KR102263433B1 - 반도체장치, 적층형 반도체장치, 봉지후 적층형 반도체장치, 및 이들의 제조방법 - Google Patents
반도체장치, 적층형 반도체장치, 봉지후 적층형 반도체장치, 및 이들의 제조방법 Download PDFInfo
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- KR102263433B1 KR102263433B1 KR1020167027165A KR20167027165A KR102263433B1 KR 102263433 B1 KR102263433 B1 KR 102263433B1 KR 1020167027165 A KR1020167027165 A KR 1020167027165A KR 20167027165 A KR20167027165 A KR 20167027165A KR 102263433 B1 KR102263433 B1 KR 102263433B1
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- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
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- H10W72/941—Dispositions of bond pads
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- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
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- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
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Applications Claiming Priority (3)
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| JP2014071301A JP6031059B2 (ja) | 2014-03-31 | 2014-03-31 | 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法 |
| JPJP-P-2014-071301 | 2014-03-31 | ||
| PCT/JP2015/001433 WO2015151426A1 (ja) | 2014-03-31 | 2015-03-16 | 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法 |
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| JP6444269B2 (ja) * | 2015-06-19 | 2018-12-26 | 新光電気工業株式会社 | 電子部品装置及びその製造方法 |
| JP6042956B1 (ja) * | 2015-09-30 | 2016-12-14 | オリジン電気株式会社 | 半田付け製品の製造方法 |
| JP6534948B2 (ja) * | 2016-02-26 | 2019-06-26 | 信越化学工業株式会社 | 半導体装置の製造方法、フリップチップ型半導体装置の製造方法、半導体装置及びフリップチップ型半導体装置 |
| US20170365567A1 (en) * | 2016-06-20 | 2017-12-21 | Samsung Electro-Mechanics Co., Ltd. | Fan-out semiconductor package |
| JP6791352B2 (ja) * | 2017-03-14 | 2020-11-25 | 株式会社村田製作所 | 回路モジュールおよびその製造方法 |
| FR3070090B1 (fr) * | 2017-08-08 | 2020-02-07 | 3Dis Technologies | Systeme electronique et procede de fabrication d'un systeme electronique par utilisation d'un element sacrificiel |
| FR3070091B1 (fr) | 2017-08-08 | 2020-02-07 | 3Dis Technologies | Systeme electronique comprenant une couche de redistribution inferieure et procede de fabrication d'un tel systeme electronique |
| JP6866802B2 (ja) * | 2017-08-09 | 2021-04-28 | 信越化学工業株式会社 | シリコーン骨格含有高分子化合物、感光性樹脂組成物、感光性樹脂皮膜、感光性ドライフィルム、積層体、及びパターン形成方法 |
| US10818578B2 (en) | 2017-10-12 | 2020-10-27 | Stmicroelectronics S.R.L. | Method of manufacturing semiconductor devices, corresponding device and circuit |
| US10651126B2 (en) * | 2017-12-08 | 2020-05-12 | Applied Materials, Inc. | Methods and apparatus for wafer-level die bridge |
| CN114050113A (zh) * | 2018-08-06 | 2022-02-15 | 中芯集成电路(宁波)有限公司 | 封装方法 |
| CN109494163A (zh) * | 2018-11-20 | 2019-03-19 | 苏州晶方半导体科技股份有限公司 | 芯片的封装结构以及封装方法 |
| CN109545757A (zh) * | 2018-11-20 | 2019-03-29 | 苏州晶方半导体科技股份有限公司 | 芯片的封装结构以及封装方法 |
| JP7225754B2 (ja) * | 2018-12-13 | 2023-02-21 | Tdk株式会社 | 半導体ic内蔵回路基板及びその製造方法 |
| CN109817769B (zh) * | 2019-01-15 | 2020-10-30 | 申广 | 一种新型led芯片封装制作方法 |
| TWI803738B (zh) * | 2019-03-11 | 2023-06-01 | 美商羅門哈斯電子材料有限公司 | 製造印刷線路板的方法 |
| CN112020199B (zh) * | 2019-05-29 | 2022-03-08 | 鹏鼎控股(深圳)股份有限公司 | 内埋式电路板及其制作方法 |
| DE102019130898A1 (de) * | 2019-08-16 | 2021-02-18 | Infineon Technologies Ag | Zweistufige laserbearbeitung eines verkapselungsmittels eines halbleiterchipgehäuses |
| CN112351573B (zh) * | 2019-09-18 | 2025-04-29 | 广州方邦电子股份有限公司 | 一种多层板 |
| IT201900024292A1 (it) | 2019-12-17 | 2021-06-17 | St Microelectronics Srl | Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente |
| US11626379B2 (en) | 2020-03-24 | 2023-04-11 | Stmicroelectronics S.R.L. | Method of manufacturing semiconductor devices and corresponding semiconductor device |
| WO2022004409A1 (ja) * | 2020-07-03 | 2022-01-06 | ナミックス株式会社 | アンテナ付き半導体パッケージ及びアンテナ付き半導体パッケージ用樹脂組成物 |
| CN112533365A (zh) * | 2020-12-14 | 2021-03-19 | 深圳市艾诺信射频电路有限公司 | 基板加工方法及基板 |
| US11528218B2 (en) * | 2021-03-01 | 2022-12-13 | Cisco Technology, Inc. | Probe fusion for application-driven routing |
| JP2024062874A (ja) * | 2022-10-25 | 2024-05-10 | 株式会社アドバンテスト | 積層チップおよび積層チップの製造方法 |
| US20240145255A1 (en) * | 2022-10-27 | 2024-05-02 | Innolux Corporation | Electronic device |
| CN115985783B (zh) * | 2023-03-20 | 2023-05-30 | 合肥矽迈微电子科技有限公司 | 一种mosfet芯片的封装结构和工艺 |
| CN118943027B (zh) * | 2023-05-11 | 2025-12-09 | 中国科学院微电子研究所 | 一种内埋芯片基板的制造方法及临时键合结构 |
| CN121100407A (zh) * | 2023-05-12 | 2025-12-09 | Lg 伊诺特有限公司 | 电路板和包括该电路板的半导体封装 |
| CN116960000A (zh) * | 2023-06-28 | 2023-10-27 | 广东佛智芯微电子技术研究有限公司 | 大板级扇出型封装方法及大板级扇出型封装结构 |
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| JP2010103398A (ja) * | 2008-10-27 | 2010-05-06 | Shinko Electric Ind Co Ltd | 電子部品内蔵基板及びその製造方法 |
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| JP5001542B2 (ja) * | 2005-03-17 | 2012-08-15 | 日立電線株式会社 | 電子装置用基板およびその製造方法、ならびに電子装置の製造方法 |
| JP4533283B2 (ja) | 2005-08-29 | 2010-09-01 | 新光電気工業株式会社 | 半導体装置の製造方法 |
| US20080246126A1 (en) * | 2007-04-04 | 2008-10-09 | Freescale Semiconductor, Inc. | Stacked and shielded die packages with interconnects |
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| WO2011122228A1 (ja) * | 2010-03-31 | 2011-10-06 | 日本電気株式会社 | 半導体内蔵基板 |
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| JP5977051B2 (ja) * | 2012-03-21 | 2016-08-24 | 新光電気工業株式会社 | 半導体パッケージ、半導体装置及び半導体パッケージの製造方法 |
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| US9478498B2 (en) * | 2013-08-05 | 2016-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Through package via (TPV) |
| KR101863462B1 (ko) * | 2013-08-21 | 2018-05-31 | 인텔 코포레이션 | 범프리스 빌드업 층을 위한 범프리스 다이 패키지 인터페이스 |
| US9455211B2 (en) * | 2013-09-11 | 2016-09-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated fan-out structure with openings in buffer layer |
| US9111870B2 (en) * | 2013-10-17 | 2015-08-18 | Freescale Semiconductor Inc. | Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof |
| US9666522B2 (en) * | 2014-05-29 | 2017-05-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Alignment mark design for packages |
| US9852998B2 (en) * | 2014-05-30 | 2017-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Ring structures in device die |
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| JP2010103398A (ja) * | 2008-10-27 | 2010-05-06 | Shinko Electric Ind Co Ltd | 電子部品内蔵基板及びその製造方法 |
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| CN106415823A (zh) | 2017-02-15 |
| US20170077043A1 (en) | 2017-03-16 |
| TWI648438B (zh) | 2019-01-21 |
| KR20160138082A (ko) | 2016-12-02 |
| EP3128548A4 (en) | 2017-12-13 |
| JP6031059B2 (ja) | 2016-11-24 |
| CN106415823B (zh) | 2019-03-05 |
| EP3128548A1 (en) | 2017-02-08 |
| EP3128548B1 (en) | 2021-08-11 |
| TW201600651A (zh) | 2016-01-01 |
| US10141272B2 (en) | 2018-11-27 |
| WO2015151426A1 (ja) | 2015-10-08 |
| JP2015195238A (ja) | 2015-11-05 |
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