044922 A KR 20150044922A KR 102276772 B1 KR102276772 B1 KR 102276772B1
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KR
South Korea
Prior art keywords
anhydride
polyamideimide resin
diamine
acid
compound
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KR1020150044922A
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English (en)
Korean (ko)
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KR20150114425A (ko
Inventor
신지 온다
Original Assignee
에아.워타 가부시키가이샤
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Publication of KR20150114425A publication Critical patent/KR20150114425A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
KR1020150044922A 2014-04-01 2015-03-31 폴리아마이드이미드 수지 및 당해 폴리아마이드이미드 수지의 제조방법 KR102276772B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-075763 2014-04-01
JP2014075763A JP6234870B2 (ja) 2014-04-01 2014-04-01 ポリアミドイミド樹脂および当該ポリアミドイミド樹脂の製造方法

Publications (2)

Publication Number Publication Date
KR20150114425A KR20150114425A (ko) 2015-10-12
KR102276772B1 true KR102276772B1 (ko) 2021-07-12

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KR1020150044922A KR102276772B1 (ko) 2014-04-01 2015-03-31 폴리아마이드이미드 수지 및 당해 폴리아마이드이미드 수지의 제조방법

Country Status (4)

Country Link
JP (1) JP6234870B2 (ja)
KR (1) KR102276772B1 (ja)
CN (1) CN104974345B (ja)
TW (1) TWI653257B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567110B (zh) 2015-12-04 2017-01-21 張綺蘭 樹脂組合物、以及包含此樹脂組合物之絕緣基材及電路板
CN109906217B (zh) * 2016-11-10 2022-05-10 东丽株式会社 二胺化合物、使用其的耐热性树脂及树脂组合物
CN110258118B (zh) * 2019-07-12 2021-07-13 开封大学 水溶性耐温型碳纤维上胶剂及其制备方法
CN111574923A (zh) * 2020-05-28 2020-08-25 苏州东特绝缘科技有限公司 聚酰胺酰亚胺绝缘涂料及其制备方法

Citations (3)

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JP2008088403A (ja) 2006-09-05 2008-04-17 Hitachi Chem Co Ltd 感光性接着剤組成物、及びそれを用いた接着フィルム、接着シート、接着剤パターン、並びに半導体装置
CN101589089A (zh) 2006-12-12 2009-11-25 东洋纺织株式会社 聚酰胺酰亚胺树脂、从该树脂得到的无色透明柔性贴金属层叠体及布线板
CN102131882A (zh) 2008-08-27 2011-07-20 日立化成工业株式会社 感光性粘接剂组合物、膜状感光性粘接剂、粘接剂图案、带粘接剂的半导体晶片、半导体装置及电子部件

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JPH02828A (ja) * 1987-12-02 1990-01-05 Matsushita Electric Ind Co Ltd 液晶表示装置
JP4792626B2 (ja) 2000-09-14 2011-10-12 東洋紡績株式会社 アルカリ可溶性ポリアミドイミド共重合体
JP4846266B2 (ja) 2005-05-19 2011-12-28 株式会社カネカ 新規ポリイミド前駆体およびその利用
US20090202793A1 (en) * 2006-07-11 2009-08-13 Nippon Kayaku Kabushiki Kaisha Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the same
WO2008041426A1 (en) * 2006-10-04 2008-04-10 Hitachi Chemical Company, Ltd. Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board
JP5103928B2 (ja) * 2007-02-13 2012-12-19 日立化成工業株式会社 接着剤組成物及びこれを用いた接着フィルム
JP5061679B2 (ja) * 2007-03-26 2012-10-31 日立化成工業株式会社 ポリアミド樹脂及びその製造方法、並びに、樹脂組成物
JP2009179697A (ja) * 2008-01-30 2009-08-13 Dic Corp ポリイミド樹脂、ポリイミド樹脂組成物およびポリイミド樹脂の製造方法
JP5617698B2 (ja) 2011-03-04 2014-11-05 日立金属株式会社 絶縁塗料およびそれを用いた絶縁電線

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008088403A (ja) 2006-09-05 2008-04-17 Hitachi Chem Co Ltd 感光性接着剤組成物、及びそれを用いた接着フィルム、接着シート、接着剤パターン、並びに半導体装置
CN101589089A (zh) 2006-12-12 2009-11-25 东洋纺织株式会社 聚酰胺酰亚胺树脂、从该树脂得到的无色透明柔性贴金属层叠体及布线板
CN102131882A (zh) 2008-08-27 2011-07-20 日立化成工业株式会社 感光性粘接剂组合物、膜状感光性粘接剂、粘接剂图案、带粘接剂的半导体晶片、半导体装置及电子部件

Also Published As

Publication number Publication date
CN104974345A (zh) 2015-10-14
CN104974345B (zh) 2018-08-14
TWI653257B (zh) 2019-03-11
JP6234870B2 (ja) 2017-11-22
JP2015196776A (ja) 2015-11-09
KR20150114425A (ko) 2015-10-12
TW201544526A (zh) 2015-12-01

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